Abstract: A method of performing an immersion tin process in the production of a component carrier is provided which includes immersing at least a part of a copper surface of the component carrier in a composition containing Sn(II) in an immersion tin unit, while passing a non-oxidizing gas through the immersion tin unit, wherein at least part of the non-oxidizing gas is recycled. In addition, an apparatus for performing an immersion tin process in the production of a component carrier, a method of performing a copper plating process in the production of a component carrier and an apparatus for performing a copper plating process in the production of a component carrier are provided.

Abstract: An electroplating method according to an embodiment is a electroplating method of generating a metal film on a cathode surface by setting a negative potential to a cathode of an anode and the cathode provided in a reaction bath, including mixing and accommodating a plating solution containing at least plated metal ions, an electrolyte, and a surface active agent and a supercritical fluid in the reaction bath and applying a current in a concentration of the supercritical fluid and a cathode current density in which a polarization resistance obtained from a cathode polarization curve while the plated metal ions are reduced is larger than before the supercritical fluid is mixed.

Abstract: Disclosed are pre-wetting apparatus designs and methods. In some embodiments, a pre-wetting apparatus includes a degasser, a process chamber, and a controller. The process chamber includes a wafer holder configured to hold a wafer substrate, a vacuum port configured to allow formation of a subatmospheric pressure in the process chamber, and a fluid inlet coupled to the degasser and configured to deliver a degassed pre-wetting fluid onto the wafer substrate at a velocity of at least about 7 meters per second whereby particles on the wafer substrate are dislodged and at a flow rate whereby dislodged particles are removed from the wafer substrate. The controller includes program instructions for forming a wetting layer on the wafer substrate in the process chamber by contacting the wafer substrate with the degassed pre-wetting fluid admitted through the fluid inlet at a flow rate of at least about 0.4 liters per minute.

Abstract: A multilayered plate containing, as the graphene forming matrix, an external layer composed of a metal or a metal alloy and, as a support substrate, the transition metals and/or their alloys and/or metalloids and/or their solutions and compounds is subjected to heat treatment in the following stages: plate heating until the plate reaches a temperature that is between 0.5° C. and 50° C., annealing, at a constant or variable temperature from the temperature range, for a period between 60 and 600 seconds and cooling, with the cooling rate maintained between 0.1 and 2° C./min in the temperature range of 1,200° C.-1,050° C.

Abstract: A substrate processor uses pressurized gas to create a vortex for lifting and holding a wafer, and to create a vacuum to prevent the wafer from adhering to a contact ring seal after electroplating the wafer. A processor head has a rotor movable into and out of an electrolyte vessel. A backing plate on the rotor includes vortex outlets which create the vortex in the rotor. A vacuum channel adjacent to the perimeter of the rotor applies vacuum to the wafer edges to hold the wafer onto the backing plate. A solenoid or switch in the head has a first position to supply gas flow to the vortex outlets, and a second position to supply gas flow to an aspirator which creates the vacuum in the vacuum channel.

Abstract: A method of immersing an electrode in an electroplating solution while under vacuum, to substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. A method of electroplating an electrode in an electroplating solution including the application of a vacuum to the electrode while it is immersed in the electroplating solution to thereby substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. The electroplating liquid may be applied to only one side of the electrode (“the wet side”) in which case, sufficient time is allowed to pass for the immersion liquid to fill the microscopic through-holes, cavities or indentations in the electrode. An enhancement of this mode is to force liquid through the microscopic holes from the wet side. A highly penetrating solvent may be used as an immersion liquid.

Abstract: To provide an anodic oxidation method, a titanium oxide film manufacturing method and a catalyst carrying method which is suitable, for example, for anodic oxidation of aluminum, titanium and catalyst carrying on the surface of alumite (registered trademark), capable of generating an oxide film at a low cost and rapidly by eliminating the use of a strongly acid or strongly basic electrolytic solution and using a carbonated water as an electrolytic solution, capable of controlling the sealing treatment of oxide film through a simple method, capable of effecting the oxide film dyeing and catalyst carrying rationally and easily, and capable of effecting the catalyst carrying safely and surely without eroding a base material. An object (3) to be treated is electrolyzed in an electrolytic solution received in a treatment vessel (1) serving the object (3) as an anodic electrode. It is an anodic oxidation method in which an oxide film is generated on the surface of the object (3).

