Abstract: Devices, systems, and methods for processing sample materials. The sample materials may be located in a plurality of process chambers in the device, which is rotated during heating of the sample materials.

Abstract: The present invention is a method for solder joint integrity assessment. The invention comprises collecting data from one or more solder joint strain tests and characterizing the solder joint data integrity using a force-deflection graph. A force-deflection graph characterizes the response force of a solder joint to applied strain as a function of time. One embodiment of the invention uses the slope of the graph to characterize the integrity of the solder joint. Another embodiment uses the area below the graph to characterize the integrity of the solder joint. To generate the force-deflection graph, the invention applies one or more tests to the solder joint. In one embodiment, a shear test is applied to the solder joint. In another embodiment, a cold pull test is applied to the solder joint. In another embodiment, a hot pull test is applied to the solder joint.

Abstract: The invention concerns an improved method of heating or tempering foils and an associated device including an arrangement for measuring the temperature, based on the following features: a separate arrangement is provided for heating the foil edges; the foil edge heating arrangement comprises an infrared radiator device (21) and a hot air heating device (29); and the infrared radiator device (21) and the hot air heating device (29) can be controlled or set at different heating output values.

Abstract: A gas supplied from a gas source is exposed to an atmosphere above a liquid surface in a tank saving the liquid and thereafter is supplied around a wafer in a treatment chamber through a gas supply passage and a supply port. The gas supplied around the wafer uniformly flows from around the wafer toward above the center of the wafer and thereafter is discharged from an exhaust port which is formed at the top of the treatment chamber. Meanwhile, with respect to the wafer, heat treatment is performed by a heating mechanism and a predetermined PEB is carried out. The humidified gas is supplied into the treatment chamber, thereby preventing drying in the treatment chamber. Therefore, water in resist is not taken out, resulting in that a required resist pattern can be formed on the wafer.

Abstract: In a broad aspect, the invention is a conveyorized oven for heating food products comprising: a cavity having two continuous access openings; a convection heating source, the convection heating source including a heating element, a blower, and a plenum in communication with the cavity, the convection heating source providing heated air to the cavity; an upper radiant energy heating source in communication with the cavity, the upper radiant energy heating source including an infrared light source and at least one reflector providing radiant energy to the cavity; a lower radiant energy heating source in communication with the cavity, the lower radiant energy heating source providing radiant energy to the cavity; and a conveyor system for transporting food products through the first continuous access opening, the cavity, and the second continuous access opening at a rate of speed sufficient to allow the food products to be heated.

Abstract: A method for heating LowE glass panels in a tempering furnace (1) provided with rollers. LowE glass panels are carried on a conveyor constituted by rollers (2) into the tempering furnace and then the discussed glass panels are set in an oscillating motion within the tempering furnace for the duration of a heating cycle. This is followed by delivering the discussed glass panels into a tempering station (3). In the tempering furnace, the glass panels are heated by means of top and bottom radiation heating elements (4, 5), as well as by top and bottom convection heating elements (6, 7). In the early stage of a heating cycle the top glass surface is subjected to convection heating more powerful than that applied to the bottom surface and in the final stage of a heating cycle the bottom glass surface is subjected to convection heating more powerful than that applied to the top surface.

Abstract: A compact reflow oven and cleaning apparatus combines in a unitary housing for both the reflow and cleaning function. This results in the saving of valuable floor space in the printed circuit board assembly areas. The unitary housing and control of temperatures in the reflow and cleaning areas facilitate the removal of contaminants before solidification of such contaminants.

Abstract: This specification discloses a heater comprising an electrically conductive substrate, a first electrically insulating layer formed on the electrically conductive substrate, a heat generating resistor formed on the first electrically insulating layer, and a second electrically insulating layer formed on the heat generating resistor, wherein when the glass transition temperature of the first electrically insulating layer is defined as T1 and the glass transition temperature of the heat generating resistor is defined as T2 and the glass transition temperature of the second electrically insulating layer is defined as T3, T1, T2 and T3 have the relation that T1>T3≧T2 or T1>T2≧T3. The specification also discloses an image heating apparatus using such heater.

