Abstract: A bonding method of package components and a bonding apparatus are provided. The method includes: providing at least one first package component and a second package component, wherein the at least one first package component has first electrical connectors and a first dielectric layer at a bonding surface of the at least one first package component, and the second package component has second electrical connectors and a second dielectric layer at a bonding surface of the second package component; bringing the at least one first package component and the second package component in contact, such that the first electrical connectors approximate or contact the second electrical connectors; and selectively heating the first electrical connectors and the second electrical connectors by electromagnetic induction, in order to bond the first electrical connectors with the second electrical connectors.

Abstract: Embodiments of the present invention provides an approach for repairing defects in a structure, located in difficult to reach area, by using a self-guiding and self-melting robotic thread. The approach can use an external guidance system to find the target location of the structure and deploy a robotic thread to the defective area. Portion of the robotic thread contains a filler material can have similar materials to the structure. After the system has determined the size, length and volume of the repair, the system calculates the required length of the robotic thread and guides the thread to the defective area. Once the robotic thread is in place, the filler material begins to melt via heat. The filler material, in a melted and pliable state, can flow into the defect area. Once cooled, the filler material can now support the structure.

Abstract: To provide a solid phase welding method and a solid phase welding apparatus which are possible to accurately control the welding temperature, to lower the welding temperature and to achieve a solid phase welding of the metallic materials. The present invention provides a solid phase welding method for metallic materials comprising, a first step of forming an interface to be welded by abutting end portions of one material to be welded and the other material to be welded and applying a pressure in a direction substantially perpendicular to the interface to be welded, a second step of raising a temperature of the vicinity of the interface to be welded to a welding temperature by an external heating means, wherein the pressure is set to equal to or more than the yield strength of the one material to be welded and/or the other material to be welded at the welding temperature.

Abstract: An end cap for use with a stator assembly is provided. The end cap includes a tooth portion, a yoke portion, and a lip. The tooth portion includes a first end and an opposite second end and the yoke portion is formed at the first end of the tooth portion. The yoke portion includes at least one arm that extends from the tooth portion. The lip is defined along at least one of the tooth portion and the at least one arm portion.

Abstract: A method of forming a solder joint between a coaxial cable and a coaxial connector includes the steps of: positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the solder element is positioned within a vacuum chamber; melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with a mounting structure; and applying suction to the melting solder element to reduce the formation of bubbles within the solder joint.

Abstract: Apparatus and methods for magnetically enhanced electrical signal conduction are disclosed. An embodiment electrical connector comprises a connector body, a first active signal contact mechanically attached to and at least partially disposed within the connector body, a ground contact mechanically attached to the connector body, an insulator mechanically separating and electrically isolating the first active signal contact and the ground contact, and a first permanent magnet electrically connected to the first active signal contact. An embodiment electrical cable comprises an elongated insulating sheath, a first active signal electrical conductor disposed within the sheath, a first connector body mechanically attached to a first end of the sheath, a first active signal contact mechanically attached to the first connector body, and electrically connected to the first active signal electrical conductor, and a first permanent magnet electrically connected to the first active signal electrical conductor.

Abstract: A method (e.g., for creating a printing plate assembly of an ink jet print head assembly) includes coating one or more sides of plural planar subsection plates with a bonding material. The subsection plates include printing holes through which a fluid is to be ejected from the ink jet print head assembly. The method also includes placing the subsection plates of the printing plate assembly against each other with the printing holes axially aligned with each other and heating the bonding material between the subsection plates such that the subsection plates are affixed to each other. The subsection plates are coupled with each other to form a chamber printing assembly that is coupled to the ink jet print head assembly that prints fluid onto one or more objects by ejecting the fluid out of the printing holes of the subsection plates. The subsection plates may be hermetically bonded to each other by inductively heating the assembly.

