Abstract: An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a z-axis motion system carrying the weld head assembly. The z-axis motion system includes (i) a z-axis forcer for moving the weld head assembly along a z-axis of the ultrasonic welding system, and (ii) a z-axis overtravel mechanism disposed between the z-axis forcer and the weld head assembly.

Abstract: A semiconductor manufacturing apparatus includes a tool performing joining by ultrasonic vibration while applying a load to a metal terminal. The tool includes a plurality of protrusions arranged along the X-axis direction and the Y-axis direction on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal. The intervals between the plurality of protrusions are equal in the X direction of the pressing surface, and are larger on the inner peripheral side than on the outer peripheral side in the Y-axis direction of the pressing surface.

Abstract: A tiled display includes a first display device comprising a first display area and a first pad area having grooves, and a second display device comprising a second display area and a second pad area overlapping the second display area, the second pad area having protrusions, wherein the protrusions are inserted into the grooves to connect the first pad area with the second pad area.

Abstract: Systems and methods include using an ultrasonic cutter tool to cut a seal. The system comprises an ultrasonic cutter tool disposed onto a railing system coupled to a platform, wherein the ultrasonic cutter tool is configured to translate along the railing system. The system further comprises a power source electrically coupled to the ultrasonic cutter tool, and an alignment mold disposed parallel to the railing system and offset by a distance. The system further comprises one or more roller bearing carriages coupled to the railing system, wherein each of the one or more roller bearing carriages comprises a set of roller bearings, wherein each set of roller bearings is disposed over the alignment mold, wherein each set of roller bearings is configured to translate along the alignment mold as each of the one or more roller bearing carriages translates along the railing system.

Abstract: A bonding system includes a supporting jig having a mounting surface on bonding substrates which are mounted, a bonding device that sandwiches and welds the bonding substrates between itself and the mounting surface, an articulated robot to which the bonding device is attached, and a control unit that controls the articulated robot and the bonding device.

Abstract: Applied power as a function of time is ramped up at the onset of an RF welding process in a manner that is predetermined to match source and load impedance as reflected by maximized forward power during at least the majority of the welding process. The ramp-up portion takes the form of a non-linear curve, such as an S-shaped curve, as opposed to one or more discrete steps. The applied power may then be maintained at or near that maximum required value at least a majority of the remainder of the heating portion of the welding process. The shape of the non-linear ramp-up portion of the applied power curve may be predetermined using, for example, virtual motor control using applied power as a virtual axis.

Abstract: A welding process involves a fixture for holding a workpiece and a welder, or welding electrode. The fixture imposes ultrasonic vibration on the workpiece. The welder vibrates during vibration, and is operable at a first voltage for welding and a second voltage for peening. The peening may occur while the weldmetal is crystallizing. The welding process may be a process of welding two part as together, or of filling a groove or other feature, or of applying or restoring a surface, or of applying a hard facing or ceramic to a parent metal or object. The weldmetal may be the same, or substantially the same, as the parent metal, or it may be different. The different material may be a ceramic material.

Abstract: A method for calibrating a second bonding machine based on a calibrated first bonding machine is disclosed. The first bonding machine includes a first ultrasonic transducer. The second bonding machine includes a second ultrasonic transducer and a power supply. The method includes providing a first electrical calibration supply that causes the first ultrasonic transducer to oscillate at a first calibration amplitude when it is damped by a mechanical damping, providing a second electrical calibration supply that causes the second ultrasonic transducer to oscillate at the same calibration amplitude when it is damped by the same mechanical damping.

Abstract: A method for optimizing a welding process to produce a weld joint having a predetermined strength includes measuring a plurality of melt layer thicknesses of weld joints for a plurality of sample assemblies formed by the welding process, measuring a plurality failure loads of weld joints for the plurality of sample assemblies, each of the measured plurality of failures loads being associated with one of the measured plurality of melt layer thicknesses, selecting a first failure load from the plurality of measured failure loads responsive to determining that the first failure load corresponds to a predetermined weld strength, and selecting a first melt layer thickness from the plurality of measured melt layer thicknesses that is associated with the selected first measured failure load.

