Abstract: A method of fabricating deposits of non-volatile substances, including biomacromolecules, in the form of spots and filing on a substrate surface by electrospray, where the deposits are used to determine the interaction of the deposited non-volatile substances to other substances. Also included in this method is the mass fabrication on a single chip of an array of single and multicomponent microsamples.

Abstract: The invention concerns the manufacture of complex metallic or metallized porous structures, wherein the electroplating metal over the entire developed surface is preceded by a specific pre-metallization of the basic structure. The pre-metallization is obtained by depositing a conductive polymer, which is deposited on the entire developed surface of the structure by the steps of an oxidizing pre-treatment of the structure, depositing in the liquid phase, a monomer having a polymerized foam that is electrically conductive, and polymerizing oxidation-doping of the monomer. The structures according to the invention are particularly intended for use as electrodes for the electrolysis of liquid effluents, as electrode supports for electrochemical generators, as catalyst supports, filtration media, phonic insulation, electromagnetic and nuclear protection structures, or for other applications.

Abstract: Apparatus and methods for manufacturing electrochromic cells. Layers of various inks are printed on substrates by high speed printing means. The electrochromic cells comprise layers of electrode, electrolyte, and counter electrode ink materials which are printed on at least one substrate. When an electrical voltage differential is introduced between the electrode and counter electrode layers, an electrochemical reaction occurs in the electrochemical cell.

Abstract: A method of producing a nozzle plate for use in an ink jet head includes the steps of (a) stretching a predetermined number of resin lines, each having a cross section corresponding in shape to each nozzle hole to be formed in an ink jet head, in the same arrangement as that of nozzle holes to be formed in the ink jet head, (b) plating the peripheral surface of each of the resin lines with a metal, while maintaining the arrangement of the resin lines, (c) forming a nozzle substrate so as to include the resin lines therein with the metal used in the plating of the resin lines, (d) slicing the nozzle substrate, and (e) removing the resin lines from the sliced nozzle substrate, thereby forming the nozzle plate. In the above method, the resin lines can be removed from the nozzle substrate, and then the nozzle substrate can be sliced so as to form the nozzle plate.

Abstract: A process for electroplating metal on a resistive substrate and the article of manufacture produced therefrom are disclosed. The metal layer is electroplated onto the resistive substrate in an electroplating bath having a polarization parameter &xgr; less than approximately 10 such that the metal layer is of substantially uniform thickness. The polarization parameter &xgr; of less than approximately 10 for the electroplating bath can be achieved by numerous means, such as by providing a low metal ion concentration in the electroplating bath or by adding one or more additives to the electroplating bath. The present invention may be used with a variety of metals and resistive substrates.

Abstract: A copolymer of general formula (I), wherein unit A is a monomer of an electronically conductive polymer, unit B is a nucleotide, an oligonucleotide or an analogue thereof, x, y, z are integers of 1 or higher or y is 0, and 1 is a covalent bond, or a spacer arm. Methods for preparing polymer (I) and its use, in particular for nucleic acid synthesis, sequencing and hybridization, are also disclosed.

Abstract: A process comprising electromotively coating an article molded from a sheet molding compound comprising a mixture of: (a) 10-40 percent by weight of a thermosetting resin, (b) 20-60 percent by weight of calcium carbonate particles, (c) 10-40 percent by weight of glass fibers having an aspect ratio of at least 5 and a length of at least 2 cm, and (d) 0.4-3 percent by weight of a carbon black having a primary particle size of less than 125 nm, a nitrogen surface area of at least 275 m2/g, and a dibutyl phthalate absorption of at least 180 cc/100 g; wherein the article has a conductivity of at least 10-7 Siemens/cm (S/cm), a tensile strength of at least 8,500 psi, and a flexural strength of at least 21,000 psi.

Abstract: A method for forming an indium oxide film on an electrically conductive substrate by immersing the substrate and a counter electrode in an aqueous solution containing at least nitrate and indium ions and flowing an electric current between the substrate and the couter electrode, thereby causing indium oxide film formation on the substrate, is provided. A substrate for a semiconductor element and a photovoltaic element produced using the film forming method are also provided. An aqueous solution for the formation of an indium oxide film by an electroless deposition process, containing at least nitrate and indium ions and tartrate, is also disclosed. A film-forming method for the formation of an indium oxide film on a substrate by an electroless deposition process, using the aqueous solution, and a substrate for a semiconductor element and a photovoltaic element produced using the film-forming method are further provided.

Abstract: Process for multi-coat lacquering of a substrate with a stoved first electrodeposition layer by applying a second surface coating layer of 10 to 30 .mu.m dry layer thickness consisting of a base lacquering agent containing a first, water-based, polyurethane resin, and wet-on-wet application of a third coating agent with a thinner dry layer thickness of 7 to 15 .mu.m consisting of a second water-based base lacquering agent, further application without prior stoving of a clear lacquer layer and mutual stoving, wherein the first base lacquering agent has a higher concentration of polyurethane resin than the second base lacquering agent.

Abstract: Proposed is an improvement in the method for the preparation of a battery electrode consisting of a spongy metal sheet to serve as a substrate having a three-dimensional skeletal structure with intercommunicating open pores and an active material filling the open pores of the skeletal structure of the substrate.

