Utilizing Electromagnetic Wave Energy During Coating (e.g., Visible Light, Etc.) Patents (Class 205/91)
  • Patent number: 11769851
    Abstract: The present disclosure provides a method for treating a surface portion of a TCO material in a semiconductor device that comprises a structure arranged to facilitate current flow in one direction. To perform the method the surface portion of the TCO is exposed to an electrolyte and a current is induced in the device. The current allows reducing the TCO material in a manner such that the adhesion of a metallic material to the exposed surface portion is improved over the adhesion of the metallic material to a non-exposed surface portion.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: September 26, 2023
    Assignee: NewSouth Innovations Pty Limited
    Inventors: Alison Joan Lennon, Vincent Akira Allen
  • Patent number: 11629073
    Abstract: The present invention relates to a hybrid system for water treatment, desalination, and chemical production. The hybrid system of the present invention includes a photoanode, an anode chamber, an anion exchange membrane, a middle chamber, a cation exchange membrane, a cathode chamber, and a cathode. In the middle chamber, saltwater or seawater is desalinated by photoelectrochemical electrodialysis. Chloride ions are generated during the desalination, transferred to the anode chamber, and activated by the photoanode. In the anode chamber, wastewater is treated by the activated chloride ions. In the cathode chamber, at least one chemical species selected from the group consisting of water, oxygen, and carbon dioxide is reduced by electrons supplied from the photoanode.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: April 18, 2023
    Assignee: KYUNGPOOK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Hyun Woong Park, Seong Hun Kim
  • Patent number: 11460424
    Abstract: An evaluation method is for evaluating a charging connector in coolability by connecting an evaluation jig to the charging connector, the charging connector including a pair of male terminals and a bottom wall, the evaluation jig including a pair of female terminals, the pair of female terminals being connected to the pair of male terminals in evaluating the charging connector in coolability. The method comprises: connecting the pair of female terminals to the pair of male terminals; and adjusting a connection state of the terminals so that contact resistance between the terminals falls within a prescribed range. In the step of adjusting, a resistance between a point of 4.5 mm of the male terminal from a surface of the bottom wall and a point of 43 mm of the female terminal from the surface of the bottom wall is measured as the contact resistance.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: October 4, 2022
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hisato Kawahara, Hiroaki Yuasa, Hidetoshi Kusumi
  • Patent number: 11402406
    Abstract: An evaluation method is a method for evaluating a charging connector in coolability by connecting an evaluation jig to the charging connector, the charging connector including a pair of male terminals coolable with a coolant, the evaluation jig including a pair of female terminals, the pair of female terminals being connected to the pair of male terminals in evaluating the charging connector in coolability. The method comprises: connecting the pair of female terminals to the pair of male terminals; adjusting a connection state between the male terminal and the female terminal such that contact resistance between the terminals is 0.06 m? or more and 0.15 m? or less; and after the adjusting, evaluating the coolability depending on whether the male and female terminals have a temperature of 90° C. or lower when a charging current of 400 A is supplied to the terminals for 30 minutes.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: August 2, 2022
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hisato Kawahara, Hiroaki Yuasa, Hidetoshi Kusumi
  • Patent number: 10950742
    Abstract: A method for preparing a film of a CIS semiconductor compound overcoated by a color layer includes preparing an electrolyte solution by mixing precursors of film constituents including Cu, In, and Se with a solvent; configuring an electrodeposition circuit by connecting an electrochemical cell comprising the electrolyte solution, a working electrode, and a counter electrode to a voltage or current supply device; disposing a photomask having the predetermined pattern on the working electrode; producing the film through the photomask on a surface of the working electrode by applying a reduction voltage or current; disposing a light source to emit light toward the photomask; and photoelectrically depositing the film on the surface of the working electrode at least in the predetermined pattern while illuminating light through the photomask; and forming a color layer of CuSe at least in the predetermined pattern on the film employed as a working electrode using photo-electrodeposition.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: March 16, 2021
    Assignee: Korea Institute of Science and Technology
    Inventors: Doh Kwon Lee, In Ho Kim, Hee Sun Yun, Jang Mi Lee
  • Patent number: 10537520
    Abstract: The present invention relates to stable, liquid parenteral formulations of Melphalan or pharmaceutically acceptable salts thereof. Further this invention also describes process of preparing such formulations.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: January 21, 2020
    Assignee: LEIUTIS PHARMACEUTICALS PVT. LTD.
