Abstract: A method for preparing an electrode of an inductive component, includes: S1: performing surface insulation treatment, specifically including: placing an inductive component in a tilting and rotating spraying pot, and performing thermal spraying on resin by using a fixed spray gun for surface insulation treatment; S2: exposing an inner electrode, specifically including: processing an electrode area through laser or mechanical polishing to expose the inner electrode; S3: performing surface pretreatment, specifically including: performing degreasing and surface pretreatment with ultrasound in a special solution; S4: performing surface activation treatment, specifically including: performing surface activation treatment with ultrasound in a low-concentration acid solution; S5: electroplating to form a metal layer, specifically including: electroplating to form an electroplated copper layer first, then electroplating to form an electroplated nickel layer, and finally electroplating to form an electroplated tin lay

Abstract: A surface of an article is modified by aluminizing an initial surface at a first temperature to form a first aluminized layer and a sublayer, removing at least a portion of the first aluminized layer, aluminizing the sublayer at a second temperature to form a second aluminized layer, and finally removing at least a portion of the second aluminized layer to form a processed surface. The second temperature is less than the first temperature and a roughness of the processed surface is less than the roughness of the initial surface.

Abstract: A method for coating an interconnect for a solid oxide cell (SOC) stack comprises providing an interconnect substrate comprising Cr and Fe, coating the interconnect substrate with a first metallic layer by electrodeposition, coating the resulting structure with a second layer of metallic cobalt by electrodeposition and coating the resulting structure with a layer of metallic copper by ion-exchange plating. This way, a metallic copper-cobalt coating is formed on the interconnect.

Abstract: A method of manufacturing an external timepiece component, including: a metallic base made of a first material including titanium and/or a first titanium alloy; at least one metallic cover plate made of a second material, this second material including a second metal selected from among gold and platinum and palladium, and/or a second alloy including at least gold or platinum or palladium, this at least one cover plate being of a thickness greater than or equal to 0.5 millimeters; the at least one cover plate is welded to the base to form a bimetallic blank; and the bimetallic blank is shaped and/or machined to give the structural component its final form.

Abstract: A method for making a scissoring type current-perpendicular-to-the-plane magnetoresistive sensor with exchange-coupled soft side shields uses oblique angle ion milling to remove unwanted material from the side edges of the upper free layer. All of the layers making up the sensor stack are deposited as full films. The sensor stack is then ion milled to define the sensor side edges. The side regions are then refilled by deposition of an insulating layer. Next, the lower soft magnetic layers of the exchange-coupled side shields are deposited, which also coats the insulating layer up to and past the side edges of the upper free layer. The soft magnetic material adjacent the side edges of the upper free layer is removed by oblique angle ion beam milling. The material for the antiparallel-coupling (APC) layers is deposited, followed by deposition of the material for the upper soft magnetic layers of the exchange-coupled side shields.

Abstract: Systems and methods for reducing overhang on electroplated surfaces of printed circuit boards are described. One such method includes applying a first resist layer on a substrate having a first copper layer, applying a first image to the first resist layer, developing the first resist layer in accordance with the first image, applying a second copper layer on the first copper layer, electroplating a first metallic layer on the second copper layer, removing the first resist layer, etching a portion of the first copper layer, removing the first metallic layer, depositing a third copper layer on a surface of the assembly, applying a second resist layer on the third copper layer, applying a second image to the second resist layer, developing the second resist layer in accordance with the second image, electroplating a preselected metal layer on the third copper layer, removing the second resist layer, and etching a portion of the third copper layer.

Abstract: A composite dual blackened copper foil includes a copper foil and two blackened layers. The copper foil has a shiny side and a matte side. The blackened layers are formed on the shiny and matte sides respectively. The blackened layers are formed alloy by electroplating in a plating bath consisting essentially of copper, cobalt, nickel, manganese, magnesium and sodium ions. A rough layer is selectively formed between the blackened layer and the shiny side as well as the matte side. Both side of the copper foil is spotless, powder free, and good in etching quality. The copper foil is effective at blocking electromagnetic wave, near infrared, undesired light and the like. The copper foil exhibits strong light absorption and is applicable to direct gas laser drilling. A method of manufacturing the composite dual blackened copper foil is also provided.

