Abstract: In some method and apparatus disclosed herein, the profile of current delivered to the substrate provides a relatively uniform current density on the substrate surface during immersion. These methods include controlling the current density applied across a substrate's surface during immersion by dynamically controlling the current to account for the changing substrate surface area in contact with electrolyte during immersion. In some cases, current density pulses and/or steps are used during immersion, as well.

Abstract: To reduce a liquid discharge amount by vibrating meniscuses at high acceleration with displacement of partitions, a plurality of partitions, each formed of a piezoelectric material, are provided to thereby form a plurality of pressure chambers. Each of electrode pairs for shear-deforming each partition is arranged on both sides of a corresponding one of the partitions. A nozzle plate having nozzles each connected to one of the pressure chambers is arranged on the side of a first end of the pressure chambers. Each pressure chamber is formed such that the width of the pressure chamber becomes long as it approaches, from the first end, a second end on the opposite side.

Abstract: An object of the present invention is to obtain a hard disk substrate that can have a smooth surface of a plating film through electroless NiP plating and does not have deteriorated corrosion resistance against acid solutions.

Abstract: An apparatus and a method are disclosed that form an anodic oxide coating on part of the outer surface of a profile having an irregular cross-sectional shape. A partial anodizing apparatus that is used to partially anodize a profile having an irregular cross-sectional shape includes an electrolytic bath that is divided into two or more partial baths. The profile is held using the two or more partial baths so that part of the profile is situated outside the electrolytic bath to form a sealed electrolysis chamber.

Abstract: There is provided a method for producing a surface-treated metallic material, by use of which a metallic material having a stable and excellent sliding characteristic can be produced with a low environmental load without covering the metallic material surface with an oxide film. The method for producing a surface-treated metallic material includes immersing an anode and a cathode in an electrolyte solution, placing a metallic material used as a material to be treated above the surface of the electrolyte solution, and applying a voltage between the anode and the cathode to treat the metallic material surface, the voltage being equal to or higher than a voltage for causing a complete plasma state.

Abstract: A plating fixture that affords improved control and process repeatability of the placement of material on a surface of a terminal lead is described. The thereby plated terminal lead is further incorporatable into an electrochemical cell. The plating fixture consists of a membrane that prevents migration of the electroplating chemicals along areas of the lead that are not desired. Furthermore, the fixture utilizes a setup plate that controls the length of the lead that is plated.

Abstract: Solar cells are produced using a method for producing solar cells, wherein silicon containing vitreous substrates is provided, wherein each substrate is provided with an electrically conductive material on at least one side thereof. In the method, at least a portion of each substrate is successively transported through an electrolytic solution that is present in an electrolytic bath, and the electrically conductive material as the cathode is connected during the transport of the substrates through the electrolytic bath for the purpose of electrodepositing material from the electrolytic solution onto the electrically conductive material during said transport, wherein the substrates are suspended from a conveyor element during transport and extend in the transport direction.

Abstract: A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:

Abstract: A processed product is continuously partially plated without being covered. Electroplating is carried out on a portion other than a head of a processed product also having a lower part and a constricted part between the head and the lower part. A pair of rails has an opening between the rails narrower than the head and broader than the constricted part, and electrodes are arranged thereon. A plating bath is positioned below the rails, and electrode plates are arranged in a plating solution. The constricted part of the processed product is positioned at the opening between the rails, and a pushing element extending from above the rails through the opening contacts the processed product at a position lower than the center of gravity at the lower part. The pushing element is displaced along the rails to plate a portion of the processed products positioned below the rails.

Abstract: Disclosed herein are functionalized polymers comprising ethylene and substituted ethylene segments, which have been crosslinked using a multifunctional thiol to enhance their crosslinking ability. These functionalized polymers are useful as film forming resins in cathodic electrocoating compositions. Also disclosed herein are aqueous dispersion compositions comprising the functionalized polymers and a process for coating various electrically conductive substrates.

Abstract: The present disclosure is directed to an anticrater additive that is useful for providing a smooth surface to a cured layer of an electrocoating composition on a substrate. The anticrater additive comprises the reaction product of a polyisocyanate with an acrylic polymer having one isocyanate reactive functional group. The acrylic polymer can be an acrylic polymer that is terminated with a chain transfer agent. Also disclosed is an electrocoat composition comprising the anticrater additive and a substrate coated with a cured layer of the electrocoat composition.