Abstract: The invention discloses a lens, which comprises an outer surface and an inner surface, wherein a pattern outline is printed on the outer surface; and an argon gas layer, a high refractive index layer, a lower refractive index layer and a waterproof layer are evaporated at an area, outside the pattern outline, of the outer surface from inside to outside in turn. By adoption of clear patterns formed on the outer surface by the manufacturing processes and a four-layer vacuum electroplating film evaporated at an area, outside the pattern outline, of the outer surface, the coating does not block the sight and the lens is more beautiful and has the functions of radiation resistance and ultraviolet resistance. The invention also discloses a pattern printing and vacuum electroplating method which has simple and efficient processes and realizes the functions of the coated lens.

Abstract: A method of immersing an electrode in an electroplating solution while under vacuum, to substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. A method of electroplating an electrode in an electroplating solution including the application of a vacuum to the electrode while it is immersed in the electroplating solution to thereby substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. The electroplating liquid may be applied to only one side of the electrode (“the wet side”) in which case, sufficient time is allowed to pass for the immersion liquid to fill the microscopic through-holes, cavities or indentations in the electrode. An enhancement of this mode is to force liquid through the microscopic holes from the wet side. A highly penetrating solvent may be used as an immersion liquid.

Abstract: A method of immersing an electrode in an electroplating solution while under vacuum, to substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. A method of electroplating an electrode in an electroplating solution including the application of a vacuum to the electrode while it is immersed in the electroplating solution to thereby substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. The electroplating liquid may be applied to only one side of the electrode (“the wet side”) in which case, sufficient time is allowed to pass for the immersion liquid to fill the microscopic through-holes, cavities or indentations in the electrode. An enhancement of this mode is to force liquid through the microscopic holes from the wet side. A highly penetrating solvent may be used as an immersion liquid.

Abstract: The inventive method and device for vacuum-compression micro plasma oxidation relate to electrochemical processing of metal, in particular to micro plasma treatment in electrolyte solutions. The aim of said invention is to develop a method for obtaining qualitatively homogeneous coatings by micro-plasma oxidation on large-sized parts, including irregular shaped parts, or simultaneously on a great number of small parts. The second aim of the invention is to design a device for processing parts, having an extended surface area, by using low-power supplies. The inventive method for vacuum-compression micro-plasma oxidation of parts consists in dipping a processable part into an electrolyte solution pre-filled in a sealed container, in generating micro-plasma discharges on the surface of said part and, subsequently, in forming a coating, wherein the micro-plasma discharges are formed in low-pressure conditions above the electrolyte solution.

Abstract: A method of manufacturing a fuel cell includes thermally treating a hydrogen permeable membrane in a given temperature higher than an actual operating temperature of the fuel cell, and forming an electrolyte layer on the hydrogen permeable membrane subjected to the thermal treatment. The hydrogen permeable membrane is composed of a polycrystalline metal.

Abstract: A method to electrodeposit or electroless deposit material onto substrates from ionic liquids in vacuum or in a protective atmosphere after exposing the ionic liquid to vacuum and the resulting material. According to the invention, dense layers, free of unwanted components, can be produced in vacuum or in a protective atmosphere after exposing the ionic liquid to vacuum.

Abstract: The present invention concerns a method for galvanic deposition of a hard chrome layer on a substrate surface at high rates of deposition. According to the invention, the substrate surface being coated makes contact at reduced pressure relative to the ambient pressure with a chromium-containing electrolyte suitable for galvanic deposition and a relative motion between substrate surface and electrolyte is produced during the depositing of the chrome layer on the substrate surface.