    Inventors: Kocherlakota Chandrashekhar, Banda Nagaraju
  • Patent number: 9447514
    Abstract: A structure and method of making a thin-film solar cell is provided. A thin-film solar cell includes a substrate, absorber layer and a buffer layer. The absorber layer is deposited by a single-step bulk electrochemical process, or a multi-layer electrochemical process. The buffer layer is deposited by an electrochemical deposition process such as a multi-layer deposition or an atomic layer deposition. The absorber and buffer layers are non-toxic materials which can include sulfur incorporated during the deposition process or incorporated after deposition by an anneal step.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: September 20, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hariklia Deligianni, Lian Guo, Raman Vaidyanathan
  • Patent number: 9450136
    Abstract: A structure and method of making a thin-film solar cell is provided. A thin-film solar cell includes a substrate, absorber layer and a buffer layer. The absorber layer is deposited by a single-step bulk electrochemical process, or a multi-layer electrochemical process. The buffer layer is deposited by an electrochemical deposition process such as a multi-layer deposition or an atomic layer deposition. The absorber and buffer layers are non-toxic materials which can include sulfur incorporated during the deposition process or incorporated after deposition by an anneal step.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: September 20, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hariklia Deligianni, Lian Guo, Raman Vaidyanathan
  • Patent number: 9403293
    Abstract: An anodized layer formation method of an embodiment of the present invention includes the steps of: (a) providing an aluminum base which has a surface that is made of aluminum; (b) anodizing the surface to form a barrier-type alumina layer; and (c) after step (b), further anodizing the surface to form a porous alumina layer which has a plurality of minute recessed portions. According to an embodiment of the present invention, a method is provided that enables formation of a porous alumina layer which has an interpore distance of a desired magnitude with the use of an aluminum base which has a surface that is made of aluminum, irrespective of the surface form.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: August 2, 2016
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Akinobu Isurugi, Kiyoshi Minoura, Takao Imaoku
  • Publication number: 20150144495
    Abstract: A method of depositing aluminum onto a substrate is disclosed. In this method, the substrate is disposed as cathode in an electrochemical cell with an anode and a liquid electrodeposition composition comprising an ionic liquid and a source of aluminum, and aluminum is electroplated onto the substrate. Residual water content in the electroplating bath is controlled by exposure to light in the presence of a photo-oxidation catalyst to decompose the water or species associated with water.
    Type: Application
    Filed: November 22, 2013
    Publication date: May 28, 2015
    Applicant: Sikorsky Aircraft Corporation
    Inventors: Lei Chen, Xiaomei Yu, William P. Fallon
  • Patent number: 8926805
    Abstract: An electroplating apparatus and method for depositing a metallic layer on the surface of a wafer is provided wherein said apparatus and method do not require physical attachment of an electrode to the wafer. The surface of the wafer to be plated is positioned to face the anode and a plating fluid is provided between the wafer and the electrodes to create localized metallic plating. The wafer may be positioned to physically separate and lie between the anode and cathode so that one side of the wafer facing the anode contains a catholyte solution and the other side of the wafer facing the cathode contains an anolyte solution. Alternatively, the anode and cathode may exist on the same side of the wafer in the same plating fluid. In one example, the anode and cathode are separated by a semi permeable membrane.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: January 6, 2015
    Assignee: International Business Machines Corporation
    Inventors: Veeraraghavan S. Basker, Eduard Cartier, Hariklia Deligianni, Rajarao Jammy, Vamsi K. Paruchuri
  • Patent number: 8840768
    Abstract: A preparation method for molecular recognition sensor by electrodeposition is provided. The preparation method is as following: forming molecularly imprinted polymeric micelles by self-assembly of ionic type photosensitive copolymers; forming a film on the surface of an electrode by electrodepositing the molecularly imprinted polymeric micelles at a constant potential; crosslinking the electrodeposited micellar film via ultraviolet light irradiation; extracting the template molecules from the crosslinked film to obtain electrode modified by the molecularly imprinted polymeric micellar film; and connecting the modified electrode with a sensor device and a computer to construct a molecular recognition sensing system capable of specifically detecting the template molecules.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: September 23, 2014
    Assignee: Jiangnan University
    Inventors: Xiaoya Liu, Yiqun Yang, Chenglin Yi, Jing Luo, Haiqiang Wu, Sisi Jiang, Baoqing Wang, Jinqiang Jiang, Ren Liu, Shengwen Zhang, Jing Xu
  • Publication number: 20140261613
    Abstract: Various technologies described herein pertain to assembling electronic devices into a microsystem. The electronic devices are disposed in a solution. Light can be applied to the electronic devices in the solution. The electronic devices can generate currents responsive to the light applied to the electronic devices in the solution, and the currents can cause electrochemical reactions that functionalize regions on surfaces of the electronic devices. Additionally or alternatively, the light applied to the electronic devices in the solution can cause the electronic devices to generate electric fields, which can orient the electronic devices and/or induce movement of the electronic devices with respect to a receiving substrate. Further, electrodes on a receiving substrate can be biased to attract and form connections with the electronic devices having the functionalized regions on the surfaces. The microsystem can include the receiving substrate and the electronic devices connected to the receiving substrate.
