Abstract: To provide a soldering method and a soldering apparatus which are capable of preheating a mask without degrading throughput. Provided is a soldering method including preheating a mask on which a substrate is not placed, placing the substrate on the preheated mask, and bringing at least a part of the substrate placed on the preheated mask into contact with molten solder and thus soldering the substrate.

Abstract: Systems and methods are disclosed herein relating to eliminating solder bridges between adjacent leads of small-pitch through-hole electrical components soldered to circuit boards using wave-soldering techniques. Several wave solder pallet insert patterns are disclosed. Each wave solder insert may include an insert pattern of peeling members is intended to eliminate solder bridges from various small-pitch component lead layouts.

Abstract: A device for assembling an element on a surface of a substrate by providing a solder-forming mass. The device has a means for moving the element and a measurement means. The means for moving the element includes a support and an element gripper member. The gripper member has a vertical axis that is perpendicular to the surface of the substrate and is mounted to move freely in translation on the support in a direction parallel to its vertical axis. The measurement means measures a variation of the position of the element in vertical translation.

Abstract: A screen printer includes: a substrate holder that holds a substrate; a mask to be contacted with the substrate; an imaging device that images the substrate; an elevation mechanism that moves up the substrate holder at a below-mask-position below the mask based on a result of the imaging to contact the substrate with the mask; a horizontal moving mechanism that moves the substrate holder between the below-mask-position and a retreat position retreated in a horizontal direction from the below-mask-position; a printing head that moves on the mask contacted with the substrate and prints a paste on the substrate via the mask; and a mask cleaner that cleans a lower surface of the mask with the substrate separated from the mask by the elevation mechanism. The imaging of the substrate and the cleaning of the mask are performed with the substrate holder positioned at the retreat position.

Abstract: A tool driving section of a friction stir spot welding device is configured to cause each of a pin member and a shoulder member to advance and retract, and is controlled by a tool driving control section. A press-fit reference point setting section sets a position where the pin member or the shoulder member contacts an object to be welded as a press-fit reference point, and the tool driving control section controls the position of the pin member with respect to the shoulder member on the basis of the press-fit reference point, thereby controlling the press-fit depth of a rotating tool press-fitted from the surface of the object to be welded. This achieves the excellent welding quality at suitable precision according to welding conditions especially in a double-acting friction stir spot welding method.

Abstract: A soldering system includes a track, a laying device, a boiler, a shelter, a transmission roller, a position sensor, a thermal radiation heating device, and a driving device. At least one hole is formed on the shelter, and a shape and a dimension of at least one hole on the shelter corresponds to a shape and a dimension of a DIP component. The transmission roller rotates the shelter according to a transmission speed of the track. The position sensor detects a position of a circuit board relative to the boiler. The thermal radiation heating device heats an area on a second surface of the circuit board different from a first surface adjacent to the DIP component through the at least one hole on the shelter continuously, so as to increase a temperature of the second surface when the first surface of the circuit board is passing through the boiler.

Abstract: A welding system having a traveling base carriage, a carriage positioning mechanism engaging the base carriage; and a ring gear assembly mounted on the base carriage. The ring gear assembly will include: (i) two half ring sections, each having at least one gear track; (ii) a ring gear mount attaching each of the half ring sections to the base carriage, where the ring gear mounts allow the half ring sections to separate and guide the half ring sections into mating engagement. The system further includes at least one weld head assembly mounted on the ring gear assembly. The weld head assembly includes: i) a welding torch; ii) a torch positioner, and iii) a position sensor.

Abstract: A chip mounting apparatus is provided with a drive control means. The drive control means is provided with a tool holder whereupon a tool for applying pressure to a chip is mounted, a holder supporting means for supporting the tool holder to be vertically moved, a drive means for vertically moving the holder supporting means, and a position detecting means for detecting a relative position of the tool holder to the holder supporting means. The drive control means controls the height and the pressurizing force of the tool, based on the position of the tool holder when the tool and the chip are one over another and brought into contact with a substrate. A chip mounting method is also provided. Short-circuit failures between adjacent solder bumps can be prevented and chips can be mounted with high yield and reliability.

Abstract: A conductive ball mounting apparatus and method for holding a conductive ball on the holding face, as has a suction port formed therein, of a holder head thereby to mount the held conductive ball, while interposing a flux therein, on a workpiece. After the end of the mounting action and before a next conductive ball is held, flux removing means for removing the flux adhered to the holding face is brought into abutment against the holding face of the holder head thereby to remove the flux from holding face.