Abstract: A method of immersing an electrode in an electroplating solution while under vacuum, to substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. A method of electroplating an electrode in an electroplating solution including the application of a vacuum to the electrode while it is immersed in the electroplating solution to thereby substantially eliminate air and/or other gas from microscopic holes, cavities or indentations in the electrode. The electroplating liquid may be applied to only one side of the electrode (“the wet side”) in which case, sufficient time is allowed to pass for the immersion liquid to fill the microscopic through-holes, cavities or indentations in the electrode. An enhancement of this mode is to force liquid through the microscopic holes from the wet side. A highly penetrating solvent may be used as an immersion liquid.

Abstract: A polishing device is hermetically accommodated in a chamber containing an atmosphere having a composition different from the ambient air, so that the atmosphere around the polishing device is altered into the composition different from the ambient air, and voltage is applied between a wafer and a polishing pad to polish the wafer with an electrolytic effect. The polishing device has the atmosphere containing extremely less oxygen, preventing a surface of the wafer from oxidation and thereby providing a constant polishing rate.

Abstract: A method of manufacturing a fuel cell includes thermally treating a hydrogen permeable membrane in a given temperature higher than an actual operating temperature of the fuel cell, and forming an electrolyte layer on the hydrogen permeable membrane subjected to the thermal treatment. The hydrogen permeable membrane is composed of a polycrystalline metal.

Abstract: Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed layer or applying a plating material to the seed layer. A dielectric material (9) is arranged between the structures (8) thus formed. The dielectric layer is planarized for uncovering the structure below and another structure layer is formed on top of the first. Alternatively, the dielectric layer is applied with a thickness two layers and the structure below is accessed by selective etching of the dielectric layer for selectively uncovering the top surface of the structure below. Multiple structure layer may also be formed in one step.

Abstract: The inventive method and device for vacuum-compression micro plasma oxidation relate to electrochemical processing of metal, in particular to micro plasma treatment in electrolyte solutions. The aim of said invention is to develop a method for obtaining qualitatively homogeneous coatings by micro-plasma oxidation on large-sized parts, including irregular shaped parts, or simultaneously on a great number of small parts. The second aim of the invention is to design a device for processing parts, having an extended surface area, by using low-power supplies. The inventive method for vacuum-compression micro-plasma oxidation of parts consists in dipping a processable part into an electrolyte solution pre-filled in a sealed container, in generating micro-plasma discharges on the surface of said part and, subsequently, in forming a coating, wherein the micro-plasma discharges are formed in low-pressure conditions above the electrolyte solution.

Abstract: The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.

Abstract: The present invention relates to an anodic oxidation method and a treatment apparatus thereof which is suitable, for example, for generation of an oxide film and electropolishing of aluminum, capable of generating an oxide film at a low cost and rapidly by eliminating the use of electrolytic solution having a strong acid property and using a carbonated water as the electrolytic solution, capable of improving the oxide film generating operation and rationalizing the water discharging treatment, capable of preventing increase in temperature of the electrolytic solution without a need of a special equipment, capable of generating an oxide film in a stable manner and obtaining a good oxide film by eliminating the generation of oxide in the vicinity of an object to be treated, and capable of rationalization of the oxide film generating treatment and enhancing the productivity by using supercritical carbon dioxide. An object (3) to be treated is electrolyzed as an anode in an electrolytic solution.

Abstract: A plating tool cell anode for venting unwanted gases from a fluid plating solution. In a first embodiment, the solution is introduced into a chamber, defined by the plating tool cell (10), by fluid inlet (12) and contacts the anode (50). The fluid encounters a hydrophobic membrane (14) and a hydrophilic membrane (15) spaced from the hydrophobic membrane. A driving force, such as a vacuum, is applied to the gap (16) between the membranes to remove unwanted gases therein. In a second embodiment, a single membrane is used that is both hydrophobic and hydrophilic. Preferably, the hydrophobic portion of the membrane is located at or near the perimeter of the chamber and gas to be vented is directed toward the hydrophobic portion(s).

Abstract: A process tool for electrochemically treating a substrate is configured to reduce the oxygen concentration and/or the sulfur dioxide concentration in the vicinity of the substrate so that corrosion of copper may be reduced. In one embodiment, a substantially inert atmosphere is established within the process tool including a plating reactor by providing a continuous inert gas flow and/or by providing a cover that reduces a gas exchange with the ambient atmosphere. The substantially inert gas atmosphere may also be maintained during further process steps involved in electrochemically treating the substrate including required transportation steps between the individual process steps.

