Abstract: A computer-numerically-controlled machine can include a light source and a housing. The light source can be configured to deliver electromagnetic energy to at least one location on a material at least partially disposed within the computer-numerically-controlled machine. The housing can include at least one side part surrounding an interior space and the at least one location on the material. The housing can include a structural material defining at least a portion of the interior space. The housing can further include a protective material protecting the side part. The protective material can reduce a permeability of the side part to the electromagnetic radiation relative to the structural material alone.

Abstract: A machining tool includes a light irradiator, a cover, and a light blocking filter. The light irradiator is to irradiate a workpiece to process the workpiece. The cover covers the light irradiator and the workpiece in the cover. The light blocking filter is configured to change light transmissivity of the light blocking filter in accordance with light from an inside of the cover, which the light blocking filter receives.

Abstract: A system for building a three dimensional green compact comprising a printing station configured to print a mask pattern on a building surface, wherein the mask pattern is formed of solidifiable material; a powder delivery station configured to apply a layer of powder material on the mask pattern; a die compaction station for compacting the layer formed by the powder material and the mask pattern; and a stage configured to repeatedly advance a building tray to each of the printing station, the powder delivery station and the die compaction station to build a plurality of layers that together form the three dimensional green compact.

Abstract: A system and method for laser cutting a plurality of parts, for example metal chassis components, using a plurality of laser cutting apparatuses is provided. The system includes a plurality of the laser cutting apparatuses disposed in a single enclosed cell for simultaneously trimming multiple parts. The system also includes at least one inner chamber and at least one set of double doors for transferring the parts in and out of the enclosed cell without any light escaping the cell. The parts are conveyed through the first door to the inner chamber while the second door is closed, and through the second door to the enclosed cell while the first door is closed. The system also includes robots continuously preloading and unloading the parts to maximize the laser trimming time.

Abstract: Systems and methods for preventing or reducing contamination enhanced laser induced damage (C-LID) to optical components are provided including a housing enclosing an optical component, a container configured to hold a gas phase additive and operatively coupled to the housing; and a delivery system configured to introduce the gas phase additive from the container into the housing and to maintain the gas phase additive at a pre-selected partial pressure within the housing. The gas phase additive may have a greater affinity for the optical component than does a contaminant and may be present in an amount sufficient to inhibit laser induced damage resulting from contact between the contaminant and the optical component. The housing may be configured to maintain a sealed gas environment or vacuum.

Abstract: The invention discloses a method and a device of improving crystallization ratio of polysilicon, which is applied to the process that the amorphous silicon layer converts into the polysilicon layer. More specifically, superposing at least two pulse laser beams into a superposed pulse laser beam. The pulse width of the superposed pulse laser beam is larger than each pulse laser beam. Next, utilizing the superposed pulse laser beam to irradiate onto the amorphous silicon layer for transforming the amorphous silicon layer into polysilicon layer. The superposed pulse laser beam irradiates onto the surface of the amorphous silicon layer. The amorphous silicon layer is transformed into the polysilicon layer. Consequently, the crystallization ratio of polysilicon is improved.

Abstract: A movable microchamber system with a gas curtain is disclosed. The microchamber system has a top member with a light-access feature and a stage assembly that supports a substrate to be processed. The stage assembly is disposed relative to the top member to define a microchamber and a peripheral microchamber gap. An inert gas is flowed into the peripheral microchamber gap to form the gas curtain just outside of the microchamber. The gas curtain substantially prevents reactive gas in the ambient environment from entering the microchamber when the stage assembly moves relative to the top member.

Abstract: A thermal cutter for cutting with heat a board mounted upon a table having an internal space includes a plurality of walls and a sound absorbent material. The walls are disposed in the internal space of the table to partition a plurality of exhaust chambers with each of the exhaust chambers having an aperture that opens towards a side on which the board is mounted. The sound absorbent material is provided to at least a portion of at least one of the walls, the sound absorbent material being removably coupled to the table.

Abstract: A method is disclosed for crystallizing semiconductor material so that it has large grains of uniform size comprising delivering a first energy exposure of high intensity and short duration, and then delivering at least one second energy exposures of low intensity and long duration. The first energy exposure heats the substrate to a high temperature for a duration less than about 0.1 sec. The second energy exposure heats the substrate to a lower temperature for a duration greater than about 0.1 sec.