Abstract: The present invention relates to a weight balancer (100) and a pipe joining method that is capable of reducing a load of pipes when arranging and welding the pipes in ships, plants, piping work sites and the like.

Abstract: A bonding apparatus including, on a supporting stand 12, two linear motors 130 and 140 and a bonding head supporting stage 114 which supports the bonding head 120 by means of fluid pressure so that the bonding head 120 is movable in the horizontal plane. The linear motors 130 and 140 respectively include driving sections 132 and 142 and movable coil assemblies 134 and 144. An arm 136 extending from the movable coil assembly 134 of the first linear motor 130 is fastened to the bonding head 120, and an arm 146 extending from the movable coil assembly 144 of the second linear motor 140 is engaged with the bonding head 120. A driving force aimed at the center of gravity of the bonding head 120 is applied to the bonding head 120 via the arms 136 and 146, so that the bonding head 120 is moved.

Abstract: The machine is adapted to supply, manipulate and position steel strip, fed from a coil, so as to bring it into gapped relationship beneath the side wall of a partly constructed, elevated tank. This is done so that the strip can be welded to the side wall to add a course. It is the objective to ensure that the tank wall is plumb (vertical) and in radius (both as to curvature and relative to the center of the tank) and that the width of the gap is optimized, at the weld point. The machine comprises a ‘floating’ main frame or platform suspended on a mobile undercarriage by four pivotally mounted cylinders. The cylinders are independently responsive to instruments monitoring the elevation, levelness and plumbness of the tank wall and the width of the gap. The main frame carries the coil and carries the strip and the tank wall in the vicinity of the weld point.

Abstract: The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing them onto the substrate, and a vision system adapted to view and obtain positional information of the substrate. Furthermore, a carrier is provided to which the vision system is mountable, such that operation of the vision system is decoupled from movement of the ball pick head. Drivers responsive to said positional information viewed by the vision system are operative to align at least the substrate and the ball pick head for depositing solder balls onto the substrate.

Abstract: A method and guidance system for accurately positioning a welding torch relative to a desired weld path. The method and system are based on ultrasonic sensing of information relating to the distance between the welding torch and surfaces on one or more components being welded, and then using this information to move the welding torch to a specific point in space relative to the desired weld path. The method and system maintain the welding torch over the weld path and at a predetermined distance from the weld path during movement of the torch along the weld path.

Abstract: In heat bonding method and device, first and second marks (MA, MB) formed on the film carrier (52) are measured before performing heat bonding of outer leads (54) formed on a film carrier (52) to electrodes (58) formed on a transparent plate (56), where an expansion amount of the film carrier (52) is changed according to a condition of the heat bonding. A distance between the measured marks (MA, MB) is then obtained. The condition for the heat bonding is determined based on this distance. The heat bonding is performed under this condition determined.

Abstract: A bump formation method and a bump forming apparatus for forming bumps on a semiconductor wafer. The apparatus includes a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is carried out continuously to the ICs included in one basic block. Position recognition to the other basic block is carried out only when the bump formation operation is shifted from one basic block to the other basic block. Thus, in comparison with the conventional art, in which the position recognition operation is carried out every time bumps are formed to each IC, the number of times of the recognition is greatly reduced, so that the productivity can be improved.

Abstract: A wire bonding device in accordance with the present invention is provided, which comprises: an XY table (2), a first holding member (8) supported by the XY table (2), a camera (9) supported by the first holding member (8), a second holding member (5) supported by the XY table (2), a capillary (7) held by the second holding member (5), a stationary base (3) for securing an object of bonding (4) in position, and a driving amount calculating unit (13) for computing the driving amount of the XY table (2) on the basis of the positional deviation of the camera (9) with respect to the origin of the XY table (2) due to temperature change in the first holding member (8) and the positional deviation of the capillary (7) with respect to the origin of the XY table (2) due to temperature change in the second holding member (5).

Abstract: A position-, speed- and force-controllable chip accessing apparatus comprises a fixing seat, a rotational direction moving device, a linear direction moving device, and a position sensing device, characterized in that a flexible positioning means is provided at a proper central site of said fixing seat and is screw fixed with said rotational direction moving device; one side of said rotational direction moving device is coupled with said linear direction moving device, while the other side of said rotational direction moving device is coupled with said position sensing device screw; and that by measuring with a speed sensor and a position sensing device on said linear direction moving device, the control of the force, speed and moving distance can be achieved.

