Abstract: A window member including a base substrate and a light shielding layer including a first light shielding pattern disposed in a first area of the base substrate and a second light shielding pattern disposed in a second area of the base substrate while being spaced apart from the first light shielding pattern and providing a signal transmission area at an inner side thereof. The second light shielding pattern includes an edge having a plurality of curved portions on a plane. This arrangement reduces an area of the light shielding pattern adjacent to the signal transmission area of the window member.

Abstract: Embodiments are directed to a method for manufacturing a product comprising: establishing, by a computing device comprising a processor, at least one parameter of a particular instance of a component to be used in the product, adapting, by the computing device, a baseline model of the component based on the at least one parameter to accommodate use of the particular instance of the component, growing a structure based on the adapted model to accommodate the particular instance of the component using an additive manufacturing technique, coupling the structure to the particular instance of the component, growing an electrical harness by using additive printing to establish an electrical cable, and assembling the product by coupling the electrical harness to the particular instance of the component.

Abstract: A self-aligning swaging punch is provided for adjoining together a pin and a workpiece having a pinhole. The swaging punch comprises a shaft and a tip having an open-ended cavity. The shaft transfers an axial force from a press or hammer to the tip. The tip transfers the axial force from the shaft to a top surface of the workpiece near the pinhole. The tip may be spherical in shape for evenly deforming the workpiece near the upper edge of the pinhole. The open-ended cavity receives the pin therein and allows the pin to extend at least partially into the open-ended cavity while the tip contacts the workpiece. The open-ended cavity also ensures that the swaging punch is aligned with the pinhole and perpendicular to the surface of the workpiece when the pin is inserted into the pinhole such that the workpiece evenly deforms and presses against the pin.

Abstract: A process is provided for contacting a nanostructured surface. In that process, a substrate is provided having a nanostructured material on a surface, the substrate being conductive and the nanostructured material being coated with an insulating material. A portion of the nanostructured material is at least partially removed. A conductor is deposited on the substrate in such a way that it is in electrical contact with the substrate through the area where the nanostructured material has been at least partially removed.

Abstract: Electroplating systems and methods are provided that employ a structure for defining a zone of deposition for co-depositing metal and nanomaterial on a cathode. Materials that may be co-deposited include copper and carbon nanotubes Pulsed power may be employed to produce a more dimensionally uniform and/or more functionally uniform deposit.

Abstract: According to one embodiment, a pattern transfer mold includes a base body, first and second stacked bodies, first and second electrodes. The base body includes a base unit including a first surface, a first protrusion provided on the first surface and having a first side surface, and a second protrusion provided on the first surface, separated from the first protrusion, and having a second side surface opposing the first side surface. The first stacked body is provided on the first side surface, and includes first conductive layers and a first insulating layer. The second stacked body is provided on the second side surface, separated from the first stacked body, and includes second conductive layers and a second insulating layer. The first electrode is electrically connected to at least one of the first conductive layers. The second electrode is electrically connected to at least one of the second conductive layers.

Abstract: A perpendicular write head, the write head having an air bearing surface, the write head including a magnetic write pole, wherein at the air bearing surface, the write pole has a trailing side, a leading side that is opposite the trailing side, and first and second sides; side gaps, wherein the side gaps are proximate the write pole along the first and second side edges; and side shields proximate the side gaps, wherein the side shields have gap facing surfaces and include at least one set of alternating layers of magnetic and non-magnetic materials, wherein only one kind of material makes up the gap facing surfaces at the air bearing surfaces.

Abstract: A plating fixture that affords improved control and process repeatability of the placement of material on a surface of a terminal lead is described. The thereby plated terminal lead is further incorporatable into an electrochemical cell. The plating fixture consists of a membrane that prevents migration of the electroplating chemicals along areas of the lead that are not desired. Furthermore, the fixture utilizes a setup plate that controls the length of the lead that is plated.

Abstract: Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.

Abstract: A voltage is applied between a stainless steel plate and an electrode such that the stainless steel plate is an anode, whereby a passive film formed at a portion to be plated of the stainless steel plate melts due to the reduction reaction and is removed. Thereafter, a voltage is applied between the stainless steel plate and the electrode such that the stainless steel plate is a cathode, whereby a plating underlayer is formed at the portion to be plated of the stainless steel plate from which the passive film is removed.