Abstract: A novel method of electrochemical treatment such as electroplating, etc. and an electrochemical reaction apparatus thereof which is high in reactability and able to be electrochemically reacted efficiently, which is small or zero in amount of generation of liquid waste such as electrolytic solution and cleaning liquid and therefore, amicable to the environment, and in which it is no more required to clean the electrode, etc. with cleaning liquid after reaction. Electrochemical reaction is executed in a reaction vessel (6) containing matter (5) which is in a supercritical or subcritical state and an electrolytic solution (1), and after reaction, the supercritical or subcritical matter (5) is shifted into a state of the matter (5) before being shifted into a critical state.

Abstract: The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.

Abstract: A process tool for electrochemically treating a substrate is configured to reduce the oxygen concentration and/or the sulfur dioxide concentration in the vicinity of the substrate so that corrosion of copper may be reduced. In one embodiment, a substantially inert atmosphere is established within the process tool including a plating reactor by providing a continuous inert gas flow and/or by providing a cover that reduces a gas exchange with the ambient atmosphere. The substantially inert gas atmosphere may also be maintained during further process steps involved in electrochemically treating the substrate including required transportation steps between the individual process steps.

Abstract: A method for chemical plating a substrate is provided. Embodiments of the method include evacuating an enclosure having a substrate disposed therein under vacuum, filling the enclosure with an electrolyte solution having a pressure between about 0.5 atm and about 200 atm, chemical plating a metal layer on a surface of the substrate, and draining the electrolyte solution from the enclosure. In another aspect, the method includes energizing an ultrasonic source to agitate the electrolyte solution substantially simultaneous with the step of chemical plating a metal layer on a surface of the substrate. In still another aspect, the method includes varying the pressure of the plating cell to agitate the electrolyte solution. In yet another aspect, the method includes increasing a pressure of the electrolyte solution by heating the electrolyte solution.

Abstract: A method and associated apparatus of electroplating an object and filling small features. The method comprises immersing the plating surface into an electrolyte solution and mechanically enhancing the concentration of metal ions in the electrolyte solution in the features. In one embodiment, the mechanical enhancement comprises mechanically vibrating the plating surface. In another embodiment, the mechanical enhancement comprises mechanically vibrating the electrolyte solution. In a further embodiment, the mechanical enhancement comprises increasing the pressure applied to the electrolyte solution.

Abstract: A process for cleaning an electrically conducting surface (3) by arranging for the surface to form the cathode of an electrolytic cell in which the anode (1) is maintained at a DC voltage in excess of 30V and an electrical arc discharge (electro-plasma) is established at the surface of the workpiece by suitable adjustment of the operating parameters, characterized in that the working gap between the anode and the cathode is filled with an electrically conductive medium consisting of a foam (9) comprising a gas/vapor phase and a liquid phase. The process can be adapted for simultaneously coating the metal surface by including ions of the species required to form the coating in the electrically conductive medium.

Abstract: An electrochemical deposition apparatus and method for depositing a material onto a surface of a workpiece and for polishing the material are disclosed. The apparatus includes a platen and a polishing surface, including a conductive material and conductors embedded therein, disposed proximate the platen. During material deposition, a bias is applied across the conductor and the platen to cause deposition of material onto the workpiece surface.

Abstract: A novel method of electrochemical treatment such as electroplating, etc. and an electrochemical reaction apparatus thereof which is high in reactability and able to be electrochemically reacted efficiently, which is small or zero in amount of generation of liquid waste such as electrolytic solution and cleaning liquid and therefore, amicable to the environment, and in which it is no more required to clean the electrode, etc. with cleaning liquid after reaction. Electrochemical reaction is executed in a reaction vessel (6) containing matter (5) which is in a supercritical or subcritical state and an electrolytic solution (1), and after reaction, the supercritical or subcritical matter (5) is shifted into a state of the matter (5) before being shifted into a critical state.