Abstract: A die bonding device for installing electronic components S on a metal stem, comprising a bonding nozzle for suctioning an electronic component S and positioning the electronic component S on a component mounting face of the stem, a stem carrying head for carrying the stem, a heater section for heating the electronic component S while it is positioned on the component mounting face of the stem, and an imaging camera having a light axis L extending through the component mounting face of the stem when positioned inside the heater section, which performs reciprocating motion in the direction of the light axis L.

Abstract: A pressure gauge or monitor is attached to a soldering iron so that the pressure with which the iron is being applied can be precisely monitored. Such a pressure monitor on a soldering iron can be used to monitor the pressure applied with the soldering iron when forming a solder electrode on an anti-reflective film of a cathode ray tube. This allows such electrodes to be consistently and optimally formed for grounding the anti-reflective film.

Abstract: So as to perform high-precision position detection without performing pattern matching in the direction of rotation even when the object of detection involves a positional deviation in the direction of rotation, pattern matching between a reference image and a rotated image obtained by rotating this reference image is performed during registration, and then the difference between the measured value of the position obtained following rotation and the theoretical value of the position of the rotated image is retained as a calibration amount corresponding to the known angle of rotation. Upon detection, the measured value is detected by pattern matching between an image of the object of detection, which is detected by imaging the object of detection disposed in an attitude that includes a positional deviation in the direction of rotation, and a reference image; and this measured value is corrected by the calibration amount.

Abstract: To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.

Abstract: Two position detectors for a leading strip and two position detectors for the trailing strip are provided so as to be separated each other by a certain distance along each of the strips in a transferring direction of the strips to detect a deviation of a center line of each of the strips in a width direction of the strips with respect to a center line of a processing line. Two alignment devices for the leading strip and two alignment devices for the trailing strip, which are provided so as to be separated by a certain distance in the transferring direction, clamp each of the strips and adjust a position of each of the strips in the width direction in response to each of the detected deviations to align the center line of each of the strips with the center line of the processing line.

Abstract: In a ball mount apparatus for mounting balls on a work by means of a mount head, the work is disposed under the mount head and the mount head is provided with a Z-axis driving mechanism for driving the mount head only in an up/down direction. A ball tray for storing the balls is disposed at a height between the mount head and the work and provided with a driving mechanism for reciprocating between a ball sucking position under the mount head and a stand by position.

Abstract: A small-sized motor is employed by a driving unit of a welding equipment wherein the inner diameter of a rotary shaft of the motor can be reduced as much as possible, and the entire length of the driving unit is reduced. The driving unit of a welding equipment is provided with a pressure application shaft. The pressure application shaft is driven by a motor including a hollow rotary shaft, a screw shaft fixed inside the rotary shaft, and a nut provided integrally with or substantially integrally with the pressure application shaft, the nut being screwed with a screw provided on the screw shaft. The rotary shaft of the motor is substantially coaxially positioned with the screw shaft. Outer diameters of the nut and pressure application shaft are respectively smaller than an inner diameter of the rotary shaft to form a direct moving guide part.

Abstract: To provide parts soldering apparatus and method which improve the productivity during parts soldering and increase the mounting accuracy of parts on a circuit board. The parts soldering apparatus of the present invention has: a stage for positioning a circuit board whereon, the circuit board is mounted a solder tip whereon; a loading arm made of a light-transmitting material, for loading a part onto the solder tip; a fluctuating mechanism for pressing the loading arm toward the circuit board; and an optical source for irradiating light onto the part through the loading arm and for melting the solder tip by the conductive heat of the light irradiated onto the part.

Abstract: In wire bonding a semiconductor chip to the lead frame or other substrate, increase of productivity is achieved by letting the capillary which guides the wire between the wiring points (4, 5) move faster along its trajectory in the two travel stages (s1, s2). The capillary's drives in the horizontal (x, y) and vertical (z) directions are programmed by presetting the speed (vH) of the horizontal component of the movement and then calculating the vertical speed (vV) as a dependent variable based on the given trajectory. In determining said horizontal speed (vH) to be preset, the maximum horizontal and/or vertical acceleration values (aH*, aV*) associated with the drive mechanism are taken into account. Further time can be saved by letting the horizontal travel begin during the first travel stage (s1) and, by simultaneous vertical and horizontal travel, producing a steady transition (point k') from the first stage (s1) to the second (s2).