Abstract: Due to repeated use of a gauge portion, used to perform positioning and accuracy comparison measurement at the time of manufacture of various type of molds for metalworking, a gauge line on an outer circumferential surface portion of the gauge portion can disappear due to friction. A plug gauge body, which helps a user recognize the time for maintenance and replacement of the plug gauge, has a constricted portion formed on one side of a shank portion and a cylindrical gauge portion having a uniform diameter and extending from one side of the constricted portion, with the shank portion, the constricted portion, and the gauge portion, being formed axially, a wear checking gauge line having a predetermined depth and width formed so as to extend from one end portion of an outer circumferential surface portion of the gauge portion in the direction of the constricted portion.

Abstract: The present disclosure relates to an electro-chemical plating (ECP) process which utilizes a dummy electrode as a cathode to perform plating for sustained idle times to mitigate additive dissociation. The dummy electrode also allows for localized plating function to improve product gapfill, and decrease wafer non-uniformity. A wide range of electroplating recipes may be applied with this strategy, comprising current plating up to approximately 200 Amps, localized plating with a resolution of approximately 1 mm, and reverse plating to remove material from the dummy electrode accumulated during the dummy plating process and replenish ionic material within the electroplating solution.

Abstract: The present invention relates to the fabrication of complicated electronic and/or mechanical structures and devices and components using homogeneous or heterogeneous 3D additive build processes. In particular the invention relates to selective metallization processes including electroless and/or electrolytic metallization.

Abstract: Certain embodiments herein relate to a method of electroplating copper into damascene features using a low copper concentration electrolyte having less than about 10 g/L copper ions and about 2-15 g/L acid. Using the low copper electrolyte produces a relatively high overpotential on the plating substrate surface, allowing for a slow plating process with few fill defects. The low copper electrolyte may have a relatively high cloud point.

Abstract: The present invention relates to a method and device for the electrochemical treatment of at least one component, which has a treatment chamber and at least one feed unit for an electrolyte to the treatment chamber, and at least one way for setting the pH value of the electrolyte being provided before the treatment chamber.

Abstract: The present invention relates to the manufacturing method of metal clad laminates by forming a conductive layer on a single side or both sides of a material film that is made of an insulating material using the silver complexes having a unique structure and electroplating metals outside of said conductive layer. The present invention can provide the manufacturing method of metal clad laminates, which has a fast operation speed for mass production, simple process steps to minimize defective ratio and cheap production cost.

Abstract: A method of depositing nano-dots on a substrate includes forming a template on the base, the template defining nano-pores, at least partially filling the nano-pores with a pillar material to define nano-pillars, depositing a dot material on the nano-pillars to define nano-dots on the nano-pillars, and contact printing the substrate with the array of nano-dots.

Abstract: Disclosed is a method of treating the surface of an electrically conducting substrate surface wherein a tool comprising an ion-conducting solid material is brought into contact at least in some areas with the substrate surface. The tool conducts the metal ions of the substrate and an electric potential is applied so that an electrical potential gradient is applied between the substrate surface and the tool in such a manner that metal ions are drawn from the substrate surface or deposited onto the substrate surface by means of the tool.

Abstract: An apparatus and a method suited for metal plating aircraft engine components that allows the creation a local environment for plating by covering a localized area to be plated so that the localized area to be plated is sealed from remaining parts of the component, thereby eliminating the need for masking remaining parts of the component prior to plating.

Abstract: Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers.

Abstract: Some implementations provide a substrate that includes a first dielectric layer, a second dielectric layer, a core layer, and a composite conductive trace. The first and second dielectric layers have a first coefficient of thermal expansion (CTE). The core layer is between the first dielectric layer and the second dielectric layer. The composite conductive trace is between the first dielectric layer and the second dielectric layer. The composite conductive trace includes copper and another material. The composite conductive trace has a second CTE that is less than a third CTE for copper to more closely match the first CTE for the first and second dielectric layers.

Abstract: A device contains individually controllable sites for electrochemically monitoring an analyte in interstitial fluid of a user. The sites include a conductive pattern attached at a first and second ends thereof to electrode material in a closed-circuit configuration for receiving a first predetermined voltage applied thereto in order to thermally ablate a stratum corneum of a user's skin to access the interstitial fluid and form an open-circuit configuration including first and second portions of the electrode material that are electrically isolated from each other; a sensing area deposited on at least one of the first and second portions of the electrode material; and a measuring component for receiving individual measurement data from the sensing area in response to a second predetermined voltage applied to the open circuit configuration. The individual measurement data is indicative of an amount of the analyte in the interstitial fluid.

Abstract: The invention relates to a removable anodising agent, in particular for local anodic oxidation of metal surfaces, and its use, and a method for anodic oxidation by means of an anodising agent according to the invention.