    Type: Application
    Filed: October 23, 2013
    Publication date: September 18, 2014
    Applicant: Sandia Corporation
    Inventors: Gregory N. Nielson, Murat Okandan
  • Patent number: 8795503
    Abstract: The invention concerns a device to conduct an electrochemical reaction on the surface of a semiconductor substrate (S), characterized in that the device comprises: a container (10) intended to contain an electrolyte (E), a support (20) arranged in the container, said support being adapted for attachment of the semiconductor substrate (S) on said support (20), a counter-electrode (30) arranged in the container (10), illumination means (50) comprising a source (51) emitting light rays and means (52) to homogenize the light rays on all of said surface of the semiconductor substrate (S), so as to activate the surface of the semiconductor substrate (S), and an electric supply (40) comprising connection means for connection to the semiconductor substrate and to the counter-electrode in order to polarize said surface of said semiconductor substrate (S) at an electric potential permitting the electrochemical reaction.
    Type: Grant
    Filed: March 25, 2010
    Date of Patent: August 5, 2014
    Assignee: Alchimer
    Inventors: Said Zahraoui, Francis Descours, Frederic Raynal
  • Patent number: 8795502
    Abstract: A method of forming patterned metallization by electrodeposition under illumination without external voltage supply on a photovoltaic structure or on n-type region of a transistor/junction.
    Type: Grant
    Filed: May 12, 2010
    Date of Patent: August 5, 2014
    Assignee: International Business Machines Corporation
    Inventors: John M. Cotte, Harold J. Hovel, Devendra K. Sadana, Xiaoyan Shao, Steven Erik Steen
  • Publication number: 20140209471
    Abstract: A method and apparatus for electrochemically forming an oxide layer on a flat conductive surface which involves positioning a working electrode bearing the flat conductive surface in opposed parallel spaced apart relation to a flat conductive surface of a counter electrode such that the flat conductive surface of the working electrode and the flat conductive surface of the counter electrode are generally opposed, horizontally oriented, and define a space therebetween.
    Type: Application
    Filed: September 8, 2011
    Publication date: July 31, 2014
    Applicant: CLEAR METALS, INC.
    Inventors: Leonid Borisovich Rubin, Alexander Sergeyevich Osipov, Elena Borisovna Neburchilova
  • Publication number: 20140174936
    Abstract: Monovalent copper plating baths are used to metallize current tracks of the front side or emitter side of semiconductor wafers. Copper is selectively deposited on the current tracks by electrolytic plating or LIP. Additional metallization of the current tracks may be done using conventional metal plating baths. The metalized semiconductors may be used in the manufacture of photovoltaic devices.
    Type: Application
    Filed: April 19, 2012
    Publication date: June 26, 2014
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Gary Hamm, Jason A. Reese, Lingyun Wei
  • Publication number: 20140110264
    Abstract: A simple and fast light induced nickel plating method for p-type silicon wafer and n/p silicon solar cell material is revealed. When a n/p solar cell or p-Si semiconductor substrate, which is subjected to metallization with metal contact on the rear side, is immersed in a plating bath, metal ions are reduced on the front surface of semiconductor as soon as illumination starts on the front. The mechanism of nickel plating in this invention is nickel electroplating under the reduction reaction with the use of interfacial potential between the nickel plating bath and the metal surface. It does not need any surface catalytic processing and extra voltage. Instead, it can carry out the nickel deposition on the specific surface with a high nickel plating rate, a simple process and a low production cost.