Abstract: A molding system for molding electronic components mounted on first and second sides of a substrate has a molding cavity onto which the substrate is locatable for molding. The molding cavity has a first section covering a molding portion of the first side of the substrate, and a second section covering a molding portion of the second side of the substrate. First and second pots have plungers for compressing molding compound placed therein. First and second runners connect the first and second pots to the first and second sections of the molding cavity for introducing the molding compound onto both sides of the substrate. In particular, the runners extend at least from an edge of the substrate along both sides of the substrate to the molding cavity.

Abstract: A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.

Abstract: A mechanical vibration machining method or the like is suitable for allowing a probe to provide vibration to a horn with high efficiency. A horn portion is supported by a first support portion and a second support portion configured as a double-support structure. A first probe unit and a second probe unit are coupled to both ends of the horn portion. The first probe unit and the second probe unit vibrate the horn portion by means of vibration generated by a first generation unit and a second generation unit. The horn portion provides nodal points at which elongation and contraction alternately occur. For example, in a case in which the contact portion is arranged at the center of the horn portion, the second generation unit is oscillated with a phase that is the opposite of that of the first generation unit.

Abstract: An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a z-axis motion system carrying the weld head assembly. The z-axis motion system includes (i) a z-axis forcer for moving the weld head assembly along a z-axis of the ultrasonic welding system, and (ii) a z-axis overtravel mechanism disposed between the z-axis forcer and the weld head assembly.

Abstract: An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.

Abstract: There is provided a friction stir welding method in which, when double-sided friction stir welding is performed, enough plastic flow to obtain a welded state uniform in the thickness direction of metal sheets can be obtained, in which an increase in welding speed is achieved while the occurrence of defects during welding is prevented, and in which sufficient strength and improvement in welding workability can be achieved. There is also provided a friction stir welding device suitable for the friction stir welding.

Abstract: The present disclosure relates to a full-automatic deep access ball bonding head device includes: a Z-axis base; a Z-axis sliding stage, which is connected to the Z-axis base in a sliding manner along Z-axis; an EFO mechanism; and a bonding mechanism, which is fixed on the Z-axis sliding stage. The EFO mechanism includes an EFO sliding block, an EFO wand, and a compressed spring. The EFO sliding block is located on the side of the Z-axis sliding stage and connected to the Z-axis base in a sliding manner. The compressed spring is connected between the upper end of the Z-axis sliding stage and the upper end of the EFO sliding block, and the EFO wand is connected to the lower end of the EFO sliding block.

Abstract: The invention relates to a method and to an arrangement for electrically conductive connecting, by means of ultrasonic welding, of first electric conductors (140, 142) and second electric conductors (144, 146) in a compression space the cross section of which can be changed and which comprises at least one lateral slide, a sonotrode and a counter electrode, wherein firstly, blank ends of the first electric conductors (140, 142) are introduced into the compression space and are welded by means of ultrasonic action to form a first connection (148) and then after the first connection has been removed from the compression space, blank ends of the second electric conductors (144, 146) are introduced into same and are welded by means of ultrasonic action to form a second connection, wherein the first connection is fed to a retaining device (182, 184) before the second connection is welded.

Abstract: A wire bonding method includes bringing a capillary and a wire inserted through the capillary into pressure contact with a bonding point of a lead placed on an XY stage to bond the wire to the lead, including moving the XY stage in a state in which the capillary is in pressure contact with the lead to move the capillary along a movement locus including a plurality of arc portions.

Abstract: An ultrasonic bonding apparatus includes a sensor that detects vibration along a height direction in a bonding target member which vibrates by ultrasonic vibration. The ultrasonic bonding apparatus includes a control device that changes control parameters associated with the driving of a bonding tool based on information related to the vibration along the height direction detected by the sensor.

Abstract: An ultrasonic welding apparatus (50) includes a sonotrode (8) with a working surface (10), an anvil (4) with a working surface (11), which lies opposite the working surface (10) of the sonotrode (8), and two side delimiters (5, 6) with respective side delimiting surfaces (12, 13). The working surfaces (10, 11) and the side delimiting surfaces (12, 13) delimit a compression chamber (9) for placing an elongated welding material (60) in a welding material direction (B). The ultrasonic welding apparatus (50) has a clamping device (14), by which the anvil (4) is clamped at least in a welding position (S) by a clamping force, which acts on at least part of a side (15) of the engaging surface (26) of the anvil (4) that lies opposite the working surface (11) of the anvil (4), in the direction of the sonotrode (8). A method for ultrasonic welding is also disclosed.

