Abstract: A non-volatile semiconductor memory and three or more types of transistors are provided. A thickness of a first gate oxide film of a first transistor is larger than that of a second gate oxide film of a second transistor, and is smaller than that of a third gate oxide film of a third transistor. In a first transistor region, a first silicon oxide film is formed on a surface of a semiconductor substrate, and second and third silicon oxide films are formed on the first silicon oxide film. By removing the second and third silicon oxide films and a part of an upper layer of the first silicon oxide film, the first gate oxide film is formed from the first silicon oxide film.

Abstract: Integrated optical devices and methods of forming the same are disclosed. A method of forming an integrated optical device includes the following steps. A substrate is provided. The substrate includes, from bottom to top, a first semiconductor layer, an insulating layer and a second semiconductor layer. The second semiconductor layer is patterned to form a waveguide pattern. A surface smoothing treatment is performed to the waveguide pattern until a surface roughness Rz of the waveguide pattern is equal to or less than a desired value. A cladding layer is formed over the waveguide pattern.

Abstract: A support member for a thermal processing chamber is described. The support member has a sol coating on at least one surface. The sol coating contains a material that blocks a desired wavelength or spectrum of radiation from being transmitted by the material of the support member. The sol coating may be a multi-layer structure that may include adhesion layers, transition layers, and cap layers, in addition to radiation-blocking layers.

Abstract: A display device includes a first display substrate and a second display substrate. The first display substrate includes a first base, a first electrode disposed on the first base, a second electrode spaced apart from the first electrode, and a light emitting element disposed between the first electrode and the second electrode. The second display substrate faces the first display substrate and is configured to receive light emitted from the light emitting element. The second display substrate includes a second base, a first color filter disposed on a surface of the second base, and a first wavelength conversion pattern disposed on the first color filter. The first wavelength conversion pattern includes a first surface facing the first display substrate, and a second surface facing the first surface and the first color filter. The first surface includes a curved surface portion recessed toward the second surface.

Abstract: An optical filter (1a) includes a light-absorbing layer and satisfies the following requirements (i) to (iii) when light with wavelengths of 300 nm to 1200 nm is incident at an incident angle of 0°: (i) an average transmittance of 78% or more in the wavelength range of 450 nm to 600 nm; (ii) a spectral transmittance of 1% or less in the wavelength range of 750 nm to 1080 nm; and (iii) a decreasing spectral transmittance with increasing wavelength in the wavelength range of 600 nm to 750 nm and a first IR cut-off wavelength in the wavelength range of 620 nm to 680 nm. The requirement (i), the requirement (ii), and the requirement (iii) are satisfied by the light-absorbing layer (10).

Abstract: A thermo-optic phase shifter comprises an optical waveguide comprising a P-type region comprising a first contact, an N-type region comprising a second contact, and a waveguide region disposed between the P-type region and the N-type region and having a raised portion. The thermo-optic phase shifter further comprises one or more heating elements. The one or more heating elements include one or more discrete resistive heating elements or the P-type and N-type regions driven as resistive heating elements.

Abstract: An apparatus can include an electrochromic device configured to be maintained a continuously graded transmission state. When using the apparatus, the electrochromic device can be switched from a first transmission state to a continuously graded transmission state and maintained in the continuously graded transmission state. The current during switching can be higher than current during maintaining the continuously graded transmission state. In an embodiment, the grading can be reversed to provide a mirror image of the grading. In another embodiment, at least 27% and up to 100% of the electrochromic device can be in a continuously graded transmission state. The control device can be located within an insulating glass unit, adjacent to the insulating glass unit, or remotely from the insulating glass unit. In a further embodiment, a gap between bus bars can be used to form a portion of the electrochromic device that can be continuously graded.

Abstract: A test strip includes a substantially transparent substrate and one or more colorimetric test spots on the transparent substrate. Each colorimetric test spot has one or more sensing chemicals chemically attached onto a porous support material. The porous support material has at least one exposed surface configured to absorb a body fluid. The one or more sensing chemicals are configured to change a color in response to a presence of a target drug in the body fluid.