Abstract: A welding equipment that forms an end part includes a vacuum chamber; a holding member that is installed in the vacuum chamber and that holds the end part in which a welding groove is formed by placing a half cell, an end plate, and a beam pipe next to each other; a window that is installed in a top-end surface portion of the vacuum chamber, which intersects with an axial center of the end part, and that forms a portion thereof; a laser radiating head that is installed outside the vacuum chamber and that radiates a laser beam into an internal space of the end part through the window; and a mirror member that is installed in the internal space of the end part and that adjusts a reflected laser beam, formed by reflecting the laser beam, so as to be oriented perpendicular to the welding groove.

Abstract: A process chamber for a processing of a material by means of a directed beam of electromagnetic radiation is provided, which comprises an optical element (9) for coupling the beam (7) into the process chamber (10), wherein the optical element has a surface (9a) facing the inside of the process chamber, a wall section (12) surrounding the optical element (9), a first inlet (16) for a gas that is arranged at one side of the optical element (9) and designed such that an escaping first gas flow (18) strokes substantially tangentially over the surface (9a) of the optical element (9), a second inlet (23) for a gas, which is designed and arranged such that an escaping second gas flow (25) flows at a distance to the surface (9a) in substantially the same direction as the first gas flow (18).

Abstract: Unit for treating blanks of hollow bodies made of plastic material, including an enclosure having two opposite walls, namely a first wall and a second wall facing the first one, which together define an enclosure through which the blanks pass along a predetermined longitudinal trajectory. Each wall includes a series of spaced emitters each having a plurality of sources of monochromatic or pseudo-monochromatic electromagnetic radiation sources; a reflective section extends into each space between two adjacent emitters; the emitters of the second wall are offset longitudinally with respect to those of the first wall, so that the emitters of each wall face a reflective section of the opposite wall.

Abstract: A method and apparatus to perform laser ablation in the vicinity of a charged particle beam while simultaneously protecting the light optical components of the apparatus utilized to perform the ablation from being coated with debris resulting from the ablation process. According to preferred embodiments of the present invention, a protective transparent screen is used to shield the laser optical components. A preferred screen could be replaced or repositioned without breaking vacuum in the sample chamber and would not be particularly susceptible to undesirable charging effects.

Abstract: A laser cleaning device, and a laser cleaning method using the same, for removing an electrolyte solution stuck to an electrolyte tab during a process of injecting the electrolyte solution are disclosed. The laser cleaning device for an electrode tab of a battery includes: a cleaning housing, in which a battery case for receiving an electrode group, an electrolyte solution and an electrode tab exposed to the outside are embedded; a laser generator which includes a laser source for generating a laser beam and an output controller for controlling output of the laser beam; a laser transmitter which transmits the laser beam generated by the laser generator; and a laser emitting unit which is installed inside the cleaning housing, and which irradiates the laser beam transmitted by the laser transmitter onto the electrode tab so as to remove liquid pollutants stuck to the electrode tab. The laser cleaning method comprises steps generally corresponding to the latter functions of the laser cleaning device.

Abstract: A laser protective wall element for a housing in laser machining stations with which increased protection, in particular for the eyes of living beings, can be achieved. In a laser protective wall element for a housing at laser machining stations, an intermediate layer is present which has hot conductor properties. The intermediate layer can be formed between electrically conductive plate-like elements, an electrically conductive plate-like element and an electrically conductive coating or also two electrically conductive layers or can be arranged there. The electrically conductive plate-like elements, the coating and/or the layers are connected to an electrical voltage source as well as a measuring instrument which detects electrical current, electrical resistance and/or electrical capacity and whose measured signal change can be used for the condition monitoring of the laser protective wall element.

Abstract: A method of forming a bonded assembly (10). The method comprises: providing at least first and second parts (12, 14) of an assembly (10) to be bonded; assembling the first and second parts (12, 14) in a required relative position to define a bond interface region therebetween; sealing part way along an edge (18) of the bond interface region using laser beam welding to define a cavity between the first and second parts (12, 14); in a vacuum environment, sealing the remainder of the edge (20) of the bond interface region using electron beam welding to form a fluid tight seal around the cavity; and applying heat and pressure to an external surface of the cavity to diffusion bond the first and second parts (12, 14) together.

