Abstract: In order to even out the electrolytic treatment of workpieces 9 made of electrically non-conductive material and having a very thin base metallising 6, 8, a device is employed in a manner according to the invention comprising means for bringing treatment liquid into contact with the workpieces 9, means 10 for electrical contracting of the workpieces 9 at contacting sites and counterelectrodes 5.x which are so arranged that the workpieces 9 may be arranged opposing them, whereby the counterelectrodes 5.x are each subdivided into at least two electrode segments 13.x such that at least one contact-near electrode segment 13.1 and at least one contact-remote electrode segment 13.4 and possibly further electrode segments 13.2, 13.3 arranged between them are provided and each electrode segment 13.x is fed by a separate current source 15.x.

Abstract: When forming metallic components, in particular three-dimensionally curved blades, which constitute a single piece with the blading of turbomachine rotor wheels, the linear oscillation of the electrode acting as a tool is superimposed by a circular oscillation, enabling the electrode to turn into the workpiece conformally with its shape. Further forming is performed by circular oscillation with circular feed in the one and/or the other direction. An embodiment of the corresponding apparatus comprises an electrode holder (9) with linear feed (Zvor) and linear oscillation (Zosz) and a workpiece holder (5) with circular oscillation (Cosz) and circular feed (Cvor).

Abstract: A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Application of a potential difference between conductive surface and an electrode and establishing relative motion between the belt pad and the conductive surface result in material removal from the conductive surface. Electrical contact to the surface is provided through either contacts embedded in the belt pad or contacts placed adjacent the belt pad.

Abstract: An apparatus and method for adapting a CNC milling machine for electroerosion machining. The apparatus includes a tubular electrode on the distal end of an adapter shaft. A tool holder on the proximal end of the adapter shaft is mountable in the chuck of a cutter spindle in the milling machine. The adapter shaft is rotatably mounted within a bearing and an electrical brush contact subassembly, both of which are supported by a bracket. The bracket is attached to the milling machine but insulates it from the tool electrode. The bearing supports the adapter shaft in alignment with the CNC spindle. An electrical power supply energizes the electrode and the workpiece for electroerosion in a gap between them. Electrolyte is circulated through the spinning tool electrode during operation. The CNC computer is configured to operate the machine, power supply, and electrolyte flow for electroerosion machining.

Abstract: A system and method are described for radially positioning a workpiece for electrochemical machining. In one embodiment, a pressurized air chamber is configured to contain pressurized air. In addition, an expandable diaphragm is configured to position the workpiece radially relative to an electrode assembly in response to the pressurized air being released into the pressurized air chamber.

Abstract: On a fixture for electro-chemical machining for the production of long, curved cavities (11) in a component (12), the working electrode (3) of the electro-chemical machining tool (1) is connected to a guide body (1a) which moveably rests against the inner walls of the respective cavity by means of power-actuated guide elements (2), with the guide body being connected to a flexurally soft and torsionally stiff guide linkage (5) coupled to a feed and rotary drive. Control of the movement of the guide body is accomplished in dependence of at least one wall thickness measured with a measuring device (13, 14) during feed movement.

Abstract: An electroetching process of the present invention uses a multiphase environment for planarizing a wafer with conductive surface having a non-uniform topography. The multiphase environment includes a high resistance phase and an etching solution phase. The conductive surface to be planarized is placed in the high resistance phase and adjacent a phase interface between the high resistance phase and the etching solution phase. A wiper is used to mechanically move the thin high resistance phase covering the conductive surface so that the raised regions of the non-planar conductive surface is briefly exposed to etching solution phase. The mechanical action of the wiper does not disturb the high resistivity phase filling the rescessed regions of the surface. As the raised surface locations are exposed, the etching solution phase contacts and electroetch the exposed regions of the raised regions until the surface planarized.

Abstract: The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution, a belt workpiece surface influencing device extended between a supply spool and a receiving spool. During the process, the surface of the workpiece is placed in proximity of the workpiece surface influencing device and the process solution is flowed through the process section and onto the surface while a potential difference is applied between the electrode and the surface of the workpiece.