Abstract: Optical communication modules and associated methods and computer program products for performing network communication security are provided. An example optical module includes a substrate, a first optoelectronic component supported by the substrate configured for operation with optical signals having a first wavelength, and a second optoelectronic component supported by the substrate configured for operation with optical signals having a second wavelength. The module further includes an optical communication medium defining a first end in optical communication with the first optoelectronic component and the second optoelectronic component and a second end. The module also includes security circuitry operably connected with the first optoelectronic component and the second optoelectronic component. The security circuitry determines the presence of a noncompliant component coupled with the optical communication medium at the second end based upon operation of the second optoelectronic component.

Abstract: Integrated optical devices and methods of forming the same are disclosed. A method of forming an integrated optical device includes the following steps. A substrate is provided. The substrate includes, from bottom to top, a first semiconductor layer, an insulating layer and a second semiconductor layer. The second semiconductor layer is patterned to form a waveguide pattern. A surface smoothing treatment is performed to the waveguide pattern until a surface roughness Rz of the waveguide pattern is equal to or less than a desired value. A cladding layer is formed over the waveguide pattern.

Abstract: An otoscopic tip element having an axisymmetric hollow body having a substantially conical shape and made from a moldable plastic material includes a distal opening, a proximal opening, an interior surface, and an exterior surface. To maximize light transmissivity, a distal portion of the interior surface is provided with a smooth or polished surface finish and a proximal portion of the interior surface and the outer surface is provided with a textured surface finish such that light from a light source of an otoscope can be axially directed through the hollow body for emission through the distal opening, as well circumferentially through the exterior surface. The surface finish and color/tint of the speculum tip element can be adjusted or tuned to promote axial, circumferential and total light output relative to an intended medical target.

Abstract: A method of manufacturing a device chip includes applying, from a front surface of a wafer formed with devices in a plurality of regions partitioned by a plurality of crossing division lines, a laser beam of such a wavelength as to be absorbed in the wafer along the division lines, to form V-shaped laser processed grooves along the division lines, the laser processed grooves becoming shallower toward outer sides in a width direction; adhering an adhesive tape to the front surface of the wafer formed with the laser processed grooves; and grinding the wafer held by a chuck table, with the adhesive tape interposed therebetween, from a back surface, to divide the wafer while thinning the wafer to a finished thickness, thereby forming a plurality of device chips having inclined surfaces at outside surfaces thereof.

Abstract: An optical switch device includes a first semiconductor structure configured to operate as a first waveguide and a second semiconductor structure configured to operate as a second waveguide. The second semiconductor structure is located above or below the first semiconductor structure and separated from the first semiconductor structure. The second semiconductor structure includes a portion of a first doped region doped with dopants of a first type and a portion of a second doped region doped with dopants of a second type that is different from the dopants of the first type.

Abstract: A micro-optical bench includes a substrate having a multi-layer trench and a micro-lens aligned by and mounted to the substrate in the multi-layer trench.

Abstract: An optical device comprises first, second and third elements fabricated on a common substrate. The first element comprises an active waveguide structure supporting a first optical mode, the second element, fabricated on a planarized top surface of the first element, comprises a passive waveguide structure supporting a second optical mode, and the third element, at least partly butt-coupled to the first element, comprises an intermediate waveguide structure, positioned such that a top surface of the intermediate structure underlies a bottom surface of the passive waveguide structure. If the first optical mode differs from the second optical mode by more than a predetermined amount, a tapered waveguide structure in at least one of the second and third elements facilitates efficient adiabatic transformation between the first optical mode and the second optical mode. Mutual alignments of the first, second and third elements are defined using lithographic alignment marks.

Abstract: An actuator element of a MEMS device is provided, which is fabricated using surface micromachining on a substrate. An insulating layer having a first portion contacts the substrate while a second portion is separated from the substrate by a gap. A metallic layer contacts the insulating layer having a first portion contacting the first portion of the insulating layer and a second portion contacting the second portion of the insulating layer. The second portion of the metallic layer is prestressed. Alternately, the actuator element includes a first insulating layer separated from the substrate by a gap. A metallic layer has a first portion contacting the substrate and a second portion contacting the insulating layer. A second insulating layer contacts a portion of the second portion of the metallic layer opposite the first insulating layer, where the second insulating layer is prestressed.