Abstract: Soldering equipment for connecting solar cells includes an inductor loop for generating a high-frequently magnetic field for soldering conductors to the solar cells and holding-down devices, which devices penetrate the inductor loop, for pressing the conductor onto the conductor tracks of the solar cells. A field-concentrator element of a ferrite material is arranged in each holding-down pin of the holding-down device, whereby the magnetic field can be locally amplified and concentrated.

Abstract: The invention relates to a method for processing a modular hybrid component having a first part made of a first material and a second part made of a second material, which is different from the first material with regard to its electromagnetic and/or thermal properties. The method including exposing the modular hybrid component to an alternating electromagnetic field, whereby both parts are heated up differently, and that a brazing or soldering joint or field sensitive mineral cement between the first part and the second part is affected by the heating action.

Abstract: A soldering method is provided. According to the method at least two sets of components are heated and soldered by heating. Each set includes a first soldering partner, a second soldering partner, and a solder. During the soldering process, the individual temperatures of each one of the sets are transmitted by a radio frequency transmitter to a receiving and control unit. The control unit controls the heating of the sets depending on the transmitted individual temperatures.

Abstract: An electrical connector (10) is particularly suitable for bonding to a vehicle window (12), wherein the vehicle window (12) and the electrical connector (10) are disposed on/in an assembly fixture and are brought into bonding contact with one another to form a vehicle window assembly (14).

Abstract: The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.

Abstract: A robotic processing system includes a microprocessor-controlled workpiece processor having a mobile processing element to be positioned independently in three orthogonal dimensions with respect to each of a plurality of target locations on a workpiece, with each particular target location of the plurality of target locations including an element to be processed, the mobile processing element processing the element at each particular target location by first moving to an initial location that is offset from the particular target location in a single dimension and then second moving along the single dimension towards the element at the particular target location until a contact signal is detected; and a control, coupled to the workpiece and to the mobile processing element, communicating the contact signal to the workpiece processor when the processing element makes physical contact with the element at the particular target location.

Abstract: A method for manufacturing an optical module 1 includes: a cladding 12 of one end of the optical fiber is exposed; an arrangement process of arranging the optical fiber 10 such that at least a leading end of a portion on which the cladding 12 is exposed is positioned in a box portion through a pipe portion 35 in which one end is connected to the box portion 31 configured to accommodate an optical element and which extends to an outside of the box portion 31; and a soldering process of soldering an inner wall of the pipe portion 35 and the optical fiber 10 by heating at least a part of a lower region BAR interposed between a heat dissipation portion and the pipe portion 35 in a state where a part of a wall of the box portion 31, in which the optical element is accommodated, is heat-dissipated.

Abstract: High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.

Abstract: An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.

Abstract: Induction soldering via an assembly fixture is utilized to bond one or more items of hardware to a vehicle window to form a vehicle window assembly. A method of operating the assembly fixture to bond the one or more items of hardware to a vehicle window by induction soldering is also an aspect of the invention.

Abstract: A system for forming a brazed joint between a tie wire and a workpiece, and methods therefor are presented. The system includes: a braze chamber including an induction heating coil, the induction heating coil having magnetic flux concentrators thereon; and a controller receiving a temperature feedback signal from a temperature sensor on a tie wire and controlling a temperature of a section of the tie wire to be brazed by controlling an electrical current applied to the induction heating coil.

Abstract: A temperature sensor assembly is provided. The temperature sensor includes an aluminum capillary soldered to an actuation unit. The actuation unit operably fluidly couples to the capillary to define an internal cavity storing a working fluid. The working fluid configured to manipulate the actuation unit when the working fluid changes temperature. Solder sealingly couples the capillary to the actuation unit.