Abstract: An internal magnetic-force polishing system is disclosed for finishing a interior metal surface of a material. The system comprises a magnetic electrolysis-polishing which is adapted for finishing the interior metal surface of the material. A cathode terminal is provided for contacting pre-finished material and a transfer unit is also provided for transferring material from the cathode terminal to the magnetic electrolysis-polishing unit. The system has an electrolyte feeding unit which stores electrolytes and supplies the electrolyte to the magnetic electrolysis-polishing unit. A control unit is provided for controlling the transfer unit, the magnetic electrolysis-polishing unit and the electrolyte feeding unit.

Abstract: A method for selectively removing a layer of electrolytically dissoluble metal such as copper overplate from a substrate such as a low-k dielectric comprising: providing a substrate bearing on a major surface thereof a layer of electrolytically dissoluble metal, the metal layer serving as a dissoluble electrode and having a central region and an adjacent peripheral region; providing at least a first counterelectrode and a second counterelectrode; positioning the counterelectrodes opposite the metal layer and spaced from the metal layer and spaced from each other; in a first electrolytic step, passing an electric current between the first counterelectrode and the central region of the metal layer, wherein the first counterelectrode is cathodic with respect to the metal layer, and the first electrolytic step includes a first phase, a second phase, and a third phase and during the first phase the electric current is a low amperage current, during the second phase the electric current includes a train of anodi

Abstract: A machining apparatus is provided. The machining apparatus includes a discharge machining head assembly and a slide assembly supporting the head assembly. The machining apparatus also includes an electromagnet configured to support the slide assembly in a position on a work piece to machine an area. The slide assembly permits linear displacement of the head assembly generally parallel to the supporting work piece surface.

Abstract: An apparatus for processing a material on a wafer surface includes a cavity defined by a peripheral wall and configured to direct a process solution and direct it to the surface to to a first wafer surface region without being directed to a second wafer surface region, a head configured to hold the wafer so that the surface of the wafer faces the cavity, and an electrical contact member positioned outside the cavity peripheral wall and configured to contact the second wafer surface region extending beyond the cavity, when the wafer is moved relative to the contact member. Advantages of the invention include substantially full surface treatment of the wafer.

Abstract: A miniature machine tool for micro-machining is capable of performing on a workpiece at least one conventional mechanical machining operation and another micro-machining operation such as electrochemical machining (ECM), electro deposit machining (EDM), micro-milling or micro-turning or micro-drilling. The machine tool includes a holder in which the workpiece is clamped during all successive machining operations so that the machining operations may be performed in succession without intervening reclamping of the workpiece. This increases dimensional accuracy when micro-machining high-precision components.

Abstract: A profiled tube (50b) comprising a high carbon content alloy (greater than 0.3%), superalloy or other high creep strength material, has a fluted bore with internal fins (52b) and intervening valleys or troughs (56b). Such a tube is made by centrifugal casting and subsequent electrochemical machining by drawing of an electrode (104) along the tube while at the same time passing electrolyte along the tube and around the electrode and also applying an electrical current between the tube and electrode, so that material of the tube passes into solution in the electrolyte. The electrode (104) has the same profile as the end-profile required in the tube (80) but has an inclined working face (124). An electrode rod (92) drives the electrode from one end mounting means (82) to another (84), each of which support the tube (80) and supply/exhaust electrolytic solution. The electrolyte is preferably sodium nitrate, although an acid based system is feasible.

Abstract: A method for the production of pipe segments from a pipe (10) in which the pipe (10) is rotated about its longitudinal axis, while an electrode (20) is positioned in the vicinity of the outer surface (11) of the pipe (10) and electrolyte (30) is fed to the space between the pipe (10) and the electrode (20). The electrode (20) and the pipe (10) are connected to a voltage source (40), with the result that an electric current is brought about via the electrolyte (30). Thus, the pipe (10) is divided into pipe segments in an electrochemical way.

Abstract: A multi-axis machine, with numerical control on each axis, is used to drive the tool and workpiece movements necessary to machining complex airfoil geometry. Tooling is typically made of a metal such as brass or other low cost material and rotates during machining. The tooling may be any shape(cylindrical, conical) and size depending on application. A DC power (continuous or pulsed) is used to provide voltage across the tool and workpiece. A medium such as water, de-ionized water, or electrolyte (such as sodium nitrite) is provided between the tool and workpiece. Workpiece metal is removed in a controlled manner by high intensity thermal erosion.