Abstract: The present invention relates to an anodized aluminum oxide template that is used to grow periodic nanostructure and method of fabrication of the said template. The invention further relates to the fabrication of the respective periodic nanostructures from diverse materials using hydrothermal and/or CVD method for growing the said nanostructure. The AAO template enabled nanostructure comprises of a substrate disposed on the top of the AAO template; seed/s disposed in the nano-channels/nanopores of the AAO; nanostructures that are grown from respective nano-channels to form substantially uniform distribution/near periodic structure.

Abstract: A plating method for an RF device is disclosed. The method includes (a) pre-treating the RF device made from a substrate material; (b) forming a copper plating layer by applying copper plating to the RF device; and (c) forming a thin-film layer over the copper plating layer, the thin-film layer made of a precious metal, where a thickness of the precious-metal thin-film layer is thinner than a skin depth at a working frequency band. The disclosed method makes it possible to provide a plating treatment with a low cost while providing a superior appearance quality.

Abstract: A method for making a printed wiring member including wire-bondable contact pads and wear-resistant connector pads, the method includes a) providing a blank printed wiring member comprising a copper foil laminated to a dielectric substrate; b) masking the blank printed wiring member to protect regions of the copper foil; c) removing copper in unprotected regions of the blank printed wiring member to form a patterned printed wiring member including contact pads and connector pads; d) depositing a nickel coating on the patterned printed wiring member; e) electrolytically depositing a hard gold layer on the nickel coating; and f) depositing palladium on a surface of the hard gold layer to improve bondability of the contact pads while preserving wear resistance of the connector pads.

Abstract: Impellers made of composite materials with flow path cavities covered by an erosion resistant coating are manufactured by covering removable molds having shapes corresponding to a negative geometry of the flow path cavities, with the erosion resistant coating using plating or thermal spraying. After shaping and curing a composite material around the molds covered with the erosion resistant coating, the molds are removed, while the erosion resistant coating remains on the composite impeller.

Abstract: Disclosed is process for producing a protective layer for protecting a component against high temperatures and aggressive media. The process comprises forming a surface layer comprising aluminum and chromium on a surface of the component to be provided with the protective layer by chromizing and alitizing. The chromizing and/or the alitizing in different regions of the component surface to be protected is carried out simultaneously but differently to result in a protective layer that has different regions.

Abstract: Disclosed is a coating for protecting a component against high temperatures and aggressive media, which coating has at least one subregion whose main constituent is chromium. The layer additionally comprises aluminum, the chromium content at least in the subregion in which chromium is the main constituent being greater than 30% by weight and the aluminum content being greater than or equal to 5% by weight. The invention further provides a process for producing such a coating, comprising chromizing the surface to be coated and subsequently alitizing the chromium-rich layer produced during chromizing.

Abstract: There is disclosed articles for and methods of confining volatile materials in the void volume defined by crystalline void materials. In one embodiment, the hydrogen isotopes are confined inside carbon nanotubes for storage and the production of energy. There is also disclosed a method of generating various reactions by confining the volatile materials inside the crystalline void structure and releasing the confined volatile material. In this embodiment, the released volatile material may be combined with a different material to initiate or sustain a chemical, thermal, nuclear, electrical, mechanical, or biological reaction.

Abstract: A coated article includes a substrate, and a coating deposited on the substrate by magnetron sputtering. The coating includes micropores, and each micropore is sealed by a sealing element.

Abstract: The invention relates to a chemical reactor with a nanometric superstructure, comprising at least one member wherein at least one reaction chamber is arranged, and said reaction chamber being filled at least partially with a high specific surface area material having a specific surface area greater than 5 m2/g, and characterized in that said high specific surface area material is selected from nanotubes or nanofibers. These nanotubes or nanofibers are preferably selected in the group consisting of carbon nanofibers or nanotubes, ?-SiC nanofibers or nanotubes, TiO2 nanofibers or nanotubes. They may be deposited on an intermediate structure selected in the group consisting of glass fibers, carbon fibers, SiC foams, carbon foams, alveolar ?-SiC foams, said intermediate structure filling the reaction chamber of said reactor at least partially.