Abstract: A device comprises first, second and third elements fabricated on a common substrate. The first element comprises an active waveguide structure comprising: one portion, of effective cross-sectional area A1, supporting a first optical mode; and a second portion, butt-coupled to the first portion, of effective cross-sectional area A2>A1. The second element comprises a passive waveguide structure supporting a second optical mode. The third element, at least partly butt-coupled to the second portion, comprises an intermediate waveguide structure supporting intermediate optical modes. If the first optical mode differs from the second optical mode by more than a predetermined amount, a tapered waveguide structure in at least one of the second and third elements facilitates efficient adiabatic transformation between the first optical mode and one intermediate optical mode. No adiabatic transformation occurs between any intermediate optical mode and the first optical mode.

Abstract: Provided is a mold manufacturing method that is capable of manufacturing a mold of a complex shape particularly of an optical element with sufficient shape accuracy and within a relatively short time. This mold manufacturing method includes: a step for forming a base made of metal into a first shape through machining; a step for coating the base with a resin layer; a step for forming the resin layer into a second shape; and a step for forming the base into a third shape through dry-etching.

Abstract: Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects are provided. An example optical interconnect joins first and second optical conduits. A first direct oxide bond at room temperature joins outer claddings of the two optical conduits and a second direct bond joins the inner light-transmitting cores of the two conduits at an annealing temperature. The two low-temperature bonds allow photonics to coexist in an integrated circuit or microelectronics package without conventional high-temperatures detrimental to microelectronics. Direct-bonded square, rectangular, polygonal, and noncircular optical interfaces provide better matching with rectangular waveguides and better performance. Direct oxide-bonding processes can be applied to create running waveguides, photonic wires, and optical routing in an integrated circuit package or in chip-to-chip optical communications without need for conventional optical couplers.

Abstract: A method of manufacturing an electrode structure includes providing an initial structure, the initial structure including at least two elevated regions extending from a substrate, wherein top portions of the two elevated regions are separated by a first lateral distance, depositing material onto the elevated regions by means of physical vapor deposition such that adjacent top portions of the deposited material are separated by a second lateral distance that is smaller than the first lateral distance, and applying electrodes onto the top portions of the material.

Abstract: An apparatus for treating a substrate using a process gas includes a chamber having a treatment space defined therein, a substrate support unit for supporting the substrate in the treatment space, a gas supply pipe disposed in a ceiling surface of the chamber for supplying the process gas to the treatment space, and an exhaust unit for exhausting the process gas in the treatment space, wherein the exhaust unit includes an exhaust plate having an exhaust hole defined therein through which the process gas is exhausted, and an adjustment plate overlapping the exhaust plate, wherein the adjustment plate is constructed to control an opened amount of the exhaust hole when viewed from above.

Abstract: A method of forming a mask includes forming a reflective multilayer over a substrate; forming a capping layer over the reflective multilayer, in which the capping layer includes a ruthenium-containing material and a low carbon solubility material that has a carbon solubility lower than a carbon solubility of the ruthenium-containing material; forming an absorption layer over the capping layer; and etching the absorption layer until exposing the capping layer.

Abstract: An optoelectronic device including an active area capable of supplying an electromagnetic radiation and sandwiched between first and second semiconductor layers, the first semiconductor layer delimiting a surface and including a first portion in contact with the active area and delimiting a first part of the surface and extending in a second portion delimiting a second part of the surface, the second portion forming a single-mode waveguide, the optoelectronic device including an opaque portion reflective for the electromagnetic radiation covering the first part and including a diffraction grating on the second part capable of extracting the electromagnetic radiation from the second portion.

Abstract: Imprinted substrates are often used to produce miniaturized devices for use in electrical, optic and biochemical applications. Imprinting techniques, such as nanoimprinting lithography, may leave residues in the surface of substrates that affect bonding and decrease the quality of the produced devices. An imprinted substrate with residue-free region, or regions with a reduced amount of residue for improved bonding quality is introduced. Methods to produce imprinted substrates without residues from the imprinting process are also introduced. Methods include physical exclusion methods, selective etching methods and energy application methods. These methods may produce residue-free regions in the surface of the substrate that can be used to produce higher strength bonding.