Abstract: An ultrasonic welding assembly comprising a sonotrode having a first body portion, a first nodal region, a welding region, a second nodal region, and a second body portion; a transducer rotationally connected to the second body portion for transmitting acoustic vibrations to the welding region; a roller device connected to the transducer and sonotrode for permitting axial rotation of the transducer and sonotrode; a support device flexibly connected to the roller device for maintaining axial alignment of the transducer and sonotrode relative to a target welding area; a mount for supporting the sonotrode; and four frictionless bearings positioned around the nodal regions of the sonotrode, wherein the frictionless bearings are attached to the mount.

Abstract: The present invention relates to a method for intermittent ultrasonic processing of a length of material, wherein a length of material is moved through between a sonotrode and a counter-tool and the length of material is processed intermittently. In order to specify a method for intermittent ultrasonic processing of a length of material by which the disadvantages of the prior art can be avoided or at least reduced, according to the invention it is suggested that in a processing interval the sonotrode is stimulated by an ultrasonic oscillation with an oscillation amplitude A and in a movement interval the sonotrode is stimulated with an oscillation amplitude B, wherein B<A and during the processing interval and during the movement interval the length of material touches both the sonotrode and also the counter-tool.

Abstract: An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a z-axis motion system carrying the weld head assembly. The z-axis motion system includes (i) a z-axis forcer for moving the weld head assembly along a z-axis of the ultrasonic welding system, and (ii) a z-axis overtravel mechanism disposed between the z-axis forcer and the weld head assembly.

Abstract: A method for automatically threading wire in a wire bonding apparatus includes the steps of extending a wire tail of a wire from a wire spool, locating the wire tail in a wire locating device and positioning the wire tail at a straightening location of the wire locating device. The wire tail is straightened at the straightening location with a wire manipulating device and then conveyed to a threading location. With a wire threading device, the straightened wire tail is received at the threading location and is threaded through a capillary of the wire bonding apparatus.

Abstract: A welding apparatus has a guide rail arrangement with at least one guide rail attachable to a welding target. A carriage has a carriage housing and a rail follower assembly that is movably mountable to the guide rail arrangement for relative movement along the at least one guide rail. A feedstock source is disposed within the carriage housing and configured to deposit a feedstock material on a target surface of the welding target. An ultrasonic weld head is partially disposed within the carriage housing and has a sonotrode that extends toward the target surface so as to engage the deposited feedstock material and apply a normal welding force to the deposited feedstock material and the target surface. The sonotrode is operable to conduct ultrasonic vibrations into the deposited feedstock material and the target surface to weld the feedstock material to the target surface.

Abstract: An ultrasonic welding device includes a sonotrode emitting longitudinal vibrations in the direction of a longitudinal sonotrode axis which comprises a work surface on a sonotrode head and an anvil. A weldment accommodation for a weld deposit is between the work surface ‘p’ and a counterface of the anvil. The ultrasonic welding device includes a stop device for defining the welding position with respect to the work surface. The counterface is disposed at an inclination ? towards the longitudinal sonotrode axis such that when the counterface is inclined downward towards a vibration node adjacent to the work surface, distance a between the work surface and the counterface continuously increases towards the vibration node, and when the counterface is inclined upward towards a vibration node adjacent to the work surface distance a is essentially constant.

Abstract: A device for manufacturing a plate solder according to the present invention includes a reel on which a thread solder is wound; a cutter that cuts the thread solder, provided between the reel and an end part of the thread solder extending from the reel; an aggregating part that aggregates a plurality of cut thread solders such that the plurality of thread solders are in contact with one another; and a roller that rolls the plurality of aggregated thread solders and pressure bonds them to one another to form a plate solder.

Abstract: A welding device with which two components can be pressed against each other comprises a static first section and a second section movable relative to the first section. At least one drive system is connected at a first end to the first section and at a second end to the second section, as well as at least one elastic guiding system by which the first section and the second section are connected to one another. The first section and the second section are movable relative to each other along only one axis due to at least one elastic guiding system, so that an axial length of the arrangement can be varied. A moving coil drive may be used or another drive without mechanical losses or with mechanical losses less than a clamping force to be applied during operation.