Abstract: A golf club head is manufactured so as to be at least partially composed of martensitic stainless steel and to have an exterior surface. At least one chromium layer is deposited on at least a portion of the exterior surface of the golf club head. At least one outer layer is deposited by physical vapor deposition on at least a portion of the at least one chromium layer, the outer layer including a metal and a nonmetal.

Abstract: Techniques for fabrication of kesterite Cu—Zn—Sn—(Se,S) films and improved photovoltaic devices based on these films are provided. In one aspect, a method of fabricating a kesterite film having a formula Cu2?xZn1+ySn(S1?zSez)4+q, wherein 0?x?1; 0?y?1; 0?z?1; and ?1?q?1 is provided. The method includes the following steps. A substrate is provided. A bulk precursor layer is formed on the substrate, the bulk precursor layer comprising Cu, Zn, Sn and at least one of S and Se. A capping layer is formed on the bulk precursor layer, the capping layer comprising at least one of Sn, S and Se. The bulk precursor layer and the capping layer are annealed under conditions sufficient to produce the kesterite film having values of x, y, z and q for any given part of the film that deviate from average values of x, y, z and q throughout the film by less than 20 percent.

Abstract: An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 ?In maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5 during baking to provide adequate corrosion resistance during battery operation.

Abstract: A method for silver plating an electrical contact is provided. The method includes cleaning an electrical contact by removing oil or other contaminants and exposing the electrical contact to at least one of an acid or base. The method also includes preparing a silver plating bath including a silver compound, a transition metal compound, and a supporting salt, wherein the transition metal is at least one of nickel or cobalt. The method further includes silver plating the electrical contact in the silver plating bath.

Abstract: The invention relates to a method of providing an electric current taker made from silver and having a highly electroconductive contact surface into an aluminium support bar to be used in electrolysis.

Abstract: A method for coating workpieces which consist of two different metallic materials includes providing the workpiece in a nickel strike electrolyte with a nickel layer as substrate before the application of a corrosion-resistant layer.

Abstract: It is to provide a method for manufacturing a metal electrode having transition metal oxide coating layer and a metal electrode manufactured thereby, which eliminates a contact resistance problem and simultaneously improves electric conductivity of the electrode by using a one body electrode, which is not requiring separate current collector and binder, and further maintains pseudo-capacitance from the redox reaction by coating the metal surface with a transition metal oxide.

Abstract: An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 ?In maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5 during baking to provide adequate corrosion resistance during battery operation.

Abstract: A copper foil with a resistance layer is provided, wherein the variation value is small when it is made into a resistance element, the adhesion with the resin substrate to be laminated with is able to be sufficiently maintained, which has an excellent characteristics as a resistance element for a rigid and a flexible substrate. A copper foil with a resistance layer of the present invention comprises a copper foil on one surface of which a metal layer or alloy layer is formed from which a resistance element is to be formed, the surface of the metal layer or alloy layer being subjected to a roughening treatment with nickel particles. A method of production of a copper foil with a resistance layer of the present invention comprises: forming a resistance layer of phosphorus-containing nickel on a matte surface of an electrodeposited copper foil having crystals comprised of columnar crystal grains wherein a foundation of the matte surface is within a range of 2.5 to 6.

Abstract: An electrical component is provided by a method comprising forming a middle plated layer made of palladium or a palladium alloy on a substrate and forming a surface plated layer made of tin or a tin alloy containing a metal other than palladium on the middle plated layer. Thus, there can be provided an electrical component having a surface layer consisting primarily of tin in which whisker formation can be prevented for a long period under stress.