Abstract: Integrated optical devices and methods of forming the same are disclosed. A method of forming an integrated optical device includes the following steps. A substrate is provided. The substrate includes, from bottom to top, a first semiconductor layer, an insulating layer and a second semiconductor layer. The second semiconductor layer is patterned to form a waveguide pattern. A surface smoothing treatment is performed to the waveguide pattern until a surface roughness Rz of the waveguide pattern is equal to or less than a desired value. A cladding layer is formed over the waveguide pattern.

Abstract: A display device includes a substrate, a circuit layer on the substrate, a display layer on the circuit layer, at least one hole in a display area of the substrate that penetrates the substrate, the circuit layer, and the display layer, and at least two grooves that surround the at least one hole, where each of the at least two grooves has an undercut structure. The substrate includes a first substrate, a first inorganic layer, a second substrate, and a second inorganic layer, which are sequentially stacked, and each of the at least two grooves extends down from the display layer into the second substrate.

Abstract: A method of fabricating a color filter is provided. In the method of fabricating the color filter, a patterned sacrificial layer having a thickness difference is formed on a substrate such that a patterned black photosensitive spacing material layer is formed by a single-tone photomask or a half-tone photomask and has effects of an original black matrix, a main spacer, and a sub-spacer. Thus, production costs can be reduced and a high yield can be carried out.

Abstract: In one embodiment, there is provided an optical fiber sound pickup device including: a housing having a substantially cylindrical structure; a vibration diaphragm mounted to an end face of a first side end of the housing; a ferrule including a main body of a substantially cylindrical shape, at least a part of the main body being mounted in the housing by cooperating with an inner wall of the housing, a head end of the main body that is close to the vibration diaphragm being separated from the vibration diaphragm by a distance; and an optical fiber fixedly extending through into the ferrule, a head face of the optical fiber being flush with an end face of the head end. A method and an equipment for manufacturing an optical fiber sound pickup device are also provided.

Abstract: An optical receiver may include a planar lightwave circuit with an optical path and a tapered reflection surface to direct an optical beam toward a top surface of the planar lightwave circuit. The optical receiver may include a photodiode disposed onto the top surface of the planar lightwave circuit such that a receive portion of the photodiode is aligned to the optical path, wherein a gap between the photodiode and the planar lightwave circuit is less than 5 microns.

Abstract: Optical grating components and methods of forming are provided. In some embodiments, a method includes providing an optically transparent substrate, and forming an optical grating layer on the substrate. The method includes forming an optical grating in the optical grating layer, wherein the optical grating comprises a plurality of angled components, disposed at a non-zero angle of inclination with respect to a perpendicular to a plane of the substrate. A first sidewall of the optical grating may have a first angle, and a second sidewall of the grating has a second angle different than the first angle. Modifying process parameters, including selectivity and beam angle spread, has an effect of changing a shape or dimension of the plurality of angled components.

Abstract: A method for producing a reflection-reducing layer system is disclosed. In an embodiment, a method includes depositing an organic layer on the substrate, generating a nanostructure in the organic layer by a plasma etching process, applying a cover layer to the nanostructure, wherein the organic layer, the nanostructure and the cover layer together form a reflection-reducing structure, wherein the cover layer comprises an inorganic material or an organosilicon compound, and wherein the cover layer is at least 5 nm thick and performing a post-treatment after applying the cover layer, wherein a material of the organic layer is at least partially removed, decomposed or chemically converted, and wherein an effective refractive index neff,2 of the reflection-reducing structure after the post-treatment is smaller than an effective refractive index neff,1 of the reflection-reducing structure before the post-treatment.

Abstract: The present invention relates to a method for manufacturing an optical device comprising forming a first trench in a glass plate and a second trench perpendicular to the first trench, wherein the first trench has an end opening into the second trench. The trenches are treated with hydrofluoric acid. The first trench is filled with a material to form a waveguide, and a mirror is formed on the wall of the second trench opposite the waveguide. An encapsulation layer is deposited over the glass plate, waveguide and second trench.