Abstract: A soldering apparatus for connecting solar cells includes an induction heat source to connect cell conducting tracks, provided with soldering medium, with electric conductors. The heat source has a high-frequency generator and an inductor loop in which the flow of a high-frequency current causes a high-frequency magnetic field to induce in the conducting track and in the electric conductor arranged along the conducting track eddy currents that generate the heat that is necessary for the soldering operation. The U-shaped inductor loop has narrowings and widenings that serve to optimize the heat development in the soldering zone and thus also save energy. Each widening affords access to the soldering point for a magnetic-field-neutral pressure foot that presses the conductor onto the conducting track. The inductor loop extends the entire length of the conducting track of the cell upper and lower sides to solder to the conductor in one soldering operation.

Abstract: Disclosed is an apparatus for electrically interconnecting a plurality of solar cells. The apparatus comprises: i) a roller operative to roll along a solar cell to press an electrical conductor against an electrical contact of the solar cell, the electrical conductor being for electrically interconnecting the solar cell with one or more other solar cells; and ii) a heat-generating device arranged and configured to provide heat for soldering the electrical conductor to the electrical contact of the solar cell while the roller is pressing the electrical conductor against the electrical contact of the solar cell. A method of electrically interconnecting a plurality of solar cells, and a mechanism for laying and soldering an electrical conductor onto a solar cell, are also disclosed.

Abstract: Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.

Abstract: A soldering method is provided. According to the method at least two sets of components are heated and soldered by heating. Each set includes a first soldering partner, a second soldering partner, and a solder. During the soldering process, the individual temperatures of each one of the sets are transmitted by a radio frequency transmitter to a receiving and control unit. The control unit controls the heating of the sets depending on the transmitted individual temperatures.

Abstract: A mounting substrate includes a substrate, a bonding pad and an induction heating pad. The bonding pad is formed on the substrate, and adhered to a solder ball to mount a semiconductor chip on the substrate. The induction heating pad is disposed adjacent to the bonding pad, the induction heating pad being induction heated by an applied alternating magnetic field to reflow the solder ball. The induction heating pad having a diameter greater than a skin depth in response to the frequency of the applied alternating magnetic field is selectively induction heated in response to a low frequency band of the alternating magnetic field. Accordingly, during a reflow process for a solder ball, the semiconductor chip may be mounted on the mounting substrate to complete a semiconductor package without damaging the mounting substrate, to thereby improve the reliability of the completed semiconductor package.

Abstract: A method for soldering electronic components to a circuit board by: applying a solder paste to solder contacts of a circuit board and then arranging electronic components on the circuit board to keep the pins of the electronic components in contact with the solder contacts and then a high frequency to melt the solder paste and to let the pins of the electronic components be electrically connected to the solder contacts of the circuit board electrically by the solder paste.

Abstract: A kind of temperature controlling device of heating element and method thereof detect the actual temperature of heating body of the heating element, and calculate the descending gradient and frequency of temperature based on the detected actual temperature. The norm signal is formed based on the actual temperature, descending gradient and frequency of the temperature to control the switch power as to achieve the split second control for the electric power of the heating element.

Abstract: A soldering head for an induction-soldering apparatus for soldering a contact strip onto a solar cell and a soldering process using the soldering head are provided. The soldering head has a soldering side, with which the soldering head is placed onto the site to be soldered during the soldering process, an inductor loop with a feed region and a coupling-out region arranged on the soldering side, a main body made of an electrically non-conductive material, and a fastener, with which the main body is fixed to the inductor loop, wherein the coupling-out region of the inductor loop is exposed on the soldering side, and the main body has one or more spacer elements, on the soldering side, which are arranged outside the coupling-out region and protrude beyond the coupling-out region of the inductor loop.

Abstract: In a method for soldering contact wires to a side of a solar cell for producing the electrical contact-making, the solar cells have at least one metallic strip-shaped region. A contact wire is soldered onto the latter for the electrical connection of the solar cell, wherein the soldering duration or the duration of the energy input externally onto the soldering region is very short and is less than 800 ms.

Abstract: An exhaust gas system includes a first exhaust component and a second exhaust component that are spaced apart from each other by a solder gap that can be has great as 1.20 mm. A high temperature solder material is provided near the solder gap and is heated by an inductor to form an induction solder joint between the first and second exhaust components.