Abstract: One aspect is a method for the production of a three-dimensional structure of successive layers producing a multitude of successive layers wherein, with the exception of a first layer, each of the successive layers is arranged on a preceding layer. Each of the successive layers includes at least two materials wherein one material is a sacrificial material and one material is a structure material. Each of the successive layers defines a successive cross-section through the three-dimensional structure. Producing each of the layers includes depositing the sacrificial material by means of an electrochemical process and depositing the structure material by means of physical gas phase deposition. After a multitude of successive layers has been produced, the three-dimensional structure is uncovered by removing at least a part of the sacrificial material. The sacrificial material is at least one of a group consisting of nickel, silver, palladium, and gold.

Abstract: A surface treatment process which enables a substrate (polymer) to be given specific physical properties, especially surface nanoporosity, for example with a view to electroless metallizing it, and which completely replaces surface treatment by sulfo-chromic pickling. The surface treatment includes a hybrid UV/corona treatment of the substrate surface followed by non-electrolytic metallization. A device for implementing these processes is also disclosed.

Abstract: A method for making an oxidation resistant article, including (a) depositing a layer of a Pt group metal on a substrate to form a platinized substrate; and (b) depositing on the platinized substrate layer of Pt group metal a layer of a reactive element selected from the group consisting of Hf, Y, La, Ce and Zr and combinations thereof to form a surface modified region thereon, wherein the surface modified region includes the Pt-group metal, Ni, Al and the reactive element in relative concentration to provide a ?-Ni+?-Ni3Al phase constitution.

Abstract: An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 ?In maximizes formation of an intermetallic compound Cu3Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu6Sn5 during baking to provide adequate corrosion resistance during battery operation.

Abstract: A layered composite which has a substrate made of a ferrous material with a PVD/PACVD coating and a corrosion protection layer that is disposed on the PVD/PACVD coating. The PVD/PACVD coating has pores into which the corrosion protection layer protrudes.

Abstract: A Ni—Pt alloy and target superior in workability containing 0.1 to 20 wt % Pt and having a Vickers hardness of 40 to 90. A method of manufacturing the Ni—Pt alloy comprises steps of subjecting a raw material Ni having a purity of 3N level to electrochemical dissolution, neutralizing the electrolytically leached solution with ammonia, removing impurities through filtration with activated carbon, blowing carbon dioxide into the resultant solution to form nickel carbonate, exposing the resultant product to a reducing atmosphere to prepare high purity Ni powder, leaching a raw material Pt having a purity of 3N level with acid, subjecting the leached solution to electrolysis to prepare high purity electrodeposited Pt, and dissolving the resultant high purity Ni powder and high purity electrodeposited Pt. The method enables rolling of the Ni—Pt alloy ingot upon reducing the hardness thereof, which results in the stable and efficient manufacture of a rolled target.

Abstract: An electrochemical deposition method and electrolyte to plate uniform, defect free and smooth gallium films are provided. In a preferred embodiment, the electrolyte may include a solvent that comprises water and at least one monohydroxyl alcohol, a gallium salt, and an acid to control the solution pH and conductivity. The method electrodeposits a gallium film possessing sub-micron thickness on a conductive surface. Such gallium layers are used in fabrication of semiconductor and electronic devices such as thin film solar cells.

Abstract: Provided are probes featuring multiple electrodes, which probes have diameters in the nanometer range and may be inserted into cells or other subjects so as to monitor an electrical characteristic of the subject. The probes may also include a conductive coating on at least one probe element to improve the probes' performance. The probes may also be used to inject a fluid or other agent into the subject and simultaneously monitor changes in the subject's electrical characteristics in response to the injection. Related methods of fabricating and of using the inventive probes are also provided.

Abstract: The invention relates to a method for producing coated spring-loaded steel rails especially for windshield wipers comprising a rubber or elastomer wiper blade, wherein a cold-rolled steel rail blank is provided with a zinc layer, whereafter a zinc-containing anchor layer is produced, and a coating made of a polymerizable coating powder is deposited on the anchor layer and partially cured.

