Etching Or Trimming Patents (Class 219/121.19)
  • Patent number: 11145483
    Abstract: A charged particle beam writing apparatus according to one aspect of the present invention includes an emission unit to emit a charged particle beam, an electron lens to converge the charged particle beam, a blanking deflector, arranged backward of the electron lens with respect to a direction of an optical axis, to deflect the charged particle beam in the case of performing a blanking control of switching between beam-on and beam-off, a blanking aperture member, arranged backward of the blanking deflector with respect to the direction of the optical axis, to block the charged particle beam having been deflected to be in a beam-off state, and a magnet coil, arranged in a center height position of the blanking deflector, to deflect the charged particle beam.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: October 12, 2021
    Assignee: NuFlare Technology, Inc.
    Inventors: Takahito Nakayama, Takanao Touya
  • Patent number: 10919078
    Abstract: A lamination cylinder includes a surface structure, on which a plurality of craters is defined having a different geometry and a random distribution. Some of the craters are partially superimposed with respect to each other.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: February 16, 2021
    Inventors: Giovanni Boselli, Massimo Cavallari, Paolo Gaboardi, Rick McWhirter, Massimo Perassolo, Claudio Trevisan
  • Patent number: 9909218
    Abstract: A method and apparatus for local beam processing using a beam activated gas to etch material are described. Compounds are disclosed that are suitable for beam-induced etching. The invention is particularly suitable for electron beam induced etching of chromium materials on lithography masks. In one embodiment, a polar compound, such as ClNO2 gas, is activated by the electron beam to selectively etch a chromium material on a quartz substrate. By using an electron beam in place of an ion beam, many problems associated with ion beam mask repair, such as staining and riverbedding, are eliminated. Endpoint detection is not critical because the electron beam and gas will not etch significantly the substrate.
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: March 6, 2018
    Assignee: Ecole Polytechnique Federales de Lausanne
    Inventors: Tristan Bret, Patrik Hoffmann, Michel Rossi, Xavier Multone
  • Patent number: 9895787
    Abstract: Systems and methods are disclosed herein for adding surface features to grinding wheels. A laser may be directed substantially perpendicular to a grinding surface of a grinding wheel. The laser may be pulsed and may ablate material from the grinding surface. The laser may move relative to the grinding wheel in order to ablate shaped surface features into the grinding surface.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: February 20, 2018
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: John P. Rizzo, Gordon M. Reed
  • Patent number: 9764445
    Abstract: Systems and methods are disclosed herein for dressing and trueing grinding wheels. A laser may be directed substantially tangential to a grinding surface of a grinding wheel. The laser may be a continuous wave laser and may ablate material from the grinding surface. The laser may move relative to the grinding wheel in order to ablate shaped surface profiles into the grinding surface.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: September 19, 2017
    Assignee: UNITED TECHNOLOGIES CORPORATION
    Inventors: John P. Rizzo, Gordon M. Reed
  • Patent number: 9694473
    Abstract: A rotary tool (21) working surface (23) includes a plurality of cutting bodies (24). The rotary tool (21) can be driven about a rotational axis (R). The actual enveloping surface (HF) of the working surface (23) is ascertained by an optical measuring arrangement (29). At least one other target variable (GS) is detected, which describes a microscopic parameter of the working surface (23). The actual variable (GI) corresponding to each specified target variable (GS) is detected by the measuring arrangement (29), and the deviation between the target variable (GS) and the actual variable (GI) is determined. If the actual enveloping surface (HF) lies outside of a specified target enveloping area (HR) or if a deviation (D) between an actual variable (GI) and the corresponding target variable (GS) is unacceptably large, selected first and/or second cutting bodies (24a, 24b) are machined and/or removed by a laser device (35).
    Type: Grant
    Filed: October 19, 2011
    Date of Patent: July 4, 2017
    Assignee: WALTER MASCHINENBAU GMBH
    Inventors: Christoph Plüss, Heinrich Mushardt, Oliver Wenke
  • Patent number: 9685273
    Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: June 20, 2017
    Assignee: ROHM CO., LTD.
    Inventors: Hiroki Yamamoto, Keishi Watanabe, Hiroshi Tamagawa
  • Patent number: 9616523
    Abstract: A laser processing device has a laser source and a high speed vibration unit. The laser source has a laser-emitting end being capable of emitting a laser beam adapted to process a workpiece. The high speed vibration unit is located on a moving path of the laser beam and is capable of vibrating periodically along a direction parallel to the moving path of the laser beam such that the focusing point of the laser beam moves periodically on the workpiece at high speed. The laser processing device with the fast moving focusing point is able to efficiently process parts of the workpiece at specific depths. Therefore, product quality and production rate are increased.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: April 11, 2017
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Chen-Bin Chou, Chao-Yung Yeh
  • Patent number: 9000325
    Abstract: A phenomenon where a depicted pattern becomes unclear owing to a rotational runout of a roller mold in the direction of a rotary shaft is suppressed while restraining an increase in the cost.