    Type: Application
    Filed: October 24, 2012
    Publication date: April 24, 2014
    Applicant: Atomic Energy Council-Institute of Nuclear Research
    Inventors: Yu-Han Su, Wei-Yang Ma, Tsun-Neng Yang
  • Publication number: 20140103538
    Abstract: One embodiment is a method for void-free metallic electrofilling inside openings, said method includes: providing a substrate with at least one opening, the substrate includes an electrically conductive surface, including inside the at least one opening; immersing the substrate in an electrolyte contained in an ECD cell, the ECD cell includes at least one anode and a cathode, the cathode includes at least a portion of the conductive surface, the electrolyte includes plating metallic ions and at least one inhibitor additive, said metallic ions and at least one inhibitor additive having concentrations; providing electrolyte agitation across the substrate surface; and applying electroplating current density to the substrate; wherein the agitation, the concentrations, and the electroplating current density are such to produce void-free metallic electrofilling of the at least one opening, and wherein a height of electrodeposited surface bumps, or transition steps or humps, or transition spikes, is less than 140 nm
    Type: Application
    Filed: November 30, 2012
    Publication date: April 17, 2014
    Inventor: Uri Cohen
  • Publication number: 20140008234
    Abstract: A metal underlayer is selectively plated on semiconductor wafers immediately followed by plating copper on the metal underlayer using a low internal stress copper plating bath. Additional metallization may be done to build up the metal layers using conventional metal plating baths and methods to form current tracks. Formation of metal silicides is avoided. Good adhesion of the metals to the semiconductors is achieved. The metalized semiconductors may be used in the manufacture of photovoltaic devices.
    Type: Application
    Filed: July 9, 2012
    Publication date: January 9, 2014
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Lingyun WEI, Gary HAMM, Narsmoul KARAYA, JR.
  • Publication number: 20130327649
    Abstract: A method of manufacturing a biosensor having a microbeam linked to a support, at least one electrode a biological molecule A grafted onto the microbeam in a different zone from the zone where the electrode is embedded, and a mechanoelectrical transducer for converting variations of the mechanical properties of the microbeam into an electrical signal, when the biological molecule A is placed in contact with a biological molecule B to be detected and/or quantified. The method includes: formation of an electrode on fluoropolymer material sheet, passivation of the electrode(s), creation of the form of the biosensor in the sheet of polymer material and separation of this form from the sheet, functionalization either of a prefunctionalized zone or of a zone of the microbeam, this zone being different from the zone wherein the electrode is embedded, and grafting of a biological molecule A onto the functionalized zone.
    Type: Application
    Filed: February 14, 2012
    Publication date: December 12, 2013
    Applicant: Commissariat A L'Energie Atomique Et Aux Energies Alternatives
    Inventors: Jérôme Polesel Maris, Thomas Berthelot
  • Patent number: 8603314
    Abstract: Semiconductors are electrochemically etched in solutions containing sources of bifluoride and nickel ions. The electrochemical etching may form pores in the surface of the semiconductor in the nanometer range. The etched semiconductor is then nickel plated.
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: December 10, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Gary Hamm, Jason A. Reese, George R. Allardyce
  • Patent number: 8594417
    Abstract: Systems and methods for inspecting anodes, and smelting management based thereon are provided. In one embodiment, a system includes an imaging device configured to obtain images of at least one anode assembly, an image processor configured to producing imaging data based on the images, and a data analyzer configured to produce anode characteristic data based on the imaging data. In one embodiment, a method includes the steps of obtaining at least one image of at least a portion of an anode assembly, producing imaging data based on the at least one image, and deriving anode characteristic data based, at least in part, on the imaging data.
    Type: Grant
    Filed: November 27, 2007
    Date of Patent: November 26, 2013
    Assignee: ALCOA Inc.
    Inventors: Jean-Pierre Gagné, Gilles Dufour
  • Patent number: 8551313
    Abstract: An electroplating apparatus and method for depositing a metallic layer on the surface of a wafer is provided wherein said apparatus and method do not require physical attachment of an electrode to the wafer. The surface of the wafer to be plated is positioned to face the anode and a plating fluid is provided between the wafer and the electrodes to create localized metallic plating. The wafer may be positioned to physically separate and lie between the anode and cathode so that one side of the wafer facing the anode contains a catholyte solution and the other side of the wafer facing the cathode contains an anolyte solution. Alternatively, the anode and cathode may exist on the same side of the wafer in the same plating fluid. In one example, the anode and cathode are separated by a semi permeable membrane.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: October 8, 2013
    Assignee: International Business Machines Corporation
    Inventors: Veeraraghavan S. Basker, Eduard Cartier, Hariklia Deligianni, Rajarao Jammy, Vamsi K. Paruchuri
  • Publication number: 20130240364
    Abstract: The provided method includes photoelectrodeposition of an electrocatalyst onto a semiconductor to form a photoanode. The method yields composite photoanodes showing enhancement of photocurrent (water splitting rate) when incorporated into a photoelectrochemical cell for water electrolysis.