Abstract: The electrochemical formation of oxygen ion conducting solid oxide layers is achieved by the cathodic deposition of the oxide layers from a melted salt bath of alkali element halides containing dissolved metal halides which provide the metal cations from which oxide layers are formed and attached to conductive cathodes. Oxygen is supplied at the cathodes to form oxygen ions which diffuse through the cathodically formed oxide layers and react with dissolved metal cations leading to oxide layer growth. The dissolved metal halides are regenerated at the anodes from metals and metal compounds. The process is called cathodic oxide deposition (COD) and represents a new and economic method for the fabrication of oxygen ion conductor layers for solid oxide electrochemical devices.

Abstract: The present invention provides a method for producing an oxide film wherein a sharp-pointed processing electrode is positioned close to the material to be processed in an oxygen-containing gas, and a voltage in the single digit range is impressed across the material and the electrode so that the surface of the material is positive and the electrode is negative thereby causing an electric current to flow across the material and the electrode. The surface of the material reacts electrochemically with oxygen adsorbed on the surface of the material to anodize the surface immediately proximate the electrode. The method makes possible the formation of a patterned oxide film with a resolution of 0.1 .mu.m or less, thus surpassing the limit of conventional oxide film production methods.

Abstract: The invention comprises a method of forming a multi-element, thin hot film sensor on a polyimide film. The sensor is formed by first cleaning one surface of the polyimide. Then, under a continuous vacuum, the surface is simultaneously cleaned by ion bombardment while nickel is deposited by evaporation. The ion beam cleaning is discontinued and copper is then deposited to an initial thickness by evaporation without a break in the vacuum. The vacuum is then removed and a final thickness of copper is deposited by plating. Sensor patterns are then defined in the nickel and copper layers using conventional photolithography and etching techniques.

Abstract: An electroplating apparatus positively biases an anode with respect to a work dipped in an electrolyte in an electrolysis vessel for depositing metal on the work, and an inert ambience is created over the electrolyte so that the electrolyte is never oxidized.

Abstract: An apparatus for electroplating, particularly in the production of metal matrices for manufacturing articles of plastic, such as compact discs, said apparatus comprising a container having a peripheral wall and opposed first and second end walls so as to form a plating space therein, adapted to house an electrolyte, and an anode, a carrier with an electrically conductive surface to be plated forming the cathode and means being arranged between the anode and the cathode for providing a flow of electrolyte from said cathode towards said anode. For allowing a faster production of metal matrices with better quality it is suggested according to the invention that the peripheral wall is formed with an internal contour which substantially corresponds to the surface to be plated, said carrier forming the second container end wall which through intermediate current supply members is sealingly urged against the mating edge of the peripheral wall, while the anode is located adjacent said first end wall of the container.

Abstract: Bubbles are removed from small cavities, such as blind via holes in a semiconductor wafer, by immersing the article having the cavities in a liquid medium. A wetting agent is preferably present in the liquid medium. A vacuum is applied to the liquid medium, and the vacuum is vented to air. The application of vacuum and venting are repeated several times, causing the bubbles to be drawn from the cavities and to dislodge from the surface of the article. The bubbles float free, and processing within the cavities can commence.

Abstract: An apparatus and method for electroplating a graphite-epoxy workpiece in-situ. An electroplating assembly includes a rigid base that is retained a fixed distance about the surface region by insulated standoff legs. A flexible vacuum bag is coupled to the graphite-epoxy workpiece with a fluid-tight seal. The vacuum bag surrounds the surface region and encloses the rigid base to form a plating chamber. A supply chamber, containing a plating fluid, is coupled to the plating chamber by a fluid-tight tubing. A storage chamber is coupled to the plating chamber by a fluid-tight tubing. A vacuum source is coupled by tubing to the supply chamber and to the storage chamber. Valves in each tubing permit the selective coupling of the vacuum source and plating chamber to either the supply chamber or the storage chamber. Electroplating is carried out while plating fluid is drawn by the vacuum, from the supply chamber into the plating chamber and into the storage chamber.