Abstract: A clamping mechanism providing automatically accurate placement includes a pillar, a first clamping plate fixed to a first end of the pillar, and a second clamping plate movably coupled to a second end of the pillar and opposite to the first clamping plate. The first clamping plate includes a base plate. The base plate includes a first surface facing the second clamping plate and two opposite side faces connected to the first surface. The first surface is concave and defines two first positioning slots on opposite sides. Each first positioning slot passes through the two side faces. The first positioning slots are configured to position a carrying frame on a transferring apparatus accurately. A transferring apparatus including the clamping mechanism is also disclosed.

Abstract: A wafer container includes at least one shelf and a frame. The shelf is capable of holding at least one wafer, and has at least one opening therein. The opening is at least partially exposed by the wafer when the wafer is hold by the shelf. The frame carries the shelf and allows access to the shelf.

Abstract: Disclosed are a sheet storage device and a controlling method thereof the sheet storage device including a storage unit, an adjustment assembly and a control portion. The storage unit comprises a mounting frame, a plurality of support brackets configured to place a plurality of sheets and two shiftable mechanisms mounted on the mounting frame and spaced apart in an upper and lower direction. The support brackets are mounted between the two shiftable mechanisms and spaced apart in a position shifting direction of the two shiftable mechanisms, and two adjacent support brackets thereof are constructed to define a storage space for placing the sheet. Each support bracket is configured such that upper and lower ends of the support bracket are adapted to be shiftably engaged with the two shiftable mechanisms respectively, so as to adjust the distance between the two adjacent support brackets.

Abstract: Card locks for securing electronics card in card slots within cages and designed and configured to allow each card lock to impart high uniform pressure between an electronics card and the corresponding card slot to maximize heat transfer from the electronics card to the card cage to efficiently sink heat generated onboard the electronics card. In some embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively pushes one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state. In other embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively draws one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state.

Abstract: A wireless charger assembly is used for transferring power to an electronic device through inductive charging. The wireless charger assembly includes a bottom case releasably mounted to an exterior flatbed, a transmitter coil, and a top case. The transmitter coil transmits power to a receiver coil of the electronic device through inductive charging. The top case has a working platform mounted around the working surface of the flatbed, a neck portion extending downwardly from the working platform, and a slot defined by the working platform and the neck portion. The neck portion releasably retained to the closed loop wall.

Abstract: An electronic device includes a circuit substrate, a bottom case, and a top case. The circuit substrate has a plurality of slits penetrating therethrough. The bottom case has a groove portion positioned at an inside surface of the bottom case such that edge portions of the circuit substrate are slidable and inserted into the groove portion. Besides, a plurality of pin-shaped protrusion portions is provided in the bottom case to be snib-fitted with the top case, and each protrusion portion has a plurality of locking portions at a tip end portion. Each protrusion portion elastically biases the circuit substrate toward the top side of the bottom case and presses the circuit substrate to a top surface of the groove portion by locking the locking portions to the circuit substrate after the locking portions are respectively inserted into the slits.

Abstract: In an electronic device, a circuit substrate is provided with at least one electronic circuit, and a case accommodates the circuit substrate. The case has a pair of groove portions and a side opening portion. The groove portions are provided, such that edge portions of the circuit substrate are slidable and inserted into the groove portions from the side opening portion. A box-shaped cover is disposed to close a bottom opening portion of the case. The cover includes a pair of side walls having top end portions, and a plurality of protrusion portions projecting from the top end portions of the side walls. The protrusion portions are inserted into a space between the edge portions of the circuit substrate and the groove portions, at a bottom side of the circuit substrate, to fix the circuit substrate.

Abstract: A paper packaging box is disclosed. The paper packaging box includes a bottom cover, two side frames, a plurality of first Velcro portions, a plurality of second Velcro portions, and a top cover. The two side frames are respectively disposed standing on two opposite sides of the bottom cover. Each of the side frames has a plurality of slots, and the slots of the two side frames are face to face in pairs. The first Velcro portions are disposed at the bottom cover. The second Velcro portions are disposed at the side frames. The first Velcro portions and the second Velcro portions are engaged with each other to allow the side frames to stand on the bottom cover. The top cover is disposed above the side frames.

