Abstract: Apparatuses and methods for heating moving continuous glass ribbons at desired lines of separation and/or for separating glass sheets from continuous glass ribbons are disclosed. An apparatus includes a translatable support portion and a heating apparatus coupled to the support portion. The heating apparatus is configured to contact the continuous glass ribbon across at least a portion of a width of the continuous glass ribbon at the desired line of separation as the support portion moves in a draw direction, thereby preferentially applying heat to a first side of the continuous glass ribbon at the desired line of separation as the continuous glass ribbon moves in the draw direction.

Abstract: The present application discloses a cutting method and a cutting machine table for cutting a substrate, where the cutting method includes following steps: cutting a large substrate to be cut to obtain a finished substrate falling on a second cutting machine table; after the cutting, driving the second cutting machine table according to a preset parameter to enable a driving-away height difference to be formed between the second cutting machine table and the first cutting machine table; driving the second cutting machine table away from the first cutting machine table; and resetting the second cutting machine table to an initial state.

Abstract: A laminated member as a laminate of a plurality of alloy ribbons is used. The laminated member has a side surface with a fracture surface. A laminated body as a laminate of the laminated member is used. A motor that includes a core using the laminated body is used. A method for manufacturing a laminated member is used that includes: fixing a plurality of amorphous ribbons to one another in a part of layers of the amorphous ribbons after laminating the amorphous ribbons; and punching a laminated member by cutting the laminate of the amorphous ribbons at a location that excludes the portion fixing the amorphous ribbons in the laminate.

Abstract: Methods of separating a glass web that is moving at a glass web velocity. The method includes exposing a separation path on the glass web to at least one laser beam spot that moves with a laser beam spot velocity vector that is equal to a glass web velocity vector in a conveyance direction. The method also includes creating a defect on the separation path while the separation path is under thermal stress from the laser beam spot, whereupon the glass web spontaneously separates along the separation path in response to the defect. In further examples, a glass web separation apparatus includes a first reflector that rotates such that a laser beam spot repeatedly passes along a separation path and a second reflector that rotates such that the laser beam spot moves in a conveyance direction of the glass web.

Abstract: A scribing apparatus includes a horizontal table on which a glass plate is placed and fixed under vacuum suction; a feed screw and a Y-axis control motor 6 for moving the table along a pair of guide rails under scribe numerical control; a guide rail device body installed above the table along an X-axis direction; a carriage mounted on the guide rail device body so as to move in the X-axis direction while being guided; a feed screw and an X-axis control motor for moving the carriage in the X-axis direction under numerical control; and a scribe head installed on the carriage.

Abstract: A cut-out glass plate positioning apparatus includes: a cut line forming device 4 provided in a cut line forming position 4a; a bend-breaking and separating device 6 for cutting out unworked plate glasses 5 from an unworked plate glass 2 along the cut lines 3; a pair of position and angle correcting devices 8 for effecting correction of the position and angle with respect to the unworked plate glass 5; a pair of sucking and transporting devices 9 for suckingly lifting and transporting the unworked plate glass 5 to each position and angle correcting device 8; and two CCD cameras 10 respectively installed above the position and angle correcting devices 8.

Abstract: A method for cutting thin glass, wherein the thin glass is heated with a laser beam along a path forming a cutting line moving along a forward feed direction, such that a crack propagates along the cutting line and cuts through the thin glass. The laser beam is formed by a beam-forming optic in such a way that the beam profile thereof has an elongated shape. The laser beam is orientated on the surface of the thin glass such that the longitudinal direction thereof is aligned in the feed direction. The elongated shape of the beam profile is asymmetric, such that the intensity course differs at the ends of the beam profile in such a way that the increase in intensity at the front end crossing the thin glass first is steeper than the drop in intensity at the opposite rear end.

Abstract: A method of elongating a glass base material to obtain a glass rod having a smaller diameter, using a glass base material elongating apparatus including a feeder at least for the glass base material, a heating furnace, and an elongating mechanism of the glass base material below the heating furnace, is such that a horizontal plane position measuring unit of the glass base material is provided inside or near the heating furnace, the feeder has a glass base material horizontal plane position adjusting unit, and the elongating mechanism has three or more sets of elongating rollers capable of switching between grasping and releasing for keeping the position of the glass rod in the horizontal plane to be constant, and the glass base material is elongated with the position thereof in the horizontal plane kept as targeted by controlling the glass base material horizontal plane position adjusting unit.