Abstract: A reflow soldering apparatus uses circulated heated gas to solder electronic components to a printed circuit board while transporting the printed circuit board mounted with electronic components on a conveyor chain. A plurality of gas passages for inflow of heated gas which have openings facing the circuit board, are provided at intervals in the transport direction of the conveyor chain. A first passage is provided for the flow of heated gas into the fan from an opening different from the opening for inflow and formed in the intermediate portion of the gas passage, and a second passage is provided for the flow of heated gas into the fan from openings formed on both ends of the gas passage.

Abstract: A method and implementing system is provided in which a gas, such as oxygen, is injected on to area of a circuit board to which an electronic component is being mounted. The injected gas causes a formation of a coating or surface alloy layer such as tin-oxide, on the solder joint. The coating causes the solder bead or joint to have a higher surface tension and a higher reflow temperature. In an exemplary double-sided double-pass assembly operation, circuit boards pass through a soldering oven on a first pass to attach components to a first side, and then the board is inverted and passed through the oven on a second pass while components are mounted on the opposite side of the board. During the second pass, a gas injection device is aimed at the component-to-board connection points on the inverted side of the board which were soldered on the first pass. The gas is injected at the point in the soldering reflow oven at which the temperature begins to exceed the solder reflow temperature.

Abstract: A reflow soldering furnace in which a printed board and a plurality of electronic parts mounted thereon are subjected to reflow soldering. The furnace comprises a reflow soldering furnace body including a plurality of heating zones defined by furnace walls, a hot-gas applier, and a radiant-heat applier. The hot-gas applier includes a heat source and a fan for blowing a hot gas of a temperature lower than a target temperature for each zone against a printed board. The radiant-heat applier includes a heater for applying radiant heat of a temperature higher than the target temperature to the printed board. The printed board and electronic parts thereon are heated to the target temperature, the melting point of solder, by means of the radiant heat from the heater. Among these electronic parts, small-sized ones with a relatively small heat capacity are restrained from overheating by the low-temperature hot gas from the hot-gas applier.

Abstract: In a conductive board heater using metal as the board, since thermal expansion is large, and expansion and shrinkage are repeated in a heating apparatus, there is a defect that the electrode portion to which a power supply spring contact point on the power supply connecter side is pressurized and contacted is worn and contact inferior occurs and it is easy to break. Furthermore, since the position of the resistor pattern of the heating body varies, excessive heating, insufficient heating, uneven heating at an end portion, or uneven curl unevenness at a paper end is occurred. A heater in an image heating apparatus is provided so as to prevent a contact defect between an electrode and a connecter of image heating apparatus.

Abstract: The invention relates to a method and an apparatus for drying or heat-treating substances or products at a pressure other than atmospheric pressure. The invention relates furthermore to banana chips dried by means of this method and banana powder produced therefrom. For drying or heat-treating, the products to be treated are loaded in transport receptacles which are subsequently charged via charging lock chambers into a treatment chamber and discharged therefrom via discharging lock chambers. For drying or heat treating, at least one microwave source is provided in the treatment chamber. After heat-treating or drying, a resting period may be scheduled. More particularly for this purpose, a vertically-oriented conveying system is provided in the treatment chamber when a longish resting period is involved. The transport receptacle is configured dished and my comprise nets on which the products are applied. The method is employed preferably for drying or heat-treating basic food material, e.g.

Abstract: Circuit chips, such as known good die (KGD) chips, are removed from an assembly including a plurality of circuit chips attached to at least one chip carrier, or substrate. The substrate is held within a top plate with the circuit chips positioned within successive chip cavities within a bottom plate. Each chip cavity includes a load surface separated by a cascade effect pitch with respect to adjacent chip cavities. A cascade effect shear force is sequentially applied to the circuit chips to remove them from the substrate. The chips may be heated to a temperature facilitating shear within a temperature range at which solder connections are solid, and the chips further heated following disassembly to a temperature at which the solder is liquid to facilitate reforming the solder for subsequent attachment of the chip into an electronic device.

