In Closed Box Patents (Class 206/723)
  • Patent number: 5477966
    Abstract: A packing device for semiconductor devices with lead terminals includes a packing box, partitions for separating a space in the packing box, and a cover. A conductive sponge used as a cushioned packing material is attached to the back surface of the cover. The semiconductor devices are placed in the packing box 3 with the lead terminals 2 facing upwardly. In this packed state, the conductive sponge is pressed against the lead terminals to collectively hold the semiconductor devices securely in the box. Thus, short-circuitting of the lead terminals is made to prevent gate of the semiconductor devices from breaking down as a result of electrostatic voltage.
    Type: Grant
    Filed: June 21, 1994
    Date of Patent: December 26, 1995
    Assignee: Fuji Electric Co., Ltd.
    Inventor: Shogo Ogawa
  • Patent number: 5474178
    Abstract: A tray is provided for supporting electrical connectors of the type having an elongated dielectric housing within which electrical terminals are secured. The housings can vary in length according to the size of the connectors. The tray is adaptable for supporting different sizes of connectors with housings of different lengths. The tray includes a first support for supporting adjacent ends of a plurality of the electrical connectors in a side-by-side array thereof. A second support is movably mounted on the tray to a plurality of different positions spaced from the first support for supporting opposite ends of different sizes of the connectors.
    Type: Grant
    Filed: June 23, 1994
    Date of Patent: December 12, 1995
    Assignee: Molex Incorporated
    Inventors: Anthony M. DiViesti, Gordon W. Funck
  • Patent number: 5469962
    Abstract: This invention relates to packing methods and materials for packing electrolytic capacitors and the like. This invention provides packing methods whereby capacitors are held in a container tray with a good order and with no rotational movement of capacitor and packing materials wherein packing of electrolytic capacitors solves the problem of capacitor rotation and allows the capacitors to be easily taken out of the container tray. According to this invention, an electrolytic capacitor loaded container tray is taken out of a receptacle and the electrolytic capacitors held in the container tray in an orderly manner can be smoothly picked up for automatic mounting on printed wiring boards.
    Type: Grant
    Filed: June 24, 1994
    Date of Patent: November 28, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Kitagawa, Hideharu Nagai, Junkichi Kawamura, Hitoshi Mizuguchi
  • Patent number: 5458237
    Abstract: A set of sheets for producing a packaging assembly for products of small thickness, such as LCD panels, which comprises a first sheet (101) to fold into a product holding element (201), a second sheet (102) to fold into a base structure (202), and a third sheet (103) to fold into a cover member (203). Corrugated paper can be conveniently used for the sheets. No styrene foam is necessary.
    Type: Grant
    Filed: May 17, 1994
    Date of Patent: October 17, 1995
    Assignee: Chuoh Pack Industry Co., Ltd.
    Inventor: Hachiro Kataoka
  • Patent number: 5447229
    Abstract: Industry-standard COT/TAB integrated circuit part carrier frame members are receivable into a shipping tube member in a stack which rests at one end on paired retaining pins and at the other end is retained by a closure member of the shipping tube. As so disposed in the shipping tube, the carrier frames are securely held with virtually no risk that they will slip out of place within the shipping tube. The shipping tube member includes side walls which define plural pairs of apertures spaced along the length of the shipping tube so that: the paired pins may be relocated to adapt the shipping tube to various shipment sizes. The remainder of the shipping tube remains empty to reduce both the cost of carrier frames conventionally used just as filler, as well as reducing shipping costs by eliminating the weight of these filler carrier frames which are shipped empty.
    Type: Grant
    Filed: June 28, 1993
    Date of Patent: September 5, 1995
    Assignee: LSI Logic Corporation
    Inventors: Brian Lynch, Patrick O'Brien, Adrian Murphy