Abstract: A laser processing machine includes a cavity, a laser system, at least one processing platform, and at least one upper motion platform. The laser system is disposed at a lower part inside the cavity, and used for outputting a laser beam. A traveling direction of the laser beam is opposite to the gravity direction. The processing platform is disposed at an upper part inside the cavity, and includes an adsorption surface and a connection surface facing each other. The adsorption surface is located below the connection surface, and is used for adsorbing a workpiece. The upper motion platform is disposed at the upper part inside the cavity, and is correspondingly connected to the connection surface of the processing platform, in order to cause the processing platform to move.

Abstract: An approach is provided for fabricating a light emitting diode using a laser lift-off apparatus. The approach includes growing an epitaxial layer including a first conductive-type compound semiconductor layer, an active layer and a second conductive-type compound semiconductor layer on a first substrate, bonding a second substrate, having a different thermal expansion coefficient from that of the first substrate, to the epitaxial layers at a first temperature of the first substrate higher than a room temperature, and separating the first substrate from the epitaxial layer by irradiating a laser beam through the first substrate at a second temperature of the first substrate higher than the room temperature but not more than the first temperature.

Abstract: The present invention is directed to a laser marking device, system and method for its use.

Abstract: A processing system for micro processing. The processing system comprises a laser configured to generate a laser beam for performing laser processing within a preparation chamber. The processing system further comprises a transmission window, configured such that the laser beam enters into the preparation chamber through the transmission window. The processing system further comprises a fastening flange for fixing the transmission window relative to the preparation chamber, and a laser shield configured to provide, in a first arrangement of the laser shield, glare protection from a passage of the laser beam from a laser beam housing to the preparation chamber. The laser shield is movably mounted for movement between the first arrangement and a second arrangement of the laser shield, wherein in the second arrangement, at least one of the transmission window and the fastening flange is separable from the processing system.

Abstract: A laser machining system includes a workpiece support, a laser machining unit arranged above the workpiece support and for machining a workpiece located on the workpiece support, at least one extraction opening beneath the workpiece support, and an enclosure separating the workpiece support, the laser machining unit and the at least one extraction opening from an external environment. The enclosure includes at least one air inflow opening arranged above the workpiece support and relative to the at least one extraction opening such that, during operation of the laser machining system, a pressure difference between the air inflow opening and the at least one extraction opening establishes a flow of air between the workpiece support and the laser machining unit, in which the flow of air separates the interior of the enclosure into a laser machining area beneath the flow band and a laser free area above the flow band.

Abstract: A layered manufacturing method for forming a desired three-dimensional object by using a powder as a raw material. The method forms a desired solid body, which is employed in a layered manufacturing device, including a stage member having stage surface; a transparent member having an optical window to cover the stage surface to form an enclosed region together with the stage surface; and an exhaust system for exhausting gasses in the enclosed region. The optical window is positioned at a vertical upper direction when the enclosed region is formed.

Abstract: A laser annealing apparatus is provided that is capable of reducing irradiation unevenness of laser light caused by a refraction phenomenon of the laser light due to fluctuation in the temperature of inert gas. The laser annealing apparatus includes a gas supply unit for supplying inert gas G to at least a laser irradiation area of a workpiece, and a gas temperature controller for regulating the temperature of the inert gas G. The gas temperature controller controls the temperature of the inert gas G supplied to the laser irradiation area so as to decrease a temperature difference between the temperature of the inert gas G and the atmospheric temperature of a space (a room R) that is disposed outside the supply area of the inert gas so the temperature controlled inert gas surrounds the optical path of the laser light.

Abstract: Laser engravers with a masking mechanism comprise a machine body, a laser-engraving mechanism inside the machine body, a working platform, and an exhauster. The laser-engraving mechanism includes a lens-cart rail that moves back and forth along a working track. The exhauster includes air outlets behind the working platform. The masking mechanism, which includes a reelable curtain-sheet, is installed above the air outlets so that while processing, the curtain-sheet is reeled out above the working platform and an air induction channel is formed to increase the working efficiency of the exhauster.

