Abstract: The present invention relates to a tray for storing a semiconductor device of a ball grid array type. More specifically, a tray structure is provided, which includes a pocket formed in the tray for holding the semiconductor device, the pocket includes sidewalls having an upper portion and a lower portion, and a shelf portion located between the upper and lower portions of the sidewalls. The shelf portion extends horizontally inwardly from the upper portion of the sidewalls to support a portion of peripheral edges of the semiconductor device. The plurality of solder balls along the peripheral edges are spaced apart from the lower portion of the sidewalls of the pocket and an inner edge of the shelf portion when one of the opposing sides of the semiconductor device abuts the upper portion of the pocket.

Abstract: A compact and extremely slim case for securely holding a pair of compact earphones, their cables, and the audio plug. The earphone case is approximately the dimension of a standard credit card with a thickness approximately equivalent to the depth of an earphone. The earphone case securely encloses and holds a pair of earphones and the audio plug along with their cables securely wrapped inside the case. The earphone case is the slimmest possible case for a pair of compact earphones.

Abstract: A TAB tape (100) packaging structure in which (i) the TAB tape (100) including a plurality of semiconductor chips (103) which are fixed, on a film (101) on which wiring patterns are repeatedly provided and (ii) an embossed tape (200) which is electroconductive and has embossed parts (202) which are sequentially provided on a first surface of and in a longitudinal direction of a film (201) are wound on a reel which is electroconductive is arranged such that the TAB tape (100) and the embossed tape (200) are wound on the reel, while (i) a first surface of the film (101) on which surface the plurality of semiconductor chips (103) are fixed and (ii) the first surface of the film (201) on which surface the embossed parts (202) protrude are overlapping and facing each other, and the embossed tape (200) has a total thickness of not less than (t+0.4) mm and not more than 1.1 mm in a case where each of the plurality of semiconductor chips (103) has a thickness of t (0.2?t?0.

Abstract: An electrode pad packaging system including an electrode pouch, an electrode pad (e.g., a defibrillation electrode pad), a wire and a shell is disclosed. The electrode pad is disposed at least partially within the electrode pouch. The wire extends from the electrode pad and, in a disclosed embodiment, at least a portion of the wire is attached to the shell. The shell is disposed in mechanical cooperation with the electrode pouch (e.g., the shell is secured to a portion of the electrode pouch). The shell includes a valve thereon that is configured to allow air to exit the electrode pouch. The valve may be configured to prevent air from entering the electrode pouch. A method of packaging an electrode pad is also disclosed. The method includes providing an electrode pouch, an electrode pad, a wire and a shell. A valve on the shell allows air to exit the electrode pouch.

Abstract: The method relates to the assembly of electric power supply cables (10) on a stator (12) of an electric motor, formed by a pack (14) of magnetic laminations and at least one winding of bundles of electrically conductive wires (16), which is housed inside cavities (18) formed in the pack (14) and has at least one head (20) projecting from the pack (14).

Abstract: A plurality of flash memories can be stored efficiently and strongly protected from external force and static electricity. There is provided a magazine for flash memories suitable to supply a plurality of flash memories to various devices continuously. The magazine comprises a housing in which a memory body of each of the flash memories with side plates, a rear plate and a pair of front plates. A plug of the flash memory projects forward from a gap between the front plates.

Abstract: A system comprising a container, a linking segment, and a container stand is provided. The container is configured to hold an object and includes an attachment device. The linking segment is configured for attachment to both the object and to the container. The container stand is configured to detachably receive the container using the attachment device.

Abstract: A carrier tape (10) for electronic components or devices (44) includes a tape body (12) and a plurality of pockets (14) formed in the tape body (12). Each of the pockets (14) includes a sidewall (18) and a base portion (20). The base portion (20) joins the sidewall (18) at an edge portion (22). A protrusion (24) is formed in the base portion (20) of the pocket (14). The protrusion (24) is configured to maintain a separation between the edge portion (22) and a surface on which the pocket (14) rests.

Abstract: A tamper evident tip cap assembly for a prefilled dosage syringe having a tip cap wherein a sleeve is frangibly connected to the tip cap, and is captured within an overcap freely rotatable thereon. The tamper evident tip cap assembly is removed from the syringe tip cap by pulling the overcap to break the frangible connection between the sleeve and syringe tip cap.

Abstract: A laptop computer protective bag, including a supportive front wall, a back wall, and a substantially rigid bridge wall that holds the front wall inclined relative to the back wall when the computer is in use resting on the front wall. Flexible side walls form a closed chamber with extremities of the front and rear walls being in close proximity when toe computer is in use, a pair of fans blowing air through the front wall for cooling a bottom surface of the computer, a vent structure permitting the air to flow through the chamber. Also disclosed is a backpack assembly that incorporated the protective bag.