Abstract: A method comprises positioning a pair of photovoltaic wafers in a side-by-side arrangement. An interconnect is placed on the pair of wafers such that the interconnect overlaps both wafers of the pair, solder material being provided between the interconnect and the respective wafers. A solder head is then located adjacent the interconnect, and the coil is energized to effect inductive heating of the solder material. The solder head comprises an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil. The magnetic field concentrator defines a passage extending axially through the eye of the coil, and may be of a material with a high magnetic permeability.

Abstract: A method of manufacturing a magnet system (101, 201) for an electro-acoustic transducer (100, 200) comprising a magnet element (105, 205) and at least one pole plate (106, 107, 206, 207), is described, wherein the method comprises providing the magnet element (105, 205) having a first coating layer comprising a first corrosion resistant material, providing the at least one pole plate (106, 107, 206, 207) having a second coating layer comprising a second corrosion resistant material, and connecting said magnet element (105, 205) and said at least one pole plate (106, 107, 206, 207) by fusing the first coating layer and the second coating layer.

Abstract: The invention discloses the internal structures and processes to synthesize the structure of self-healing materials, specially metallic materials, metal matrix micro and nanocomposites. Self healing is imparted by incorporation of macro, micro or nanosize hollow reinforcements including nanotubes, filled with low melting healing material or incorporation of healing material in pockets within the metallic matrix; the healing material melts and fills the crack. In another concept, macro, micro and nanosize solid reinforcements including ceramic and metallic particles, and shape memory alloys are incorporated into alloy matrices, specially nanostructured alloy matrices, to impart self healing by applying compressive stresses on the crack or diffusing material into voids to fill them.

Abstract: A soldering iron system includes a power assembly that provides power to an induction heater at a variable voltage and a variable frequency. A control assembly adjusts the temperature of the heater in accordance with signals from a current detector coupled to the induction heater and a selection made by the user on an operating level selector.

Abstract: For fastening the contact strip (8) to the back electrode layer (4) of a photovoltaic module, the back electrode layer (4) is provided on its outer side with a tin-, copper- and/or silver-containing contact layer (12). Subsequently the contact strip (8) provided with solder (17) on the joining surface is connected to the back electrode layer (4) by soldering. The contact layer (12) causes good adhesion of the back surface encapsulation material (13) to be obtained. A barrier layer (11) prevents alloying of the tin-solder with the layers (9, 10) of the back electrode layer (4).

Abstract: In a method for manufacturing a cylindrical high-frequency shield of a cylindrical gradient coil for a magnetic resonance system, a number of planar shield elements are placed adjacent to one another on a cylindrical support, together with a solder band or solder strip on the support. The segments or elements are inductively soldered together by an inductive soldering device that moves along a longitudinal axis of the cylindrical support.

Abstract: A soldering apparatus for connecting solar cells includes an induction heat source to connect cell conducting tracks, provided with soldering medium, with electric conductors. The heat source has a high-frequency generator and an inductor loop in which the flow of a high-frequency current causes a high-frequency magnetic field to induce in the conducting track and in the electric conductor arranged along the conducting track eddy currents that generate the heat that is necessary for the soldering operation. The inductor loop includes a U-shaped loop element that has narrowings and widening in one arm that is positioned closer to the conductor. Ferrite beads and ferrite tubes at the widening concentrate the magnetic field to optimize the heat development in the soldering zone and thus also save energy.

Abstract: The present invention provides technology that uniformly heats and melts a plurality of solder material arranged in a plurality of locations on a board, and uniformly solders a plurality of parts to the board that are arranged in a plurality of locations on the board. A soldering apparatus includes an induction coil having a length in the longitudinal direction that is longer than the length of the board. An inner space having a size sufficient to arrange the board therein is maintained inside the induction coil. The board supporting the parts and the solder material will be positioned in the approximate center of the inner space of the induction coil. An alternating current will flow through the induction coil in this state. An alternating magnetic field will be generated in the inner space of the induction coil. Magnetic fluxes will substantially uniformly pass through the inner space of the induction coil along the longitudinal direction of the induction coil.