Abstract: Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the workpiece frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the workpiece frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the workpiece is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the workpiece frontal side surface, in its entirety, is thus permitted.

Abstract: An electrochemical machining technique involves moving a cathode (2) towards an anodic workpiece (1). A current is passed through an electrolyte which flows between the cathode (2) and workpiece (1) so as to cause material to be removed electrolytically from the workpiece (1). A vibratory movement is imposed on the cathode (2) and the current passed between the cathode (2) and workpiece (1) is also varied. The vibratory movement may consist of a main sinusoidal oscillation and a secondary ultrasonic vibration, and the current variation is synchronized with the main vibration so that current pulses, and ultrasonic vibration pulses, coincide, with a predetermined small phase shift, with peaks of the main vibration corresponding to the smallest gap between the cathode (2) and workpiece (1).

Abstract: A family of discrete and uniformly sized silicon nanoparticles, including 1 (blue emitting), 1.67 (green emitting), 2.15 (yellow emitting), 2.9 (red emitting) and 3.7 nm (infrared emitting) nanoparticles, and a method that produces the family. The nanoparticles produced by the method of the invention are highly uniform in size. A very small percentage of significantly larger particles are produced, and such larger particles are easily filtered out. The method for producing the silicon nanoparticles of the invention utilizes a gradual advancing electrochemical etch of bulk silicon, e.g., a silicon wafer. The etch is conducted with use of an appropriate intermediate or low etch current density. An optimal current density for producing the family is ˜10 milli Ampere per square centimeter (10 mA/cm2). Higher current density favors 1 nm particles, and lower the larger particles.

Abstract: An electrode for rejuvenating a cooling passage within an airfoil, the electrode including a tip, an end, a conductive core extending between the tip and the end, and an insulating coating disposed on the conductive core. The insulating coating exposes a number of conductive strips of the conductive core extending between the tip and the end. The insulating coating forms a number of insulating portions and further exposes a number of spacer portions of the conductive core longitudinally positioned between the insulating portions. The insulating portions substantially span a distance between the tip and the end and are positioned between the conductive strips.

Abstract: The present invention discloses an apparatus having a platen; a polishing pad disposed over the platen; a slurry dispenser disposed over the polishing pad; a cathode connected electrically to the polishing pad; a wafer carrier disposed over the polishing pad;

Abstract: The present invention pertains to apparatus and methods for planarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by increasing the fluid agitation in raised regions with respect to recessed regions. That is, the agitation of the electropolishing bath fluid is agitated or exchanged as a function of elevation on the metal film profile. The higher the elevation, the greater the movement or exchange rate of bath fluid. In preferred methods of the invention, this agitation is achieved through the use of a microporous electropolishing pad that moves over (either near or in contact with) the surface of the wafer during the electropolishing process. Thus, methods of the invention are electropolishing methods, which in some cases include mechanical polishing elements.

Abstract: Method and device for manufacturing of expandable cylindrical metal meshes for use in expandable stents and in particular for customized manufacturing. The method includes determining the type and size of the stent to be implanted, electrochemically forming the stent with desired pattern of meshes and implanting the stent into patient. The method comprises using a cathode with desired pattern of meshes and a tubular blank, from which the stent is formed. Between the cathode and the blank is delivered an electrolyte and the cathode and the blank are simultaneously rotated during electrochemical forming process.

Abstract: A method of forming a curved cooling channel into a gas turbine component such as a turbine blade uses an electrode in the form of a helix. The electrode is driven to rotate around the central rotational axis of the helix and axially along the central rotational axis. A turbine blade for a gas turbine component is provided with at least one helical cooling channel.

Abstract: A method for producing the silicon nanoparticle of the invention is a gradual advancing electrochemical etch of bulk silicon. Separation of nanoparticles from the surface of the silicon may also be conducted. Once separated, various methods may be employed to form nanoparticles into colloids, crystals, films and other desirable forms. The particles may also be coated or doped.

Abstract: The present invention provides an apparatus for electrochemical mechanical processing of a surface of a workpiece by utilizing a process solution. The apparatus of the present invention includes an electrode touching the process solution, a belt workpiece surface influencing device extended between a supply spool and a receiving spool. During the process, the surface of the workpiece is placed in proximity of the workpiece surface influencing device and the process solution is flowed through the process section and onto the surface while a potential difference is applied between the electrode and the surface of the workpiece.