Abstract: A cover glass and a manufacturing method thereof are provided, the method includes: coating a first organic layer on a transparent substrate; forming first via holes on the first organic layer at intervals, heating and melting the first organic layer to flow; wet-etching the transparent substrate having the first organic layer to form a first microstructure on a region of the transparent substrate not shielded by the first organic layer; and removing the first organic layer form the transparent substrate. The present disclosure breaks the limitation for preparing microstructures with size below 5 ?m in the existing photolithography process, the organic material in wet-etching process can be controlled by heating to make the organic material melted to flow. The size of the microstructure can be reduced and flexibly adjusted according to the pixel size of display panel, the speckle effect of the display device caused by anti-glare treatment can be reduced.

Abstract: A process of forming a semiconductor optical device is disclosed. The semiconductor optical device provides a waveguide structure accompanied with a heater for varying a temperature of the waveguide structure. The process includes steps of: (a) forming a striped mask on a semiconductor substrate; (b) selectively growing a dummy layer on the semiconductor substrate; (c) removing the patterned mask; (d) burying the dummy layer by a supplemental layer; (e) exposing a portion of the dummy layer by etching a portion of the supplemental layer; (f) and removing the dummy layer by immersing the dummy layer within a solution that shows an etching rate for the dummy layer enough faster than an etching rate for the supplemental layer and the substrate so as to leave a void in a region the dummy layer had existed.

Abstract: Assemblies, optical connectors, and methods for bonding optical elements to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical element to a substrate includes disposing a film layer on a surface of the substrate, disposing the optical element on a surface of the film layer, and directing a laser beam into the optical element. The method further includes melting, using the diameter laser beam, a material of the substrate to create a bond area between the optical element and the surface of the substrate. The film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area. The bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.

Abstract: An optical device comprises first, second and third elements fabricated on a common substrate. The first element comprises an active waveguide structure supporting a first optical mode, the second element comprises a passive waveguide structure supporting a second optical mode, and the third element, at least partly butt coupled to the first element, comprises an intermediate waveguide structure. If the first optical mode differs from the second optical mode by more than a predetermined amount, a tapered waveguide structure in at least one of the second and third elements facilitates efficient adiabatic transformation between the first optical mode and the second optical mode. Mutual alignments of the first, second and third elements are defined using lithographic alignment marks.

Abstract: A method for fabricating a diffraction grating includes generating an ionized gas, passing the ionized gas through a gating structure to selectively directed gas toward a substrate, injecting an etchant gas into the directed gas, and exposing a surface of the substrate to the directed gas and the injected etchant gas to form grating structures on the surface of the substrate.

Abstract: A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.

Abstract: A connector device for connecting optical fiber endpieces comprising an optoelectronic chip, a fiber end piece holder and a reflection surface. The chip is oriented for emitting and/or detecting optical signals along a first propagation direction normal to a circuit board. The reflection surface changes a propagation direction of optical signals from the first propagation direction to a different, second propagation direction and/or vice versa. The connector device comprises a layered optical stack mounted to the circuit board and designed for propagation of optical signals along the first propagation direction. The connector device further comprises a coupling adapter piece mounted to the layered optical stack that holds and/or secures the fiber end piece holder in an orientation enabling propagation of signals radiation along the second propagation direction. The reflection surface for changing between both propagation directions is comprised in the coupling adapter piece.

Abstract: A diffraction grating includes a substrate and an array of triangular ridges extending from the substrate. The ridges run parallel to one another and have triangular cross-sections such that first sides of the ridges face in a first direction and adjacent second sides of the ridges face in a second, different direction. An array of grating lines is disposed over the first sides of the array of ridges, each grating line of the array of grating lines comprising a slab of transparent material supported by the first side of a corresponding ridge of the array of ridges. A refractive index of the array of grating lines is different from a refractive index of the array of ridges.

Abstract: Techniques for fabricating a slanted structure are disclosed. In one embodiment, a method of fabricating a slanted structure in a material layer includes injecting a first reactive gas into an reactive ion source generator, generating a plasma that includes reactive ions in the reactive ion source generator, extracting at least some of the reactive ions from the plasma to form a collimated reactive ion beam towards the material layer, and injecting a second reactive gas onto the material layer. The collimated reactive ion beam and the second reactive gas etch the material layer both physically and chemically to form the slanted surface-relief structure.