    Type: Grant
    Filed: June 8, 2011
    Date of Patent: April 7, 2015
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Naoto Ito, Toshio Kitada, Hidenari Kiguchiya
  • Patent number: 8969753
    Abstract: A plasma treatment installation including at least two stationary workpiece holders adapted for controlled rotation about their respective axis and having supporting plates for supporting workpieces for the treatment thereof, at least one hood to be set on a workpiece holder that is adapted to enclose each of a plurality of workpiece holders to form a sealed treatment space, and a manipulator for automatically equipping the supporting plates of a workpiece holder with workpieces, while the other workpiece holder is covered by the hood to perform the plasma treatment of the workpieces.
    Type: Grant
    Filed: May 17, 2007
    Date of Patent: March 3, 2015
    Inventor: Siegfried Straemke
  • Patent number: 8696920
    Abstract: A method of fabricating a case for a portable electronic device includes: preparing a case preform; processing the inner surface of the case preform using a laser; and surface-treating the outer surface of the case preform, wherein the outer surface of the case preform shows fine prominences and depressions formed by the surface-treating of the outer surface of the case preform, and patterns formed by processing the inner surface of the case preform appear bumpily on the outer surface of the case preform.
    Type: Grant
    Filed: April 21, 2011
    Date of Patent: April 15, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Chul Jin, Yong-Wook Hwang, Seung-Chang Baek, Jong-Woo Kim, Hoon-Soo Park
  • Publication number: 20140016083
    Abstract: A spectacle lens has a colored mark, a colored graphics image with a predeterminable color and brightness impression. The spectacle lens includes a lens body having a light-refracting effect and having a surface with an interference layer system arranged on the surface.
    Type: Application
    Filed: July 11, 2013
    Publication date: January 16, 2014
    Inventors: Frank Macionczyk, Simon Holtmann
  • Publication number: 20130248486
    Abstract: A highly polished surface on an aluminum substrate is formed using any number of machining processes. During the machining process, intermetallic compounds are typically generated at a top surface area of the aluminum substrate caused by spot heat generated between the tool edge and the cut tip of the aluminum substrate during the cutting process. The intermetallic compounds can leave surface imperfections after conventional mechanical polishing operations that render the surface of the aluminum substrate difficult to obtain a desired high glossiness due to exfoliation of the intermetallic compounds from the top surface. In order to remove the effect of the intermetallic compounds, an electron beam is applied to the surface resulting in Joule heating to melt down a top surface zone. In this way, any tooling traces and intermetallic compounds are eliminated.
    Type: Application
    Filed: September 26, 2012
    Publication date: September 26, 2013
    Applicant: Apple Inc.
    Inventors: SIMON R. LANCASTER-LAROCQUE, Purwadi RAHARJO, Kensuke UEMURA
  • Patent number: 8410392
    Abstract: The invention relates to a machining device (10) comprising at least one machining head (16) designed to provide at least one high-energy machining beam (22), especially an electron or laser beam. Such a machining device is used to remove material from workpieces (28) or for connecting workpieces (28) by bonding, especially by means of welding. According to the invention, at least one scanning device (32) designed as an optical coherence tomograph and provided for surface scanning is associated with the machining head (16). The invention also relates to a method for machining material using a high-energy machining beam for scanning surface areas of a workpiece which is machined, not yet machined, or being machined, by means of an optical coherence tomograph.
    Type: Grant
    Filed: March 4, 2008
    Date of Patent: April 2, 2013
    Assignee: Precitec Optronik GmbH
    Inventors: Markus Kogel-Hollacher, Christoph Dietz
  • Patent number: 8319145
    Abstract: A gemstone micro-inscription system, comprising an energy source, a spatial light modulator, and a control, the control controlling a spatial light pattern modulation of the spatial light modulator, wherein the spatial light modulator exposes a photoresist on the gemstone, which selectively impedes an etching process to produce a pattern on the gemstone corresponding to the spatial light modulation pattern.
    Type: Grant
    Filed: July 9, 2007
    Date of Patent: November 27, 2012
    Assignee: Lazare Kaplan International, Inc.
    Inventors: Charles Rosario, William H. Moryto
  • Patent number: 8314357
    Abstract: A method of using Joule heating to regenerate nanowire based biosensors. The nanowire based biosensor contains various detection molecules, such as nucleic acids, bound to the surface of the nanowire. Binding of analyte nucleic acids to the detection molecules alters the electrical properties of the nanowire, producing a detectable signal. By passing a Joule heating effective amount of electrical current through the nanowire, the nanowire may be heated to a temperature sufficient to dissociate the bound analyte from the detection molecule, without damaging the detection molecules or the bond between the detection molecules and the nanowire surface. The Joule heated nanowires may thus be regenerated to an analyte-free “fresh” state and used for further sensing. In alternate embodiments, the specificity of the nanowire for a particular analyte may be modulated by using Joule heating to heat the nanowire to an intermediate temperature where some analytes bind and some do not.