Abstract: A laser cutting system including a chamber configured to provide a controlled environment while the laser is being used to cut a pattern into a material to reduce or eliminate heat and oxygen related changes to the mechanical characteristics of the material. A system for providing a gas to the controlled environment within the chamber, as well as a means for exhausting gas and cutting debris from the chamber is also described. A cutting mandrel that provides for flow of a shielding gas and also provides a means for dispersing a laser beam before it can produce unwanted damage to a section of tubing is also described.

Abstract: An apparatus for manufacturing a three-dimensional object (3) by applying and solidifying a powdery constituent material (3a) layer by layer at positions corresponding to the respective cross sectional area of the object (3) in the respective layer by exposure to a laser (7) or another energy source comprises a heating or cooling element (22) supplying heat to or removing heat away from the constituent material (3a) applied layer by layer. For smoothing the temperature distribution, an intermediate layer (23) having a highly anisotropic heat conductivity is provided.

Abstract: A process and apparatus for making silicon or silicon/germanium core fiber is described, which uses a plasma process with reducing agent to make preform. The process also makes the recommendations in selecting the adequate cladding tube for better fiber properties. An improved fiber drawing apparatus is also disclosed in order to draw this new type of preforms.

Abstract: Apparatus and methods of thermally processing semiconductor substrates are disclosed. Aspects of the apparatus include a source of intense radiation and a rotating energy distributor that distributes the intense radiation to a rectifier. The rectifier directs the radiation toward the substrate. Aspects of the method include using a rotating energy distributor to distribute pulsed energy to a substrate for processing. The rotational rate of the energy distributor is set based on the pulse repetition rate of the energy source. A substrate may be continuously translated with respect to the energy distributor at a rate set based on the pulse repetition rate of the energy source.

Abstract: An integrated additive manufacturing cell (IAMC) that combines conventional manufacturing technologies with additive manufacturing processes is disclosed. Individual IAMCs may be configured and optimized for specific part families of complex components, or other industrial applications. The IAMCs incorporate features that reduce hardware cost and time and allow for local alloy tailoring for material properties optimization in complex components.

Abstract: A selective laser sintering apparatus is adapted contain or receive a build frame and comprises a cap assembly which includes a removable plate assembly having at least one gas inlet formed therein. The removable plate assembly sealingly covers the build frame. The cap assembly further comprises at least one gas line fluidly connectable to the gas inlet via a gas port to deliver inert gas to the interior of the build frame. The plate assembly comprises upper and lower plates defining a spacing therebetween. A seal extends around a periphery of the upper and lower plates and is sandwiched therebetween to enclose the spacing. The lower plate has a plurality of gas inlets formed therein which are in fluid communication with the spacing such that inert gas may be delivered to the build volume while the cap assembly is installed thereupon.

Abstract: A laser processing machine includes a workpiece support, a movement unit that is movable relative to the workpiece support, the movement unit being configured to move a laser processing head over the workpiece support, and a switch cabinet in which one or more control components of the laser processing machine are provided. An arrangement of the switch cabinet provides a free movement space disposed underneath at least a portion of the switch cabinet, wherein at least a portion of the movement unit is disposed within the free movement space.

Abstract: A method of laser welding of two members by their respective edges, on a first surface of a slideway section, wherein at least a first one of said members is welded by application of two parallel laser beams from a second surface of the slideway section, with a distance between the beams approximately corresponding to the thickness of the first member, to obtain a laser transmission welding in a single run.

Abstract: A device for welding a plurality of foils to one another by means of a laser, for use in a packaging machine, comprises a clamping unit configured for applying pressure to a plurality of foils in a predetermined area as well as for conducting the laser radiation used for the purpose of welding to this area. A method for welding a plurality of foils to one another by means of a laser in a sealing station comprises welding the foils to one another along a sealing seam by means of the radiation of the laser while pressing them together in the area of the sealing seam.