Abstract: Disclosed herein is a laser processing apparatus including a controller. The controller includes a target pattern detecting section performing matching between patterns formed in each device imaged and a key pattern to thereby detect a target pattern included in each device, a spacing detecting section detecting the spacing in a Y direction between the target pattern and an ablation groove formed along each division line by ablation, and a map creating section creating a map showing the spacing in the Y direction between each target pattern and the ablation groove for the plural devices arranged along the ablation groove.

Abstract: Method for preparing micro-optical structure on a film based on chemical mechanical polishing etching, combining photolithography technology with chemical mechanical polishing technology to make preparation and large-scale integration of large-size high-quality micro optical devices on-chip possible. The method comprises coating metal on film surface, selectively removing the metal film by photolithography (such as femtosecond laser selective ablation, ultraviolet photolithography, electron beam etching, ion beam etching, and reactive ion etching), chemical mechanical polishing, chemical corrosion or over polishing and other steps. Micro-optical devices on-chip prepared by the method have extremely high surface finish and extremely low optical loss.

Abstract: A transmissive-type liquid crystal display device includes a base material having transmissivity, a light-shielding body having a grid pattern in a plan view seen from a thickness direction of the base material, a pixel electrode, a first insulator that is provided to cover the light-shielding body and has transmissivity, and a second insulator that is disposed in contact with the first insulator between the base material and the pixel electrode and has transmissivity. A refractive index of the second insulator is higher than a refractive index of the first insulator. An outer edge of a surface of the second insulator on the pixel electrode side overlaps the light-shielding body in the plan view.

Abstract: Assemblies, optical connectors, and methods for bonding optical fibers to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate includes directing a laser beam into the optical fiber disposed on a surface of the substrate, wherein the optical fiber has a curved surface and the curved surface of the optical fiber focuses the laser beam to a diameter that is smaller than a diameter of the laser beam as it enters the optical fiber. The method further includes melting, using the laser beam, a material of the substrate at a bond area between the optical fiber and the surface of the substrate such that the optical fiber is bonded to the surface of the substrate.

Abstract: A workpiece dividing method includes: a laser processing step of forming along each street a plurality of minute holes extending in a pulsed laser beam application direction; and a dividing step of pressing the streets by a pressing member to divide a wafer along the streets. The minute hole has one end opening at least one of a front surface and a back surface of the wafer and is decreased in diameter from the one end toward the other end. In the dividing step, the pressing member is pressed against that surface of the front surface and the back surface of the wafer at which the one end of the minute hole is not opening.

Abstract: Embodiments of the present disclosure provide a pixel structure, including a plurality of sub-pixels arranged in an array, each sub-pixel including a display region and a non-display region, the non-display region of each sub-pixel being formed with a thin film transistor therein, the display region of each sub-pixel being formed therein with a sub-wavelength grating for transmitting therethrough light in a predetermined wavelength range. Embodiments of the present disclosure further provide a method of manufacturing a pixel structure, an array substrate including the pixel structure and a display device.

Abstract: An optical element (transmissive or reflective) includes a transmissive layer comprising two different optical media arranged among discrete volumes arranged along the layer. The discrete volumes are arranged to approximate a desired phase function (typically modulo 2?) and are smaller than an operational wavelength in order to provide a range of phase delays needed to adequately approximate the desired phase function.

Abstract: A heat-assisted magnetic recording (HAMR) write apparatus includes a laser for providing energy and resides in proximity to a media during use. The HAMR write apparatus includes a write pole that writes to a region of the media, coil(s) for energizing the write pole and a waveguide optically coupled with the laser. The waveguide includes at least one multi-mode interference (MMI) device. The MMI device has at least one input, a plurality of outputs, a propagation section and a multi-mode interference (MMI) section. Energy from the laser propagates through the propagation section before the MMI section. The propagation section expands the energy from the laser to a plurality of modes. A first portion of the outputs is output from the propagation section. The MMI section is between the propagation section and a second portion of the plurality of outputs.

Abstract: A display apparatus includes a wire grid pattern layer and a capping layer. The wire grid pattern layer includes protrusions having the same shape and spaced at uniform intervals to form a wire grid. The capping layer is on the wire grid pattern layer. The protrusions include metal, and the capping layer includes metal oxide which is an oxide of the metal.