Abstract: A method for the consecutive resistance heating of sequentially advanced wire pins by means of electrodes positioned on end faces of the pins includes the following steps:A. connecting in series at least two wire pins to a current source through the electrodes;B. passing heating current through each wire pin for a number of consecutive heating periods which equal the number of the serially-connected wire pins; andC. between each heating period removing that wire pin which has been exposed to all consecutive heating periods and, in its stead, introducing a new wire pin.

Abstract: Apparatus for incrementally moving a planar frame, such as a die support frame used in the manufacture of semiconductor components. The apparatus includes means for mounting a frame for movement in a vertical plane past a heater element, whereby portions of the frame can be successively heated by the heater element to permit bonding of die to leads terminating at the upper margin of the frame. The frame is incrementally moved by one or more horizontally reciprocal pawls, each pawl being receivable within an opening in the frame during a feed stroke of the pawl and being cammed out of such opening during a return stroke thereof. A first clamp releasably clamps the frame to the heater element during a die bonding operation and moves away from the heater element at the end of the return stroke and during the feed stroke.

Abstract: Metallic particles are heated to a coherent bonding state, are provided with an electric charge and accelerated into and through an evacuated chamber. Means associated with the chamber continuously control the directional path of the moving particles in accordance with the shape of the article to be formed. The projected particles then impinge upon a target at one end of the chamber to build up the three-dimensional object desired.