Abstract: An electromachining apparatus includes a mandrel for supporting a workpiece next to a cutter mounted on an arbor. The workpiece is powered as an anode and the cutter is powered as a cathode, and a coolant is circulated therebetween. The cutter is rotated and plunge twisted into the workpiece to form a twisted slot therein, with adjacent ones of such slots forming twisted blanks therebetween. The individual blanks may then be subsequently machined to final shape such as an airfoil configuration.

Abstract: According to this dynamic pressure groove processing method, dynamic pressure grooves are formed in specified regions by electrochemical machining with the electrode of an electrode tool put close to a workpiece in the initial stage. Through this electrochemical machining, corners of land portions adjacent to the dynamic pressure grooves can be curved and smoothed. Next, by subjecting the workpiece to electrochemical machining with the electrode of the electrode tool put away from the workpiece, the land portions are to undergo weak electrochemical machining. Surface roughness of surfaces of the land portions can be reduced, and the curved corners of the land portions can be made smoother at the same time. Therefore, the abrasion resistance characteristic of the dynamic pressure grooves can be improved further than that achieved by the conventional electrochemical machining, allowing the abrasion resistance characteristic and reliability to be sufficiently improved.

Abstract: A method of reducing cutting tool wear in a lubricated metal cutting operation has been developed. An electrical cutting cell is provided having an anodic conductive cutting tool and a cathodic conductive work-piece connected to a DC current supply; the lubricant contains platable wear reducing agents. The lubricant is located to bathe the contacting interface between the cutting tool and work-piece to constitute an electrolyte. Next, the electrical current flow through the contacting interface is controlled to be in the range of 25-500 milli-amps. Lastly, the cutting tool is moved into and along cutting contact with the work-piece while current flows there-between to electro-chemically deposit the wear reducing agents on at least the contacting interface to reduce cutting tool wear and improve ease of mass removal.

Abstract: Deposition of conductive material on or removal of conductive material from a wafer frontal side of a semiconductor wafer is performed by providing an anode having an anode area which is to face the wafer frontal side, and electrically connecting the wafer frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the wafer frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the wafer is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the wafer frontal side surface, in its entirety, is thus permitted.

Abstract: An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a platen, a conductive element disposed adjacent the platen and a polishing surface disposed adjacent the conductive element. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing surface while causing relative motion between the workpiece and the polishing surface. A voltage source is configured to effect an electric potential difference between the metallized surface on the workpiece and the conductive element so that an electric field is produced between the metallized surface and the conductive element. The apparatus further includes a solution application mechanism configured to supply an electrolytic solution to the polishing surface.

Abstract: A procedure and a device for the electroerosive or electrochemical machining of bent surfaces of a work piece (2) by means of an electrode (1; 1′; 1″) which is generally independent of the form of the bent surface, in which the electrode (1; 1′; 1″) is led for the machining of the bent surface along a forward feed device (V) above the work piece surface. The invention is distinguished by the fact that the electrode (1; 1′; 1″) is led across the work piece surface at an inclined angle to the forward feed device (V) with the forward feed device (V) placed tangentially to the work piece surface.

Abstract: A pipe electrochemical polishing system (10, 10a) for in place polishing of a pipe (28(has provision for detecting the instant position of a cathode (14) within the pipe (28) such as cable marks (52) and cable mark sensor (50), an infrared camera (60), heat sensing crayon marks (64), thermisters (66), and capacitance sensors (68), used individually or in combination. According to the inventive in place electropolishing method (80) when it is determined that the cathode is in a non horizontal portion (72) of the pipe (28) and further is presently traveling generally downward, then the direction of flow of the electrolyte (24) is reversed to carry any bubbles in the electrolyte (24) away from the area of the cathode (14).

Abstract: To avoid or minimize the occurrence of cross streaks or current streaks on a substrate that is transported through an electrolytic bath and roughened electrochemically in it, the current density is regulated in the electrolyte between a first alternating or three-phase current electrode and the substrate in such a way that at the beginning of a roughening zone, the current density has a lesser value than within the roughening zone, in the transport direction of the substrate. Downstream of the first alternating or three-phase current electrode, either a further alternating current electrode or a further three-phase current electrode acts on the substrate. In a preferred embodiment, the first alternating or three-phase current electrode has a rounded outline, which is composed of a curved portion and adjoining it a straight portion.