Abstract: An apparatus (400) used for indexing and affixing components to a substrate includes a vacuum conveyor and a controller (816) for controlling operation of the apparatus (400). The conveyor includes pallets (102), first and second tracks (414, 416), first and second motors (502, 503), a vacuum source, a plenum (110), and first and second elevators (404, 405). The pallets carry the substrate, while the first and second tracks guide the pallets. The first motor is used for driving a pallet in a first direction on the first track, while the second motor is used for driving a pallet in a direction opposite to the first direction on the second track. The plenum is coupled to the vacuum source and at least one pallet for applying adhering forces to the substrate. The first and second elevators are used for transferring a pallet between the first and second tracks.

Abstract: A wire bonding apparatus includes a frame, an X, Y, table, installed on the frame, including a linear stepping motor with a first stator and a first inductor, a transducer, pivotably installed on the X, Y table, to one end of which a capillary for bonding wire is installed, a first transferring portion installed to the frame to make the other end of the transducer ascend so that the capillary for wire bonding ascends, a second transferring portion installed on the X, Y table in front of the first transferring portion to, thereby, make the other end of the transducer ascend during bonding, and a first location detecting portion installed to the frame and the X, Y table to detect an amount of movement in the X and Y directions so that energy loss according to the driving of a head portion can be reduced.

Abstract: An apparatus is provided for use with a solderability testing machine to releasably engage a sample for immersion into a solder bath. The apparatus contains a pair of spring-loaded plates which serve to hold the sample so that only the desired portion of the sample may be dipped in the solder. The apparatus also carries a threaded, depth-controlling member which may be threadedly adjusted to precisely control the depth of immersion of the sample held by the holder into the sample bath.

Abstract: An apparatus for assembling workpieces in which an assembling work is performed includes a workpiece setting jig, a setting station including a workpiece setting apparatus for setting a first workpiece on the workpiece setting jig, an assembling station including an assembling unit for assembling a second workpiece with the first workpiece on the workpiece setting jig, a welding station including a welding unit for welding the first and the second workpieces together, a discharging station including a discharging unit for taking the welded workpieces out of the workpiece setting jig, a charging station provided in a position which faces the setting station as seen in the direction of sending and withdrawing the workpiece setting jig. The charging station, the assembling station, the welding station and the discharging station being arranged in a circular form.

Abstract: A pipe welding apparatus which utilizes a pair of welding electrodes which are at least ninety degrees spaced apart relative to a cylindrical workpiece. The welding procedure only occurs during movement of each welding electrode from an upper position to a lower position.

Abstract: An electronic circuit board rework and repair system having a carriage manually movable to successive station positions and having a table thereon movable along mutually orthogonal axes for positioning of a circuit board clamped to the table. At a first station, a circuit board is loaded onto the table, and a microscope can be swung into position for inspection of the loaded board. At a second station, an intended component or circuit board site can be aligned by way of a visual image of the component and site, and the table locked in position. At a third station, the selected component or circuit board site is automatically in alignment with a programmable heater for selected heating of the component contacts and removal of the component by a pickup probe associated with the heater. The system is calibrated such that there is alignment between a visually established position at the second station and that component position under the heater at the third station.

Abstract: A tool positioning system comprises a discontinuity detection means, such as an eddy current system, for detecting a discontinuity within a workpiece resulting from a joint between a first piece of material relative to a second piece of material, the discontinuity being detected from the back side of the second piece of material. The discontinuity is detected at a plurality of points by translating an eddy current probe over the back side of the second piece of material, the individual points thereafter being utilized to compute line elements that define the joint between the first and second pieces of material in a continuous fashion over the surface of the second piece of material. Thereafter a tool, such as a laser welding tool, is guided along the computed position along the backside of the second piece of material such that the first and second pieces of material are welded together along the joint.

Abstract: In order to ensure total bonding together of two-dimensional arrays of inm bumps on circuit boards, additional bumps are placed on each board in a triangular pattern which contains the array of that board. Opposing sets of thrusters are used to move the boards and their bumps toward each other, after the arrays are aligned with the boards juxtaposed and substantially parallel to each other. As corresponding sets of additional bumps touch each other, the set of thrusters moving the boards at those points hold their positions, until all sets of additional bumps are in touch; all of the thrusters of at least one board are then simultaneously energized until a predetermined pressure is achieved between the boards.