Abstract: A cassette tray is provided, which includes a bottom plate and two holding members. The bottom plate includes a plurality of positioning holes, wherein the positioning holes are arranged in rows along a first direction, and the rows are spaced apart from each other in a second direction perpendicular to the first direction. Each of the holding members is selectively connected to the positioning holes in one of the rows and mounted on the bottom plate in a detachable manner, and a circuit board is received between the two holding members.

Abstract: The present invention provides a package cushioning structure for module, which includes a cushioning bottom board and a cushioning band extending through and interlaced with the cushioning bottom board. The cushioning bottom board forms a plurality of spaced hollow sections. A bar is arranged between every two of the hollow sections. The cushioning band includes a plurality of cushioning air columns mounted thereto at interval. The cushioning air columns are arranged alternately on the bars. To package, modules are each positioned on and born by each of the bars between two of the cushioning air columns. An alternate package cushioning structure includes a cushioning bottom board having a surface forming slots and a cushioning band arranged in the cushioning bottom board through a mounting channel extending through the bottom board from a side surface thereof. Air columns of the cushioning band are located in the slots to support modules.

Abstract: A circuit board magazine for carrying electronic articles, such as printed circuit boards and the like having a plurality of slots arranged in stacked parallel relationship for receiving the electronic articles is provided. The plurality of slots are formed as a pair of oppositely facing recessed regions extending along the length of the device. Each of the slots includes a recessed region that receives an edge of the printed circuit boards. An engagement mechanism is mounted at an open end face of the device. The engagement mechanism includes a retention bar and a spring-loaded lever that is pivotally mounted for automatic movement to a raised inoperative position to disengage the retention bar and permit the bar to swivel freely. In a retracted position, the retention bar permits passage of the printed circuit boards through the open end face. In the closed position, the retention bar prevents movement of the circuit boards from the interior of the device.

Abstract: A tray cleaning apparatus having a top plate, a bottom plate, a first bearing plate assembly and a second bearing plate assembly. The first bearing plate assembly disposed between top plate and bottom plate comprises a first supporting plate, plural first blocks and plural second blocks, the first supporting plate comprises an inner surface having a first disposing area and a second disposing area. The first blocks are disposed at the first disposing area and the second blocks are disposed at the second disposing area. The second bearing plate assembly disposed between top plate and bottom plate comprises a second supporting plate, plural third blocks and plural fourth blocks, the second supporting plate comprises an outer surface having a third disposing area and a fourth disposing area. The third blocks are disposed at the third disposing area and the fourth blocks are disposed at the fourth disposing area.

Abstract: A box for transporting is suitable for preserving a plurality of substrates. The box for transporting includes a box body and at least one partition plate. The box body has a bottom part and a plurality of first sidewalls. A plurality of first bumps arranged in array is disposed on the bottom part, and the first bumps define a plurality of supporting regions. The first sidewalls are connected to the bottom part, and a plurality of major grooves is disposed in inner surfaces of the first sidewalls, wherein a first preserving space is surrounded by the bottom part and the first sidewalls. The partition plate is leant against the supporting regions and inlayed into the major grooves, so as to divide the first preserving space into a plurality of preserving sub-spaces.

Abstract: An LED indicator casing (1R) has: a casing (1a) including a bottom face (S1), a front face (S2) having an aperture (2a) for light emission, and paired side faces (S3 and S4) adjoining the front face (S2); and paired lead terminals (11 and 12), one of which has a light-emitting element (LED)(21) fitted thereto. The paired lead terminals (11 and 12) are led out to the bottom face (S1) via the paired side faces (S3 and S4) of the casing (1a) respectively.

Abstract: A process carrier is capable of supporting printed circuit boards during manufacturing and testing. The process carrier includes a base plate, a first top plate and a second top plate. The base plate has an upper surface including a recessed area sized to receive a panelized group of printed circuit board substrates and a lower surface. The first top plate is coupleable to the upper surface of the base plate during a first manufacturing process. The first top plate includes a plurality of connected rails configured to secure the panelized group of printed circuit board substrates. The second top plate is coupleable to the upper surface of the base plate during a second manufacturing process. The second top plate is configured to cover the panelized group of printed circuit board substrates.