Abstract: A plating method for an RF device is disclosed. The method includes (a) pre-treating the RF device made from a substrate material; (b) forming a copper plating layer by applying copper plating to the RF device; and (c) forming a thin-film layer over the copper plating layer, the thin-film layer made of a precious metal, where a thickness of the precious-metal thin-film layer is thinner than a skin depth at a working frequency band. The disclosed method makes it possible to provide a plating treatment with a low cost while providing a superior appearance quality.

Abstract: The invention relates to a coating method for a workpiece, including the following method steps: a) applying a coating liquid to the workpiece, wherein the coating liquid comprises an ionic liquid containing ions of at least one element, b) electrochemically depositing a layer of the at least one element from the coating liquid on the workpiece, c) removing the workpiece from the coating liquid, d) removing excess coating liquid from the workpiece. In order to suggest an industrially suitable coating process, particularly for workpieces having at least a partial metal surface, using stable, durable baths, it is provided that the temperature of the workpiece is set such that the temperature of the coating liquid deviates by no more than 10° C.

Abstract: The present disclosure provides oxide nanotubes formed by anodizing and oxidatively-annealing a titanium or titanium allow substrate with or without ultrasonication. If desired, carbon nanotubes may be grown in the oxide nanotubes. The substrates show improved specific capacity and charge-discharge rates for use as an electrode in lithium-ion batteries.

Abstract: Embodiments are directed to electrochemically fabricating multi-layer three dimensional structures where each layer comprises at least one structural and at least one sacrificial material and wherein at least some metals or alloys are electrodeposited during the formation of some layers and at least some metals are deposited during the formation of some layers that are either difficult to electrodeposit and/or are difficult to electrodeposit onto. In some embodiments, the hard to electrodeposit metals (e.g. Ti, NiTi, W, Ta, Mo, etc.) may be deposited via chemical or physical vacuum deposition techniques while other techniques are used in other embodiments. In some embodiments, prior to electrodepositing metals, the surface of the previously formed layer is made to undergo appropriate preparation for receiving an electrodeposited material.

Abstract: The disclosure relates to processes for the electrochemical modification of electron emitting materials such as carbon nanotubes. The processes improve the oxidation resistance of the electron emitting materials when they are fired in an oxygen-containing atmosphere such as air. The disclosure also relates to the preparation of cathodes or cathode assemblies, for use in a field emission device, wherein are contained an electron field emitter made from such electron emitting material.

Abstract: In a method for production of a corrosion resistant and/or oxidation resistant coating, at least one metal of the platinum group or an alloy thereof is galvanically deposited onto a surface of a substrate, and thereafter the thusly galvanically coated substrate is aluminized. In a first stage of the galvanic deposition process a current magnitude applied for the galvanizing is increased continuously or step-wise beginning from an initial value up to a maximum value, and in a second stage of the galvanic deposition process the current magnitude applied for the galvanizing is maintained constant at the maximum value. The galvanic deposition of the or each metal of the platinum group or the corresponding alloy may be carried out using an open-celled or open-mesh or porous anode.

Abstract: When silver oxide is reduced to silver, a large number of cores of metallic silver are formed inside the silver oxide. Then, the silver oxide is reduced in a manner of being hollowed out while its original outer configuration is being maintained. As a result, the curvature of the silver generated becomes larger. The utilization of this microscopic-particle implementation mechanism allows accomplishment of the bonding even if the silver oxide is supplied not in a particle-like configuration, but in a closely-packed layer-like configuration. In the present invention, there is provided an electronic member including an electrode for inputting/outputting an electrical signal, or a connection terminal for establishing a connection with the electrical signal, wherein the uppermost surface of the electrode or the connection terminal is a silver-oxide layer.

Abstract: A metallized substrate having, disposed in the order mentioned: a ceramics substrate; a high-melting point metal layer; a base nickel plating layer; a layered nickel-phosphorous plating layer; a diffusion-inhibiting plating layer; and a gold plating layer. The base nickel plating layer being any one of a nickel plating layer, a nickel-boron plating layer, or a nickel-cobalt plating layer. The diffusion-inhibiting plating layer being any one of a columnar nickel-phosphorous plating layer, a palladium-phosphorous plating layer, or a palladium plating layer. According to the above composition, even after heating the semiconductor chips in a mounted state, the metallized substrate can make the connection strength of wire bonding favorable.