Abstract: A conveyor oven has two insulated cabinets, each cabinet having two plenums for conducting heated air toward a printing plate that rests on a conveyor. The two plenums in each cabinet face each other and are substantially identical. Each plenum has a supply and return duct assembly located above the conveyor, and is supplied by a fan and heater arrangement located below and underneath the conveyor. An insulated intermediate chamber is disposed between the exit of the first upstream cabinet and the second, downstream cabinet. With this arrangement, the conveyor carries a printing plate through the first cabinet, where the plate is heated, then through the intermediate insulated chamber, where it is maintained at a heated temperature, and then into the second cabinet where it is again heated. It is then conveyed out of the second cabinet and out of the oven by the conveyor.

Abstract: Embodiments of the present invention can be used in situations in which heat and mass-transfer modified product, such as individual-sized pizzas, are to be prepared in relatively short periods of time, for example in one to five minutes. Through structural design features and air manipulation, embodiments of the invention provide distinct advantages over the prior art, including improving quality control by increasing uniformity of heating across the oven and within each particular product, decreasing required baking time by increasing the effectiveness of impinging air jets through air pulsation and fluctuation, and maintaining uniformity of air flow to contact the baked product substantially perpendicular to its surface. Tubes or pipes possessing impingement nozzles permit the use of compressed air instead of fans. Embodiments of the invention permit more compact oven design, better control of air jet parameters, and quieter oven operation, and other advantages.

Abstract: Circuit chips, such as known good die (KGD) chips, are removed from an assembly including a plurality of circuit chips attached to at least one chip carrier, or substrate. The substrate is held within a top plate with the circuit chips positioned within successive chip cavities within a bottom plate. Each chip cavity includes a load surface separated by a cascade effect pitch with respect to adjacent chip cavities. A cascade effect shear force is sequentially applied to the circuit chips to remove them from the substrate. The chips may be heated to a temperature facilitating shear within a temperature range at which solder connections are solid, and the chips further heated following disassembly to a temperature at which the solder is liquid to facilitate reforming the solder for subsequent attachment of the chip into an electronic device.

Abstract: A toaster for bread-type food products includes a generally upright using defining a toasting cavity having a top mouth for depositing the food products into the cavity and a bottom opening from which toasted food products exit the cavity. A conveyor conveys the food products through the cavity. A toasting heater platen spaced from the conveyor toasts the food products as they are conveyed through the cavity. A flexible chute is disposed at the bottom opening of the cavity and against which the toasted food products are deposited as they exit the cavity. The flexible chute directs the toasted food products away from the opening at an angle to the direction the food products are conveyed through the cavity.

Abstract: A radiant oven for treating a web of material has oven chambers, electric radiant heaters and buffer plates. The material treated in the oven chamber is isolated from the heaters by the buffer plates. The buffer plates also prevent solvent vapors from reaching the heaters. This invention allows the use of nonclassified electric radiant heaters to treat material in a classified oven chamber.

Abstract: An apparatus for rapidly heating a plurality of parts to a desired temperature. The apparatus includes an oven within which is disposed a rotationally supported magazine for holding a plurality of parts to be heated. A plurality of heating elements and an air circulation system for circulating heated air are also disposed within the oven. A controller is operatively coupled to the magazine for controlling rotation of the magazine to enable parts to be loaded into, and unloaded from, the magazine through an input/output station. A user actuatable switch, such as a foot pedal operated switch, is operatively coupled to the controller to allow a user to send control signals to the controller during loading and unloading of parts to control rotation of the magazine such that the parts are presented at the input/output station for removal and/or loading. The air circulation system significantly reduces the time needed to heat the parts to a given temperature, thus reducing the operating cost of the oven.

Abstract: An object of the present invention is to provide a heater for heating an image which is not deformed easily even when a metal substrate is used as well as a manufacturing method of the heater and an image heating apparatus.

Abstract: A furnace for reflowing solder on a wafer having a heating chamber with an entrance, an exit, and top, bottom, side, and end walls formed of sheets of porous insulation. The furnace has a first belt extending from a loading position into and through the heating chamber. The furnace has a second belt coupled to the first belt, the second belt extending through the exit of the heating chamber to an unloading position. The heating chamber also has infrared lamps positioned below the first belt, the infrared lamps heat the first belt, such that the first belt heats the wafer situated on the first belt.

