Abstract: A method for manufacturing an airfoil is provided, the method including drilling a hole in a near wall of the airfoil using a laser drill and activating a back strike protection in a cavity of the airfoil. The method additionally includes detecting a breakthrough of a laser from the laser drill through the near wall of the airfoil and subsequently initiating a drilling subroutine, with the drilling subroutine including a continued operation of the laser drill. Such a method may provide for an improved hole, such as a cooling passage, in the airfoil.

Abstract: A microphone having a microphone capsule is provided. The microphone capsule has a diaphragm carrier, a diaphragm and an adhesive tape ring which is used to fasten the diaphragm to or in the diaphragm carrier. The microphone capsule is in the form of a dynamic sound transducer. A dynamic sound transducer for headphones, earphones or headsets is also provided. The sound transducer has a diaphragm carrier, a diaphragm and a moving coil which is coupled to the diaphragm. In a similar manner to the microphone capsule, the sound transducer has an adhesive tape ring between the diaphragm and the diaphragm carrier, which ring is used to fasten the diaphragm to the diaphragm carrier.

Abstract: A method of machining cooling holes in a component includes the steps of inserting an electro discharge machining guide that houses an electrode into an internal cavity of a component, and machining a cooling hole into a wall of the component with the electrode. A gas turbine engine component includes first and second spaced apart walls providing an internal cavity. The first wall has outer and inner surfaces. The inner surface faces the internal cavity. A cooling hole extends through the first wall from the inner surface to the outer surface. The cooling hole includes entry and exit openings respectively provided in the inner and outer surfaces. The exit opening includes a cross-sectional area that is smaller than a cross-sectional area of the entry opening.

Abstract: The present invention relates to a cutting method for cutting an upper edge and a lower edge of a cutting plane into a curved shape, when a cutting object is cut by supplying plasma gas to the periphery of an electrode of a plasma torch and ejecting plasma arc from a nozzle. In order to melt the upper edge and the lower edge of the cutting plane to form a curved shape, at least one condition selected from plural conditions including a cutting electric current, cutting speed, height of a plasma torch, angle of the plasma torch, and flow rate of plasma gas upon performing the vertical cutting for forming the upper edge and the lower edge of the cutting object substantially at right angles is changed.

Abstract: The invention relates to a protective device (1) for the laser machining of holes (3) in at least one component (2) by means of a laser beam (5), wherein the protective device (1) is positionable in the beam direction downstream of the beam-exit-side end (8) of a hole (3) to be machined in the component wall (10), in order to protect an adjoining rear space having a component wall (11), opposite the hole (3), of the component (2) from the incident laser beam. The protective device (1) according to the invention is formed from a composite made of a matrix composed of polyether ether ketone plastics material and fibers embedded therein, wherein the fibers are embedded such that, with respect to their particular fiber extending direction, they extend in a criss-cross manner in the plastics material and are distributed at approximately the same density in the volume of the plastics material of the protective device (1).

Abstract: Methods for temporary bussing of semiconductor package substrates are disclosed and may include metal plating regions of a packaging substrate utilizing a plurality of bussed traces, which may be decoupled by forming debuss holes at intersections of the bussed traces. The decoupled traces may then be electrically tested, and the packaging substrate may be singulated into a plurality of substrates utilizing a sawing process through singulation areas in the packaging substrate. The traces may be electrically coupled via plating bars in the substrate. The plating bars may be located in the singulation areas. The intersections of the bussed traces may be in a Y pattern, which may be repeated along the singulation areas. The debuss holes may be formed utilizing mechanical drilling or lasing. The regions of the packaging substrate may be metal plated utilizing an electroplating process. The plurality of bussed traces may be biased for the electroplating process.