    Type: Application
    Filed: September 7, 2012
    Publication date: September 19, 2013
    Applicant: UNIVERSITY OF WASHINGTON
    Inventors: Daniel R. Gamelin, Diane K. Zhong
  • Publication number: 20130233718
    Abstract: A material surface treatment protocol (e.g., FIG. 13) uses concurrent electronic and photonic stimulation to generate an exothermic reaction and coat the surface (e.g., FIGS. 8 and 9) of a material, such as palladium. This protocol is performed at or near the boiling point of water within a sealed vessel that prevents the escape of steam and that is lined with silica or a similar glass to increase the silica available to the reaction. The great majority of the applied energy is heat used to elevate the temperature to near the boiling point, while concurrent stimulations provide only about 100 mW of additional energy for the surface treatment.
    Type: Application
    Filed: April 30, 2013
    Publication date: September 12, 2013
    Inventors: Brian P. Roarty, Carol J. Walker
  • Publication number: 20130199830
    Abstract: By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.
    Type: Application
    Filed: August 5, 2011
    Publication date: August 8, 2013
    Applicant: Hitachi Chemical Company Ltd
    Inventors: Masaki Morita, Konatsu Nakamura, Shin Takanezawa
  • Publication number: 20130183534
    Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.
    Type: Application
    Filed: September 30, 2011
    Publication date: July 18, 2013
    Applicants: Kunio Mori, Meiko Electronics Co., Ltd., Sulfur Chemical Institute Incorporated
    Inventors: Kunio Mori, Yusuke Matsuno, Takahiro Kudo, Shigeru Michiwaki, Manabu Miyawaki
  • Publication number: 20130161614
    Abstract: Nanostructured films including a plurality of nanowells, the nanowells having a pore at the top surface of the film, the pore defining a channel that extends downwardly towards the bottom surface of the film are provided. Also provided are methods including exposing a growth substrate to an anodizing bath, applying ultrasonic vibrations to the anodizing bath, and generating a current through the anodizing bath to form the nanostructured film. The nanostructured films may be formed from TiO2 and may be used to provide solid state dye sensitized solar cells having high conversion efficiencies.
    Type: Application
    Filed: July 29, 2011
    Publication date: June 27, 2013
    Inventors: Ashutosh Tiwari, Michael Snure, Makarand Karmarkar
  • Publication number: 20120318673
    Abstract: An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.
    Type: Application
    Filed: August 28, 2012
    Publication date: December 20, 2012
    Applicant: International Business Machines Corporation
    Inventors: Veeraraghavan S. Basker, John M. Cotte, Hariklia Deligianni, Matteo Flotta
  • Publication number: 20120292192
    Abstract: Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.
    Type: Application
    Filed: April 30, 2012
    Publication date: November 22, 2012
    Inventors: Manish RANJAN, Shantinath GHONGADI, Frederick Dean WILMOT, Douglas HILL, Bryan L. BUCKALEW
  • Publication number: 20120285833
    Abstract: A preparation method for molecular recognition sensor by electrodeposition is provided. The preparation method is as following: forming molecularly imprinted polymeric micelles by self-assembly of ionic type photosensitive copolymers; forming a film on the surface of an electrode by electrodepositing the molecularly imprinted polymeric micelles at a constant potential; crosslinking the electrodeposited micellar film via ultraviolet light irradiation; extracting the template molecules from the crosslinked film to obtain electrode modified by the molecularly imprinted polymeric micellar film; and connecting the modified electrode with a sensor device and a computer to construct a molecular recognition sensing system capable of specifically detecting the template molecules.
    Type: Application
    Filed: July 31, 2012
    Publication date: November 15, 2012
    Inventors: Xiaoya LIU, Yiqun Yang, Chenglin Yi, Jing Luo, Haiqiang Wu, Sisi Jiang, Baoqing Wang, Jinqiang Jiang, Ren Liu, Shengwen Zhang, Jing Xu
  • Patent number: 8303791
    Abstract: An electrochemical process comprising: providing a 125 mm or larger semiconductor wafer in electrical contact with a conducting surface, wherein at least a portion of the semiconductor wafer is in contact with an electrolytic solution, said semiconductor wafer functioning as a first electrode; providing a second electrode in the electrolytic solution, the first and second electrode connected to opposite ends of an electric power source; and irradiating a surface of the semiconductor wafer with a light source as an electric current is applied across the first and the second electrodes. The invention is also directed to an apparatus including a light source and electrochemical components to conduct the electrochemical process.