Abstract: The present invention includes a ceiling portion 8, bottom portion 9, a substrate housing portion 3 formed by a side walls 5 to 7, a plurality of wafer slots 11 arrayed in parallel on the inner surface of the side walls 6 and 7, a slit portion 12 formed in an extended manner along the array direction of the wafer slots 11 on each of a second side wall 6 and a third side wall 7, a slide portion 18 movably arrayed along each of the slit portions 12, a plurality of substrate securing pieces arrayed with substantially the same intervals with the intervals of the wafer slots 11 on the inner surface of the slide portion 18, in which, with the slide portion being in a substrate securing position, the substrate housing pieces press and secure the substrate on the wafer slot 11, and in a substrate securing releasing position, the substrate housing pieces move separately from a circumferential portion of the substrate and releases a securing state of the substrate.

Abstract: A circuit board storage bag and a storage rack are disclosed. A plurality of printed circuit board storage bags for accommodating a circuit board comprise a front surface portion and a rear surface portion opposed to the obverse and reverse surfaces, respectively, of the circuit board accommodated in the circuit board storage bag and connecting portions for connecting the front surface portion and the rear surface portion. The front surface portion and the rear surface portion bend at the connecting portions to open and close the circuit board storage bag for use in transporting the circuit board. The circuit boards are stored in a storage rack having an inclined mounting surface for mounting the storage bags and a bag stopper at the lower end of the mounting surface. The bags are stored in vertical position on one side at the lower end of the mounting surface.

Abstract: A system and method for an improved multiple hard-disk-drive data-storage enclosure. Some embodiments position drives in counter-rotating pairs, each simultaneously accessing half the data, such that seek-caused actuator rotational-acceleration vibration cause simultaneous canceling rotational torque. Some embodiments position the edge of a first drive (or drive pair) at an angle to the actuator midpoint of a nearby second drive (or drive pair), such that rotational-acceleration vibration from a seek-caused actuator rotation in the first drive does not cause a rotational movement into the second drive that affects the tracking or seek operation. Some further embodiments position drives in a herringbone pattern to redirect air flow in addition to reducing rotational-acceleration vibration interaction. Other embodiments include a printed wire circuit board mounted to reduce the rotational-acceleration vibration interaction.

Abstract: Support frame (1) for wall mounting at least one electrical apparatus (20, 21, 22, 23), the frame (1) comprising: a surround casing (4) for wall fixing, enclosing an opening (5) that defines a assembly housing adapted to accepting and retaining said at least one electrical apparatus (20, 21, 22 and 23), the opening (5) being defined by a facing pair of fixing panels (6 and 7) and a facing pair of connecting panels (9 and 10) with ends attached to said fixing panels (6 and 7) and the fixing panels (6 and 7) comprising attachment elements (8) for mounting said at least one electrical apparatus (20, 21, 22 and 23). The connecting panels (9 and 10) include coupling components (11), adapted to engaging with respective complementary coupling components (12) substantially located on end sections of a divider (13) that can be removably coupled to said frame (1) to subdivide said opening.

Abstract: A cassette device for accepting substrates includes a frame, a plurality of slots protruding from opposing sides of the frame, and at least two supporting bars connected to at least two of the slots.

Abstract: The present invention provides a supporting member for thin-film-coated boards that is capable of sufficiently suppressing dust generated because of particles and the like. The present invention also provides a storage container suitable for storing thin-film-coated boards that has such a supporting member so as to store the thin-film-coated boards at a high level of cleanliness. The supporting members (2) and (5) have supporting means for supporting the thin-film-coated boards (1) such as mask blanks. The surface of at least a portion of the supporting means that comes into contact with the thin-film-coated boards (1) is permitted to be a smooth plane having an arithmetic average surface roughness (Ra) of 0.1 ?m or lower. The surface of at least the portion of the supporting means that comes into contact with the thin-film-coated boards (1) is composed of, for instance, a resin material.

Abstract: An anti-static polymer composition comprises a thermoformable, moldable, hybrid urethane-vinyl polymer composition which exhibits relatively low surface and volume resistivities and good toughness. The hybrid polymer composition can be made without volatile organic compounds such as solvents, neutralizing amines, or both.

Abstract: A circuit board clamping device is applied to at least two spaced and stacked circuit boards, wherein the two circuit boards are spaced apart and fixed by a plurality of spacing posts. The circuit board clamping device includes a securing member, a pressing member and a forcing member. The securing member can be disposed on one of the circuit boards and adjacent to the spacing posts. The pressing member can be disposed on the securing member and is used to press the spacing posts. The forcing member is disposed on the pressing member and is engaged with the pressing member. The two circuit boards are securely stacked and coupled to each other by the pressing member pressing the spacing posts.

