Abstract: A plastic jig which may be injection molded has a plurality of square pockets, each pocket having a pair of integral spring loaded fingers on two adjacent sides of square component trays for repeatedly and consistently positioning the component trays placed in said pocket. The resiliency of said spring loaded fingers operate to urge the square tray against fixed locating portions of the pocket. Features on the top and bottom of the jig provide for the secure stacking of jigs while holding trays. An upper jig above an adjacent lower jig provides a cover, enclosing the components in the tray in lower jig.

Abstract: A chip carrier which is employed in the industry for mounting integrated circuits and various types of electronic components on chips and is adapted to be positioned within a processing tray or carrier frame for shipping and processing purposes, and wherein the chip carrier is adapted to be precisely positioned and adhesively maintained in a fixed relationships in the carrier frame. Also disclosed is a method of manufacturing chip carrier arrays or strips which are adapted to be positioned in predetermined adhesively fixed relationships within a carrier frame or tray for processing and shipping purposes.

Abstract: A tray (1) has an upper surface (3) an upper surface provided with a plurality or pockets (10) for containing parts (50) in a regular, longitudinal arrangement at a predetermined pitch in a single row. The tray (1) has a pair of longitudinal first side surfaces (6A, 6B), and teeth (30) are arranged at equal intervals on the first side surfaces (6A, 6B). Pins (35) driven by a linear driving mechanism are fitted in grooves (38) between the adjacent teeth (30) to feed the tray (1) accurately in the longitudinal direction. A tray assembly of a desired capacity can be formed by combining a necessary number of the trays (1) in a transverse arrangement by engaging the teeth (30) of the tray (1) with the grooves (38) of the adjacent tray (1).

Abstract: A transport tray for semiconductor devices that includes a retention mechanism. The tray is formed with molded plastic inserts positioned in a tray. Each insert includes a contact surface that is designed to have two stable points, one corresponding to a latched state and one corresponding to an unlatched state. The retention mechanism includes elements that allow the contact surface to rotate and translate relative to the surface of a semiconductor component being inserted or removed from the tray. Rotation across the surface, as opposed to sliding, significantly reduces the wear of the retention mechanism.

Abstract: A packaging system for use with irregular shaped articles is described. The system includes a carton having slotted sidewall members disposed to receive suspension folders at least one suspension folder. The suspension folder includes a layer of a packaging material having a pair of apertures and having a pair of creases disposed along a region of the layer coextensive with an edge portion of each one of the apertures. The layer is provided with a stretchable material bonded to a first surface of said layer of packaging material. A strong hinge is provided at portions of the layer disposed along the edges of the pair of apertures to join the first and second portions of the layer of packaging material.

Abstract: An IC carrier retains an IC and a wiring sheet in an opposed relation so that electrical connection can be achieved between the IC and a socket through the wiring sheet. The IC carrier comprises a slip-preventive sheet capable of suppressing lateral displacement of the wiring sheet with respect to the IC by exerting a surface pressure against the wiring sheet.

Abstract: A device for storing and transporting electronic devices such as semiconductor chips, comprising: a frame having a top side, a bottom side, a periphery, and a window within the periphery, a thin film covering the window, the thin film having on its top surface an adhesive layer, the adhesive layer being adapted to hold a plurality of electronic devices, the electronic devices being attachable to the adhesive layer at any location on the thin film within the window, and the electronic devices being uncovered, a recess in the bottom side, and a raised flange around the window on the top side wherein the raised flange of one of the devices mates with the recess of another device, thereby allowing the devices to be stacked. The adhesive properties of the adhesive layer may be greatly reduced by exposure to electromagnetic radiation such as heat (infrared) or ultraviolet, thereby releasing the electronic device.

Abstract: A structure for protecting semiconductor integrated microcircuit dice during shipping. The structure secures the position of the die atop an ultraviolet (UV) light penetratable plate using a UV light sensitive adhesive layer. Once the structure reaches its destination, prior to removal of the die, the adhesive layer is exposed to ultraviolet light. This exposure reduces the adhesiveness or coefficient of friction of the layer, thereby facilitating die removal from the structure. The UV sensitive adhesive does not leave contaminating silicon residue on the removed die. The invention may be realized using currently commercially available UV tape and a modified die-pac having a UV light penetratable window.

Abstract: A component holder body is provided with a component arrangement section where an installation space for a component is defined, and holding parts for holding the component arranged in the installation space. The component arrangement section is constructed so as to be shiftable between a holding position in which the component arrangement section projects and a position projecting upward from the holding position. Meanwhile, the holding parts are designed so as to shift, in association with the shift of the component arrangement section between the holding and projecting positions, between a holding posture for holding the component and a retreat posture for opening the installation space.