Abstract: The invention relates to methods and devices for forming and measuring lipid bilayers, for example, by joining lipid monolayers that self-assemble at the interface of aqueous and organic phases using sessile aqueous droplets in contact with a measurement electrode. At least one of the aqueous solution, the lower aqueous phase, and/or the upper organic phase comprise lipids. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Abstract: A processed product is continuously partially plated without being covered. Electroplating is carried out on a portion other than a head of a processed product also having a lower part and a constricted part between the head and the lower part. A pair of rails has an opening between the rails narrower than the head and broader than the constricted part, and electrodes are arranged thereon. A plating bath is positioned below the rails, and electrode plates are arranged in a plating solution. The constricted part of the processed product is positioned at the opening between the rails, and a pushing element extending from above the rails through the opening contacts the processed product at a position lower than the center of gravity at the lower part. The pushing element is displaced along the rails to plate a portion of the processed products positioned below the rails.

Abstract: An electroplating method includes steps of: providing a substrate having a first portion and a second portion connected to the first portion; forming a metallic layer on a surface of the second portion; immersing the first portion of the substrate in an electrolyte solution, applying a current to the metallic layer to electroplate the first portion of the substrate with a metal layer; and moving the substrate in a direction away from the electrolyte solution during electroplating the first portion of the substrate. The method can improve a uniformity of the obtained plating layer.

Abstract: An electrode assembly for use with an electrodeposition process. According to an exemplary embodiment, the electrode assembly includes an electrode for exchanging electrical current with a solution, a passageway for removing gas that becomes trapped between a workpiece and the solution, and a sleeve for electrically isolating the electrode from the workpiece.

Abstract: This invention relates generally to a method and apparatus for electroplating selected portions of a high contact force, high elastic response range pin-receiving and cylindrical electrical contact having a pair of spaced apart cantilever beams which extend forwardly from a base to a pin-receiving end. In accordance with the invention at least one plating cell is provided including a cavity type of enclosure thereof in general matching the outer contour of the lower portion and pin receiving end of the contact whereas plating solution is ejected towards the pin receiving end including at least one conducting device for electric current is provided adjacent to the opposite region of the contact for engaging with thereof whereas electric current is being conducted.

Abstract: The present invention relates to electrolytic recovery of metal, and in particular methods and apparatus for producing cathode plates suitable for such electrolytic recovery. The invention provides a method of providing an electrically conductive coating on a cathode plate comprising inverting and submerging an upper portion of the cathode plate in an electrolytic bath adjacent at least one anode and applying a current to electroplate the upper portion of the cathode plate wherein each anode includes: i) a first base portion adapted to be positioned adjacent to a hanger bar of said cathode plate; ii) a second extended portion connected to and extending from the base portion and adapted to be positioned adjacent a blade of the cathode plate wherein the profile of each anode is shaped such that in use, a consistent thickness of coating is electroplated over said hanger bar and cathode blade.

Abstract: Herein disclosed are an electrode and a method for making an electrode having an enhanced electrically effective surface providing an increased signal to noise ratio. The electrode having a metal surface selected from gold, tungsten, stainless steel, platinum, platinum-tungsten, platinum-iridium, and combinations thereof; and an electrically conductive coating on said metal surface, said coating consisting essentially of polymerized pyrrole.

Abstract: This invention relates generally to a method and apparatus for electroplating selected portions of elongate and generally cylindrical metallic articles pre assembled and held in spaced-apart fashion into a nonconductive support member encircled by a metallic tube like member one portion of article extending from one side of support member with the opposing portion of article extending from the opposing end of support member including a locating device to receive the articles so the portion of the articles to be electroplated extends downwardly. At least one plating cell is provided adjacent the lower region for contacting the downwardly extending portion of the articles with plating liquid whereas the plating liquid is ejected towards the articles including at least one conducting device for electric current is provided adjacent to the upper region for engaging with the portion of article extending upwardly whereas the electric current is being distributed to articles evenly and complete.