    Type: Grant
    Filed: September 14, 2009
    Date of Patent: November 20, 2012
    Assignee: Children's Hospital and Research Center at Oakland
    Inventor: Frans A. Kuypers
  • Patent number: 7897055
    Abstract: The present inventions relates to a method for manufacturing a multilayer FPCB having different number of layers in different areas. The method includes the steps of: providing a binder layer; removing a portion of the binder layer thereby defining an opening in the binder layer; forming a multilayer FPCB which having a first copper clad laminate structure and a second copper clad laminate structure disposed on two opposite sides of the binder layer respectively using the binder layer; cutting the first copper clad laminate structure; cutting the multilayer FPCB in manner that a portion of first copper clad laminate structure that is exposed to the opening is separated from the first copper clad structure thereby obtain a multilayer FPCB having different number of layers in different areas.
    Type: Grant
    Filed: October 1, 2007
    Date of Patent: March 1, 2011
    Assignee: Foxconn Advanced Technology Inc.
    Inventors: Chih-Yi Tu, Cheng-Hsien Lin, I-Hsien Chiang
  • Publication number: 20100282720
    Abstract: An exposure device engraves an image on the surface of a recording medium by scanning and exposing the recording medium with a light beam emitted from an exposure head. The exposure head comprises a light source for emitting a light beam, an exposure lens for causing the light beam to form an image on or close to the surface of the recording medium, a direction changer disposed upstream or downstream of the exposure lens in the direction in which the light beam travels, and/or inside of the exposure lens on the optical path of a light beam having a numerical aperture higher than a given numerical aperture to change the direction of the light beam having a numerical aperture higher than a given numerical aperture in such a manner as not to affect the process of engraving an image on a surface of the recording medium.
    Type: Application
    Filed: March 25, 2010
    Publication date: November 11, 2010
    Applicant: FUJIFILM Corporation
    Inventor: Ichirou Miyagawa
  • Patent number: 7386937
    Abstract: A method of making a biosensor is provided. The method includes providing an electrically conductive material on a base and partially removing the conductive material using laser ablation from the base so that less than 90% of the conductive material remains on the base and at least one electrode pattern is formed from the conductive material. The at least one electrode pattern has an edge extending between two points. A standard deviation of the edge from a line extending between two points is less than about 6 ?m along the length of the edge.
    Type: Grant
    Filed: May 1, 2006
    Date of Patent: June 17, 2008
    Assignee: Roche Diagnostics Operations, Inc.
    Inventors: Raghbir S. Bhullar, Eric R. Diebold, Brian S. Hill, Nigel A. Surridge, Douglas P. Walling
  • Patent number: 7237334
    Abstract: A method of providing a printed circuit board, a printed circuit board formed according to the method, and a system comprising the printed circuit board. The method comprises: providing a microelectronic substrate; providing a via-defining substrate by providing via openings in the substrate using laser irradiation; providing a laser activatable film on the via-defining substrate; and providing interconnects on the via-defining substrate. Providing interconnects comprises providing a patterned build-up layer on the via-defining substrate comprising exposing the laser activatable film to laser irradiation to selectively activate portions of the film according to a predetermined interconnect pattern; and metallizing the patterned build-up layer according to the predetermined interconnect pattern to yield the interconnects to provide the printed circuit board.
    Type: Grant
    Filed: August 18, 2005
    Date of Patent: July 3, 2007
    Assignee: Intel Corporation
    Inventor: Islam A. Salama
  • Patent number: 7001709
    Abstract: A method of drawing a pattern on a base material by scanning a beam, comprising: drawing a pattern including ring-shaped zones on a first pattern-drawn field on a base material by scanning a beam on a first pattern-drawn field; shifting at least one of the beam source and the base material to scan the beam on a second pattern-drawn field located next to the first pattern-drawn field in such a way that a boundary between the first pattern-drawn field and the second pattern-drawn field is positioned at a joint portion between a slope portion and a side wall portion of the ring-shaped zones; and drawing the pattern on the second pattern-drawn field by scanning a beam so that the joint portion between the slope portion and the side wall portion is drawn at the boundary between the first pattern-drawn field and the second pattern-drawn field.