Abstract: Composite conductor comprising a metallic conductor and a ceramic conductor or non-conductor, at least one of them being elongate, the two being connected with each other in an electrically conductive manner. The ceramic conductor or non-conductor and the metallic conductor are hard-soldered to each other by a contact surface extending obliquely to the longitudinal direction of the at least one elongate conductor, and has one of the conductors tapers at its end and the other conductor has a matching tapering recess. The tapering end of the conductor is fitted into the tapering recess.

Abstract: A soldering apparatus has a sealable container which accommodates a circuit board therein, weights disposed immediately upon semiconductor devices to press the semiconductor devices toward the circuit board, and high-frequency heating coils causing the weight to generate heat due to electromagnetic induction. The high-frequency heating coils are disposed away from the weights. The heat generated in each weight is applied to a plurality of joint sites of the circuit board, thereby soldering the semiconductor devices to the joint sites. As a result, efficient heating is realized while simplifying the configuration of the apparatus.

Abstract: An exhaust gas system with a first component and a second component is characterized in that an induction solder joint is present between the two components (10, 12). In a method of connecting a first component of a vehicular exhaust gas system with a second component provision is made that two components, which are put together and provided with a high temperature solder material (20), are heated up in the region of the solder material by means of an inductor (28) to a temperature which lies above the melting temperature of the solder material (20).

Abstract: A soldering apparatus for connecting solar cells includes an induction heat source to connect cell conducting tracks, provided with soldering medium, with electric conductors. The heat source has a high-frequency generator and an inductor loop in which the flow of a high-frequency current causes a high-frequency magnetic field to induce in the conducting track and in the electric conductor arranged along the conducting track eddy currents that generate the heat that is necessary for the soldering operation. The U-shaped inductor loop has narrowings and widenings that serve to optimize the heat development in the soldering zone and thus also save energy. Each widening affords access to the soldering point for a magnetic-field-neutral pressure foot that presses the conductor onto the conducting track. The inductor loop extends the entire length of the conducting track of the cell upper and lower sides to solder to the conductor in one soldering operation.

Abstract: A fuel injector for fuel-injection systems of internal combustion engines includes a valve-closure element cooperating with a valve seat, and a restoring spring which is situated in a spring pocket opening and acts upon the valve-closure element by a restoring force in the direction of the valve seat. The restoring spring has at least one holding coil in a region of the inflow side, whose area of cross section is positioned perpendicular to an area of cross section of the restoring spring.

Abstract: A portable induction tool is provided for soldering or brazing sections of metal pipe together. A work coil head (with induction coil) is U-shaped, allowing placement of the head around lengths of pipe, heating a susceptor (e.g., the pipe) to form a joint, and then to be withdrawn after the pipe joint is made. In one form, the tool uses heat pipes to remove thermal energy from the head, and also a heat exchanger for higher-powered units. Power capacitors are generally included with the induction (work) coil to create a tank circuit of a resonant frequency. The induction coil uses Litz wire, copper tubing, or heat pipes with a conductive outer skin to carry the high-current being delivered to the induction coil. The induction coil has a general racetrack configuration, which is typically wound in a U-shape (or as a semicircle) as a single winding, with multiple turns.

Abstract: To hard-solder parts to be joined along a common joint, the parts are heated by a heat source e.g. a laser beam (3). Melted solder (7) that is stored in a container (6) is then introduced into the joint. Joints can be filled with solder in this manner at higher speed and the solidified solder surface is practically devoid of pores, thus permitting the priming or painting of said parts without the need for subsequent treatment.