Abstract: An apparatus and method of electrochemical polishing a workpiece with ring-form electrode is provided. A mechanism with a tool electrode, a DC power supply and electrolysis-supply tank of the present invention can be installed on the traditional production equipment. The tool electrode is connected with the negative pole of the DC power supply, while the workpiece is connected with the positive pole of the DC power supply and kept a fixed distance from the tool electrode. The electrode or the workpiece advances at a predetermined feeding speed while the workpiece is electrochemically polished. The present invention uses the centrifugal force of rotational tool electrode to discharge electrolytic byproducts, making electrochemical polishing more effective.

Abstract: The present invention pertains to apparatus and methods for planarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by increasing the fluid agitation in raised regions with respect to recessed regions. That is, the agitation of the electropolishing bath fluid is agitated or exchanged as a function of elevation on the metal film profile. The higher the elevation, the greater the movement or exchange rate of bath fluid. In preferred methods of the invention, this agitation is achieved through the use of a microporous electropolishing pad that moves over (either near or in contact with) the surface of the wafer during the electropolishing process. Thus, methods of the invention are electropolishing methods, which in some cases include mechanical polishing elements.

Abstract: A pipe electrochemical polishing system (10, 10a) for in place polishing of a pipe (28) has provision for detecting the instant position of a cathode (14) within the pipe (28) such as cable marks (52) and cable mark sensor (50), an infrared camera (60), heat sensing crayon marks (64), thermisters (66), and capacitance sensors (68), used individually or in combination. According to the inventive in place electropolishing method (80) when it is determined that the cathode is in a non horizontal portion (72) of the pipe (28) and further is presently traveling generally downward, then the direction of flow of the electrolyte (24) is reversed to carry any bubbles in the electrolyte (24) away from the area of the cathode (14).

Abstract: An electro-polishing fixture for polishing stents which incorporates multiple anodes in contact with the stent and a center cathode disposed coaxially within the interior of the stent and a curved exterior cathode disposed about the perimeter of the stent. The invention further includes an electrolyte solution adapted for polishing stents composed of nickel-titanium alloy and a method of using the electrolyte in combination with the electro-polishing fixture.

Abstract: A method is provided for electropolishing a stent. A stent is mounted on a rack having electropolishing mounts. Each of the mounts has a base and an electrically conductive first member having a first end and a second end. The first end is connected to the base and the second end contacts the external surface of the stent. Each of the mounts also has a non-electrically conductive second member having a first end and a second end. The first end of the second member is attached to the base and the second end is placed in the bore of the stent. The second ends of the first and second members bias towards each other to secure the stent between them. The stent is immersed in an electropolishing bath and an electrical current is applied to the first member.

Abstract: A method of shaping a tool comprises the steps of defining a shape of an article to be formed with the tool as a plurality of first elements; defining an initial shape of the tool as a plurality of second elements; determining an electric potential of each of the first and second elements; determining an equipotential line between the article and the initial shape of the tool based on the electric potential of the first and second elements; and forming the tool to have a shape coincident with the equipotential line.

Abstract: In a method for electrochemical machining, the working distance is set by contacting the workpiece with the electrode, increasing the distance between the workpiece and the electrode by a first distance, detecting whether the contact between the electrode and the workpiece is broken, and further increasing the distance between the workpiece and the electrode by a second distance. Owing to this method, very small working distances can be set with a limited risk of short-circuiting and flash-over.

Abstract: An electropolishing apparatus for polishing an inner face of a deep hole of an article comprises a support for holding an article so that the article is maintained to erect in an electrolytic bath, and an electrode to be inserted into a deep hole of the article. The electrode is a hollow member having a through hole formed longitudinally. Electrolyte is supplied into the through hole of the electrode from upside. The electrolyte flows through the through hole of the electrode, a gap between the lower end of the electrode and the bottom of the hole, and another gap to be between an outer face of the electrode and an inner face of the hole. A plurality of removers consisting of nonwoven fabric may be fixed around the electrode. The support and the article rotate, while the electrode moves up and down. Furthermore, a plurality of magnets may be arranged around the article so that a magnetic field is formed in a zone including the article.