Abstract: The present invention relates to a waste fluorescent light end-cutting device. The waste fluorescent light end-cutting device includes a conveyor transferring a waste fluorescent light, a heating wire disposed on each of both sides of the conveyor, a cooling wire subsequently disposed on a rear side of the heating wire, and a suction duct disposed between the cooling wire and the heating wire. A base cap is separated from the waste fluorescent light by using a temperature difference between the heating wire and the cooling wire.

Abstract: The invention relates to an apparatus and to a method for the industrial production of elastically deformable large-surface-area glass plates in high quantities, comprising the following characteristics: a) a device for feeding a glass plate (3), b) a device for providing the surface of the glass plate (3) with initial damage in the region of the desired breaking line, c) a device for the locally limited heating of the glass surface by way of a laser beam moving on a straight line in a fan-shaped pivoting manner, d) a device for cooling the glass surface, wherein a controllable cooling nozzle delivering a fluid is disposed on at least one side of the laser beam, e) a device for transporting a thermally locally pretreated glass plate (3) into the region of a device for breaking the glass plate (3), f) a device for detecting a straight-line crack formation on the surface of a glass plate (3), g) a straight-lined breaking blade on the underside of the glass plate (3), which blade can be lifted on one side and/or

Abstract: A full body of a glass sheet (G) is cut by forming an initial crack (6a) on a preset cutting line (5) of the glass sheet (G) that is supported by a support member (2 (8)) from a back surface side of the glass sheet (G), followed by propagating the initial crack (6a) while passing through the glass sheet from a front surface to the back surface thereof due to a stress generated through localized heating along the preset cutting line (5) and cooling of a heated region that is formed through the localized heating, the glass sheet (G) being supported by the support member (2 (8)) from the back surface side through an intermediation of an elastic sheet (E) having low thermal conductivity.

Abstract: A method and system for preparing polysilicon slim rods, the method and system including: placing a piece of polysilicon on a fixture; applying a predetermined laser beam or abrasive jet to the piece of polysilicon; and separating a polysilicon slim rod from the piece of polysilicon. The laser beam may be used for either cutting or for cracking depending on the operating parameters chosen. There may also be various combinations of cutting and cracking used in order to separate the slim rod from the piece of polysilicon. For example, the laser cut may be a scribing and/or partial cut and the separation may be completed by cracking the remaining silicon. In this case, the cracking may be accomplished by, for example, mechanical bending or laser cracking. Generally speaking, a laser beam used for cracking may be different from and have differing operating parameters from a laser beam used for cutting.

Abstract: A method for separating sheet of brittle material having a thickness equal to or less than about 1 mm is disclosed. Once an initial flaw or crack is produced, a full body crack can be propagated across a dimension of the brittle material with a laser beam that is substantially absorbed proximate the surface of the sheet to produce sub-sheets. In some embodiments, only a single pass of the laser beam over a surface of the sheet is necessary to separate the sheet. In other embodiments a plurality of passes may be used. Sub-sheets can be further processed into electronic devices by depositing thin film materials on the sub-piece.

Abstract: The brittle workpiece splitting system 1 includes a substrate holding mechanism 10 for holding a substrate 51, and a processing unit 5 for splitting the substrate 51 held by the substrate holding mechanism 10 by a splitting process. The substrate holding mechanism 10 has an edge damper 12 adapted to clamp an edge part of the substrate 51 from the sides of the opposite surfaces of the edge part, and support members 19 for supporting the substrate 51 thereon at a predetermined height. The support members 19 are disposed on the side opposite the side of the edge damper 12 with respect to the intended split line 61 parallel to the edge part of the substrate 51. The edge damper 12 has an edge holder 15 on which the substrate 51 is seated, and a pressure bar 14 for pressing the substrate 51 against the edge holder 15 to hold the substrate 51 between the edge holder 15 and the pressure bar 14.

Abstract: A method for cutting a semiconductor wafer by generating a crack within the wafer, and a system thereof, are provided. The method comprises irradiating a laser beam towards a surface of the wafer and converging the laser beam to form a focal point so that a focal volume defined by the focal point and a boundary of the laser beam within the wafer is formed. Energy encompassed within the focal volume causes the wafer located at the periphery of the focal volume to contract faster than the wafer located within the focal volume, thereby generating a crack within the wafer.

Abstract: A scribing apparatus for scribing a substrate improves productivity as well as prevents substrate deterioration. The apparatus according to an embodiment of the present invention includes a wheel to scribe a substrate, a refrigerant supplier installed near one side of the wheel to spray a refrigerant to the substrate; and a hot steam supplier installed near the other side of the wheel to spray a hot steam to the substrate.

