Scoop Type Patents (Class 222/393)
  • Patent number: 7306442
    Abstract: There is a pneumatic mud stamp including an applicator, a tube-like member, a stopper, a retraction mechanism, ad a pneumatic control. The applicator is configured to apply mud in a pattern and includes a boot and a faceplate with a slot. The tube-like member is coupled to the applicator and includes a first chamber configured to hold mud, a second chamber configured to hold pressurized air, and a decoupling mechanism configured to open the tube-like member for insertion of mud therein. The stopper is slidably disposed within the tube-like member between the first and second chambers. The stopper provides a fluid tight seal therebetween. The retraction mechanism is configured to facilitate moving the stopper away from the applicator. The pneumatic control is configured to selectably dispose pressurized air into the second chamber.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: December 11, 2007
    Inventor: Shirl G. Fox
  • Patent number: 5158214
    Abstract: A solder paste applicator for dispensing a tin/lead solder in a uniform, homogeneous fashion. The solder paste applicator comprises both a mixing assembly and a plunger assembly. The mixing assembly mixes the solder until it is homogeneous and the plunger assembly is used to dispense the solder. The solder paste applicator has a tubular section, a trough section terminating in a scoop, and a collar received at the intersection of the tubular section and the trough section. The mixing assembly is received in the tubular section and is reciprocated to mix the solder.
    Type: Grant
    Filed: March 11, 1991
    Date of Patent: October 27, 1992
    Assignee: JNJ Industries Inc.
    Inventors: John Volpe, Ira G. Elias