Abstract: Method of manufacturing a bearing ring (1) for a bearing such as a ball bearing or cylindrical roller bearing, wherein the bearing ring (1) is rotated around an axis (6) and the amount of material removed is controlled by the choice of the cross section of an electrode (3) parallel to the surface of the raceway under the electrode (3). Thus the radius of the groove (2) is kept constant. An electrode with a suitably adapted convex cross section allows for the manufacture of bearing rings within a very narrow specification range. Thus the invention also relates to a bearing comprising an electrochemically machined bearing ring (1) according to the invention having excellent operational life and characteristics.

Abstract: The current density with which the process is used is of essential importance for the economy of a method of electrolytically treating materials. Normally only low or medium current densities are used, as the speed of replacement of consumed materials in the direct vicinity of the surface of the material for treatment has a restrictive effect on the magnitude of the current density at which a usable process result can still be achieved. However, a low current density leads to long electrolysis times and to complex treatment installations.

Abstract: An electroplaning technique achieves superior flatness of the face of a wafer. A chuck holds the wafer so the face of the wafer is oriented downwards and lowers it to an electroplaner stage. The electroplaner includes an elongated, horizontally extending cup, an elongated horizontally extending nozzle within it. Electrolyte flows non-turbulently from an upper side of the nozzle to create a meniscus of electrolyte that contacts the wafer. The electroplaner moves transversely while the chuck is held steady so that said meniscus sweeps across the face of said wafer. A rinser of similar construction likewise has a meniscus or rinse that sweeps across the wafer. The nozzle can have a row of openings along its upper side, or may be formed at least in part of a microporous material. The wafer is electrically configured as cathode.

Abstract: An electrochemical etching apparatus and method increasing the rate at which material is removed from a substrate such as a metallic surface. The apparatus includes an electrolyte delivery system positioned below and centered beneath the center of the substrate (e.g., a wafer) to be etched so that the center axis of the delivery system corresponds to the center of the wafer. The electrolyte delivery system and the wafer are then rotated relative to each other as the electrolyte is discharged from the delivery system and toward the surface of the wafer. A corresponding method for electrochemically etching a surface of the wafer with an electrolyte is also provided.

Abstract: An electrochemical reaction assembly and methods of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly and method achieve a highly uniform thickness and composition of deposition material or uniform etching or polishing on the semiconductor substrates by retaining the semiconductor substrates on a cathode immersed in an appropriate reaction solution wherein a wire mesh anode rotates about the continuous moving cathode during electrochemical reaction.

Abstract: The invention relates to a method and device for the electrochemical treatment of electrically mutually insulated, electrically conductive areas on an item to be treated by means of a treatment liquid. Insulated, for example etched structures on circuit boards cannot be treated electrochemically with known methods since there exists no electrical connection to the bath current source from individual areas. According to the invention, this connection is produced by brushes which touch the structured surfaces to be treated with their electrically conductive and thin fibres. A large number of brushes which are arranged transversely to the direction of transportation take care of the fact that all the electrically conductive areas on the item to be treated which are arranged in an insulated manner from one another are contacted electrically at least one after another and that the achieved contact time is sufficiently long.

Abstract: An electrochemical machining method in which a work piece and a machining electrode are opposed to each other and dipped in an electrolyte solution, and a surface of the work piece is machined by causing an electrolytic reaction between the surface of the work piece and a tip of the machining electrode in a state where a separating distance between the surface of the work piece and the tip of the machining electrode is adjusted and a desired separating distance is maintained, wherein a zero contact reference position where the surface of the work piece and the tip of the machining electrode are brought into contact with each other and the separating distance between the work piece and the machining electrode is nullified is electrically detected, moving distances of the work piece and the machining electrode from the zero contact reference position are detected, a relative separating distance between the surface of the work piece and the tip of the machining electrode is calculated based on a result of the de

Abstract: A device for electrochemically deplating metal from side edges and a backside of a semiconductor wafer or substrate. The device includes a shaped cathode having a shape substantially corresponding to a shape of at least a portion of the semiconductor wafer, such that the shaped cathode at least partially covers the backside and at least partially covers the side edges of the semiconductor wafer. The position of at least one of the semiconductor wafer and the shaped cathode is altered by position altering apparatus during the electrochemical deplating.