Abstract: A semiconductor wafer case provides high resistance to vibration. The semiconductor wafer can be easily accessed from the case. The semiconductor wafer case includes a case body and a holder in which blade-type presser feet are provided. An end of each of the presser feet has a V-shaped cross-section. Spaces are provided between presser feet (32a, 33a) and presser feet (32b, 33b). Two holders of the same shape are provided at opposite sides of the case body so that the holders can hold the semiconductor wafer horizontally.

Abstract: The supporting plate and the bulk removal, transport and storage fixture for small batch-fabricated devices (1) have openings (2) penetrating from the top side (3) to the bottom side (4) of the plate and raised retaining means (5) on the bottom side (4). The raised retaining means (5) are provided in sufficient number and are arranged according to the shape of the devices (1) for retaining the devices. Flange means (7) which are designed for providing vacuum or agents to the devices (1) on the supporting plate are connected to the supporting plate thus forming a fixture. By changing the arrangement of the raised retaining means (5) and/or the openings (2) the supporting plate and the fixture may easily be adapted to different sizes and kinds of devices.

Abstract: A carrier tape is provided with a large number of accommodating recesses with each recess having a bottom surface, the top surface being open to accept an electronic part. Each accommodating recess is provided with resilient retainer arms formed together as a unit extending from the top surface of the recess, the resilient retainer arms permitting the electronic part to be inserted into the recess but preventing it from falling off.

Abstract: A packaging system includes a bottom having a flat surface for accepting an object, a top having a flat surface and projecting fingers extending from the surface of the top. When the top is assembled to the bottom, the fingers deform, forcing the object against the bottom surface. The object is maintained in position by friction against the bottom surface and the presence of undeformed fingers surrounding the object. The packaging system may be made of static dissipative material and include connection claws and rods for connecting a number of packages in series.

Abstract: A protector for carrying a flat wire harness with a flat wire part and connectors, includes a bottom porion and a rim porion around the bottom portion. The bottom member is provided for positioning and holding the flat wire harness such that the flat wire apart is stretched and the connectors are fit in recesses formed in the bottom portion. The rim portion extends upward and radially outward from the bottom portion for enabling plural protectors to be stacked vertically with a flat wire harness stored in each bottom portion.

Abstract: A socket is disclosed for a tape carrier package (10) having a plurality of leads (6) extending across an aperture (8) in a tape carrier (2). The socket includes a cover (14) having a tape mounting surface (44) and a plurality of ribs (30) protruding from the tape mounting surface. The ribs are arranged to extend through the aperture (8) and to straddle the leads (6) when the tape carrier package (10) is disposed on the tape mounting surface (44). The cover (14) is matable with a housing (12) holding a plurality of contacts (20). The ribs (30) straddle and guide the leads (6) into engagement with respective contacts (20) as the cover is mated with the housing. A socket for a tape carrier package (110) is also disclosed. The socket includes a cover (114) having a tape mounting surface including an undersurface (144) and an inclined surface (148).

Abstract: Each IC package carrier holds a single ZIP or SIP package between its side walls having openings to provide air flow for cooling the package and to allow heat generated within the package to dissipate. A locking strip member is provided to prevent loosening of the held package. Locking elements of snap fasteners are mounted on the side walls to allow several IC package carriers be attached to each other for producing an IC package assembly. The IC package assembly held by the several attached carriers can be inserted into a socket to connect circuits within the packages with external circuitry.

Abstract: A sectional modular video-intercom control panel for simplified wiring including a frame for housing modules, the frame having at least one seat (i.e., bay) for at least one respective module, a cover element such as a one-piece bezel or a plurality of bezel pieces connectable together being applied to the edges of the frame. In the control panel, the module seat or seats can be divided in half by an insertable crosspiece located in recesses provided in the frame, the module seats being separated by fixed crosspieces which are connected to the inner edges of the frame by preferential fracture lines.

Abstract: A packing tray for protecting all kinds of semiconductor packages or chips in the form of a tray-type packing tray, a tube-type packing tray, a reel tape-type packing tray, and a waffle-type packing tray wherein the packing tray is made of paper, paper pulp, and wood, which does not cause pollution when recycling, burning, and disposal in the soil.