    Type: Grant
    Filed: August 26, 2008
    Date of Patent: November 6, 2012
    Assignee: International Business Machines Corporation
    Inventors: Veeraraghavan S. Basker, John M. Cotte, Hariklia Deligianni, Matteo Flotta
  • Publication number: 20120048378
    Abstract: A structure and method of making a thin-film solar cell. A thin-film solar cell includes a substrate, absorber layer and a buffer layer. The absorber layer is deposited by a single-step bulk electrochemical process, or a multi-layer electrochemical process. The buffer layer is deposited by an electrochemical deposition process such as a multi-layer deposition or an atomic layer deposition. The absorber and buffer layers are non-toxic materials which can include sulfur incorporated during the deposition process or incorporated after deposition by an anneal step.
    Type: Application
    Filed: August 31, 2011
    Publication date: March 1, 2012
    Applicant: International Business Machines Corporation
    Inventors: Hariklia Deligianni, Lian Guo, Raman Vaidyanathan
  • Publication number: 20120000785
    Abstract: The invention concerns a device to conduct an electrochemical reaction on the surface of a semiconductor substrate (S), characterized in that the device comprises: a container (10) intended to contain an electrolyte (E), a support (20) arranged in the container, said support being adapted for attachment of the semiconductor substrate (S) on said support (20), a counter-electrode (30) arranged in the container (10), illumination means (50) comprising a source (51) emitting light rays and means (52) to homogenize the light rays on all of said surface of the semiconductor substrate (S), so as to activate the surface of the semiconductor substrate (S), and an electric supply (40) comprising connection means for connection to the semiconductor substrate and to the counter-electrode in order to polarize said surface of said semiconductor substrate (S) at an electric potential permitting the electrochemical reaction.
    Type: Application
    Filed: March 25, 2010
    Publication date: January 5, 2012
    Applicant: ALCHIMER
    Inventors: Said Zahraoui, Francis Descours, Frederic Raynal
  • Publication number: 20110278172
    Abstract: A method of forming patterned metallization by electrodeposition under illumination without external voltage supply on a photovoltaic structure or on n-type region of a transistor/junction.
    Type: Application
    Filed: May 12, 2010
    Publication date: November 17, 2011
    Applicant: International Business Machines Corporation
    Inventors: John M. Cotte, Harold J. Hovel, Devendra K. Sadana, Xiaoyan Shao, Steven E. Steen
  • Publication number: 20110253545
    Abstract: The present disclosure provides a method of electrodeposition of a metal or metal alloy on at least one surface of a semiconductor material. The method of the present invention provides full coverage of an electrodeposited metallic film on the at least one surface of the semiconductor material. The method of the present disclosure includes providing a semiconductor material. A metallic film is applied to at least one surface of the semiconductor material by an electrodeposition process. The electrodeposition process employed uses current waveforms that apply a low current density initially, and after a predetermined period of time, the current density is changed to a high current density.
    Type: Application
    Filed: April 19, 2010
    Publication date: October 20, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Laura L. Kosbar, Xiaoyan Shao
  • Publication number: 20110212344
    Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula AMxByOz, in which A is one or more elements selected from groups 10 and 11 of the Element Periodic Table; M is one or more metal elements in three plus selected from the group consisting of Fe, Co, Mn, Al, Ga, In, Tl, and rare earth elements; and O is oxygen; and x=0-2, y=0.01-2; z=1-4; and the accelerators further have a formula A?M?mOn, in which A? is one or more elements selected from groups 9, 10, and 11 of the periodic table; M is one or more elements selected from the group consisting of Cr, Mo, W, Se, Te, and Po; and O is oxygen; and m=0.01-2; n=2-4. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator.
    Type: Application
    Filed: November 19, 2010
    Publication date: September 1, 2011
    Inventors: Qing Gong, Liang Zhou, Weifeng Miao, Xiong Zhang
  • Publication number: 20110171600
    Abstract: A bio-implant having a screw body selectively formed with nanoporous channels structure in a spiral groove and the method of making the same are disclosed. Nanoporous channels structure formed into the spiral groove of the bio-implant is carried out by the heat treatment in vacuum firstly and anodic treatment secondly. Thereafter, bioactive material is filled into the nanoporous and deposited on the implant surface by an electro-deposition process so as to increase the bioactivity and biocompatibility of the bio-implant.