Abstract: The present disclosure relates to a film-attached panel having an anti-fingerprint property and a manufacturing method thereof. The film-attached panel includes a base material, a base layer attached on a surface of the base material, an aluminum deposition layer attached on the base layer, the aluminum deposition layer being processed to have hairlines, a passivation layer disposed on the aluminum deposition layer, and a glossy coating layer formed on the passivation layer, wherein a depth of the hairline processed on the aluminum deposition layer is in the range of 0.25 to 0.35 microns.

Abstract: Focused Electric Field Imprinting (FEFI) provides a focused electric field to guide an unplating operation and/or a plating operation to form very fine-pitched metal patterns on a substrate. The process is a variation of the electrochemical unplating process, wherein the process is modified for imprinting range of patterns of around 2000 microns to 20 microns or less in width, and from about 0.1 microns or less to 10 microns or more in depth. Some embodiments curve a proton-exchange membrane whose shape is varied using suction on a backing fluid through a support mask. Other embodiments use a curved electrode. Mask-membrane interaction parameters and process settings vary the feature size, which can generate sub-100-nm features. The feature-generation process is parallelized, and a stepped sequence of such FEFI operations, can generate sub-100-nm lines with sub-100-nm spacing. The described FEFI process is implemented on copper substrate, and also works well on other conductors.

Abstract: A device contains individually controllable sites for electrochemically monitoring an analyte in interstitial fluid of a user. The sites include a conductive pattern attached at a first and second ends thereof to electrode material in a closed-circuit configuration for receiving a first predetermined voltage applied thereto in order to thermally ablate a stratum corneum of a user's skin to access the interstitial fluid and form an open-circuit configuration including first and second portions of the electrode material that are electrically isolated from each other; a sensing area deposited on at least one of the first and second portions of the electrode material; and a measuring component for receiving individual measurement data from the sensing area in response to a second predetermined voltage applied to the open circuit configuration. The individual measurement data is indicative of an amount of the analyte in the interstitial fluid.

Abstract: An electrically conductive protective coating or film is provided over the surface of a reflective coating of a solar mirror by flowing or directing a cation containing liquid and an anion containing liquid onto the conductive surface. The cation and the anion containing liquids are spaced from, and preferably out of contact with one another on the surface of the reflective coating as an electric current is moved through the anion containing liquid, the conductive surface between the liquids and the cation containing liquid to coat the conductive surface with the electrically conductive coating.

Abstract: The present invention is directed to substrates comprising amplified patterns, methods for making the amplified patterns, and methods of using the amplified patterns to form surface features on the substrates.

Abstract: Selectively accelerated or selectively inhibited metal deposition is performed to form metal structures of an electronic device. A desired pattern of an accelerator or of an inhibitor is applied to the substrate; for example, by stamping the substrate with a patterned stamp or spraying a solution using an inkjet printer. In other embodiments, a global layer of accelerator or inhibitor is applied to a substrate and selectively modified in a desired pattern. Thereafter, selective metal deposition is performed.

Abstract: A partial plating method capable of applying fine hard gold plating, a laser plating device capable of applying partial plating to a minute region with high positional precision, and a plated member. The partial plating method comprising plating a region to be plated by projecting a laser beam having a wavelength of 330 nm or more and 450 nm or less. A laser plating device comprises a plating tank, a laser oscillator for emitting a laser beam, a conveying device for conveying a member to be plated, a photoelectronic sensor for detecting the position of a positioning hole of the member to be plated, and a galvanometer scanner having a galvanometer mirror capable of scanning the laser beam. The plated member is applied with fine spot plating by the laser plating device.

Abstract: A chemically amplified positive resist composition is provided comprising an alkali-insoluble or substantially alkali-insoluble polymer having an acid labile group-protected acidic functional group, an alkyl vinyl ether polymer, a photoacid generator, and a benzotriazole compound in a solvent. The composition forms on a substrate a resist film of 5-100 ?m thick which can be briefly developed to form a pattern at a high sensitivity and a high degree of removal or dissolution to bottom.

Abstract: There is provided a nanohair structure with the nanowires exposed on a nanotemplate; the method thereof; and a three-dimensional nanostructure-based sensor with ultra-sensitivity and greatly increased three-dimensional surface-to-volume ratio which immobilizes bio-nanoparticles to the nanohair structure and arranges antibodies to the nano surface with the controlled orientation by physical interaction.

Abstract: Electroplating methods provide substantially uniform deposits of copper on the edges and walls of through-holes of printed circuit boards. The electroplating methods provide copper deposits which have high throwing power.