Abstract: A copolymer of general formula (I), ##STR1## wherein unit A is a monomer of an electronically conductive polymer, unit B is a nucleotide, an oligonucleotide or an analogue thereof, x, y, z are integers of 1 or higher or y is 0, and l is a covalent bond, or a spacer arm. Methods for preparing said polymer and its use, in particular for nucleic acid synthesis, sequencing and hybridization, are also disclosed.

Abstract: A process of directly plating onto a nonconductive substrate is disclosed. The process comprises the steps of:1) conditioning: modifying a surface of the nonconductive substrate with selected organic hydrocarbons or polymers to enhance its property of adsorbing catalysts;2) catalyzing: immersing the conditioned substrate into a catalyst colloid-containing solution or a catalyst complex-containing solution to let the catalyst be adsorbed onto the substrate;3) accelerating: reducing the catalyst with a suitable acid or basic solution (adapted to the catalyst colloid), or with a reducing agent (adapted to the catalyst complex) to reduce the catalyst being adsorbed onto the substrate;4) enhancing: immersing the substrate after accelerating step into an enhancing agent containing a compound with two ligands;5) electroplating: proceeding with a plating process.

Abstract: A polymer substrate is plated with a metal, using metallic filler particles in the polymer as anchorage points for a layer of metal formed by an electroless plating operation. The polymer has a filler that includes non-metallic filler particles and metallic filler particles; the non-metallic filler particles contiguous to the polymer surface can be etched away, so as to expose metallic filler particles proximate to the etched surfaces. The exposed metallic filler particles serve as anchorage points for the electroless plate layer.

Abstract: A vacuum metallized polyimide film comprising an aromatic polyimide layer containing a hydrocarbyl tin compound in oxidation states (II) or (IV) as an additive and a metal plated layer bonded integrally with a high bonding strength or high adhesion through a vacuum deposited metal layer without the use of an adhesive. The metallized polyimide film can be used for flexible printed circuits and multilayer printed wiring boards, as well as for heaters, antennas and antistatic films.

Abstract: A hollow container for storage and transport of fluid hydrocarbon vehicular fuels is composed of a laminated structure of polymeric resin body component and electrodeposited metal. An interior stratum of polymer chemically resistant to the fuel is joined to a stratum of electroplateable polymer disposed to the exterior of the interior stratum. The laminated polymeric structure is then electroplated to form a skin of metal encapsulating the interior polymeric strata. The tank combines the structural design flexibility of plastic with the metal barrier properties regarding evaporative emissions, permitting the use of high contents of oxygenated species in the fuel.

Abstract: A noise-damping composite is formed by providing a sandwich of a viscoelastic layer between two metal skins, the viscoelastic layer including electrically conductive particles distributed therein. The sandwich is passed through a series of cells of an electro-galvanizing line, in each cell the sandwich passing through the nip formed between a charged electrically conductive contact roller and an electrically insulating pressure roller for applying sufficient pressure to insure conductivity from the metal skin engaging the contact roller through the viscoelastic layer to the other metal skin, so that the galvanizing metal is plated on only the outer surfaces of the two metal skins.

Abstract: A method of improving the electromagnetic (EM) shielding performance of a mposite material is provided. The composite material has conductive and semi-conductive filler particles suspended in a non-conductive resin. The filler particles can be up to 40 weight percent of the composite material. The composite material is electroplated with a conductive material onto a portion of its surface to improve the electrical connection between the conductive material and a portion of the filler particles. EM shielding performance can be further enhanced by injecting an exponentially decaying electromagnetic pulse through the composite material that has been electroplated.

Abstract: A method of improving adhesion of a nickel alloy to the surfaces of diamond particles and articles made therefrom. Diamond particles are electrolessly nickel plating with the nickel alloy formed with a transitional metal, such as molybdenum. Electrolessly plated particles are then gradually heated at a steady rate from room temperature to a desired heat treatment temperature in a non-oxidizing atmosphere formed by argon containing 10% hydrogen. Exemplary articles made by the aforementioned process include a grinding wheel having uniformly dispersed abrasive diamond particles having the Ni/Mo alloy coat thereon.

Abstract: The process for directly metallizing a circuit board having nonconductor surfaces, includes reacting the nonconductor surface with an alkaline permanganate solution to form manganese dioxide chemically adsorbed on the nonconductor surface; forming an aqueous solution of a weak acid having an acid dissociation constant, for loss of a proton in aqueous solution, between 0.1 and 0.01, and of pyrrole or a pyrrole derivative and soluble oligomers thereof; contacting the aqueous solution containing the pyrrole monomer and its oligomers with the nonconductor surface having the manganese dioxide adsorbed chemically thereon to deposit an adherent, electrically conducting, insoluble polymer product on the nonconductor surface; and directly electrodepositing metal on the nonconductor surface having the insoluble adherent polymer product formed thereon. The oligomers are advantageously formed in aqueous solution containing 0.

Abstract: A method for the direct electroplating of a non-conducting substrate and plated substrates so produced are disclosed wherein the non-conducting substrate is first treated with a non-acidic aqueous salt solution containing a micro-fine colloidal distribution of a noble or precious metal and tin to form a strongly adsorbed, uniform, conducting layer of micro-fine colloidal metal cayatalyst upon at least a portion of the substrate surface. The conducting layer is then electroplated directly without the need for electroless plating, conversion coatings, or preferential plating solution additives.