Abstract: A bonding device of a fuel cell part is disclosed. The bonding device of the fuel cell part may bond an upper gas diffusion layer and a lower gas diffusion layer to top and bottom surfaces of an MEA base material through adhesive layers, while disposing the MEA base material between the upper gas diffusion layer and the lower gas diffusion layer, and may include: a lower die that supports the MEA base material, the upper gas diffusion layer, and the lower gas diffusion layer to be bonded with each other; an upper die installed in an upper side of the lower die; and an ultrasonic wave vibration source that is installed to be capable of moving in a vertical direction at opposite sides of the upper die, compressing the upper gas diffusion layer, and applying ultrasonic wave vibration energy to the adhesive layer.

Abstract: The present invention relates to an electrical connection between a flat part and a connecting part, in which the flat part and the connecting part are arranged one above the other in an overlap region, in which the contact surface of the flat part facing the connecting part in the overlap region is structured in relief-like fashion and that the flat part is friction-welded, in particular ultrasonically welded, to the connecting part via the structured contact surface.

Abstract: The invention relates to a device and to a method for producing a tested weld joint between two contact elements (11, 12), which are joined together in a welding plane S, comprising a compressing space for accommodating the contact elements (11, 12), said compressing space being delimited by a work surface of a sonotrode, which transmits ultrasonic oscillations, and a counter-surface (15) of a counter-electrode (16) in a first axial direction at two opposing sides and by delimiting surfaces of opposing delimiting elements in a second axial direction at two opposing sides, said device comprising a test head (27) next to the compressing space, and said test head being able to be transferred from a position outside of the compressing space to a position within the compressing space in such a manner that the test head (27) is disposed within the open compressing space in a test mode of the device for subjecting a contact element (12) of the previously produced weld joint to a shear force essentially oriented para

Abstract: A high-frequency vibration welding conditioning system for achieving better metal material properties is disclosed, which comprises a host computer, a signal generator, a power amplifier, a high-frequency vibrator, a high-frequency vibration energy amplification and transfer device, an acceleration sensor, and a cooling module, the host computer controlling the signal generator to output a sinusoidal excitation signal which is independently and continuously adjustable in amplitude and frequency, the sinusoidal excitation signal being inputted to the high-frequency vibrator via the power amplifier.

Abstract: A clamping system for an ultrasonic welding apparatus configured to clamp a contact element in the ultrasonic welding apparatus is presented. The contact element has a flat elongate shape and a welding region, a clamping region, and a contacting region arranged along a longitudinal axis. The clamping system includes two clamping units mechanically connected to the ultrasonic welding apparatus which are arranged spaced apart from one another and are moveable toward one another. Each clamping unit defines a clamping finger which is movable to extend over the clamping region. Each clamping finger has a clamping face that is configured to press on a surface of the clamping region that is located opposite an anvil of the ultrasonic welding apparatus while in a clamped state.

Abstract: A method of joining includes disposing a second workpiece adjacent to a first workpiece. The method further includes identifying a determined hardness parameter of at least one of the first and second workpieces at a welding position. The determined hardness parameter is determined by at least one of estimation, calculation, and measurement. The method includes selecting a weld schedule based on the determined hardness parameter and welding the first and second workpieces together using the selected weld schedule. A welding horn includes a shank and a tip having an end face, the tip being disposed at an end of the shank and configured to contact a workpiece and to transmit energy to the workpiece. Knurls are disposed on the end face, each knurl having a distal end. A curved indenter extends from the end face beyond the distal ends of the knurls.

Abstract: A bonding tool includes a wedge tool that presses a bonding wire against a principal plane of a structure such as an electrode to which the bonding wire is to be bonded. A groove formed in an end portion of a wedge tool body of the wedge tool is inclined along a longitudinal direction of the bonding wire so that a heel side of the groove is closer to the principal plane of the structure than a toe side of the groove. As a result, the wedge tool is inclined at a tilt angle and the bonding wire fits the groove in the end portion of the wedge tool body along the longitudinal direction of the bonding wire. Thus, a corner portion of the wedge tool does not contact the electrode.