Abstract: A substrate carrying device is disclosed. The substrate carrying device, in cooperation with at least a substrate, comprises two end plates having a plurality of fixing holes and mounting holes, at least two partition plates each having side faces, side edges and a plurality of parallel slots wherein the parallel slots are formed on each side face of the partition plate to receive the substrate, a plurality of assembling units, a plurality of fixing poles having binding holes, and at least a bottom rail having a plurality of fixing pins. The substrate carrying device is capable of strengthening the structure of the device, protecting the substrates, simplifying adjustment of the size of the device, and facilitating draining and stacking.

Abstract: A hard tray (2) is for carrying socket connectors (4) each having a pick up cap (3) mounted thereon. The pick up cap has a rectangular base (30) with a plane top surface (300). The hard tray has a generally rectangular bracket body (23). A rectangular array of openings (24) is defined in the bracket body, for receiving corresponding socket connectors therein. First and second extending portions (200, 220) are formed in each opening, for supporting a corresponding socket connector. A bottom portion (26) is defined in the opening and has a bottom surface (260) rough enough to avoid sucking with the top surface of a corresponding pick up cap. Therefore, in carriage, the bottom surfaces of the bottom portions of an upper hard tray do not suck the top surfaces of the pick up caps mounted on the socket connectors of an adjacent lower hard tray.

Abstract: A disk cage assembly into which multiple disk drives may be removably inserted is formed from two separate frames which are identical in shape and design and include complimentary mating features enabling the frames to be joined to form a symmetrical four-sided structure. The frames are symmetrical about a midpoint and are easily manufactured since all interior surfaces are accessible during the manufacturing process. A surface of the frames defines a plurality of channels into which modular disk drives may be inserted. In one embodiment, the frames are designed to accommodate a mid-panel which is securable within the structure and can be used to increase the number modular disk drives which can be disposed therein. The assembly may be formed from a number of different materials, including structural foam which can be used to help absorb vibrations among the disk drives within the assembly.

Abstract: A one-piece metal card cage has integral card guides provided by rows of formed projections that extend into the interior of the cage. The projections are hollow to provide ventilation openings through which air may flow to and from the interior of the cage. The card cage is fabricated from a one-piece sheet metal blank that is folded and joined together to provide top and bottom walls, opposite sidewalls, a backwall and a front opening.

Abstract: A module integrated circuit (IC) carrier is used to move module ICs through a testing machine. The module IC carrier has a housing with a pair of installation elements installed parallel to one another in a receiving space of the housing. A plurality of holding members are installed on each of the installation elements. Each holding member on one of the installation elements faces a corresponding holding member on the other of the installation elements. Module ICs are held between corresponding pairs of the holding members. The holding elements can be biased towards each other to help hold the module ICs. Each holding element may include a rotator with a grooved edge which helps to hold a module IC, and which allows the module ICs to be easily inserted into and removed from the carrier.

Abstract: A packaging tray includes a base member, first and second side members, and a first top member. The base member has a first plurality of channels defined therein. The first and second side members extend from the base and are rotatable with respect to the base. The first top member extends from one of the first and second side members and is rotatable with respect to the one of the first and second side members. The first top member includes a second plurality of channels defined therein. The first plurality of channels are aligned with the second plurality of channels.

Abstract: An accommodation container including: at least one first container body and at least one second container body which can be stacked onto the at least one first container body, respectively, and at least one accommodation part provided between the at least one first container body and the at least one second container body, the accommodation part being capable of accommodating a semiconductor device having a plurality of external connection terminals. The accommodation part is made of a soft material at least at a portion to be in contact with the external connection terminals of the semiconductor device.

Abstract: Position determining concave portions for determining, when a plurality of packaging trays are stacked, a stacking position of each packaging tray with respect to at least another packaging tray placed above or beneath are provided. Each bottom portion of the position determining concave portion in the depth direction is made slightly smaller than the opening portion of the same. Consequently, when a plurality of the packaging trays are stacked, the bottom portions of the position determining concave portions of the upper packaging tray slightly fit into the opening portions of the corresponding position determining concave portions of the lower packaging tray through point contact or linear contact, whereby the stacking position of the upper packaging tray with respect to the lower packaging tray is determined fixedly.