Abstract: The method is used to drill at least one hole into a front wall section of a workpiece (12) by way of a machining jet formed from liquid, to which abrasive material is admixed as needed. As seen looking in the drilling direction, the front wall section is located in front of a rear wall section of the workpiece, which is disposed with an intermediate space at a distance from the front wall section. The hole is drilled at least partially by the machining jet impinging on the front wall section in a pulsed manner. This pulsed jet is generated by the recurrent interruption of the impingement of the liquid and/or of the abrasive material on the front wall section.

Abstract: A method and device for producing a hole in an object is disclosed. The method includes the generation of a beam for removing material such that a bottom of a borehole is placed in a focus position of the beam, and a removal of material by impingement of the beam on the bottom of the borehole. A repeated placing of the bottom of the borehole in a focus position of the beam in order to compensate for the increased depth of the hole as a result of the removal of material is combined with a step of changing a radiation characteristic of the beam when the bottom of the borehole is repeatedly placed in a focus position.

Abstract: The disclosed invention relates to a method of realizing a laser processing system. The system relating to one aspect of the invention is provided with a processing laser, a vaporization laser, and an oscillator controller. The processing laser is a flashlamp-pumped 1.06 ?m solid-state laser, a pulsed iodine laser or an oxygen molecule laser. The vaporization laser is a pulsed laser whose wavelength is longer than 1.4 ?m.

Abstract: A high temperature turbine nozzle with automatic regulation of flow of cooling air passing therethrough. Each of vanes includes a first sleeve drilled with holes and a second sleeve that is engaged in the first sleeve, drilled with corresponding holes, and made of a material possessing a coefficient of expansion different from that of the first sleeve.

Abstract: A suspension for protecting a semiconductor material includes a polymeric matrix as carrier medium, inorganic particles, and at least one of an absorber dye or a plasticizer.

Abstract: A bioabsorbable polymeric stent with time dependent structure and properties and methods of treating a diseased blood vessel with the bioabsorable polymeric stent are disclosed. The structure and properties of the stent change with time and allow the vessel to be restored to a natural unstented state. The bioabsorbable stent loses mechanical integrity in a controlled manner due to modification of selected structural elements.

Abstract: An instrument panel has a base member and a cover member, which is adhered to the top surface of the base member. A first cleavage groove serving as a start point of rupture of the base member caused by inflation pressure of an airbag is formed in the back surface of the base member. The cover member is configured by a ground fabric layer, a cover layer adhered to the top surface of the ground fabric layer, and a cushion layer adhered to the back surface of the ground fabric layer. The cushion layer is formed of a knitted original fabric. A second cleavage groove is formed only in the back surface of the cushion layer out of the layers configuring the cover member in correspondence with the first cleavage groove of the base member.

Abstract: Systems and methods for pharmacy messaging are described. A system includes a laser module and a control module. The laser module includes a marking chamber with a plurality of laser heads therein. A first and second entry gate are adjacent the marking chamber. The first entry gate is configured to open when the second entry gate is closed. A first and second exit gate are adjacent the marking chamber at a side different from the first entry and second entry gate. The first exit gate is configured to open when the second exit gate is closed. A transporter moves the objects being marked into and out of the marking chamber through the various gates. The control module is communicatively coupled to the laser module and adapted to control the laser module. Additional methods and systems are disclosed.

Abstract: A system is described for tracking a position of a receiver medium as it travels along a media path. A laser provides heat to the receiver medium in a localized area sufficient to permanently alter a physical property of the receiver medium thereby forming a reference mark. A sensor at a downstream position along the media path is adapted to sense the reference mark providing a sensed signal. The sensed signal is analyzed to determine a position of the receiver medium as the receiver medium passes through the second position along the media path by detecting a position of the reference mark.

Abstract: A process for making perforations in a plastic film material to be used in a package for products prone to decay, in which the surface area of the perforations made in a defined surface area of the plastic film material must have a predetermined value, which process has the following steps: A. making of one perforation or a number of perforations in the defined surface area of the plastic film material, B. measuring the surface area of the perforation or of the number of perforations made in step A, C. calculating the difference between the predetermined perforation value minus the surface area of all perforations present in the defined surface area, D. if the difference is smaller than a first predetermined reference value, stopping the making of perforations in the defined surface area of the plastic film material, or if the difference is larger than the first predetermined reference value repeating the steps A to C until the difference is at most equal to the first predetermined reference value.