Abstract: A primer (16) for forming a resin frame (17) is formed on an outer end portion (16p) of a separator (1) of a fuel cell. An electrodeposition coating device (2) includes an upper frame (21) and a lower frame (22), and covers only the outer end portion (16p) of the substrate (11) with a center portion (12) of the substrate (11) left uncovered. When the substrate (11) is sandwiched between the upper frame (21) and the lower frame (22) of the electrodeposition coating device (2), an annular electrodeposition chamber (31) is formed with the outer end portion (16p) of the substrate (11) located in the electrodeposition chamber (31). Then, the electrodeposition chamber (31) is filled with an electrodeposition coating solution (32), and electrodeposition coating is performed. Then, cleaning is performed by using purified water, and drying is performed by using hightemperature air.

Abstract: A method of processing a probe element includes (a) providing a probe element comprising a first conductive material, and (b) coating only a tip portion of the probe element with a second conductive material.

Abstract: An electroplating method includes steps of: providing a substrate having a first portion and a second portion connected to the first portion; forming a metallic layer on a surface of the second portion; immersing the first portion of the substrate in an electrolyte solution, applying a current to the metallic layer to electroplate the first portion of the substrate with a metal layer; and moving the substrate in a direction away from the electrolyte solution during electroplating the first portion of the substrate. The method can improve a uniformity of the obtained plating layer.

Abstract: A tank is utilized for containing a plating solution. A rotatable support assembly rotatably supports a combustion chamber component relative to the tank for providing partial immersion of the combustion chamber component within the plating solution. An anode is positioned within the tank proximate a surface of the combustion chamber component to be electroplated. A current source is connected to the anode and in electrical contact with the combustion chamber component. When the combustion chamber component is rotated, the submerged portions are deposited with metal from the plating solution.

Abstract: A plating machine for plating a film carrier tape for mounting electronic parts includes a plating tank for plating wiring patterns of a film carrier tape and also has a bubble adhesion prevention means that is position adjustable with respect to the surface of a plating solution contained in the plating tank. The process for producing film carrier tapes for mounting electronic parts comprises partially immersing a film carrier tape in a plating solution contained in a plating tank and selectively plating wiring patterns formed in the immersed area while adsorbing bubbles generated in the plating solution to a bubble adhesion prevention means arranged at the surface of the plating solution.

Abstract: The present invention discloses a surface treatment process for enhancing both the release rate of metal ions from a sacrificial electrode, and the working life of the electrode. A high density of micro pores are formed on the surface of the sacrificial electrode. Chlorine ions are then implanted into the pores. The chlorine ions prevent a passive film from forming on the sacrificial electrode during use, in which an electric current flows through the sacrificial electrode.

Abstract: A tool for electroplating a portion of the surface of each of a plurality of pieces includes a first plate having a plurality of holes, and a second plate having a plurality of retaining elements. Each of the holes is configured to receive a piece that is to be electroplated, and to mask a portion of the surface and expose another portion of the surface of the piece. The first and second plates are held together, and a mechanism is provided for shifting one of the plates with respect to the other between a first orientation in which the retaining elements are disengaged from pieces received in the holes and a second orientation in which the retaining elements are engaged with pieces received in the holes. This arrangement allows the pieces to be quickly and easily retained for an electroplating operation and released after the electroplating operation.

Abstract: A method to make probes of a probe card includes providing a blocking plate on an electroplating tank. The blocking plate has a plurality of openings according to the layout of contact pads on a probe head. There are bumps on the contact pads of the probe head. Continuous electroplating process can be executed after bumps (contact pads) contact electroplating solution in the electroplating tank through the openings of the blocking plate. By continuously moving the probe head according to the desired shape of probes, probes were formed by electroplating. These probes can be made into different shapes with good uniformity in elasticity and heights to increase the quality of electrical contact during wafer probing. Moreover, the process lead time and fabrication cost are saved.

Abstract: A method and apparatus for providing a uniform current density across an immersed surface of a substrate during an immersion process. The method includes the steps of determining a time varying area of an immersed portion of the substrate during the immersion process, and supplying a time varying current to the substrate during the immersion process, wherein the time varying current is proportional to the time varying area and is configured to provide a constant current density to the immersed portion of the substrate.

Abstract: A method is described for electroplating a cylindrical inside surface (4) of a work-piece (3) extending substantially over a semi-circle, with an electrolyte being conveyed from a bath (8) in a circulation through a gap (9) between the inside surface (4) and a revolving guide means (6). In order to ensure advantageous coating conditions it is proposed that the electrolyte is conveyed with the help of the guide means (6) immersed only partly in the bath (8) in the circumferential direction through the gap (9) between the guide means (6) and the work-piece (3) guided outside of the bath (8).