Abstract: The present invention provides a modular data storage system that can constraint movement of a data storage module within an enclosure during operation, handling, and transportation. The present invention achieves the objective by employing compliant features at strategic locations in the data storage system by utilizing shock/vibration isolators and the frictional forces generated by the compliant elements to introduce damping effects. In addition, this invention provides a locking mechanism that will allow the user to smoothly insert, remove and firmly grip a data storage module.

Abstract: A holding blade is formed to be separated from a neighboring holding blades. A body of an elastic plate is separated from bodies of neighboring elastic plates. Each elastic plate base is integrally formed and connected with each corresponding elastic plate body. The thickness of the elastic plate gradually decreases from the junction between the elastic plate base and the frame portion toward its top end. The surface of the elastic plate is shaped in a curved manner. The cross-section of the elastic plate body is substantially rectangular in shape with a larger width in the horizontal direction, and terrace portion extends outward from the elastic plate body.

Abstract: The present invention generally provides a case for a printed circuit board which forms a single in-line pin configuration from an edge connected circuit board. The case includes a frame enclosing the edges of the circuit board and a base at a mounting plane side of the frame. Connector pins affixed to the edge connectors of a printed circuit board are secured to the printed circuit board and extend from the base. A tab extending generally parallel to the frame from an edge of the base provides a smooth vacuum pick up engagement surface for handling and placement of the present case.

Abstract: There is provided a cassette case for holding a plurality of substrates therein, including a cassette case for holding a plurality of substrates therein, including (a) a three-dimensional, hollow frame, and (b) a pair of substrate support members spaced away from each other and carried at the frame with at least one substrate being supported therebetween in the frame. The substrate support members are fixedly carried at the frame at one of longitudinal ends thereof, and at the other of the longitudinal ends thereof so that so that the members are able to expand or contract in a length-wise direction thereof. The above mentioned cassette case ensures that even if the substrate support members thermally expand when the cassette case is thermally treated, there is nothing which obstructs thermal expansion of the substrate support members. Thus, it is possible to eliminate deformation of the substrate support members caused by obstruction to thermal expansion of the substrate support members.

Abstract: A chassis system for housing a plurality of circuit boards, such as PCI standard bus boards, provides a rack-mountable chassis having an open front side and a motherboard with a plurality of board connectors arranged side-by-side with respect to the front end. The boards are mounted in individual frameworks that facilitate ready installation and removal from the chassis. In particular, the chassis includes a plurality of receiving blocks at the bottom rear of the chassis, aligned with each of the motherboard connectors. The receiving blocks receive pivots mounted on the back of each framework. The framework is inserted into, and removed from the front opening of the chassis in an upwardly pivoted position that clears the motherboard connectors and other obstructions in the chassis. The framework is pivoted into and out of engagement with the motherboard when the pivot is located in the receiving blocks. The chassis can include top-mounted tracks. The tracks receive rollers on the framework.

Abstract: A storage container for storing and shipping items is foldable between a flat unformed condition and a second folded formed condition. The container includes a base section, and first and second end sections hinged to respective first and second ends of the base section. First and second cover sections are hinged to respective second ends of the end sections. The container includes a structure to secure differently sized and shaped articles in the same location of the inner surface of the base section. The securing structure includes slots, retention columns, ridges, troughs having various walls forming a trough for securing these articles using a friction fit. The container also includes a device for indicating whether the container has been opened.

Abstract: A container 2 for flat panel comprising: a lower end holding resilient member 38 disposed on a bottom end of a lower end bottom groove 32 to which a lower end of the flat panel 34 contained in the container 2 is inserted, and an upper end holding resilient member 50 having a belt shaped portion covering an upper end of the flat panel 34 along the longitudinal direction thereof. The upper end holding resilient member 50 has an U-shaped cross section, a pair of fitting rods extending along the longitudinal direction thereof are attached at both sides of both ends of the longitudinal direction thereof, and each end of each fitting rod 52 is attached removably in an engagement groove 58 of an adapter 56 attached in the container 2. In accordance with the container 2 for flat panel of the present invention, it is possible to take custody of or transport a plural of flat panels such as glass substrates used for flat display devices without destroying them and contaminating the surfaces of them.