Abstract: A method and an apparatus for preventing particle contamination in a hot plate oven for curing a coating layer on a wafer surface are disclosed.

Abstract: A heating unit includes a pair of heating bodies for heating a band film conveyed along a predetermined film feeding path defined by a film guide. An embossing unit includes a punch and a die for forming a predetermined raised pattern on a heated surface of the band film. A shifting mechanism locates the heating unit and the embossing unit closely by a first distance during a thermal processing of the band film and separates at least one of the heating unit and the band film far away from the other by a second distance larger than the first distance when the thermal processing is interrupted or stopped.

Abstract: The invention relates to a method and an apparatus for drying or heat-treating substances or products at a pressure other than atmospheric pressure. The invention relates furthermore to banana chips dried by means of this method and banana powder produced therefrom. For drying or heat-treating, the products to be treated are loaded in transport receptacles which are subsequently charged via charging lock chambers into a treatment chamber and discharged therefrom via discharging lock chambers. For drying or heat-treating, at least one microwave source is provided in the treatment chamber. Furthermore an infrared heating source may be provided. After heat-treating or drying a resting period may be scheduled. More particularly for this purpose a vertically oriented conveying system is provided in the treatment chamber when a longish resting period is involved. The transport receptacle is configured dished and may comprise nets on which the products are applied.

Abstract: To prevent the temperature from rising locally in a closed space so as to make the temperature in an annealing furnace uniform, an apparatus and method for annealing welded parts includes an annealing furnace 2 which is substantially closed; a doorway 5 through which welded parts 4 are placed into and out of the annealing furnace; a carriage mechanism 6 for carrying welded parts on a predetermined course in the annealing furnace; infrared lamps 9 for heating welded parts carried in the annealing furnace; and a circulating mechanism 12 for circulating hot air in the annealing furnace. Thus, the annealing (distortion-eliminating) efficiency of the welded parts is improved.

Abstract: The invention relates to a process for heat treatment of two-dimensional objects such as semiconductor wafers, for example in the form of silicon wafers, where the objects are arranged on supports and are conveyed through a heating unit, in particular continuously. To achieve a targeted treatment of a two-dimensional object, in particular of a semiconductor component such as a silicon wafer, on one side only, while at the same time achieving a high throughput with incorporation as necessary into a continuous overall manufacturing process, it is proposed that the objects be arranged in full surface contact with the supports, which cover the objects completely or almost completely on their underside and which in turn comprise quartz glass in particular.

Abstract: A furnace for heating articles is provided with a housing containing a heating structure as well as a feed and a discharge between which a track extends for moving the articles through the furnace. The heating structure comprises at least one source which emits radiation having a wavelength located in the range of light radiation, such as an infrared source, and the track for moving the articles comprises a material transparent to light radiation.

Abstract: A method for aligning a boundary condition temperature in a thermal processor utilizes an air temperature measurement. During the thermal process, air temperature measured along an interval series forms an air profile and provides a reference to which the boundary condition temperature may be aligned. A method for aligning a part temperature profile to the processor temperature profile uses the measured air temperature to adjust the part temperature profile, so as to be synchronized with the air temperature profile. These procedures may be used in conjunction with setpoint parameter prediction for attaining a target part temperature response.

Abstract: A silicon wafer is heated from an initial pre-heating temperature (T0) up to a first annealing temperature (T1) by a rapid heating up step using an IR lamp. A first annealing is executed at the first annealing temperature (T1). Successively, while the silicon wafer is maintained at a second annealing temperature (T2) lower than the first annealing temperature (T1), a second annealing step is executed by a resistive heating furnace. A thermal oxidation can be executed as the second annealing step. To do so, an equipment for manufacturing a semiconductor device in the present invention is provided with: a heating device having an IR lamp and a resistive heater; an annealing tube having on a surface thereof a plurality of concave portions in such a way that each bottom approaches a central line; a resistive heater wrapped around this annealing tube; and an IR lamp movably inserted into and pulled out from the concave portion from the external.