Abstract: Methods for testing turbine blades. One method for testing turbine blades includes measuring dimensions of each of a first set of turbine blades. The method also includes testing airflow through first openings in each of the first set of turbine blades to determine airflow properties of each of the first set of turbine blades. The method includes determining a relationship between the dimensions and the airflow properties of each of the first set of turbine blades. The method includes measuring dimensions of each of a second set of turbine blades. The method also includes determining airflow properties for each of the second set of turbine blades based at least partially on the dimensions of the second set of turbine blades and the relationship.

Abstract: Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are presented, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create multiple scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces different types of sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination through either light scattering or light reflection and nearly invisible without illumination. Transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating.

Abstract: In some embodiments, same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning (SAP) is presented. In this regard, a method is introduced including patterning a first density region of a laminated substrate surface using LPP, patterning a second density region of the laminated substrate surface using SAP, and plating the first and second density regions of the laminated substrate surface, wherein features spanning the first and second density regions are directly coupled. Other embodiments are also disclosed and claimed.

Abstract: The object of the present invention is provision of a surface protection sheet for laser processing to be applied to the surface on the opposite side of the laser beam irradiation face, which can protect the surface of an application object, and does not allow easy development of a dross during laser cutting processing. According to the present invention, a surface protection sheet 1 for laser processing to be applied to the surface on the opposite side of the laser beam irradiation face 2a of a workpiece 2 during a cutting process by irradiation of a laser beam 6 on the workpiece 2 is provided, which contains a substrate layer and an adhesive layer formed on one surface of the substrate layer, wherein the substrate layer is made of a resin material having a melt viscosity measured based on JIS K7199 (1999) at 290° C. of not more than 200 Pa·s, and has a thickness of 0.01-0.12 mm.

Abstract: A method is described for simultaneously writing patterns in thin films of material coated on the opposite sides of thin glass or plastic substrates by direct write, laser ablation. The substrates are fully or partially transparent to the laser radiation used and in addition the surfaces of the substrates are not assumed to be flat. Different registered patterns may be applied at the same time to opposite sides of the substrates.

Abstract: A method for forming cavity in substrate includes setting start position on closed loop line having circumference L for substrate, consecutively irradiating laser from laser device upon board for the substrate such that holes are formed, and moving the device in loop from the start position along the line such that penetrating hole is formed through the board. The start position of first loop is set as base position, the moving includes shifting the start position by distance d after each loop and controlling such that the moving satisfies p=?di, m?L/p and M=m×n, where i=1 to n, n represents number of loops, p represents pitch of the holes, m represents number of the holes in loop, ?di is distance from the base position for the start position after i-th loop, and M is number of the holes by the loops.

Abstract: Methods for producing a continuous hole in a substrate are provided. A laser is used for producing an inner proportion and a diffuser of the continuous hole, wherein an angular position of the laser with respect to the substrate is changed at least three times.

Abstract: Microfluidic flow-through elements and methods for forming and using the same, particularly, low cost, easily sterilized, disposable microfluidic flow-through elements may include an orifice region suitable, for example, for fluid jet formation (such as in a droplet sorter or flow cell) or sample injection or hydrodynamic focusing (such as in a non-droplet flow cytometer). Laser drilling, for example laser ablation, may be used to form an orifice region extending through an orifice wall section of a base substrate. The base substrate may be unitarily-formed by injection molding a polymeric material. The orifice region may be advantageously configured to form a predetermined geometry by controlling the characteristics of the ablating beam.