Abstract: A turbine component having a protective bilayer coating thereon comprising: a superalloy substrate; and a bilayer protective coating applied to the substrate wherein the bilayer protective coating comprises a first inner layer of platinum and aluminum; and a second outer oxidation-resistant layer applied over the first inner layer, the second outer layer comprising an MCrAlX alloy where M is selected from Fe, Ni and Co, and where X is yttrium or another rare earth element. A method of improving oxidation resistance of a Ni or Co-based superalloy turbine component comprising: depositing a bilayer protective coating on a turbine component by depositing a first inner platinum-aluminum layer on a surface of the turbine Component; and depositing a second outer layer comprising an MCrAlX alloy over the first inner layer, wherein M is a metal selected from Fe, Ni and Co, and X is yttrium or another rare earth element.

Abstract: A method of coating a metallic article having an at least part-metallic surface comprising a first metal, with a surface having a pre-determined wettability, the method at least comprising the steps of: (a) coating at least a part of the metallic article with a layer of a second metal to provide a metal-metal bonded surface, said surface being rough either prior to or because of step (a); and (b) contacting the metal-metal bonded surface of step (a) with a material to provide the surface having the pre-determined wettability. The first metal may be one or more of the group comprising: iron, zinc, copper, tin, nickel and aluminium, and alloys thereof including steel, brass, bronze and nitinol for example. Preferably, the second metal is coated onto the first metal using electroless Galvanic deposition.

Abstract: A chromium plating bath containing trivalent chromium ions and hexavalent chromium ions is prepared by a method including the steps of: (A) mixing chromic acid and an organic acid in an aqueous solution containing these acids and reducing chromic acid by the organic acid so as to prepare an aqueous solution not containing hexavalent chromium ions; (B) adding a pH adjustor to the aqueous solution not containing hexavalent chromium ions so as to adjust pH to a value of 1 to 4; and (C) further adding chromic acid to the aqueous solution not containing hexavalent chromium ions and having undergone the pH adjustment so as to prepare an aqueous solution containing trivalent chromium ions and hexavalent chromium ions. The chromium plating bath containing both trivalent chromium ions and hexavalent chromium ions can be prepared while easily and assuredly adjusting the contents (content ratio) of trivalent chromium ions and hexavalent chromium ions to predetermined values (a predetermined value).

Abstract: The invention relates to a method for coating a cooling element (1) mainly made of copper, provided with water cooling pipes (2) and used particularly in connection with metallurgic furnaces or the like, wherein the cooling element includes a fire surface (3) that is in contact with molten metal, suspension or process gas; side surfaces (6) and an outer surface (7), so that at least part of the fire surface (3) is coated by a corrosion resistant coating (5).

Abstract: Methods of enhancing contrast ratio of conductive nanostructure-based transparent conductors are described. Contrast ratio is significantly improved by reduction of light scattering and reflectivity of the nanostructures through steps of plating the conductive nanostructures followed by etching or oxidizing the underlying conductive nanostructures.

Abstract: Platinum containing coatings for corrosion and oxidation protection of a substrate, and platinum electrodeposition methods for coating a substrate. The coating may comprise platinum and at least one supplementary constituent, and the method may involve co-electrodeposition of platinum and the supplementary constituent from a single electrolyte composition. The supplementary constituent may comprise chromium, an oxidation protective reactive element, or an alloy of chromium with a reactive element. Components protected by such coatings are also disclosed.

Abstract: A method for making an oxidation resistant article, including (a) depositing a layer of a Pt group metal on a substrate to form a platinized substrate; and (b) depositing on the platinized substrate layer of Pt group metal a layer of a reactive element selected from the group consisting of Hf, Y, La, Ce and Zr and combinations thereof to form a surface modified region thereon, wherein the surface modified region includes the Pt-group metal, Ni, Al and the reactive element in relative concentration to provide a ?-Ni+??-Ni3Al phase constitution.