Abstract: Food cooking apparatus having a two conveyor belts, one of which is heated by a platen to provide a moving cooking surface. Since both belts are movable, they are operable to grip a bun heel or crown and convey it along a cooking path between the two belts without disfigurement of the bun. Also disclosed is a quick connect/disconnect feature that allows quick removal of one of the assemblies for cleaning, maintenance and/or belt replacement. This feature has a bracket member which when released allows the removable assembly to slidable disengage from the frame of the apparatus. The food cooking apparatus includes an electrical heating platen with a coil wound in a serpentine manner and spatially distributed to produce high temperature cooking in the early stage of cooking and lower temperature cooking in the later stages of cooking.

Abstract: A method for making a furnace for heating a glass sheet by lower electric resistance elements (50) supported by a furnace housing (12) below a roll conveyor (40) and by supplying a gas burner heated hot gas flow from a forced convection heater (56) that provides a dominant mode of external heat for heating the conveyed glass sheet from above. The furnace is manufactured by retrofitting an electric resistance heater type glass sheet furnace that initially has both lower and upper electric resistance elements (50) located below and above the roller conveyor (40). The lower electric resistance elements (50) are maintained while the upper electric resistance elements (50) are replaced with a gas burner forced convection heater (56).

Abstract: A rotating vacuum kiln and method for heat treating solid particulate material under vacuum conditions uses a rotating refractory metal cylindrical vessel with a cool inlet zone, hot intermediate zone, and cool exit zone, with a first series of inner radiation shields provided at the hot intermediate zone adjacent the cool inlet zone and a second series of inner radiation shields provided at the hot intermediate zone adjacent the cool exit zone to protect those two zones from the high temperatures in the hot intermediate zone. Heat for the hot intermediate zone of the cylindrical vessel is provided indirectly by electrical resistance heaters that surround the vessel and outer radiation shields are provided about the heaters to direct heat to the cylindrical vessel.

Abstract: A rotating vacuum kiln and method for heat treating solid particulate material under vacuum conditions uses a rotating refractory metal cylindrical vessel with a cool inlet zone, hot intermediate zone, and cool exit zone, with a first series of inner radiation shields provided at the hot intermediate zone adjacent to the cool inlet zone and a second series of inner radiation shields provided at the hot intermediate zone adjacent the cool exit zone to protect those two zones from the high temperatures in the hot intermediate zone. Heat for the hot intermediate zone of the cylindrical vessel is provided indirectly by electrical resistance heaters that surround the vessel and outer radiation shields are provided about the heaters to direct heat to the cylindrical vessel.

Abstract: A mercury retorting apparatus, a retorting system, and a method for continuous removal of mercury from dry, semi-granular, and sludge materials contaminated with mercury without shutting down the system for removal of accumulated liquid mercury, water, and dust particles. The retorting apparatus comprises a powered screw feed assembly having a feed tube with a closely fitting feed screw therein. The screw feed assembly feeds the material from the lower portion of a hopper configured to contain a quantity thereof into a rotatably powered retorting tube in which a vacuum is drawn. The material forms a seal within the powered screw feed assembly against vacuum loss in the retorting tube during operation thereof. A first rotatable seal between the feed tube and retorting tube prevents vacuum loss therebetween. An elongate electric kiln encloses the mid-portion of the retorting tube.

Abstract: An oven includes a bowl-shaped body having an upper portion pivotally connected with a lid, an electric motor installed on an inner bottom of the bowl-shaped body and having a vertical output axle having upper end formed with a square head, a tray having a central portion formed with a protruded square member which has a square recess at a bottom configured to engage with the square head of the output axle of the electric motor, an annular ring-like member provided with a plurality of rollers and mounted under the tray for facilitating rotation of the tray, a skewer provided with a first gear fixedly mounted at one end thereof, and a second gear freely rotatably mounted at another end thereof, a first groove having a small distance from an inner side of the first gear and sized to engage with the U-shaped slot of the L-shaped lugs, and a second groove having a small distance from an inner side of the second gear and sized to engage with the U-shaped slot of the L-shaped lug, the skewer having a round portion

Abstract: An impingement heat transfer device for transferring heat between a stream of temperature controlled air and a product wherein an air supply duct and an air return duct have a common wall. A tube has one end communicating with the inside of the air supply duct and another end extending through an opening in the air return duct. Air is circulated to reduce pressure in the air return duct and increase pressure in the air supply duct such that a stream of air flows through and out of the tube and spent air is drawn through the opening encircling the tube into the air return duct.