Abstract: A process for reopening cooling-air holes by a laser in order to remove coat down is provided. A nanosecond laser is provided and used for reopening the holes, wherein pulse times between 1 ?s and 20 ?s and a pulse frequency between 20 kHz and 40 kHz provided by the nanosecond laser are used.

Abstract: A laser material processing system which includes a pulsed fiber laser source having a continuous wavelength bandwidth of larger than 100 nm and pulse width of from 100 femtosecond to 1 microsecond, a broad band laser emitted from one core of an optical fiber, where the broad band laser is applied to a subject material to produce removal of the subject material and/or color change of the subject material.

Abstract: A system for manufacturing an airfoil includes a laser beam and a first fluid column surrounding the laser beam to create a confined laser beam directed at the airfoil. A liquid flowing inside the airfoil disrupts the first fluid column inside the airfoil. A method for manufacturing an airfoil includes confining a laser beam inside a first fluid column to create a confined laser beam and directing the confined laser beam at a surface of the airfoil. The method further includes creating a hole through the surface of the airfoil with the confined laser beam, flowing a liquid inside the airfoil, and disrupting the first fluid column with the liquid flowing inside the airfoil.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: a base substrate; an inner layer build-up layer formed on the base substrate and including a first inner layer circuit layer, a second inner layer circuit layer, an inner layer insulating layer, and an inner layer via having a tapered section; and an outer layer build-up layer formed on the inner layer build-up layer and including an outer layer circuit layer, an outer layer insulating layer, and an outer layer via having a rectangular section.

Abstract: Disclosed is a method of manufacturing a metal mask. A method of manufacturing a metal mask in accordance with an exemplary embodiment of the present invention includes forming through holes in a plate using a laser, by scanning the laser onto sequentially smaller overlapping portions of the plate.

Abstract: A system for manufacturing an airfoil includes a laser beam and a first fluid column surrounding the laser beam to create a confined laser beam directed at the airfoil. A gas flowing inside the airfoil disrupts the first fluid column inside the airfoil. A method for manufacturing an airfoil includes confining a laser beam inside a first fluid column to create a confined laser beam and directing the confined laser beam at a surface of the airfoil. The method further includes creating a hole through the surface of the airfoil with the confined laser beam, flowing a gas inside the airfoil, and disrupting the first fluid column with the gas flowing inside the airfoil.

Abstract: An apparatus for creating a hole in solid sheet material (1) by laser beam irradiation is described comprising a source of laser radiation; a focusing apparatus (11) for impinging a beam of laser radiation from the source onto a surface of solid sheet material (1) in which holes are to be formed in use; and a holding device (7) for holding said solid sheet material (1); wherein the holding device (7) is structured to hold the sheet material (1) in use in an arcuate configuration. A method of creating a hole in solid sheet material making use of such an arcuate configuration is also described.

Abstract: The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.

Abstract: Components, such as turbine blades or vanes, are formed to a desired shape and dimensions by ablation machining a work piece surface. Recast layer material created on the work piece surface during the ablation machining is subsequently removed by fluoride ion cleaning (FIC). Exemplary ablation machining methods include laser machining and electric discharge machining (EDM). The work piece material may include superalloys commonly used for fabrication of turbine blades or vanes, which are susceptible to recast layer formation during EDM or laser machining. Post ablation FIC recast layer removal is easier than known methods, such as mechanical grinding, secondary EDM machining of the layer at lower speeds and/or current intensity, or chemical etching processes. Ablation machining processes can be optimized for speed and efficiency without regard for recast layer avoidance, with knowledge that the recast layer will be subsequently removed by the complimentary FIC process.

Abstract: A process for providing a protection against damages in a machine head is claimed. The process comprises the following steps: First a blind steel plate (protection plate 20) is fixed to a protection chamber (10). Then the transparent liquid jet (WJ) guided laser beam (LB) is started, which drills a transit-hole into it. This protection plate (20) has the transit-hole (23) precisely arranged on the optical axis. Therefore no further alignment is required. Further an apparatus for treating a work piece by means of a laser beam (LB) which is guided in a transparent liquid jet (WJ) is claimed. The apparatus comprises a protection chamber (10) mounted on the output (5) of a coupling unit (CU) and a protection plate (20) replaceable fixed to the first chamber (10) protecting the outlet (15) of the first chamber (10) from sputtered debris.