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: February 21, 2006
    Assignee: Konica Corporation
    Inventors: Osamu Masuda, Kazumi Furuta
  • Patent number: 6698097
    Abstract: A method for manufacturing a tool to form a dynamic pressure bearing in which at least one of the bearing surfaces has a plurality of pressure generating grooves defined by projections and in which lubricating fluid is contained in the grooves to provide lubrication between the bearing surfaces when they rotate relative to one another. A flat bevel is created at one or more of the corners of each of the projections that define the grooves thereby generating a wedge-shaped space that communicates between the grooves and the gap between the bearing surfaces. This wedge-shaped space facilitates passage of lubricating fluid from the groove to the gap when movement, normally rotation, occurs between the two bearing surfaces thereby minimizing wear between the surfaces.
    Type: Grant
    Filed: April 5, 2000
    Date of Patent: March 2, 2004
    Assignee: Sankyo Seiki Mfg. Co., Ltd.
    Inventors: Kazushi Miura, Masato Gomyo
  • Publication number: 20040016116
    Abstract: Disclosed herein are methods for modifying an inner-layer circuit feature of a printed circuit board. A trimming point on the inner-layer circuit feature is identified using an x-ray inspection system. The coordinates of the trimming point are then related to the coordinates of a visible reference marker on the printed circuit board. Next, the relationship between the visible reference marker and the trimming point is used to position a cutting tool over the trimming point. Finally, the cutting tool is used to make one or more cuts into the printed circuit board, until the inner-layer circuit feature is acceptably modified at the trimming point.
    Type: Application
    Filed: July 24, 2002
    Publication date: January 29, 2004
    Inventors: Albert An-Bon Yeh, Regina Nora Pabilonia, Thomas James Weaver, Arthur Fong
  • Patent number: 6530317
    Abstract: In accordance with the present invention a gravure cylinder is engraved by means of an electron beam which is modulated to create upon the surface of the gravure cylinder the desired gravure cells, the required vacuum being maintained only in a limited volume around the electron gun by the use of a conformal high vacuum ferrofluid seal that is substantially free of mechanical friction.
    Type: Grant
    Filed: December 5, 2000
    Date of Patent: March 11, 2003
    Assignee: Creo Srl
    Inventor: Daniel Gelbart
  • Patent number: 6492647
    Abstract: The specification describes a method and apparatus for electron beam lithography wherein a Wehnelt electron gun is modified to improve the uniformity of the electron beam. The bias on the Wehnelt aperture is reversed from the conventional bias so that it is biased positively with respect to the cathode. The Wehnelt opening is tapered with a disk emitter inserted into the taper. The result of these modifications is an electron beam output with low brightness which is highly uniform over the beam cross section.
    Type: Grant
    Filed: May 7, 1999
    Date of Patent: December 10, 2002
    Assignee: Agere Systems, Inc.
    Inventors: Victor Katsap, James Alexander Liddle, Warren Kazmir Waskiewicz
  • Publication number: 20020170887
    Abstract: A method of working an optical element for producing an optical element having a microscopic pattern, comprising a pattern drawing step for forming a specified pattern corresponding to said optical element on a base material including a layer of pattern drawing object, wherein said layer of pattern drawing object has a curved surface, and said specified pattern is drawn by the application of an electron beam to said layer of pattern drawing object.
    Type: Application
    Filed: February 21, 2002
    Publication date: November 21, 2002
    Applicant: Konica Corporation
    Inventors: Kazumi Furuta, Yuichi Akanabe, Masahiro Morikawa, Osamu Masuda, Koji Horii, Tomohide Mizukoshi
  • Publication number: 20020063114
    Abstract: The surface of an article with a metallic base body is cleaned. A plasma comprising electrically positively charged ions is generated, and the ions are accelerated toward the article, so that they come into contact with the base body for cleaning purposes. To do this, an electron beam is directed onto the base body. The outgoing flux of electrons which come into contact with the base body is controlled by the base body being connected to a reference potential via a switch of at a fixed, adjustable or regulated frequency.
    Type: Application
    Filed: January 10, 2002
    Publication date: May 30, 2002
    Applicant: Siemens Aktiengesellschaft
    Inventor: Gebhard Dopper
  • Patent number: 6277659
    Abstract: A substrate removal approach involves sensing acoustic energy in a semiconductor device as a function of substrate thickness in the device as substrate is being removed. According to an example embodiment of the present invention, a semiconductor chip having substrate at a back side that is opposite circuitry at a circuit side is analyzed. Some or all of the substrate in the back side of the semiconductor chip is removed, and a thinned region having a bottom area is formed. A laser is directed to the bottom area, and a thermal parameter characterizing target circuitry in the device is detected in response to the laser. The detected parameter is used and an indication of the remaining substrate thickness between the bottom area and the circuitry is determined. In response to the indicated thickness, the substrate removal process is controlled, making possible effective control of the substrate removal process.
    Type: Grant
    Filed: September 29, 1999
    Date of Patent: August 21, 2001
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Rama R. Goruganthu, Jeffrey D. Birdsley, Michael R. Bruce, Brennan V. Davis, Rosalinda M. Ring