Abstract: A digital music player cradle for sequentially supporting multiple digital music players includes a base with a cavity in an upper surface. The cavity accepts an end portion of a largest digital music player of the multiple digital music players. A support wall extends from the upper surface of the base for supporting one of the digital music players at a time. A trough in the back of the base extends through the support wall and into the cavity. The trough is provided to route a data cable connected to the one of the multiple digital music players. A plurality of ledges is within the cavity. The ledges are of decreasing size towards the bottom of the cavity and each ledge is sized to hold a different one of the multiple digital music players.

Abstract: A tray for a semiconductor device and the semiconductor device are disclosed in which the resist of the semiconductor is not easily separated from the substrate. A tray for semiconductor device has a support section formed as a pocket for carrying the semiconductor device, a pair of first protrusions formed on the opposite sides of the support section, and a pair of second protrusions formed on the opposite sides of the tray on the surface side reverse to the surface side where the support section are provided. The second protrusions are arranged in spaced relation to and in the same direction as the first protrusions. The interval between the first protrusions is larger than the interval between the second protrusions, so that in the case where the tray receives a shock, the semiconductor device comes into contact with the second protrusions earlier than with the first protrusions, thereby making it difficult for the resist of the semiconductor device to come off.

Abstract: A protective enclosure capable of storing an electronic device while protecting it from damage emanating from impacts, impingements, dust and moisture is provided herein. More specifically, the present invention allows a user to use a portable electronic device without requiring the user to open the enclosure and expose the contents to inclement weather.

Abstract: A packaging tray (2) includes an elongate base (3). The base includes supporting portions (31) for receiving CPU sockets (1) therein. Each supporting portion includes four sidewalls (311), and a bottom wall (313) having an upper surface and a lower surface. Each sidewall forms an inwardly extending rib (312). Four standoffs (314) are formed on the lower surface. When mounting the CPU sockets on the upper surfaces, each CPU socket rests on the corresponding ribs, and solder balls of the CPU socket are supported by the corresponding upper surface. Thus, in handling of the CPU sockets, the solder balls are unlikely to sustain damage. Conversely, the CPU sockets can be reverse mounted on the lower surfaces. The solder balls of each CPU socket are located in a horizontal plane face up, with the standoffs supporting the CPU socket. The solder balls can be accurately inspected by a flatness inspection device.

Abstract: A test tray insert of a test handler is provided including a housing, a locker, and a stopper, where one end side of the stopper is hinged on the inside of the mounting hole and the other end side of the stopper is protruded to the receiving hole so that the stopper fixes the device. The housing includes a receiving hole for loading a device in the enter of the receiving hole, and a mounting hole, extended from both sides of the receiving hole, including a joint jaw. The housing further includes a base protrusion placed n both ends of the bottom of the receiving hole and a supporting protrusion placed in both sides of the base protrusion.

Abstract: A novel system is provided for automatically generating caution labels for moisture-sensitive semiconductor devices packed in drypack bags. The system has a scanner that scans a lot number or an ID mark representing ID information of a moisture-sensitive device sealed in a drypack bag, and a computing device with a look-up table containing moisture-sensitivity levels assigned to the moisture-sensitive devices. In response to an ID signal produced by the scanner, the computing device searches the look-up table for a moisture-sensitivity level assigned to the packed moisture-sensitive device. The determined moisture-sensitivity level is supplied by the computing device to a label-formatting device for generating a caution label indicating the moisture-sensitivity level. The label-formatting device controls a printer for printing the generated caution label.

Abstract: A tray for storing a semiconductor device such as a BGA device. This tray comprises a storage portion for receiving and storing the BGA device therein. The storage portion has a wall surface which is arranged around the semiconductor device upon storing the semiconductor device. This wall surface has an area which is inclined with an angle so as to support an edge of a package of the semiconductor device but not to come into contact with wiring terminals thereof. With this arrangement, the inclined are comes into contact with only the edge of the package so as to be able to support the package.

Abstract: A combination of a carrier and cylindrical resistors, the carrier having a base that has a plurality of holding regions, two parallel rails for supporting a resistor in each holding region, each parallel rail having a non-ramped bottom surface, a ramped side surface and an arced surface between the non-ramped bottom surface and the ramped side surface, the two parallel rails being inward of two flexible tangs in each holding region, each of the two flexible tangs having an arm positioned for pushing on each of two wire conductors of each cylindrical resistor, to cause a body of each cylindrical resistor to be pushed against the arched surfaces of the parallel rails.