Abstract: A method for cutting a nonmetal material is provided. The method includes steps of (a) generating a tension stress on a surface of the nonmetal material by exerting a bending stress thereon; (b) providing a thermal effect along a path direction on the surface, wherein the thermal effect grows along a direction opposite to the path direction; (c) providing a first cryogenic effect in a first incident direction along the path direction; and (d) providing a second cryogenic effect in a second incident direction along the path direction, wherein a crack along the path direction on the surface is formed as a result of the tension stress, the thermal effect, and the cryogenic effects therealong for cutting the nonmetal material.

Abstract: A method for forming a crack which can precisely form a crack in a desired direction in substrates made of brittle materials even if the substrate of a large size is placed apart from a correct reference position on the scribe table. According to this method, a crack formation presumed line M is formed following the position separated from a beam travel line L, which is the track of the movement of the center of the beam spot B, by an offset amount O by moving a beam spot B relatively to a substrate G so that the beam travel line L can be in an oblique direction to a reference axis direction X set so as to be coincident with the substantial major axis direction of the beam spot B, and further a cooling spot C is relatively moved following the crack formation presumed line M, and thereby a vertical crack is formed following the crack formation presumed line M.

Abstract: A glass plate cutting machine using a laser beam is provided to solve problems, such as uneven glass section and slanting cutting. By using the glass plate cutting machine of the current invention, the glass plate is irradiated with a first carbon dioxide laser beam of 0.05-2 joule/mm2 on a long oval shaped area of 20-200 mm2 according to an expected cutting line thereof, and immediately cooled with water, to generate a scribe line, which is then further irradiated with a second carbon dioxide laser beam of 0.1-0.5 joule/mm? on the area of 20-200 mm2 thus obtaining a superior glass section.

Abstract: Device for severing components made from brittle material, for example, glass, ceramics, glass ceramics, by producing a thermally-induced stress fracture on component in a separation zone includes a laser for directing a laser beam onto component to be machined so that component partly transmits laser beam with partial absorption at least twice simultaneously or serially along separation zone at the same point or closely spaced points. Device includes a bearing surface on which component being machined is received, and device for subjecting component to mechanical stresses for promoting thermally induced stress fracture. Bearing surface has at least two bearing surface sections movable relative to each other between a first position and a second position, and component, in the first position, being supported in a manner substantially free from mechanical stresses, and, in a second position, component being subjected to mechanical stresses for promoting the thermally induced stress fracture.

Abstract: A method of high speed cutting of non-metallic materials (14), preferably glass and laminated glass, is described. In the inventive method a concentrated microwave radiation (1) with appropriate frequency and power density is chosen so as to accomplish heating of at least one selected area (2) of the body at the required separating propagation path (3) to required temperature in a selected short time while ensuring that this temperature is large enough to create a thermal stress (6) through the thickness of the selected area that results in the separating of the body material. In one embodiment of the invention a method of high speed cutting laminated glass is described wherein concentrated microwave radiation is used for delaminating adhesive film before the step of separating the glass body.

Abstract: The apparatus for cutting a flat glass work piece along a curved dividing line includes a laser generating a laser beam having a linear beam profile and an optical system with a scanner for producing a curvilinear focal point from the laser beam. The apparatus also moves a cold spot along the curved dividing line following the curvilinear focal point. A trajectory control device controls the position of the curvilinear focal point on the curved dividing line via actuators. A profile control device controls the contour of the curvilinear focal point according to trajectory data from the curved dividing line, so that all points of the curvilinear focal point lie on or coincide with the curved dividing line. The apparatus adjusts the length of the curvilinear focal point by adjusting scanning amplitude of the scanning motion.

Abstract: A method of removing stators from tubular stator housings involving subjecting a tubular stator housing having an interior surface to which a worn stator is adhered by adhesive to cryogenic refrigeration until the stator shrinks and pulls away from the interior surface of the tubular stator housing.

Abstract: A method of fracturing or breaking rock includes the step of directing high intensity white light (radiation) at the rock to induce thermal stress sufficient to fracture the rock. The intensity of the energy source may be varied to control the manner in which the rock fractures. An approach for generating high intensity white light includes an elongate arc chamber and an elongate concave reflector. The arc chamber and reflector may be shielded from airborne particulate matter by an air shield or a rotating or reciprocating translucent shield.

