Completely Coating One Side Of Strip Patents (Class 205/130)
  • Patent number: 11242253
    Abstract: Provided is a method which not only prevents (i) accumulation of fine silicon powder in a separation device and a pipe which are provided in steps after passage of a filter and (ii) damage to a pump, but also reduces adhesion of a silane oligomer to the filter. A method, in accordance with an embodiment of the present invention, for producing polycrystalline silicon, includes: a silicon deposition step; a separation step; and a fine powder removal step of removing the fine silicon powder by passing a chlorosilane condensate through a filter.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: February 8, 2022
    Assignee: TOKUYAMA CORPORATION
    Inventor: Yuichi Inoue
  • Publication number: 20140076732
    Abstract: The present invention provides a device for single-sided electrolytic treatment of a flat substrate. The device comprises a bath for electrolytic fluid and conveying means for conveying the flat substrate in a conveying direction at the free surface of the fluid in the bath, with the flat substrate being horizontally oriented such that the underside of the flat substrate makes contact with the free surface of the fluid in the bath. The conveying means comprise two conveying elements disposed opposite each other, which extend along two respective conveying paths, which conveying paths each comprise an electrolytic part, which electrolytic parts extend on two opposite longitudinal sides of the bath.
    Type: Application
    Filed: October 6, 2011
    Publication date: March 20, 2014
    Applicant: MECO EQUIPMENT ENGINEERS B.V.
    Inventor: Peter Jacobus Gerardus Loermans
  • Patent number: 7799182
    Abstract: Embodiments of the invention contemplate the formation of a low cost flexible solar cell using a novel electroplating method and apparatus to form a metal contact structure. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. Solar cell substrates that may benefit from the invention include flexible substrates may have an active region that contains organic material, single crystal silicon, multi-crystalline silicon, polycrystalline silicon, germanium, and gallium arsenide, cadmium telluride, cadmium sulfide, copper indium gallium selenide, copper indium selenide, gallilium indium phosphide, as well as heterojunction cells that are used to convert sunlight to electrical power.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: September 21, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Sergey Lopatin, David Eaglesham, Charles Gay
  • Patent number: 7544274
    Abstract: There is provided a plating method and device having a fixed drum (20) in which an anode (21) is exposed on the external peripheral surface; a rotating drum provided on the external periphery of the fixed drum, onto which a workpiece W transported in the longitudinal direction is wound; an annular opening (35) formed at the bottom of the rotating drum and provided so as to penetrate from the external periphery of the rotating drum to the internal periphery continuously in the peripheral direction of the rotating drum; a plating solution feeding channel (22) that leads into the fixed drum and is formed in a position on the external periphery of the fixed drum corresponding to the angle position (52a) of the prescribed arc of contact of the rotating drum onto which the workpiece is wound; a plating device for feeding the plating solution to the flow channel using the tunnel-shaped space (52) enclosed by the workpiece wound on the external periphery of the rotating drum, the peripheral wall of the annular openin
    Type: Grant
    Filed: December 27, 2005
    Date of Patent: June 9, 2009
    Assignee: Dowa Metaltech Co., Ltd.
    Inventors: Hiroshi Miyazawa, Terumasa Inao
  • Patent number: 7323093
    Abstract: A producing method of a flexible wired circuit board that can prevent the formation of a gap between an elongate substrate and a stiffener sheet bonded thereto to prevent contamination of the flexible wired circuit board obtained. In the process subsequent to the process of forming a conductive pattern 3 on a surface of the elongate substrate 1 by the semi-additive process using electrolysis plating and then annealing the elongate substrate 1 with the conductive pattern 3 in its wound up state, a stiffener sheet 9 having a width narrower than the elongate substrate 1 is bonded to the back side of the elongate substrate 1. Thereafter, an oxidized film formed on a surface of the conductive pattern 3 is removed and then a solder resist 11 is formed thereon. This prevents the strip of the stiffener sheet 9 from the elongate substrate 1 and in turn prevents etching solution or developing solution from entraining in a gap therebetween.
    Type: Grant
    Filed: September 28, 2004
    Date of Patent: January 29, 2008
    Assignee: Nitto Denko Corporation
    Inventors: Toshiki Naito, Yoshifumi Shinogi, Takeshi Yamato
  • Patent number: 7195796
    Abstract: A process is provided for making a composite work article suitable for fabricating rigid sheet metal can components. A steel sheet having first and second surfaces is pre-treated to enhance reception and retention of a multi-layer polymer coating on the pre-treated first surface. The multi-layer polymer coating is melt extruded on the pre-treated first surface and beyond opposite lateral edges of the work article to establish overhang portions, then solidified. The multi-layer polymeric coating has a tie polymeric layer contacting the pre-treated first surface, and a finish-surface polymeric layer.
    Type: Grant
    Filed: August 9, 2004
    Date of Patent: March 27, 2007
    Assignee: ISG Technologies, Inc
    Inventors: John A. Sinsel, Mark V. Loen, Michael S. Bailey
  • Patent number: 7112264
    Abstract: A plating apparatus includes a plating vessel for holding a plating bath containing at least metal ions, a conveying device for conveying a long conductive substrate and immersing the long conductive substrate in the plating bath, a facing electrode disposed in the plating bath so as to face one surface of the conductive substrate, a voltage application device for performing plating on the one surface of the conductive substrate by applying a voltage between the conductive substrate and the facing electrode, and a film-deposition suppression device fixedly disposed in the plating vessel so that at least a portion of the film-deposition suppression means is close to shorter-direction edges of the conductive substrate. At least a portion of the film-deposition suppression device close to the shorter-direction edges of the conductive substrate is conductive.