Abstract: The invention firstly comprises a method of ablation processing including a step of ablating a region of a substrate (1) by way of a laser beam (3) characterized by a further step of removing debris ablated from the region (1) by way of a flow of a fluid (7), namely a gas or vapour, a liquid or a combination of these, wherein the flow of fluid (7) is directed to flow over the region so as to entrap debris and thereafter to remove the entrapped debris from the region by directing the flow of fluid with any entrapped debris away from region along a predetermined path (6) avoiding subsequent deposition of entrapped debris on the substrate.

Abstract: A laser irradiation apparatus of the embodiment includes: a laser light transmission mechanism to guide laser light from a laser light source and emit the laser light from a laser light emission part; a condensing mechanism to condense the laser light; a pipe state casing to house and hold the condensing mechanism inside thereof and have an opening part to irradiate the laser light; a fluid supply mechanism to supply a fluid into the casing to emit the fluid from the opening part; a positioning mechanism provided at the casing to keep a distance from the condensing mechanism to the processing object constant by being brought into contact with the processing object; and a fluid guide mechanism to guide the fluid emitted from the opening part to flow between the casing and the processing object along an axial direction of the casing.

Abstract: A spatter removing device for a laser welder including an optic head to which a laser beam is transferred through an optic fiber from a laser oscillator, a cross jet mounted at one side of a lower end portion of the optic head, a safety cover provided at the outside of the optic head so as to surround the optic head, and a material injection unit that injects a material to be welded below the optic head, the device includes a discharge unit and a spatter cooling device. The discharge unit is provided with a discharge pipe that discharges a welding gas and the spatter at one side portion of the safety cover. The spatter cooling device is connected to the discharge pipe and cools the spatter so that the spatter is forcibly collected.

Abstract: An annealing method irradiates a target object, having a film formed on its surface, with a laser beam to perform an annealing process to the target object. The surface of the target object is irradiated with the laser beam obliquely at an incident angle that is determined to achieve an improved laser absorptance of the film.

Abstract: A laser head for irradiating an interaction region of a structure with laser light to remove material from the structure. The laser head includes a housing, an anchoring mechanism, and a connector coupled to the housing and optically coupled to a laser generator. The anchoring mechanism is reversably coupled to the housing and releasably affixed to the structure by vacuum pressure. The anchoring mechanism releasably holds the laser head at a selected position in relation to the structure. The connector transmits laser light from the laser generator. The laser head further includes a plurality of optical elements contained in the housing. The laser head further includes a containment plenum coupled to the housing. The containment plenum is optically coupled to the plurality of optical elements to receive the laser light. The containment plenum confines the material and removes the material from the interaction region resulting from irradiating the structure with the laser light.

Abstract: Provided are apparatuses and method for the thermal processing of a substrate surface, e.g., controlled laser thermal annealing (LTA) of substrates. The invention typically involves irradiating the substrate surface with first and second images to process regions of the substrate surface at a substantially uniform peak processing temperature along a scan path. A first image may serve to effect spike annealing of the substrates while another may be used to provide auxiliary heat treatment to the substrates before and/or after the spike annealing. Control over the temperature profile of the prespike and/or postspike may also reduce stresses and strains generated in the wafers. Also provided are microelectronic devices formed using the inventive apparatuses and methods.

Abstract: Disclosed is a dry cleaning apparatus and method for removing contaminants on a surface of a workpiece. The disclosed dry cleaning apparatus comprises a laser cleaning unit having a laser beam generator for generating a laser induced shock wave in the atmosphere, the laser cleaning unit being suitable for removing an inorganic contaminant on the surface of the workpiece using the generated laser induced shock wave; and a flash cleaning unit having a flash generator for generating a flash having pulse wave, the flash cleaning unit being suitable for removing an organic contaminant on the surface of the workpiece using the generated flash.

Abstract: (Problem to be solved) A laser refining apparatus and the laser refining method for efficiently collecting evaporant other than oxygen from an oxidized compound. (Means for solving the problem) The laser refining apparatus comprises a stage inside a processing chamber where an oxidized compound is placed; an irradiation means for irradiating a laser under the condition that the oxidized compound placed on the stage is heated to a temperature at or above the boiling point of said oxidized compound; an attaching medium to which non-oxygen evaporant evaporated by the laser irradiated by the irradiation means attaches; and a feeding means for feeding gas that prevents the non-oxygen evaporant from becoming an oxidized compound into the processing chamber. The attaching medium is positioned so that the non-oxygen evaporant can attach to the attaching medium before becoming an oxidized compound, and the oxidized compound is metal oxide or silicon oxide.