Abstract: The invention relates to a method and to a device for electrochemical micro- and/or nano-structuring, which are reliable, fast, simple, easy to implement, and reproducible. For this purpose, the invention provides a method of electrochemically structuring a sample (12) of conductive or semiconductor material that has opposite front and rear faces (11 and 13).

Abstract: An apparatus and a method suited for metal plating aircraft engine components that allows the creation a local environment for plating by covering a localized area to be plated so that the localized area to be plated is sealed from remaining parts of the component, thereby eliminating the need for masking remaining parts of the component prior to plating.

Abstract: One exemplary embodiment includes a method of selectively electroplating an electrically conductive coating on portions of a first face of a bipolar plate for use in a proton exchange membrane (PEM) fuel cell. The first face of the bipolar plate defines at least one reactant gas flow channel and a plurality of lands adjacent the at least one channel. The electrically conductive coating may be selectively electroplated on a plurality of first portions of the lands leaving second portions of the lands uncoated by the electrically conductive coating.

Abstract: The inventive method and device for vacuum-compression micro plasma oxidation relate to electrochemical processing of metal, in particular to micro plasma treatment in electrolyte solutions. The aim of said invention is to develop a method for obtaining qualitatively homogeneous coatings by micro-plasma oxidation on large-sized parts, including irregular shaped parts, or simultaneously on a great number of small parts. The second aim of the invention is to design a device for processing parts, having an extended surface area, by using low-power supplies. The inventive method for vacuum-compression micro-plasma oxidation of parts consists in dipping a processable part into an electrolyte solution pre-filled in a sealed container, in generating micro-plasma discharges on the surface of said part and, subsequently, in forming a coating, wherein the micro-plasma discharges are formed in low-pressure conditions above the electrolyte solution.

Abstract: A robotic device has a base and at least one finger having at least two links that are connected in series on rotary joints with at least two degrees of freedom. A brushless motor and an associated controller are located at each joint to produce a rotational movement of a link. Wires for electrical power and communication serially connect the controllers in a distributed control network. A network operating controller coordinates the operation of the network, including power distribution. At least one, but more typically two to five, wires interconnect all the controllers through one or more joints. Motor sensors and external world sensors monitor operating parameters of the robotic hand. The electrical signal output of the sensors can be input anywhere on the distributed control network. V-grooves on the robotic hand locate objects precisely and assist in gripping. The hand is sealed, immersible and has electrical connections through the rotary joints for anodizing in a single dunk without masking.

Abstract: Disclosed herein are electrochemical fabrication platforms for making structures, arrays of structures and functional devices having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods, systems and system components use an electrochemical stamping tool such as solid state polymeric electrolytes for generating patterns of relief and/or recessed features exhibiting excellent reproducibility, pattern fidelity and resolution on surfaces of solid state ionic conductors and in metal. Electrochemical stamping tools are capable high throughput patterning of large substrate areas, are compatible with commercially attractive manufacturing pathways to access a range of functional systems and devices including nano- and micro-electromechanical systems, sensors, energy storage devices, metal masks for printing, interconnects, and integrated electronic circuits.

Abstract: An electrode assembly for use with an electrodeposition process. According to an exemplary embodiment, the electrode assembly includes an electrode for exchanging electrical current with a solution, a passageway for removing gas that becomes trapped between a workpiece and the solution, and a sleeve for electrically isolating the electrode from the workpiece.

Abstract: A method for adsorbing a catalyst, including: a step of applying, to a substrate, a photocurable composition which contains a compound having a polymerizable group and a group that is interactive with a plating catalyst or a precursor thereof, and that, when photo-cured, forms a surface-hydrophobic cured material satisfying the following Requirements 1 and 2; a step of curing the curable composition by pattern-wise exposure, a step of removing uncured materials by development; and a step of bringing an aqueous plating catalyst solution containing a plating catalyst or a precursor thereof and an organic solvent into contact with the substrate, wherein when a palladium-containing test liquid is brought into contact with the substrate having the patterned surface-hydrophobic cured material layer formed thereon, A mg/m2 and B mg/m2, which respectively refer to a palladium adsorption in an area having the surface-hydrophobic cured material layer formed thereon and a palladium adsorption in an area not having the s

Abstract: An electro-composite tribological coating for coating a flexible or compliant structure, for example a structural seal, includes a cobalt and cobalt alloy base containing a fine dispersion of tribologically suitable particles such as chromium carbide (Cr3C2), silicon carbide (SiC), carbon graphite, and the like, which can be deposited directly on the outer surface of the seal as a near-net shape coating requiring little or no mechanical polishing or grinding. The coating is deposited on the seal in one embodiment by an electrolytic bath. In this manner, a near-net shape coating of a desirable thickness, for example having a thickness of about 0.005? and a desirable surface finish can be achieved in the as-plated condition with little or no additional polishing or grinding after coating.