Abstract: A method for immersing a substrate into a processing solution. The method includes connecting a power supply between a conductive layer on the substrate and an electrode positioned in the processing solution, immersing the substrate into the processing solution, and applying an electrical bias to the conductive layer during the immersion.

Abstract: Enhanced Electrochemical fabrication processes are provided that can form three-dimensional multi-layer structures using semiconductor based circuitry as a substrate. Electrically functional portions of the structure are formed from structural material (e.g. nickel) that adheres to contact pads of the circuit. Aluminum contact pads and silicon structures are protected from copper diffusion damage by application of appropriate barrier layers. In some embodiments, nickel is applied to the aluminum contact pads via solder bump formation techniques using electroless nickel plating. In other embodiments, selective electroless copper plating or direct metallization is used to plate sacrificial material directly onto dielectric passivation layers. In still other embodiments, structural material deposition locations are shielded, then sacrificial material is deposited, the shielding is removed, and then structural material is deposited.

Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are form from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurs during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

Abstract: The present process for electrodepositing a zinc oxide film comprises the steps of immersing a substrate and an opposing electrode in an electrodeposition bath which contains zinc nitrate and is kept heated, and forming the zinc oxide film on the substrate by passing a current between the substrate and the opposing electrode, wherein the process further includes a step of trapping the particles of zinc oxide precipitated in the electrodeposition bath by circulating or stirring the bath before the formation of the zinc oxide film, whereby the present process can prevent the generated zinc oxide powder from depositing on the surfaces of the substrate and the zinc oxide film formed by electrodeposition when restarting or starting the formation of a zinc oxide film by the electrodeposition using an electrodeposition apparatus, and hence the formation of a uniform zinc oxide film free from defects.

Abstract: An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in the electrochemical plating system by tilting the substrate as it enters the electrolyte solution to limit the trapping or formation of air bubbles in the electrolyte solution between the substrate and the substrate holder. In another aspect, an apparatus is provided for electroplating that comprises a cell, a substrate holder, and an actuator. The actuator can displace the substrate holder assembly in the x and z directions and also tilt the substrate. In another aspect, a method is provided of driving a meniscus formed by electrolyte solution across a surface of a substrate. The method comprises enhancing the interaction between the electrolyte solution meniscus and the surface as the substrate is immersed into the electrolyte solution.

Abstract: An apparatus and process for electroplating a pin grid array device having a plurality of pins, the pins having a side surface and an extremity. The apparatus comprises a contact plate defining a plane and having a plurality of electrically conductive flexible contact fingers extending from the contact plate away from the plane, the contact fingers adapted to flex when contacted by the pins. The process comprises contacting each of the plurality of pins with a flexible contact finger extending from a single electrically conductive plate, the conductive plate defining a plane, wherein the flexible contact fingers extend away from the plane.

Abstract: The electroplating of copper is the leading technology for forming copper lines on integrated circuits. In the copper electroplating process a negative potential is applied to the semiconductor wafer with the surface of the semiconductor wafer acting as the cathode. The anode will be partially or wholly formed with copper. Both the anode and the semiconductor will be exposed to a solution comprising copper electrolytes. By reducing the temperature of the copper electrolytes solution below 25° C. the rate of self annealing grain growth will increase reducing the final resistively of the copper lines.

Abstract: The present invention relates to an apparatus and method for electroplating gravure cylinders that are used for gravure printing. The apparatus and method preferably utilize rectifiers that are able to pulse direct current several hundred times per second in order to repeatedly and intermittently establish an electric field between a supply of plating material and the gravure cylinder.

Abstract: A system and a method for selective plating processes are disclosed which use directed beams of high intensity acoustic waves to create non-linear effects that alter and improve the plating process. The directed beams are focused on the surface of an object, which in one embodiment is immersed in a plating solution, and in another embodiment is suspended above a plating solution. The plating processes provide precise control of the thickness of the layers of the plating, while at the same time, in at least some incidents, eliminates the need for masking.

