Abstract: An apparatus is disclosed. The apparatus includes a heater comprising a heating element having a region that does not contain a surface heating portion. The apparatus further includes a thermostat positioned in the region. The thermostat includes a contact surface disposed to make contact with an object placed on the surface heating portion. The thermostat includes a switch configured to prevent a current from conducting through the heating element when the contact surface experiences a temperature equal to or greater than a temperature limit. The apparatus further includes a medallion coupled to the thermostat and positioned below a top surface of the heating element, the medallion comprising an aperture shaped to allow the contact surface to extend through the aperture to make contact with the object. The apparatus includes an urging element configured to provide vertical movement of the medallion in response to a downward force applied from the object.

Abstract: As part of a system for processing a workpiece by applying a controlled heat to the workpiece, a heating arrangement includes an array of spaced apart heating elements for use in a confronting relationship with the workpiece to subject the workpiece to a direct radiation that is produced. A radiation shield includes a plurality of members supported for movement between (i) retracted positions, which allow the direct radiation to reach the workpiece, and (ii) extended positions, in which the plurality of members cooperate in way which serves to at least partially block the direct radiation from reaching the workpiece and to absorb radiation emitted and reflected by the workpiece and thereby achieve greater control of the time-temperature profile than previously obtainable. At least certain ones of the members move between adjacent ones of the heating elements in moving those certain members between the retracted and extended positions. Tubular, curved and plate-like member configurations can be used.

Abstract: This invention is a thermal management method for efficient, rapid, controllable and uniform thermal management over a wide temperature range. The method integrates a thermal source, thermal sink and a thermal diffuser. According to the invention, a thermal diffuser is positioned stationary relative to the wafer surface and coupled to a thermal source and a thermal sink, which are also stationary relative to the wafer surface. The thermal sink comprises a heat-carrying media with a controllable temperature. The wafer is heated from a first processing temperature to a second processing temperature during a heating time interval and then cooled to the first processing temperature from the second processing temperature during a cooling time interval. During heating and cooling, the wafer is constantly held in a fixed position. Zonal control of the thermal source and non-uniform flow of the thermal sink enable sensitive mitigation of thermal non-uniformity on a heating surface.

Abstract: A device of this invention has a hollow heat roller (1), the surface of which has a coat of a metal layer, an excitation coil which is arranged in the heat roller (1) and generates a magnetic flux in the heat roller (1) to heat it by induction, and a press roller (2) which is in contact with the heat roller (1) under a predetermined pressure. The excitation coil has at least two maximal heating portions (42, 43) in the circumferential direction of the heat roller (1). The excitation coil is located to form one maximal heating portion (42) within the range of ±30° along the circumferential direction from the position of a nip (41) where the heat roller (1) contacts the press roller (2). With this structure, since heat accumulates in the heat roller (1) to keep it warm, the warm-up time can be shortened.