Abstract: A method for producing an electrode assembly includes a step of ultrasonically welding an exposed portion where the surface of an electrode current collector is exposed and an electrode lead to each other. The ultrasonic welding is performed, while the exposed portion of the electrode current collector and the electrode lead are stacked on each other, with an ultrasonic horn pressed against a resin sheet disposed on the exposed portion or the electrode lead. The resin sheet includes a sheet base material and an adhesive layer formed on one surface of the base material and is bonded to a portion of the exposed portion that is to be in contact with the ultrasonic horn or to a portion of the electrode lead that is to be in contact with the ultrasonic horn.

Abstract: A workpiece is described, and includes a substrate, a cable, and a cover piece. A portion of the cable is joined to the substrate employing a vibration welding tool, and the cover piece is interposed between the portion of the cable and the vibration welding tool during the joining.

Abstract: A bond head assembly for a bonding machine is provided. The bond head assembly includes a body portion and a bonding tool for bonding a semiconductor element to a substrate. The bonding tool is secured to the body portion. The bond head assembly also includes at least one reflective optical element carried by the bond head assembly. The at least one reflective optical element is configured to be positioned along an optical path of the bonding machine such that a vision system of the bonding machine is configured to view a portion of the semiconductor element while being carried by the bonding tool prior to bonding of the semiconductor element to the substrate.

Abstract: An ultrasonic welding jig includes: an anvil that supports a plate-like electric cable connection portion of a terminal; and a welding horn that is disposed so as to oppose the anvil, and in which a fitting groove is formed in an opposing surface, the fitting groove being a groove in which a portion of a core wire of an electric cable is fitted. In a state in which the core wire and the electric cable connection portion are clamped between the welding horn and the anvil, ultrasonic welding is performed by ultrasonically vibrating the welding horn in an axial direction of the core wire. In a bottom surface of the fitting groove of the welding horn, a plurality of slippage prevention grooves that are obliquely oriented and intersect an axis of the fitting groove are formed spaced apart in a direction of the axis of the fitting groove.

Abstract: A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.

Abstract: The present disclosure provides an apparatus that includes a fiber gun. In an embodiment, the apparatus may controllably cut one or more fibers into one or more fiber segments. In an embodiment, the apparatus may controllably shape one or more fibers into different shapes (e.g., from loops into substantially straight fibers). In an embodiment, the apparatus may controllably position the one or more fiber segments onto a supporting member (e.g., a composite component). For example, the apparatus may include a robot that may controllably move the fiber gun relative to a supporting member and align the fiber gun such that the one or more fiber segments are controllably positioned on the supporting member. The apparatus may further include a controller that at least partially controls operation of the apparatus.

Abstract: An ultrasonic welding assembly joins bare ends of an insulated wire bundle to a wire terminal in a weldment zone by intimate contact with a sonotrode of an ultrasonic stack. A door allows the operator to place the terminal into the nest within the weldment zone. One operator hand holds the wire bundle while one contacts an external sensor. A pair of terminal clamps extend inwardly and down to secure the terminal and create a taller capture area for the loose bare wire ends. A pair of clamp finger assemblies reversibly extend towards the insulated wires away from the weldment zone for securing the wires. A wire gatherer descends upon and captures all of the wire bare ends and secures them until the horn descends, captures, and holds the wire ends in place, then extends away from the weldment zone for ultrasonic welding to commence.

Abstract: A system for manipulating a filament can include a filament supply from which a filament can be drawn, the filament supply being positioned along an axis, a vacuum manipulator assembly positioned along the axis, wherein the vacuum manipulator assembly is configured to engage the filament when a vacuum is drawn through the vacuum manipulator assembly and draw the filament along the axis to a workpiece, and a welding tool comprising a welding head positioned along the axis between the filament supply and the vacuum manipulator assembly, the welding tool being configured to weld the filament to the workpiece.

Abstract: A capillary formed from a unitary manufactured glass includes a main portion and an end portion. The main portion is elongated and has a first aperture with a first inner diameter. The end portion, which can have a knob-like shape, has a second aperture that tapers from a second inner diameter to a third inner diameter and the third inner aperture joins to the first aperture. The second inner diameter is larger than the first inner diameter. If desired, the third inner diameter can be smaller than the first inner diameter.