Abstract: A toaster oven has a double wall housing with an air space between the double walls. The inner one of the double walls has a plurality of openings therein arranged above and below heating elements inside the oven. Inside the oven, an air divertor having a pair of spaced parallel walls is positioned adjacent each opening. One of the spaced plates has perforations so that an air stream in the air space between the double walls is driven through the openings, the space between the parallel plates, and out the perforations. A food product is located to receive the air emerging from the perforations. The individual perforations have a funnel shape in order to concentrate the emerging air and better paint the surface of the food product.

Abstract: The instant high efficiency carousel pizza oven is an oven of the open cavity or open input type which permits food access and fluid communication with the atmosphere through a proximal or front opening within the oven housing. The present oven is preferably defined in terms of a method which employs a solid rotating thermal reservoir in the nature of a circular panel capable of storing large amounts of thermal energy per unit of mass. Rotation of the panel assures that hot spots will not develop thereby eliminating scorching of food items cooked thereon. Provided beneath the panel, in thermal communication therewith, and preferably along a radius thereof situated substantially normal to an axis of rotation of the panel, is a flame burner which furnishes greater heat to the panel as a function of increase in distance from the axis to thereby provide cooking of uniform heating to the rotating panel as a function of increase in circumference relative to distance from the axis.

Abstract: Device for heating a blown film web, inflated into a blown film bubble between a pair of forward draw rolls and a pair of take off rolls, comprises a frame mounted, driven pair of forward draw rolls and an opposite, stationarily mounted, driven pair of take off rolls for the blown film web hauled off the inflated bubble. Furthermore, there are collapsing mechanisms and mechanisms for inflating and heating the blown film web. To feed the correct amount of heat to the inflated web independently of its diameter, the heating devices comprise heating elements, which are arranged concentricly around the axis of the inflated blown film web and which can be moved toward and away from the blown film web by means of regulating drives in the radial direction.

Abstract: A removable rack for supporting a reflector in an oven having a light source where the reflector focuses light emitted from the light source in a predetermined manner. The preferred removable rack is arranged and configured to support a mirror array therein where the entire rack can be removably fixed to the interior of the oven in which it will be used. The rack is preferably arranged and configured to releasably engage the mirror array therein. A method for replacing a reflector disposed in the internal portion of an oven having a light source comprising the steps of providing a removable support rack for releasably supporting the reflector removably fixed to an interior portion of an oven. A reflector can be replaced by removing a member, fixing the removable support rack to the interior portion of the oven and removing the removable support rack from the interior of the oven.

Abstract: Food cooking apparatus having a two conveyor belts, one of which is heated by a platen to provide a moving cooking surface. Since both belts are movable, they are operable to grip a bun heel or crown and convey it along a cooking path between the two belts without disfigurement of the bun. Also disclosed is a quick connect/disconnect feature that allows quick removal of one of the assemblies for cleaning, maintenance and/or belt replacement. This feature has a bracket member which when released allows the removable assembly to slidable disengage from the frame of the apparatus. The food cooking apparatus includes an electrical heating platen with a coil wound in a serpentine manner and spatially distributed to produce high temperature cooking in the early stage of cooking and lower temperature cooking in the later stages of cooking.

Abstract: A hot shelf tower dryer includes a casing having substantially parallel shelves which alternately extend from opposite ends of the tower casing to form a repetitively convoluted passage. At least one of the shelves has a hollow interior or chamber. Disposed in the chamber is at least one electrical heating element, where the power supplied to the heating element is regulated by a control system. As controlled, the electrical heating elements provide sufficient output to the tower casing which result in a substantially constant temperature throughout the passage. With the heating elements, the hot shelf tower dryer does not require the burning of natural gas or some other fossil fuel to heat the tower dryer unless such heating is desired to heat the forced air that conveys the cotton through dryer. As a result, in comparison with hot shelf tower dryer's that use fossil fuels as a heating source, pollutant emissions, such as nitrous oxide (NOx) emissions, are eliminated or at least significantly reduced.