    Type: Application
    Filed: May 11, 2010
    Publication date: July 14, 2011
    Applicant: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY
    Inventors: Chung-Kuang Yang, Sea-Fue Wang, Sheng-Yang Lee, Jen-Chang Yang, I-lin Ho
  • Publication number: 20110132764
    Abstract: A process for producing a photovoltaic structure that includes a thin coating film, generally made of a transparent conductive oxide, deposited on top of a sublayer having photovoltaic properties. The coating film is deposited electrochemically in an electrolysis bath and at least partly assisted by illumination coming from a light source.
    Type: Application
    Filed: July 28, 2009
    Publication date: June 9, 2011
    Applicants: ELECTRICITE DE FRANCE, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE- CNRS
    Inventors: Daniel Lincot, Jean Rousset
  • Publication number: 20110062028
    Abstract: An apparatus for electroplating one or more surfaces (2,3) on one or more substrates (1), especially solar cells (1a), is described. The apparatus includes an electrochemical coating bath (13), which has a coating tank (12) filled with an electrochemical coating liquid (14). The apparatus also includes a conveying device (15) for transporting the substrate through the coating bath (13), a light source circuit (60) with light sources (64) for irradiating the substrate (1) and an electrolytic cell rectifier circuit (50) for the substrate with anodes (54). The apparatus is characterized by a device for generating synchronous current pulses and light pulses, so that during a time interval between the current pulses the irradiating of the substrate or substrates is interrupted. A process for electrochemical plating of the surface of the substrate or substrates is also described.
    Type: Application
    Filed: September 16, 2010
    Publication date: March 17, 2011
    Inventors: Lothar Lippert, Stefan Dauwe
  • Publication number: 20110011745
    Abstract: A method for electrochemically depositing a metal electrode of a solar cell, comprising the steps of: making the surface of the solar cell having a cathode contact with an electrolyte solution, connecting an anode of the solar cell and a solid metal, illuminating the main light-receiving surface of the solar cell, wherein metal ions in the electrolyte solution accept electrons formed on the cathode surface of the solar cell so that a metal is formed and deposited on the cathode surface of the solar cell, meanwhile, the solid metal provides electrons to the anode of the solar cell so that the metal ions are formed and dissolved in the electrolyte solution.
    Type: Application
    Filed: January 29, 2008
    Publication date: January 20, 2011
    Applicant: WUXI SUNTECH POWER CO., LTD.
    Inventors: Jingjia Ji, Stuart Wenham, Liping Chen, Zhengrong Shi
  • Patent number: 7804046
    Abstract: In order that an object can be warmed through the use of thermoacoustic effect, the acoustic heating apparatus includes a first stack 3a sandwiched between a high-temperature-side heat exchanger 4 and a low-temperature input-side heat exchanger 5 in a first tube portion 2a and a second stack 3b sandwiched between a low-temperature-side heat exchanger 6 and a high-temperature output-side heat exchanger 7 in a second tube portion 2b. A standing wave and a traveling wave are generated through self excitation in the first tube portion 2a by cooling the low-temperature input-side heat exchanger 5 to minus 20° C. to 60° C. A temperature gradient is generated in the second stack 3b by propagating the resulting standing wave and the traveling wave to the second tube portion 2b, and high-temperature heat is output due to this temperature gradient from the high-temperature output-side heat exchanger 7 disposed on the second stack 3b side.
    Type: Grant
    Filed: March 23, 2005
    Date of Patent: September 28, 2010
    Assignee: The Doshisha
    Inventors: Yoshiaki Watanabe, Shinichi Sakamoto
  • Publication number: 20100224498
    Abstract: A method for producing a wear and corrosion resistant WC based material coated with one or more metals selected from group IVB, VB and VIB metals (according to CAS system) and Al is disclosed. The method comprises treating of said coated structure with electrochemical boriding treatment in an electrolyte which is substantially free of halogenated compounds wherein the electrolyte comprises alkali carbonates and boron sources and said electrolyte being heated during electrolysis under an induction heating regime having electromagnetic frequency ranging from 50 to 300 kHz during electrolysis.