Abstract: The cutting of the flat glass plate (1) into rectangular plates with a predetermined edge length is performed by forming initial cracks at the beginning of cutting lines on the glass plate and moving a laser beam along the cutting lines followed by a cooling spot to induce a thermo-mechanical stress alone the cutting lines. First the glass plate (1) is cut apart into partial plates (2-5) along first parallel cutting lines spaced according to the predetermined edge length. Then the cut apart glass plate is rotated by 90° and the partial plates (2-5) are moved apart from each other. Subsequently the partial plates that have been moved apart are cut apart alone several parallel second cuts (4-9) perpendicular to the first cuts. This method facilitates exact placement of the initial cracks.

Abstract: An automatic picture tube cutting machine is provided. The machine includes a transporting mechanism for transporting a tray carrying a picture tube into a moving-up-and-down base, which automatically adjusts the vertical position of the picture tube based upon its size. The machine also includes a positioning and cutting device wherein a plurality of clamp units cooperatively set tungsten heating filaments in contact with the picture tube to circumscribe that picture tube at a preset cutting height. Upon heating via the tungsten heating filaments and subsequent cool water quenching, the picture tube is broken at its circumscribed portion into separated front and rear stages.

Abstract: In the method for cutting flat glass work pieces a laser beam having a linear beam profile followed by a cold spot is moved along a curved dividing line (2) on the work piece. A linear focal point (1) is produced on the work piece by scanning the laser beam. Trajectory data from the curved dividing line (2) is made available during every scanning motion and scanning is controlled so that all points of the curvilinear focal point (1) lie on or coincide with the curved dividing line (2). A length of the curvilinear focal point is adjusted according to the curvature of the curved dividing line by adjusting scanning amplitude of the scanning motion. Preferably the laser beam output is adjusted as a function of the length of the curvilinear focal point.

Abstract: A method for cutting the edges of a continuous glass ribbon (10), moving at a speed VR, comprising a longitudinal marking stage which generates a marking line, in particular using a cutting wheel (11), a transverse marking stage, and a subsequent transverse breaking stage. The inventive method also comprises an intermediary stage between the longitudinal marking stage and the transverse marking stage consisting in generating at least one longitudinal fissure (32) through at least a substantial part of the thickness of the continuous glass ribbon, or through the entire thickness of the continuous glass ribbon, on the basis of the marking line (30), and in spreading said longitudinal fissure at a speed VF, which is more or less equal to but in the opposite direction to the speed VR of the moving continuous glass ribbon. The invention also relates to a device designed to carry out said method. The glass plates cut using the inventive method have edges, advantageously, without any major defects.

Abstract: Disclosed is a method for cutting a non-metallic substrate. A designated cutting line formed on the non-metallic substrate is cut using a thermal stress generated by rapidly heating and cooling the designated cutting line. Further, a shape and an arrangement, etc., of an energy source is optimized, thereby maximizing a cutting speed of the non-metallic substrate and also precisely cutting the non-metallic substrate.

Abstract: An in-line system for fabricating a liquid crystal display includes a sealer coating unit for coating a sealer onto a first substrate with a plurality of liquid crystal display cell regions, a liquid crystal injection unit for dropping a liquid crystal onto the first substrate coated with the sealer, and an assembly unit for assembling the first substrate with the second substrate. A sealer hardening unit hardens the sealer interposed between the first and the second substrate to thereby assemble the first and the second substrate with each other. A substrate cutting unit cuts the first and the second substrates along cutting lines through illuminating a laser beam along the cutting lines such that the first and the second substrates are severed into the liquid crystal display cell regions.

Abstract: The cutting of these rectangular plates with predetermined edge lengths is typically effected by means of a laser, which is displaced along the cutting lines, in conjunction with a trailing cooling spot for inducing a thermomechanical stress that is greater than the breaking strength of the glass, and by means of a mechanically induced initial crack at the beginning of the cutting line. When the flat glass plate (1) is in an initial position, a number of parallel first cutting lines (1-3) are made. Afterwards, the flat glass plate (1) that is cut up in such a manner is rotated 90°, and the partial plates (2-5) are moved apart by virtue of the fact that a displaceable table segment of a cutting table is assigned to each partial plate. In this position, several parallel second cuts (4-9) are then made that are perpendicular to the first cuts, whereby, on each partial plate, an initial crack is induced on the leading edge.