Abstract: Substrates having a wide range of thickness, and intended to be overmolded with a plastic package body, are accommodated in a common mold. The top surface of the substrate is provided with a dam structure, which may be formed as an additional layer on the substrate, and which is preferably in the form of a square ring. A groove (channel) is machined (e.g., by routing) into the surface of the dam structure. The top mold half, having a cavity for forming the package body, is provided with a sealing structure at the periphery of the cavity. The sealing structure has a ridge fitting into the channel of the dam structure. The depth of the groove in the dam structure is readily adjusted to ensure uniform clamping pressure of the top mold half on the substrate, so that liquid molding compound is contained within the cavity and so that undue pressure is not exerted on the substrate.

Abstract: An apparatus to extend printed circuit board length allows for secure mounting of the printed circuit boards. More particularly, the extender bracket apparatus (30) is for stabilizing small or short, commercial off the shelf (COTS) circuit boards (20) for personal computers (PC). The apparatus will aid in operation of small circuit boards for rugged applications such as high vibration conditions in vehicles. The extender bracket apparatus (30) is first fastened to an adjustable clamp (60), which is then fastened to a COTS circuit board. The adjustable clamp has holes that facilitate attaching to slots in the extender bracket apparatus. The clamp and extender board may have a dielectric surface to prevent electrical conduction. The dielectric can be an adhesive to hold the printed circuit board. The apparatus can then be fastened to a computer chassis (40) for rigidly mounting the circuit board.

Abstract: A substrate cassette with a receiving frame having support plates formed integrally therewith. The support plates minimize the deformation of substrates loaded in the cassette and ascribable to their own weights. Hemispherical lugs are formed on each support plate in order to protect the rear of the substrates from scratches.

Abstract: An assembly of several circuitized substrates, e.g., printed circuit boards, frictionally retained within a common carrier. Tabs on the carrier engage slots in each substrate to align the substrates with respect to the carrier. At least one pair of male projections on each substrate frictionally engage female retaining members in the carrier to lock each substrate with respect to the carrier. The assembly is thus adapted for subsequent processing (e.g., electronic component attach) of the substrates while assuring substrate retention. Subsequently, the substrates can be readily separated (removed) from the carrier. The carrier can be of metal or recyclable plastic material.

Abstract: A container or "card cage" for rectangular printed circuit boards. The container includes a pair of rectangular vertical end caps which are removably connected by horizontal beams. The horizontal beams have spaced transverse slots for receiving the corners of printed circuit boards and for supporting the printed circuit boards within the enclosure in a spaced relationship. In one form of the container, each beam comprises a rigid connecting rail which is removably connected to the end caps and a spacing rail which is slidably mounted on the rigid connecting rail for longitudinal movement between an inner position within the container and an outer position substantially outside of the container with one of the end caps removed. Each spacing rail contains the transverse slots for receiving the printed circuit boards.

Abstract: A one side resin sealing type semiconductor device has a semiconductor element which is mounted on one side of a circuit board. Wiring patterns are provided on both sides of the circuit board. The semiconductor element mount portion is sealed with resin. External connecting terminals, such as soldering balls, are joined to the wiring pattern on the other side of the circuit board. The method of manufacturing one side resin sealing type semiconductor devices includes the steps of: positioning and disposing the circuit board formed into an individual piece corresponding to a through-hole formed in a rectangular carrier frame; and conveying the circuit board supported by the carrier frame so as to conduct a series of processing steps such as mounting the semiconductor element, electrically connecting the semiconductor element with the wiring pattern, sealing the semiconductor element mount portion with resin, and connecting the wiring pattern with the external connecting terminals.

Abstract: The invention is a carton for packaging card-like articles. The carton includes a pair of inclined panels folded inwardly from the top of a pair of side walls. The inclined panels have a plurality of parallel slots therein for receiving the contents and keeping them in an upright spaced relationship. The lid of the carton includes an abutment flap which extends from the lid and is folded inwardly to abut the card-like contents to hold them in a position spaced from the lid. The invention also includes a blank for making such a carton.

Abstract: A container for memory modules comprising a generally rectangular shape with a lid and tray with a multitude of finger-like protrusions forming vertical slots therebetween for receiving memory modules. The interior is formed such that a cavity may be created above and below the memory modules contained inside providing a buffer region, which protects the contents from damage when the exterior of the container is subjected to physical contact.