Abstract: A soldering iron with a removable tip, including: a soldering iron, including: a shaft; a ferrite bobbin disposed on the shaft; a magnetic coil wrapped around the ferrite bobbin; and a removable tip with a heater element disposed thereon, wherein the heater element is dimensioned to be received around the magnetic coil when the removable tip is placed onto the soldering iron.

Abstract: A portable induction tool is provided for soldering or brazing sections of metal pipe together. A work coil head (with induction coil) is U-shaped, allowing placement of the head around lengths of pipe, heating a susceptor (e.g., the pipe) to form a joint, and then to be withdrawn after the pipe joint is made. In one form, the tool uses heat pipes to remove thermal energy from the head, and also a heat exchanger for higher-powered units. Power capacitors are generally included with the induction (work) coil to create a tank circuit of a resonant frequency. The induction coil uses Litz wire, copper tubing, or heat pipes with a conductive outer skin to carry the high-current being delivered to the induction coil. The induction coil has a general racetrack configuration, which is typically wound in a U-shape (or as a semicircle) as a single winding, with multiple turns.

Abstract: Procedure for soldering the constituent layers of a multilayer printed circuit and machine for performing it. The procedure is applicable to circuits made up of layers containing the circuit image (2, 3, 4, 5,) that have perimetral strips (9) including reserve areas (11), superimposed and separated from each other by isolating layers (6, 7 and 8). The procedure includes the following steps: i) place a heater circuit (13) composed of a flat winding with at least one turn in short-circuit (14) in each reserve area (11); ii) superimpose the layers that contain the circuit image (2, 3, 4, 5,) and the isolating layers (6, 7 and 8) in alternating order; iii) secure the position of the layers relative to the others, thereby creating groups (12) of reserve areas (11); iv) place induction electrodes (18) over the groups (12) of reserve areas; v) soldering each one of the groups (12) by application of a magnetic field of variable induction.

Abstract: A portable induction tool is provided for soldering or brazing sections of metal pipe together. A work coil head (with induction coil) is U-shaped, allowing placement of the head around lengths of pipe, heating a susceptor (e.g., the pipe) to form a joint, and then to be withdrawn after the pipe joint is made. In one form, the tool uses heat pipes to remove thermal energy from the head, and also a heat exchanger for higher-powered units. Power capacitors are generally included with the induction (work) coil to create a tank circuit of a resonant frequency. The induction coil uses Litz wire, copper tubing, or heat pipes with a conductive outer skin to carry the high-current being delivered to the induction coil. The induction coil has a general racetrack configuration, which is typically wound in a U-shape (or as a semicircle) as a single winding, with multiple turns.

Abstract: A system is disclosed for determining optimal process settings for a conveyor oven, such as a reflow oven used to reflow solder paste on a PCB assembly. According to a disclosed embodiment, an ideal temperature profile is obtained from the solder paste specifications of the solder paste to be reflowed in the oven. The ideal temperature profile of the paste includes a preheat phase, a soak phase, a reflow phase and a cooling phase. One or more profiles that fit the oven are obtained by aligning the beginning of each phase of the ideal profile with a forward end of an oven zone. The profile that best fits the oven is selected as a target profile for the reflow soldering process. The set points of the oven zones for effecting the target profile when the solder paste is conveyed through the oven are determined.

Abstract: A novel apparatus for manufacturing Solid-Solder-Deposit Printed Circuit Boards (SSD-PCBs) by melting solder powder via induction heating consequently forming relatively thick layers of solid solder over the soldering pads of a bare-PCB 230. Solid Solder Deposit (SSD) refers to a relatively thick layer of solid solder metallurgically bonded over the soldering pads of a bare-PCB 230 such as that said SSD-PCB by itself is the source for solder alloy during a subsequent soldering operation. The manufacture of SSD-PCBs provides the electronic assembly industry with ready-to-solder PCBs consequently eliminates the need to use solder paste at the assembly floor. This invention, unlike the prior art for producing SSD-PCBs, utilizes a solder powder pile 232 that is melted by localized electromagnetic induction heating.