Abstract: Variation in hole diameter due to heating effects is minimized even if the shortest machining route is set, and machining quality is improved. A printed circuit board to be scanned by a laser beam is divided into a plurality of scan areas (S1). An order of drilling within the scan area is sorted to obtain a scanning route with the shortest distance (S2). The order of the (N+1)th hole and the (N+2)th hole is swapped in each scanning area if it is determined that the distance between the Nth hole and the (N+1)th hole (here, N is an integer in a range of 1?N?“the maximum number of holes to be drilled in the area”?1?) is less than a predetermined threshold value, and that N+1 is not correspond to the maximum number of holes to be drilled in the scanning area (S3).

Abstract: An arrangement for a turbomachine is provided. The arrangement includes a vane for directing a hot gas during the operation of the turbomachine, a stator ring for securing the vane, a heat shield for protecting the stator ring from the hot gas flow wherein the heat shield is arranged in downstream direction of the hot gas flow in front of the stator ring characterized in that the heat shield comprises a plurality of channels formed therein for directing a cooling air.

Abstract: Removing material from the surface of a first circuit comprises generating a first laser pulse using a pulse generator; targeting a spot on the first circuit using a focusing component; delivering the first laser pulse to the spot on the first circuit, the first circuit including a digital component; ablating material from the spot using the first laser pulse without changing a state of the digital component; testing performance of the first circuit, the testing being performed without reinitializing the circuit between the steps of ablating material and testing performance. Targeting the spot on the first circuit comprises generating a second laser pulse using a pulse generator; delivering a second laser pulse to a sacrificial piece of material; detecting the position of the ablation caused by the second laser pulse with a vision system that forms an image; and using this image to guide the first laser to the spot.

Abstract: A laser processed hole is formed in a workpiece. The workpiece has a first member formed of a first material bonded to a second member formed of a second material. A value is set representing the minimum number of shots of a pulsed laser beam when the spectral wavelength of plasma has changed from the spectral wavelength inherent in the first material to that of the second material. A maximum shot number is set representing a maximum value of the number of beam shots when the spectral wavelength of the plasma has completely changed. The beam is stopped if the number of shots has reached the minimum value and the spectral wavelength of the plasma has changed whereas the beam is continued until the number of shots reaches the maximum value if the spectral wavelength of the plasma has not changed even after the number of shots has reached the minimum value.

Abstract: The present disclosure describes a compound slot, and systems and methods of forming the compound slot. An example of a compound slot includes a wafer, where the compound slot includes a trench along a long axis of the compound slot and on a top surface of the wafer, where the trench passes through an initial portion of a total depth of the wafer. A number of openings pass through a remaining portion of the total depth of the wafer, where at least a retained portion of a bottom of the trench is present around a perimeter of each of the number of openings.

Abstract: A device is used for drilling a substrate, in particular a device for generating a hole or recess or well in an electrically insulating or semiconducting substrate, more specifically a device for generating a plurality of holes or recesses or wells in an electrically insulating or semiconducting substrate.

Abstract: A process for making a hole into a substrate by at least one laser includes a first step which involves producing at least one intermediate hole with a diameter which is smaller than a final diameter of a final hole to be produced. The intermediate hole with the smaller diameter is a through-hole. The intermediate hole is produced by percussion process. The process further includes a second step which involves producing the final hole having the final diameter. The final hole is produced by machining the intermediate through-hole by a trepanning process so that the final diameter of the final hole is achieved.