Abstract: A tray for storing a semiconductor device such as a BGA device. This tray comprises a storage portion for receiving and storing the BGA device therein. The storage portion has a wall surface which is arranged around the semiconductor device upon storing the semiconductor device. This wall surface has an area which is inclined with an angle so as to support an edge of a package of the semiconductor device but not to come into contact with wiring terminals thereof. With this arrangement, the inclined are comes into contact with only the edge of the package so as to be able to support the package.

Abstract: A tray is constituted by a tray body portion for connecting a plurality of pockets and cushioning portions which are arranged on the bottom portions of the pockets serving as contact positions between the pockets and CSPs when the CSPs are stored in the pockets and which are formed of a soft material having a degree of hardness lower than that of the tray body portion. The tray moderates impact force acting on the CSPs in falling the tray to prevent the CSP from being broken and damaged.

Abstract: A tray for ball grid array integrated circuits includes a storage pocket with a transverse structure. The transverse structure carries a plurality of columnar structures at spaced positions on and extending normally from the surface of the transverse structure. Each columnar support structure includes parallel columns that terminate in coplanar free ends that engage the terminal surface of one ball grid array integrated circuit to support it in a terminals down position within the storage pocket.

Abstract: An arrangement to provide electrical and/or optical components in a gas-tight packaging, which includes a film that at least partially covers the electrical and/or optical components, to provide a very simple manufacturing result. The arrangement provides an optimal protection of the components enclosed in the packaging. In addition, the film can be constituted as a film-type wrapping which completely encloses the electrical and/or optical components and their leads and which is filled with a pressurized protective gas.

Abstract: This invention provides taped electronic components and a method of taping electronic components which can be used when a plurality of components are to be automatically mounted by an automatic mounting device. Sideways motion and twisting of the components are thereby prevented, and a plurality of components can be accurately positioned at predetermined intervals by taping leads in position. Leads on both edges of these components are arranged to be longer than other leads, and these longer leads are held in position by a tape. Further, after forming the leads and tie-bars in a one-piece construction when the leads are formed, the inner leads are cut short and the tie-bars are held in position with tape.

Abstract: An electrode package includes a pouch having pouch walls forming a sealed pouch enclosure. At least one electrode is within the pouch enclosure and includes an electrode wire having one end connected to the electrode within the pouch, an intermediate portion extending through the pouch walls, and a second end outside the pouch enclosure. A sealing joint is formed at the point where the intermediate portion of the wire extends through the pouch walls. The pouch walls have a plastic layer which surrounds and contacts the intermediate portion of the wire at the sealing joint to form an air tight seal. The invention also includes a method whereby heat and pressure are applied at the sealing joint to cause the plastic layer of the pouch walls to melt and fuse around the wires to create the seal.

Abstract: A transport tray for semiconductor devices that includes a retention mechanism. The tray is formed with molded plastic inserts positioned in a tray. Each insert includes a contact surface that is designed to have two stable points, one corresponding to a latched state and one corresponding to an unlatched state. The retention mechanism includes elements that allow the contact surface to rotate and translate relative to the surface of a semiconductor component being inserted or removed from the tray. Rotation across the surface, as opposed to sliding, significantly reduces the wear of the retention mechanism.

Abstract: A thin dielectric substrate bearing a plurality of conductive leads has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by the substrate and projecting into the hole for contact with the die pads. The leads include free outer ends that project laterally outwardly and downwardly away from the plane of the substrate for connection to contact pads on a circuit board. The free leads are isolated from pressure applied to the chip on tape assembly after it has been connected to a circuit board by means of a thin self-supporting thermally conductive heat spreader that contacts the side of the die opposite its pads and includes fixed standoff and/or alignment pins that extend through alignment holes in the thin substrate and are in physical contact with a surf ace of the printed circuit board.

Abstract: A tray for storage and transportation of multiple pin grid array (PGA) and K6 integrated circuit components, each having a planar housing and plurality of terminal pins arranged in spaced rows. The tray has a framework for supporting upstanding ribs that interfit between adjacent integrated circuit components. Each upstanding rib lies along an axis in one of two sets of intersecting axes and aligns with and fits between certain spaced rows to position the terminal pin in precise alignment with the tray. The rib axes are intersecting and oblique to the general tray orientation.