Abstract: One electrode is provided in association with the object to be coated, the other electrode. A pre-stretched ion-exchange membrane in a thin tubular form is sandwiched inbetween two nonconductive water permeable screen tubular housings. The assembly contains a supply line that provides a water way for the electrolyte to flow from the top of the device into a lower cap, then to the lower cap reservoir that allows stabilization and disbursement of electrolyte through the rifled housing Inertia developed through this defined pattern creates a swirling action that scrubs the impurities away from the anode, and to the top of the device to be carried out top. The location of the supply line is just inside the inner screen inserted through both the upper housing and lower cap. The tubular electrode is provided to the inside of membrane housing completing the inner portion of the waterway return chamber.

Abstract: An apparatus for measuring the throwing power of electroplating solutions which provides a nearly linear current density distribution across the panel. The apparatus includes a cylindrical body adapted for rotation about a longitudinal axis thereof, a cylindrical cathode arranged coaxially about a central portion of the cylindrical body, an anode coaxially positioned at a lower end portion of the cylindrical body, a conical shield coaxially arranged around an upper end portion of the cathode; and an annular disk-baffle coaxially arranged around a lower end portion of the cathode. The conical shield and the disk-baffle provide a substantially linear current distribution over the cathode.

Abstract: A process is provided for producing an abrasive coating on a substrate surface by applying a bond coat by low pressure plasma spraying and anchoring to the bond coat abrasive particles by electroplating and embedding the particles into an oxidation resistant matrix by entrapment plating.

Abstract: An apparatus and method for electroplating and deplating a rotogravure cylinder out of a plating solution using ultrasonic energy is disclosed. The apparatus includes a plating tank adapted to rotatably maintain the cylinder and to contain a plating solution so that the cylinder is at least partially disposed into the plating solution. The apparatus also includes a mounting structure mountable within the tank partially on each side of and generally below the cylinder, along with a plurality of conductors at least partially disposed within the plating solution. A current source is electrically connected to the upper portions of the conductors and to the cylinder. An ultrasonic system to introduce wave energy into the plating solution includes at least one transducer element mountable within the tank and a power generator adapted to provide electrical energy to the transducer element. A holding tank having a circulating pump and heating and cooling elements for the plating solution may be provided.

Abstract: A process and apparatus for electrolytically surface-coating special metal workpieces in which the electrolyte is conveyed in a controlled circuit in and around the electrolysis region in that most of it is conveyed at a high flow rate, at a higher inlet pressure, through the space between a cathodically connected workpiece and an anode and a smaller proportion of it is conveyed at a lower flow rate upwards to the rear of the anode away from the cathode. After leaving the electrolysis region the electrolyte is taken into a separate overflow tank and/or in the feed back system.

Abstract: A clamp for use in an electrolytic plating bath is disclosed. The clamp comprises two levers pivotally attached to each other at a fulcrum wherein the clamp, when floating on top of a liquid, is in an open position but when submerged is caused, by virtue of its buoyancy, to move to a closed position. Each lever comprises a first part integrally attached to a second part. The first part and the second part are situated on opposite sides of the fulcrum from each other such that rotational movement about the fulcrum between the open position and the closed position causes the second parts of each lever to move from an upper position to a lower position. In operation, at least one substrate is supported in a substantially vertical plane for submersion into an electrolyte bath. The substrate is positioned over the electrolyte bath and then is submersed into it. The clamp clamps the substrate at its lower edge as the substrate enters the electrolyte bath.

Abstract: A precision high rate electroplating cell comprising a rotating anode/jet assembly (RAJA) immersed in the electrolyte and having high pressure electrolyte jets aimed at the substrate (cathode). The high pressure jets facilitate efficient turbulent agitation at the substrate's surface, even when it consists of complex shapes or mask patterns. High aspect ratio areas receive similar degree of agitation (and replenishment) as areas of lower aspect ratios. As a result, thickness and composition micro-uniformities are substantially improved while utilizing significantly higher current densities and plating rates.

Abstract: Flow dividers for dividing a hot gas flow into serveral partial flows through parallel internal channels are used in heat exchangers and as catalyst carriers, and can be produced by shaping the flow divider from metallic aluminium through extrusion or winding, then converting it to hydrated aluminium oxide through anodic oxidation while it is slowly moving down into an electrolyte (4), and finally converting it to alpha-alumina through heat treatment.