Abstract: A structure for protecting semiconductor integrated microcircuit dice during shipping. The structure secures the position of the die atop an ultra-violet (UV) light penetratable plate using a UV light sensitive adhesive layer. Once the structure reaches its destination, prior to removal of the die, the adhesive layer is exposed to ultraviolet light. This exposure reduces the adhesiveness or coefficient of friction of the layer, thereby facilitating die removal from the structure. The UV sensitive adhesive does not leave contaminating silicon residue on the removed die. The invention may be realized using currently commercially available UV tape and a modified die-pac having a UV light penetratable window.

Abstract: An IC package mounting device that includes a plurality of independently operative sliding latches or clips to secure the IC package to the device. The sliding latches are housed in guide slots that prevent the latches from becoming disengaged from the carrier assembly, with the guide slots being oriented at an angle relative to the lateral peripheral dimensions of the IC package.

Abstract: High voltage circuitry often requires assembling an array of high voltage devices that are electrically isolated from one another. A lead frame that fits within conventional plastic packaging has been designed that will allow electrical isolation of the substrates of two or more transistors mounted together in a single package.

Abstract: An IC socket includes a socket body, an IC receiving portion formed in the socket body, an engagement members for engaging an upper edge or upper surface of an IC package received in the IC receiving portion and applying a push-down force thereto, and a support members for elastically supporting the lower surface or lower edge of the IC package and applying a push-up force thereto. The IC package is held between the support members and the engagement members.

Abstract: An integrated circuit carrier system having a carrier frame made up of a plurality of juxtaposed sides and an interior configuration sized to matingly engage an integrated circuit package. The integrated circuit package fits within the frame and is held in position therein by a plurality of locking clips which slidably engage a plurality of top and bottom channels diagonally disposed at each of the corners of the frame. Each locking clip is made up of a substantially C-shaped structure having an uppermost leg and a lowermost leg. The uppermost leg ends in a substantially perpendicularly disposed locking tab and the lowermost leg has a variety of locking arrangements, one of which permits the locking clip to be locked in two locking positions. In one locking position the integrated circuit package is held securely in place while in the other locking position the integrated circuit package may be inserted or removed from the carrier.

Abstract: An apparatus and method are disclosed to permit handling an electronic device (20) during programming, development, and other steps. The apparatus include a carrier (2) having a cavity (15) in which the electronic component is immobilized and protected during handling. The carrier cavity can have an opening that permits access to the electronic component. The carrier/device combination is inserted into a socket (35) which includes a plurality of leads (30) with associated contacts for making electrical connection with the electronic component leads (21). The leads of the socket have a footprint identical to that of the electronic component.

Abstract: A container for a PC card including a relatively hard base pivotably connected by a hinge to a cover. A resilient tray is positioned within the base. The cover can be kept in a closed position by a latch. An outer edge of the tray attaches to a peripheral lip on the base to form a bumper and a seal between the base and cover when the container is closed. The edge also prevents shear movement of the cover relative to the base when the container is dropped on a corner. The hinge and latch are inboard of the outer edge of the tray so that they aren't disturbed if the container is dropped. The tray includes a central receptacle that receives the PC card. Between the PC card receptacle and the outer edge of the tray there is formed a bellows-like member which tangents the cover and base and physically isolates the PC card receptacle from the cover and base.

Abstract: Each of trays forming a tray assembly has a main body having a recess for holding an article to be transported. Connectors protruding from a front and rear sides of the main body mate with each other so that the trays are linked to be flexible relative to each other. Elastic and rockable members formed integral with each main body have locking pawls capable of engaging with the article. Each locking pawl integral with the rockable member and positioned in the recess is always urged to engage with and hold in place the article, such that the pawls can be elastically retracted for an easier loading and unloading of the articles onto and from the recesses.

Abstract: An IC carrier includes a movable corner ruler for restricting a first angular portion of an IC, and a reference corner ruler for restricting a second angular portion of the IC, the second angular portion of the IC being in a diagonal relation to the first angular portion of the IC. The movable corner ruler is resiliently supported by a spring structure such that the first angular portion is resiliently pushed toward the reference corner ruler. The movable ruler includes a pair of ruler elements for pushing those two sides of the IC which define the first angular portion of the IC, the movable corner ruler being movably resiliently supported by the spring structure for movement along such two sides of the IC.

Abstract: A carrying case for a portable hard disk drive. The carrying case is particularly adapted to hold a hard disk drive that complies with the PCMCIA specifications. The case includes a cover that is pivotally connected to a base, so that the cover can be rotated between open and closed positions. Within the base portion of the case is an elastic insert which contains a slot that can receive a drive unit. The elastic insert is constructed to significantly dampen any shock load that is applied to the case and prevent damage to the drive unit.