Abstract: A glass cutting method and apparatus in which the laser beam to be irradiated onto a glass to be machined has a leading portion with a low energy density, and a trailing portion with a high energy density, thereby being capable of maximizing the thermal impact applied to the glass when the laser beam is irradiated, whereas the glass is divided into a plurality of glass portions, for which the moving speed and energy of the laser beam are controlled to meet respective thermal stress distributions at those glass portions, thereby being capable of achieving an improvement in the quality of the cut glass surface while achieving a rapid glass cutting process.

Abstract: A method of fracturing or breaking rock includes the step of directing high intensity white light at the rock to induce thermal stress sufficient to fracture the rock. An approach for generating high intensity white light includes an elongate arc chamber and an elongate concave reflector. The arc chamber and reflector may be shielded from airborne particulate matter by an air shield or a rotating or reciprocating translucent shield.

Abstract: Disclosed is a method for cutting a non-metallic substrate. A designated cutting line formed on the non-metallic substrate is cut using a thermal stress generated by rapidly heating and cooling the designated cutting line. Further, a shape and an arrangement, etc., of an energy source is optimized, thereby maximizing a cutting speed of the non-metallic substrate and also precisely cutting the non-metallic substrate.

Abstract: Disclosed is a coolant for cooling a selectively heated portion of a liquid crystal display substrate to cut the selected portion using thermal stress and a method of cutting the substrate using the same. A rapidly heated portion of the substrate is rapidly cooled using water having a high specific heat or a mixed coolant in which a material for improving characteristics of surface tension, viscosity and thermal conductivity is dissolved in water. Therefore, the cutting quality of the substrate is improved, and a cutting speed is also enhanced.

Abstract: A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.

Abstract: In a conventional method, a laser beam, with a linear beam profile and a following cool-spot to increase the thermomechanical stress, is moved along a separating line of predetermined shape. According to the invention, in order to be able to separate any shape (free-form cutting), the method is carried out, whereby a linear focal point is generated, on the workpiece, by means of scanning the laser beam and, during each scanning movement, tracking data for the separation line (2) is generated, such that the linear focal point is given a curvature corresponding to the curvature of the shape of the separation line, by adjusting the scan amplitude.

Abstract: A laser beam having a line-shaped beam profile with a following cooling spot in order to increase thermomechanic tension which is moved along a separating line having predefined contours is known in prior art. In order to cut out a given contour using simple mean, (free-shape cut) the method according to the invention relates to a line-shaped bum spot (1) generated on a work piece. Said spot is of significantly increased intensity at both ends (1a, 1b). Said spot is moved along the cut line (2) in such a way that both said ends lie on the cut line (2) and the length (S) thereof depends on the curvature of the contour of the cut line (2).

Abstract: This invention relates to a group of methods aimed to facilitate the start of a controlled thermal scoring, shearing or separation method applied to brittle materials. More or less all thermal scoring, shearing or separation methods have in common that the specific energy level inherent to this method remains constant over the path. Such energy level sufficient to control the propagation of a crack is insufficient to start the same.

Abstract: A method for cutting a circuit substrate which includes a substrate with an upper surface and a lower surface and electric circuitry provided on the upper surface of the substrate, includes the steps of: irradiating a laser beam onto the lower surface of the substrate so that a stress is generated inside the substrate using an irradiated spot of the laser beam as a heat source; and cutting the substrate by moving the irradiated spot.

Abstract: An apparatus and method for physically separating non-metallic substrates forms a microcrack in the substrate and controllingly propagates the microcrack. An initial mechanical or pulsed laser scribing device forms a microcrack in the substrate. If a pulsed laser is used, it forms a crack inside the substrate that does not extend to either the upper or lower surface. A scribe beam is applied onto the substrate on a separation line. A coolant stream intersects with, or is adjacent to, the trailing edge of the scribe beam. The temperature differential between the heat affected zone of the substrate and the coolant stream propagates the microcrack. Two breaking beams on opposing sides of the separation line follow the coolant stream. The breaking beams create controlled tensile forces that extend the crack to the bottom surface of the substrate for full separation. The scribe and break beams and coolant stream are simultaneously moved relative to the substrate.

Abstract: A method of removing stators from tubular stator housings involving subjecting a tubular stator housing having an interior surface to which a worn stator is adhered by adhesive to cryogenic refrigeration until the stator shrinks and pulls away from the interior surface of the tubular stator housing.

Abstract: A method of removing stators from tubular stator housings involving subjecting a tubular stator housing having an interior surface to which a worn stator is adhered by adhesive to cryogenic refrigeration until the stator shrinks and pulls away from the interior surface of the tubular stator housing.