    Type: Grant
    Filed: June 27, 2003
    Date of Patent: September 26, 2006
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hidetoshi Tsuzuki, Noboru Toyama, Yasuyoshi Takai, Ryo Hayashi, Yuichi Sonoda, Masumitsu Iwata, Yusuke Miyamoto
  • Patent number: 6733650
    Abstract: Disclosed are a process for producing a zinc oxide film comprising the steps of transporting a conductive long substrate via above at least one electrode comprised of zinc in an electrodeposition bath held in an electrodeposition tank and applying an electric field between the electrode and the conductive long substrate, thereby forming a zinc oxide film on the conductive long substrate, the process comprising a first step of forming the zinc oxide film on a part of the conductive long substrate; a second step of stopping the application of the electric field and the transportation; and a third step of bringing at least a region of a part of the conductive long substrate being in contact with the electrodeposition bath in the second step into non-contact with the electrodeposition bath, and an apparatus suitably used for the process. The process and apparatus enables high-quality zinc oxide films to be produced.
    Type: Grant
    Filed: July 3, 2001
    Date of Patent: May 11, 2004
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yuichi Sonoda, Kozo Arao, Noboru Toyama, Yusuke Miyamoto
  • Patent number: 6475367
    Abstract: There is disclosed an electrodeposition method capable of suppressing the drop in the power supply voltage and minimizing the heat loss by the electrodeposition current, thereby achieving uniform film formation with satisfactory characteristics. A conductive substrate is dipped in an electrodeposition bath held in an electrodeposition tank, and an oxide is electrolytically deposited on the conductive substrate.
    Type: Grant
    Filed: February 9, 2000
    Date of Patent: November 5, 2002
    Assignee: Canon Kabushiki Kaisha
    Inventors: Noboru Toyama, Kozo Arao, Yuichi Sonoda, Yusuke Miyamoto
  • Patent number: 5637205
    Abstract: The invention describes a process for the electrolytical coating of an object of steel on one or both sides. Preferably, the object is a steel strip with zinc or a zinc iron alloy. Zinc or a zinc iron alloy is deposited on the object when the object is connected to form the cathode of a galvanic cell in an aqueous solution of zinc chloride and iron chloride with a pH of 0.1 to 3.0. The zinc chloride solution has a concentration of 50 to 1000 g/l for the deposition of metallic zinc. A partial flow of electrolyte solution is past continuously into a column filled with metallic zinc, where the trivalent iron formed there during the electrolysis is reduced to a bivalent iron, and metallic zinc is dissolved simultaneously therewith. The invention also describes an apparatus for the electrolytical coating of an object of steel.
    Type: Grant
    Filed: December 20, 1993
    Date of Patent: June 10, 1997
    Assignee: Andritz-Patentverwaltungs-Gesellschaft M.B.H.
    Inventors: Ulrich Krupicka, Gerald Maresch
  • Patent number: 5618401
    Abstract: A method of making, for cathode ray tubes and the like, an inner shield material that has superior magnetic characteristics and rust resistance. The method does not require conventional blackening processes. Sheet steel or strip is nickel-plated with a nickel-iron diffusion layer and then annealed. The annealing improves the magnetic characteristics. The sheet is cold-rolled prior to annealing to provide a roughened surface, which decreases the chances of sticking during the annealing process. In one embodiment the sheet is pickled, cold-rolled, annealed, cold rolled again, nickel plated, and then annealed again. Annealing between the first and second cold-rolling operations improves the magnetic characteristics.
    Type: Grant
    Filed: January 24, 1995
    Date of Patent: April 8, 1997
    Assignee: Toyo Kohan Co., Ltd.
    Inventors: Giichiro Nomura, Osamu Yubuta
  • Patent number: 5618391
    Abstract: In a device for electrolytically coating one side of metal strips (2), the metal strips to be coated are guided around a rotary cathodic current roller (1), which they contact, and a partially cylindrical, insoluble anode (3) is arranged approximately concentrically around the current roller, at a distance thereof. The interval (4) between the section (21) of the strip guided on the current roller (1) and the anode (3) is delimited in the area of the strip edges (22) by seals (5) which can be oriented in a direction parallel to the axis of the roller. The electrolyte flows through the interval (4).
    Type: Grant
    Filed: May 9, 1995
    Date of Patent: April 8, 1997
    Inventors: Hans J. May, Roland Schnettler
  • Patent number: 5322614
    Abstract: In a process for the electrolytic deposition of metal on one side of a strip, preferably a steel strip which forms the cathode, the section (7) of the strip to be coated is guided through a gap between two parallel anodes (3,4) which are insoluble in the electrolyte (6). A voltage can be applied to the anodes (3,4) independently of each other. One of the two anodes is subdivided perpendicular to the direction of motion of the strip into several sections (41, 42, 43, 44) electrically insulated from each other. Voltages are selectively and independently applied to the anode sections to prevent the side of the strip facing the anode sections from being permanently coated and to prevent passivation of the anode sections.
    Type: Grant
    Filed: August 6, 1991
    Date of Patent: June 21, 1994
    Inventors: Hans J. May, Roland Schnettler