Abstract: A method is provided for electrochemically depositing a polymer with spatial selectivity. A substrate having a substrate surface is contacted with an aqueous solution containing a selectively insolubilizable polysaccharide, such as chitosan, which is subjected to electrochemically treatment to deposit, with spatial selectivity, the selectively insolubilizable polysaccharide on a patterned electrically conductive portion of the substrate surface.

Abstract: In some embodiments, a workpiece-surface-influencing device preferentially contacts the top surface of the workpiece, to chemically modify the surface at desired field areas of the workpiece without affecting the surfaces of cavities or recesses in the field areas. The device includes a substance which is chemically reactive with material forming the workpiece surface. The substance can be in the form of a thin film or coating which contacts the surface of the workpiece to chemically modify that surface. The workpiece-surface-influencing device can be in the form of a solid state applicator such as a roller or a semi-permeable membrane. In some other embodiments, the cavities are filled with material that prevents surface modification of the cavity surfaces while allowing modification of the field areas, or which encourages surface modification of the cavity surfaces while preventing modification of the field areas. The modified surface facilitates selective deposition of materials on the workpiece.

Abstract: A method for the selective surface treatment of a first workpiece on at least one of the metalized areas of the upper and/or underside, the first workpiece being releasably jointed to at least one additional workpiece on one of its faces so as to be sealed from the exterior in at least one partial area and the selective surface treatment of the areas not covered by the joined section being carried out in a treatment phase. Cooling and distribution of the metalized areas is made easier because the first workpiece is not flat and has on at east one face identically or different metalized areas or cavities across a whole or part of a surface. It also has at least one additional metallic protective layer or an additional metallic coating applied during the selective surface treatment.

Abstract: The invention provides method for preparing a conductive device comprising the steps of: (a) providing a non-conductive substrate layer; (b) modifying the surface of the non-conductive substrate layer by means of a laser beam treatment; (c) applying a pattern of an ink on a surface of the substrate layer, which ink comprises a first metal; (d) depositing a second metal on the ink pattern obtained in step (c); and (e) applying a third metal on the second metal by means of electrodeposition. The invention further provides a conductive device obtainable by said method.

Abstract: A microscopic metallic structure is produced by creating or exposing a patterned region of increased conductivity and then forming a conductor on the region using electrodeposition. In some embodiments, a microscopic metallic structure is formed on a substrate, and then the substrate is etched to remove the structure from the substrate. In some embodiments, a focused beam of gallium ion without a deposition precursor gas scans a pattern on a silicon substrate, to produce a conductive pattern on which a copper structure is then formed by electrochemical deposition of one or more metals. The structure can be freed from the substrate by etching, or can used in place. A beam can be used to access an active layer of a transistor, and then a conductor can be electrodeposited to provide a lead for sensing or modifying the transistor operation while it is functioning.

Abstract: Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.

Abstract: A method for making a gasket (32) for an internal combustion engine (20) includes forming a generally annual stopper (38) on a metallic gasket body (40) through the process of electrochemical deposition. An electrolytic cell is completed with the gasket body (40) forming a cathode. The stopper (38) is formed with a contoured compression surface (42) by selectively varying the electrical energy delivered to selected electrodes (70) over time. Electrolyte (48) rich with metallic ions is pumped at high speed through the inter-electrode gap. A PC controller (82) switches selected electrodes (70) ON at certain times, for certain durations, which cause metallic ions in the electrolyte (48) to reduce or deposit onto the gasket body (40), which are built in columns or layers into a three-dimensional formation approximating the target surface profile (106) for the compression surface (42). The subject method for building a three-dimensional formation can be applied to work parts other than cylinder head gaskets (32).

Abstract: A method of electrochemical deposition uses microdroplets of electrolytic solution over a targeted small circuit element. Only the targeted circuit element is electrically biased so that deposition occurs on the surface of that element, underneath the microdroplet, and nowhere else unless it is under other microdroplet(s). The invented method achieves extremely accurate and selective electrochemical deposition with a tiny amount of electrolytic solution, compared to conventional submersive and/or immersive methods, and eliminates the need for masking or etching, reducing the costs of manufacture and amount of waste electrolytic solution produced.