Abstract: A method of drilling holes through a solid material in such manner as to give holes in a first area a first profile and distribution and holes in a second area a second profile and distribution comprising the steps of: —defining a first area in which holes have a first profile and distribution; —defining a second area in which holes have a second profile and distribution at least one of which is different from that in the first area; —defining a transition zone in which holes have a profile and/or distribution as the case may be which undergo a continuous and gradual transition from that in the first area to that in the second area; —drilling holes in all of the first area, the transition zone and the second area via a continuous process.

Abstract: In the case where the workpiece (1) is processed, the laser beam is S-polarized by an optical modulator (7). Thus, the laser beam is mainly diverted toward a workpiece (1) by a polarizer (6). An optical path through which the laser beam passes is caused to have a high light converging ability with respect to a target spot by an optical device (9). In the case where the workpiece (1) is not processed, the laser beam is P-polarized by the optical modulator (7). Thus, the laser beam is mainly diverted to a beam damper (10) side by the polarizer (6). However, the workpiece 1 is irradiated with the laser beam having leaked from the polarizer (6). An optical path through which the laser beam passes is caused to have a low light converging ability with respect to the target spot by the optical device (9).

Abstract: A process is provided for forming shaped air holes, such as for use in turbine blades. Aspects of the disclosure relate to forming shaped portions of air holes using a short pulse laser, forming a metered hole corresponding to each shaped portion, and separately finishing the shaped portion using a short-pulse laser. In other embodiments, the order of these operations may be varied, such as to form the shaped portions and to finish the shaped portions using the short-pulse laser prior to forming the corresponding metered holes.

Abstract: A method of removing slag formed during laser cutting a hypotube may include flowing cooling gas into a laser nozzle, directing flow of the cooling gas onto an external surface of the hypotube, and injecting cooling fluid into an inner lumen of the hypotube at a velocity. Flowing the cooling gas and injecting the cooling fluid may at least partially remove slag from the external surface of the hypotube.

Abstract: A method for cutting a semiconductor wafer by generating a crack within the wafer, and a system thereof, are provided. The method comprises irradiating a laser beam towards a surface of the wafer and converging the laser beam to form a focal point so that a focal volume defined by the focal point and a boundary of the laser beam within the wafer is formed. Energy encompassed within the focal volume causes the wafer located at the periphery of the focal volume to contract faster than the wafer located within the focal volume, thereby generating a crack within the wafer.

Abstract: A novel apparatus and method for laser-assisted micro-milling. The disclosed laser-assisted micro-milling system and method provides unique micro-milling capabilities for very difficult-to-machine materials, such as ceramics, high temperature alloys and composites. A low power laser beam is focused at a very small spot, thus producing a very high power density, the spot being located just ahead of a mechanical micro-milling cutter to preheat the material prior to machining. This localized heating thermally weakens the workpiece resulting in lower cutting forces, improved surface finish, and longer tool life. The system is capable of micro-milling difficult-to-machine materials that may be conductive or non-conductive with high material removal rates compared to existing systems and methods.

Abstract: Novel laser drilling systems are disclosed. The laser drilling systems are useful for drilling bore holes in medical devices, especially blind bore holes in surgical needles. The laser systems use a low power fiber seed laser to produce a high quality laser beam that is modulated and amplified, and which has precise characteristics to produce precision drilled holes.

Abstract: Three systems for the destruction of the data storage portion of electronic media storage devices such as hard disk drives, solid state drives and hybrid hard drives. One system utilizes a mill cutter with which the hard drive has relative motion in the direction of the axis of the mill cutter to destroy the data storage portion. A second system utilizes a laser to physically destroy the data storage portion. The third system utilizes a chemical solvent to chemically destroy the data storage portion.

Abstract: A laser beam positioning system of a laser-based specimen processing system produces at beam positioner stage, from a fully fiber-coupled optics phased array laser beam steering system, a steered laser input beam. System directs beam through one or more other beam positioner stages to form a processing laser beam that processes target features of a workpiece mounted on a support.