Abstract: A soft-magnetic multilayer thin film produced by electroplating, wherein an anode-dissolution process is effected by intermittently applying a reverse d.c. bias current with respect to the plating-forward current. Involving the anode-dissolution process allows the formation of a re-dissolution effect layer differing in crystal structure from the plated film layer. A soft-magnetic multilayer thin film characterized by having a multilayer film structure which comprises a plated layer and a re-dissolution effect layer laminated to each other and which the plated layer is at least magnetically isolated. Further, a method of manufacturing a soft-magnetic multilayer thin film having a multilayer film structure magnetically isolated only through plating, which is offered by introducing the anode-dissolution process.

Abstract: The present invention relates to a process for mechanically plating small arms projectiles with a particulate plating metal to form jacketed small arms projectiles. The process comprises agitating a slurry comprising the small arms projectiles, an aqueous solution of a strong acid, a plating agent and the particulate plating metal, thereby producing a jacketed small arms projectile having improved lubricity characteristics and in less time than prior art methods employing electrodeposition to form the jacketed small arms projectiles.

Abstract: A method for coating a metal cookware includes the steps of (A) cleaning the metal cookware; (B) forming a scratch-resistant oxide film on the cooking surface by anodic oxidation; (C) roughening the scratch-resistant oxide film by blasting to form a roughened surface thereon, the roughened surface having valleys extending into the cooking surface; and (D) applying an anti-stick film of fluorocarbon resin on the roughened surface.

Abstract: Technetium is separated from radio-contaminated metal in a three-step process. The contaminated metal is dissolved in an acid solution; the technetium, present in the resultant solution as pertechnetate ions, is quantitatively reduced to its metallic state through a metal displacement (cementation) reaction with a base metal of lower reduction potential; and the desired metal is electrolytically recovered from the solution, substantially free from technetium contamination.

Abstract: Immersion tin-lead baths are provided, preferably free of hypophosphite ion, comprising a strongly acidic aqueous solution comprised of thiourea, water-soluble sources of divalent tin and lead, a weak acid, and a weak base.

Abstract: An immersion tin/lead alloy plating bath has a basic composition comprising an organic sulfonic acid, divalent tin and lead salts of the organic sulfonic acid and thiourea and further contains thiocyanic acid or derivative thereof, optionally with hydrated hydrazine. With this plating bath, an alloy deposit, which has a particularly desired Sn/Pb ratio of 60%/40% or so and is improved in terms of adhesion and homogeneity, can be stably obtained on the surface of copper or a copper alloy in a relatively low temperature region within a short span of time.

Abstract: This invention relates to Al plates suitable for automobile body panels and also relates to a method of pretreatment for painting. The features are: A Zn plating layer having 0.05.about.0.38 g/m.sup.2 of coating weight is formed on the surface of an Al plate or Al alloy plate by a displacement plating process or electroplating process. The coated Al or Al alloy plate is subjected to chemical conversion treatment with zinc phosphate under conditions to completely dissolve the zinc plating layer. This invention prevents the occurrence of filiform rusting and blistering after painting.

Abstract: A wire having a terminal crimped to one end thereof and an electrodeposited metal emanating from either the terminal or the wire electrically bridging the wire and the terminal. A process for making the aforesaid wherein the terminal and the wire comprise dissimilar metals having different oxidation potentials in the presence of an electrolyte and wherein the joint between the terminal and the wire is contacted with an electrolyte to deplate the more anodic metal and deposit it on the more cathodic metal.

Abstract: A stabilized spray displacement tin plating process of copper printed circuit innerlayers is disclosed for the manufacture of multilayer printed circuit boards. During prolonged use of spray tin plating, the plating solution becomes saturated with cupurous thiourea complex which precipitates interfering with spray nozzles and other mechanical components. The tin plating solution is stabilized by removing portions from the reservoir before saturation is reached, selectively precipitating the thiourea complex, and returning the remaining solution back to the reservoir. The precipitated cupurous thiourea complex is redissolved in acid and either disposed of by conventional waste treatment or the acid solution can be electrowinned to reclaim copper and oxidize thiourea to form a more acceptable acid solution for waste treatment.

Abstract: An acid solution for displacement plating of a reflowable tin lead alloy having a melting point not exceeding 500.degree. F. over a cupreous surface. The displacement plating solution contains stannous ions in an amount of from 0.05 to 0.50 moles per liter, plumbous ions in an amount of from 0.01 to 0.15 moles per liter, a total content of stannous ions and plumbous ions in an amount of from 0.05 to 0.60 moles per liter and a ratio of stannous ions to plumbous ions varying from about 1.0:3.0 to 50.0:1.0. The solution is characterized by an ability to plate the tin lead alloy at a plating rate of at least 100 microinches per 15 minutes. The deposit obtained is capable of reflow and is useful in the manufacture of printed circuit boards.