Abstract: A rapid thermal processing system for large area substrates, such as glass panels for flat panel displays, includes a processing chamber having a loading/unloading zone and a processing zone, a heating assembly for heating a substrate in the processing zone, and a transport assembly for transporting the substrate through the processing chamber. The transport assembly includes a feed conveyor for transporting the substrate from the loading/unloading zone through the processing zone and a substrate return assembly for transporting the substrate from the feed conveyor to the loading/unloading zone after the substrate is transported through the processing zone. The substrate return assembly may include a return conveyor for transporting the substrate to the loading/unloading zone and a substrate reverser for transferring the substrate from the feed conveyor to the return conveyor.

Abstract: A conveyor support for integrated circuits in an on-line oven, including a mechanism for driving and guiding the elements to be soldered while maintaining a lower surface of one of said elements in direct contact with a wall of the oven.

Abstract: Circuit chips, such as known good die (KGD) chips, are removed from an assembly including a plurality of circuit chips attached to at least one chip carrier, or substrate. The substrate is held within a top plate with the circuit chips positioned within successive chip cavities within a bottom plate. Each chip cavity includes a load surface separated by a cascade effect pitch with respect to adjacent chip cavities. A cascade effect shear force is sequentially applied to the circuit chips to remove them from the substrate. The chips may be heated to a temperature facilitating shear within a temperature range at which solder connections are solid, and the chips further heated following disassembly to a temperature at which the solder is liquid to facilitate reforming the solder for subsequent attachment of the chip into an electronic device.

Abstract: In a heat developing section, heater boxes heated by sheet-like heaters are disposed vertically in pairs between an insertion roller pair and a discharging roller pair. When a heat developing photosensitive material is fed between the heater boxes by the insertion roller pair with a photosensitive layer of the heat developing photosensitive layer facing upward, it is guided by a guide plate of a lower heater box and is conveyed with an air layer being constantly formed between an upper heater box and the heat developing photosensitive material. As a result, the heat developing photosensitive material is heated without the photosensitive layer thereof being pressed. Accordingly, the heat developing photosensitive material is uniformly heated with no wrinkles generated therein, and an image of high finished quality is formed.

Abstract: A device for separating a meltable wide strip (10) using fusion cutters (21) which cut the strips (10′) during longitudinal movement of said wide strip by melting the strip material. In order to smooth rough melted edges of strips (10′) a finishing device is used. A conveyor device is used to transport the wide strip and keeps at least the section (40) to be processed of the strip (10′) which is located in the finishing zone, under longitudinal stress. To simplify the design of the device, the finishing device is provided with deviation points (71, 70, 72) in the section (40) to be processed. The deviation points are fixed and include an open slit (25) through which the section (40) to be processed passes. The expansion of the processing section (40) is twisted by virtue of the deviating members (23, 33). The longitudinal stress is therefore exerted in such a way that the upper and lower side of the strips (10′) are automatically pressed against the deviating members (23, 33).

Abstract: An apparatus for the heat treatment of workpieces comprising comprising a plurality of evacuable chambers connected through airlocks, a conveyor, preferably a circular chain conveyor for the transport of the workpieces along a path through the chambers, an electric resistance heating device, a cooling blower, and a heat exchanger, a plurality of workpieces of equal size and configuration, in particular backsaw blades, are placed tightly one on top of another and form a stack which is placed into a frame made of profile cuts, whereby the frame is capable of being coupled to a conveyor by means of suspension elements.

Abstract: A rapid thermal processing system for large area substrates, such as glass panels for flat panel displays, includes a processing chamber, a transport assembly for transporting a substrate through the processing chamber, and a heating assembly for heating the substrate. The heating assembly includes a bank of elongated heating elements disposed in the processing chamber. The heating elements have longitudinal axes aligned with the substrate transport direction. In one embodiment, heating elements on one side of the substrate have longitudinal axes aligned perpendicular to the substrate transport direction and heating elements on the opposite side of the substrate have longitudinal axes aligned parallel to the substrate transport direction.