Abstract: A particle getter is presented for protecting electronic circuitry from damage caused by particles or debris. An adhesive film is used to capture and retain particles, such as solder balls and wire trimmings, that pose a danger to the functioning of electronic circuitry, and thereby prevent short circuits and other malfunctions. The particle getter does not interfere with access to the circuitry, and thus may be used when conformal coating is not practicable. The particle getter is particularly useful for protecting electronic circuitry aboard a spacecraft, since particles that can cause a circuit malfunction float freely in the zero-gravity environment, where they can be captured and retained by the getter. The preferred adhesive film is space-qualified, and has outgassing properties that are within limits imposed by NASA specifications. The particle getter has applications in many places where debris is present, both in space and earthbound.

Abstract: A protective device includes a cap member extending between a nose end having a chamber therein for freely receiving the distal electrode of an implantable medical lead having a plurality of outward angularly extending tines and a tail end and an integral conical shield defining a cavity at least partially protectively enveloping the tines. Retention members releasably attach the cap member to the distal electrode so as to inhibit its unintended removal and include a plurality of resilient elongated fingers of a silicone elastomer at the tail end equal in number to the tines at circumferentially spaced locations about a longitudinal axis of the device. Each adjacent pair of fingers is constructed so as the snappingly receive and capture the tine in engagement therewith such that removal of the tine from the retention recess by movement of the cap member in the opposite direction is positively inhibited by the transverse edges.

Abstract: An electrostatic discharge protection device is disclosed for use with a semiconductor chip package where the electrostatic discharge protection device establishes an electrical connection between connector pins on the semiconductor chip package and ground thereby creating a short circuit to protect the semiconductor chip package from electrostatic discharge. The electrostatic discharge protection device is manually operable to engage or disengage and also automatically withdraws the shorting connection upon insertion of the semiconductor chip package onto a printed circuit board or into a mating receptacle.

Abstract: A carrier tape (12) is disclosed including a plurality of longitudinally spaced pockets (22) extending parallel to index holes (20). Each pocket (22) includes side walls (24) and a bottom (26) having provisions (28) for holding a microchip (32). Abutments (38) having semicircular cross sections are integrally formed on the side walls (24) for engaging the free ends of the leads (34) of the microchip (32) to prevent their engagement with the side walls (24). A greater number of abutments (38) at lesser spacings are provided than the leads (34) of the microchip (32) to prevent the leads (34) from hooking between the abutments (38). The abutments (38) are arranged to minimize the number of leads (34) actually engaged and to minimize the actual area contacted by the free ends of the leads (34) with the abutments (38). The shape of the abutments (38) also optically disperses major portions of the reflection of the leads (34).

Abstract: Each IC package carrier holds a single ZIP or SIP package between its side walls having openings to provide air flow for cooling the package and to allow heat generated within the package to dissipate. A locking strip member is provided to prevent loosening of the held package. Locking elements of snap fasteners are mounted on the side walls to allow several IC package carriers be attached to each other for producing an IC package assembly. The IC package assembly held by the several attached carriers can be inserted into a socket to connect circuits within the packages with external circuitry.

Abstract: A tray for housing semiconductor devices of a ball grid type, each having a surface provided with a plurality of wiring solder balls, the surface of each of the semiconductor devices having peripheral edges, and each of the wiring solder balls having a diameter, includes a tray surface, and pockets formed in the tray surface, each pocket having corners and a shape similar to and slightly larger than the surface of each semiconductor device. Each pocket has a bottom surface forming a depression and having a shape similar to and slightly smaller than the surface of each of the semiconductor devices and a depth larger than the diameter of each wiring solder ball. Each of ribs has a root formed on each corner of each pocket for dividing the pockets from each other and each having a width gradually increasing toward the bottom surface of each pocket.

Abstract: Each of trays forming a tray assembly has a main body having a recess for holding an article to be transported. Connectors protruding from a front and rear sides of the main body mate with each other so that the trays are linked to be flexible relative to each other. Elastic and rockable members formed integral with each main body have locking pawls capable of engaging with the article. Each locking pawl integral with the rockable member and positioned in the recess is always urged to engage with and hold in place the article, such that the pawls can be elastically retracted for an easier loading and unloading of the articles onto and from the recesses.

Abstract: This invention relates to packing methods and materials for packing electrolytic capacitors and the like. This invention provides packing methods whereby capacitors are held in a container tray with a good order and with no rotational movement of capacitor and packing materials wherein packing of electrolytic capacitors solves the problem of capacitor rotation and allows the capacitors to be easily taken out of the container tray. According to this invention, an electrolytic capacitor loaded container tray is taken out of a receptacle and the electrolytic capacitors held in the container tray in an orderly manner can be smoothly picked up for automatic mounting on printed wiring boards.