    Type: Application
    Filed: November 6, 2008
    Publication date: September 9, 2010
    Inventors: Mustafa K. Ürgen, Servet I. Timur, Kürsat M. Kazmanli, Güldem Kartal
  • Publication number: 20100200408
    Abstract: A metal and oxygen material such as a transparent electrically conductive oxide material is electro deposited onto a substrate in a solution deposition process. Process parameters are controlled so as to result in the deposition of a high quality layer of material which is suitable for use in a back reflector structure of a high efficiency photovoltaic device. The deposition may be carried out in conjunction with a masking member which operates to restrict the deposition of the metal and oxygen material to specific portions of the substrate. In particular instances the deposition may be implemented in a continuous, roll-to-roll process. Further disclosed are semiconductor devices and components of semiconductor devices made by the present process, as well as apparatus for carrying out the process.
    Type: Application
    Filed: February 11, 2009
    Publication date: August 12, 2010
    Applicant: United Solar Ovonic LLC
    Inventors: Shengzhong Liu, Chaolan Hu, Yanhua Zhou, Kais Younan, Bud Dotter, II, Vincent Cannella, Arindam Banerjee, Jeffrey Yang, Subhendu Guha
  • Publication number: 20100108524
    Abstract: The invention relates to a method for manufacturing an article comprising a barrier layer, the method comprising—providing an metallic or metalloid layer to a surface of a substrate by electro-deposition, using a plating liquid comprising an ionic liquid and metal ions or metalloid ions, which metal ions or metalloid ions are reduced and deposited to form the metallic or metalloid layer during the electro-deposition; and—preferably at least partially oxidising the metallic or metalloid layer.
    Type: Application
    Filed: April 17, 2008
    Publication date: May 6, 2010
    Applicant: Nederlandse Organisatie voor toegepast-natuurweten schappelijk onderzoek TNO
    Inventors: Antonius Maria Bernardus van Mol, Harmannus Franciscus Maria Schoo, Petrus Marinus Martinus Cornelus Bressers, Joost van Erkel, Marinus Marc Koetse
  • Publication number: 20100108525
    Abstract: An apparatus for the light-supported precipitation of an electrolyte on a semiconductor component comprises a plating bath with an electrolyte, a first electrode arranged in the plating bath and a second electrode arranged outside the plating bath, a holding device for the semiconductor component and an irradiation device for irradiating the semiconductor component with electromagnetic radiation, the irradiation device being arranged outside the plating bath.
    Type: Application
    Filed: November 5, 2009
    Publication date: May 6, 2010
    Inventors: Andreas Krause, Bernd Bitnar, Claudia Lengsfeld, Holger Neuhaus
  • Publication number: 20100087916
    Abstract: A method for manufacturing a degradation-inhibiting first layer on the surface of an implant body, in particular an intraluminal endoprosthesis, whereby the body has at least one metallic material, which is at least largely biodegradable, comprising the following steps: preparing the body of the implant, and applying the first layer to at least a portion of the body surface, whereby the first layer contains magnesium stearate. An implant obtainable by such a method.
    Type: Application
    Filed: September 24, 2009
    Publication date: April 8, 2010
    Applicant: BIOTRONIK VI PATENT AG
    Inventors: Ullrich Bayer, Baerbel Becher, Bernd Block
  • Publication number: 20100072070
    Abstract: A plurality of pixels, each including first and second electrodes and an electrolytic solution, are arranged. When a voltage between the first and the second electrodes increases into a precipitation critical value or more, the precipitation of electroplating starts. When the voltage decreases into a value smaller than the deposition overvoltage value, the precipitation ends. A control unit controlling the voltage between the first and second electrodes repeats a subfield operation including a first operation of selectively supplying any of first, a second voltage and third voltages to the plurality of pixels, and a second operation of collectively supplying the second voltage value to the plurality of pixels after the first operation, at least two times or more, to control the gradation of each pixel based on a timing of supplying the third voltage.
    Type: Application
    Filed: September 3, 2009
    Publication date: March 25, 2010
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Hajime Ikeda
  • Publication number: 20100021650
    Abstract: Disclosed herein are a method of producing microstructure and a method of producing mold, the methods permitting production of much smaller pores than before in an atmosphere where impurities are negligible and also permitting production of microstructures having a smaller size and a higher crystallinity than before with the help of the pores. The method of producing microstructure comprises a step of making pores (4) in a substrate (1) to become a mold (5) by irradiation with a focused energy beam (3) and a step of growing a microstructure (8) in the thus made pores (4). The method of producing a mold includes a step of making pores (4) by irradiating a substrate (1) to become a mold (5) with a focused energy beam (3).
    Type: Application
    Filed: May 26, 2009
    Publication date: January 28, 2010
    Applicant: Sony Corporation
    Inventors: Koji Kadono, Yosuke Murakami