Abstract: A laser processing unit includes a first working area for laser processing of a workpiece, a second working area for laser processing of a workpiece, and a dividing wall adapted to separate the first working area from the second working area between, the dividing wall having individual interconnected sections and being moveable in a vertical direction.

Abstract: An apparatus for comprises a base, a wall, and an opening in the wall. The base has a first end, a second end, and a channel system. The channel system is located closer to the first end than the second end of the base. The wall extends from a side of the base to partially enclose the channel system. The opening in the wall is located closer to the second end than the first end. The shape of the wall is capable of retaining a gas introduced through the channel system in a welding location and causing the gas to move away from the channel system and through the opening in the wall.

Abstract: Laser protection arrangement with a safety cutoff comprising a passive laser protection wall which stores the radiation energy of impinging radiation of a laser of a laser material processing installation, a laser protection foil which causes a detectable change when struck by laser radiation and which is arranged in front in direction of the laser radiation, and at least one sensor which is connected to the laser by a threshold switch in order to switch off the laser when the received detector signal exceeds or falls below a threshold value.

Abstract: A method and device are provided for welding structural parts, preferably of a gas turbine, especially of an aircraft engine. A structural component is laser-welded by means of at least one laser source, the one or more laser sources being operated in a pulsed mode. Pulse duration and/or pulse shape and/or output of the one or more laser sources are adjusted in a variable manner. The wire advance of the welding wire is controlled subject to the pulses of the one or more laser sources.

Abstract: The present invention is an annealing apparatus configured to perform an annealing process to an object to be processed, the annealing apparatus comprising: a processing vessel in which the object to be processed can be accommodated; a support unit configured to support the object to be processed in the processing vessel; a gas supply unit configured to supply a process gas into the processing vessel; an exhaust unit configured to discharge an atmosphere in the processing vessel; and a rear-side heating unit including a plurality of laser elements configured to irradiate heating light beams toward an overall rear surface of the object to be processed.

Abstract: The present invention provides apparatus and methods for achieving uniform heating to a substrate during a rapid thermal process. More particularly, the present invention provides apparatus and methods for controlling the temperature of an edge ring supporting a substrate during a rapid thermal process to improve temperature uniformity across the substrate.

Abstract: A laser head is adapted to irradiate an interaction region of an inhabitable structure with laser light to remove material from the structure. The laser head includes a housing. The laser head further includes a connector coupled to the housing and optically coupled to a laser generator. The connector is adapted to transmit laser light from the laser generator. The laser head further includes at least one optical element contained in the housing and optically coupled to the connector. The optical element is adapted to receive laser light from the connector. The laser head further includes a containment plenum coupled to the housing. The containment plenum is optically coupled to the optical element to receive the laser light from the optical element. The containment plenum is adapted to confine the material and remove the material from the interaction region resulting from irradiating the structure with the laser light.

Abstract: An apparatus processes a surface of an inhabitable structure. The apparatus includes a base unit adapted to provide energy waves to an interaction region, the energy waves removing material from the structure. The base unit includes an energy wave generator and a head coupled to the energy wave generator. The head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further includes a manipulation system which includes an anchoring mechanism adapted to be releasably coupled to the structure and a positioning mechanism coupled to the anchoring mechanism and coupled to the head. The manipulation system is adapted to controllably adjust the position of the head relative to the structure. The apparatus further includes a controller electrically coupled to the base unit. The controller is adapted to transmit control signals to the base unit in response to user input.

Abstract: The invention relates to a method and apparatus for improving properties of a solid material by providing shockwaves there through. Laser shock processing is used to provide the shockwaves. The method includes applying a liquid energy-absorbing overlay, which is resistant to erosion and dissolution by the transparent water overlay and which is resistant to drying to a portion of the surface of the solid material and then applying a transparent overlay to the coated portion of the solid material. A pulse of coherent laser energy is directed to the coated portion of the solid material to create a shockwave. Advantageously, at least a portion of the unspent energy-absorbing overlay can be reused in situ at a further laser treatment location and/or recovered for later use.