Abstract: A connecting device for connecting a circuit chip to a substrate is provided. The connecting device includes: a main body having a first opening and a second opening; a vibration part on the main body, the vibration part being configured to vibrate the main body; and an intake part coupled with the first and second openings to adsorb the circuit chip to the main body. Both the first and second openings are open at a surface of the main body to which the circuit chip is adsorbed, and the second opening is arranged in the first opening on a plane.

Abstract: A vibrating body unit includes a vibration generator, a vibration transmitter and first amplitude enlarger. The vibration generator generates ultrasonic vibration whose amplitude has a predetermined correlation with a frequency. The vibration transmitter has a proximal end and a distal end while the vibration generator is attached from a proximal side, and transmits the ultrasonic vibration to a distal side in a longitudinal axis direction. At least one first amplitude enlarger is provided in the vibration transmitter, and enlarges the amplitude of the ultrasonic vibration at a first amplitude enlargement rate in a direction of transmission of the ultrasonic vibration, the first amplitude enlargement rate having a correlation with the frequency opposite to the predetermined correlation.

Abstract: A solder-ball-supplying method, a solder-ball-supplying device and a solder-bump-forming method, which are flux-less and capable of being also applied to electrodes having a fine pitch. A substrate on which a resist with openings is positioned on electrode(s), which has a diameter of 10 through 30 ?m, of the substrate is prepared. Next, plural solder balls SBL each having a grain diameter of 1 through 10 ?m are shaken down to the opening(s) of the resist from a hopper and filled therein. Next, by sliding and moving a squeegee on an upper surface of the resist along X-Y direction, the solder balls SBL shaken down to the resist other than the openings are scrapped and removed and the solder balls SBL in the openings and around them are pushed into the openings by the squeegee.

Abstract: The device comprises a sonotrode (102) which can produce an oscillatory movement by means of a transducer (101) in order to generate ultrasound oscillation waves in said light alloy melt, when said sonotrode (102) and said melt are in contact, so as to perform the degassing; and an electronic-mechanical component (104) embedded in part of the sonotrode (102) for detecting the state of the service life or an anomaly of the sonotrode (102). The electronic-mechanical component (104) includes means for sending at least one notification signal to an electronic remote control equipment (103), forming a system together with the device. The electronic control device (103) is configured for sending an activation or deactivation signal for activation or deactivation of said transducer (101), taking into account said at least one notification signal.

Abstract: The method comprising the following steps: a) Providing a first bath of a liquid metal (1) comprising aluminium with a content X and magnesium with a content Y, the magnesium content Y being different to zero, b) Immersing at least partially a sonotrode (3) formed from a material inert to liquid aluminium, in the first bath of liquid metal (1), and c) Applying power ultrasounds to the sonotrode (3) so as to excite the liquid metal (1) until wetting (5) of the sonotrode (3) by the liquid metal (1) is obtained. d) Cooling the first liquid metal (1) of the first bath until solidification of the first liquid metal (1) around the sonotrode (3) is obtained, generating an intimate bond (6) between the sonotrode (3) and the solidified first liquid metal (1) having a bonding strength substantially equal to that of brazing between two metals. e) Machining the solidified first metal (1) in the form of a flange (7) configured for the attachment of a mechanical amplifier and/or of a transducer (4).

Abstract: A method of bonding wires onto surfaces, an apparatus and a computer program product are disclosed. The method of bonding wires onto surfaces, comprises the steps of: collecting operating characteristics of a bonding tool while forming a wire bond which bonds a wire to a surface; determining whether a possible bonding failure of the wire bond has occurred as indicated by the operating characteristics; and capturing an image of the wire bond to identify whether a foreign body is present on the surface if it is determined that a possible bonding failure has occurred. In this way, imaging of the wire bond is only necessary when the operating characteristics indicate a suspect bonding failure has occurred. This avoids the need to image every bond, while still imaging suspect bonds. This approach helps to significantly increase the throughput of the wire bonding apparatus whilst still identifying and classifying bonding defects due to the presence of a foreign body.