Abstract: A soldering apparatus for soldering a printed wiring board includes a solder vessel for containing molten solder, a nozzle disposed in the vessel and having opposing first and second opening, and an electromagnetic pump secured in the vessel and including a tubular member defining a solder flow path therein and having an inlet and an outlet connected to the second opening of the nozzle. The pump has cores and coils disposed at a position below the surface level of the molten solder and arranged to generate a moving magnetic field in the path when the coils are electrically energized, so that the molten solder is fed from the inlet to the outlet and is projected from the first opening of the nozzle to form a solder wave.

Abstract: Soldering apparatus designed to apply soldering, by means of jetting out streams of molten solder, which is gathered in a solder bath, to a piece to be soldered carried in a predetermined direction. While jetting out molten solder from the solder bath, a drive means in the apparatus supplies drive for setting the relative position between the end of the jet-stream nozzle and the piece and a control means also available outputs control signals matching a predetermined condition to the drive means to carry out micro-adjustment of the jet-stream nozzle in short time with high accuracy. At the same time, remote operation can also be performed.

Abstract: The present invention relates to a selective wave solder machine. In particular, it relates to a system for calibrating and adjusting process points to account for variations in machines and circuit boards. Vision systems are used to locate fiducials on the processing modules and the circuit boards. Differences between stored locations for fiducials relating to the circuit board and the processing modules are used to adjust the positions of stored process points to achieve improved performance.

Abstract: Selective gas knives for wave soldering provide for targeted gas flow at a particular location on a substrate, such as a printed circuit board. Both the temperature and flow rate of gas through a segment of a gas knife can be independently controlled.

Abstract: A method of soldering a circuit board comprises moving a circuit board through various stations including a preheater station and a solder station.

Abstract: When dross is removed from a molten-solder reservoir, a substantial amount of molten solder is often removed with the dross. This molten solder can be separated from the dross and returned to reservoir via a conduit for reuse. Additionally, a skimmer for removing the dross from the reservoir includes a skimming plate pivotally attached to a displaceable structure; a stop is provided to restrict the degree to which the skimming plate can pivot so that the skimming plate will not pivot more than 90° from vertical to enable the skimming plate to dig into the dross and collect dross when the displaceable structure is displaced toward on outlet of the reservoir. Further still, the displaceable structure of the skimmer can be controlled via a computer control system storing software code instructions for a motor to extend and retract the displaceable structure such that the skimming plate extends to a position further from the outlet port of the reservoir with each displacement cycle.

Abstract: The invention relates to a soldering apparatus, including a vessel for containing and heating molten solder, transporting means for transporting objects for soldering to the vessel and removing said objects, at least one tube extending substantially vertically above the soldering vessel, pump means for feeding molten solder to the underside of the tube, and moving means for moving into at least the vicinity of each other the underside of the printed circuit board for soldering and the upper side of the tube, wherein an outflow opening is arranged in each of the tubes at some distance from the upper side of said tubes. By arranging the outflow opening at some distance from the upper side of the tube the outflowing solder flow will no longer contact the printed circuit board and the components present thereon thus allowing more freedom in the design of the printed circuit board and the placing of the components thereon.

Abstract: A bath apparatus 12 reserves a liquid 13 as a heating medium and includes an input partition bath 31, a first intermediate partition bath 32, a heat partition bath 33, a second intermediate partition bath 34 and a removing partition bath 35 that are divided by gates 21 through 24 and sequentially arranged in a direction in which a printed board assembly where components are loaded onto a printed board moves. The temperatures of liquids 13-31 and 13-32 in the input partition bath 31 and the first partition bath 32 are a preheating temperature. The temperature of a liquid 13-33 in the heat partition bath 33 is a soldering temperature. The gate 21 is gradually opened while the printed board assembly 11 is located in the first intermediate partition bath 32 and before the printed board assembly 11 is conveyed into the heat partition bath 33.

Abstract: There is provided a method which can conveniently estimate a quality of a lead-free solder material used for a flow soldering process. In the present invention, a differential thermal analysis curve of a sample of the lead-free solder material is obtained by utilizing a differential thermal analysis method, and thereby a quality of the lead-free solder material used for a flow soldering process is estimated based on the obtained differential thermal analysis curve.

Abstract: A pedestalled LED 10 including a light emitting diode element 12 and a tower element 14 for use on the wave soldered side of a circuit board 16. The light emitting diode element 12 and the tower element 14 are capable of withstanding exposure to wave solder 22.

Abstract: A trough device in a soldering furnace comprises a motor, a soldering pot, support device, a trough part and transmission device. The support device connects with a fixing base of the motor via a micro adjustment device and an inclinometer for adjusting an inclining angle of the soldering pot and informing the adjusted inclining angle. A guidance part with double layer structure is located at the soldering pot and can receive the solder oxide residue falling down from the circuit board or spattered out from the soldering pot to prevent the solder oxide residue from flowing back to the trough part. The transmission device further comprises a transmission shaft, a shaft hub, a fan blade part and fixing plate assembly. The shaft hub surrounds the transmission shaft with bearings being disposed between the shaft hub and the transmission shaft. The fixing plate assembly is arranged at the lower end of the shaft hub and engages with the soldering pot by way of screw threads.

Abstract: A packaging method using lead-free solder, characterized by including a reflow-soldering step in which a surface mount device is soldered to a circuit board with a lead-free solder paste; an inserting step in which the lead or terminal of a insertion mount device is inserted into the circuit board; a step in which a warp preventing jig is attached to the circuit board; a flux applying step in which flux is applied to the foregoing circuit board; a preheating step in which, after applying flux, the lower surface of the circuit board is preheated; a flow-soldering step in which the upper surface of the circuit board the lower surface of which was preheated in the preheating step is heated, and by applying lead-free solder paste to the lower surface of the circuit board, the lead or terminal of the insertion mount device is flow-soldered to the circuit board; and a temperature controlling step where temperatures of both surfaces of a circuit board are adjusted, the upper surface of the circuit board is cooled or

Abstract: An adjustable nozzle of a stannic furnace comprises a nozzle tank which is mounted at the upper portion of a stannic tank of the stannic furnace, a front backflow stopper and a rear backflow stopper which are respectively mounted at the forward area and the backward area inside the nozzle tank to form an opening of the nozzle such that a liquid tin within the stannic tank passes through the nozzle tank and produces a tin wave at the opening of the nozzle. The feature of the adjustable nozzle lies in that the rear backflow stopper is mounted at the backward area inside the nozzle tank by means of a rear combining means which adjusts the altitude of the rear backflow stopper with an altitudinal opening and fixes the rear backflow stopper by a fixing means so as to control the waveform of the tin wave produced by the nozzle of the stannic furnace.

Abstract: A trough device in a soldering furnace comprises a motor, a soldering pot, support device, a trough part and transmission device. The support device connects with a fixing base of the motor via a micro adjustment device and an inclinometer for adjusting an inclining angle of the soldering pot and informing the adjusted inclining angle. A guidance part with double layer structure is located at the soldering pot and can receive the solder oxide residue falling down from the circuit board or spattered out from the soldering pot to prevent the solder oxide residue from flowing back to the trough part. The transmission device further comprises a transmission shaft, a shaft hub, a fan blade part and fixing plate assembly. The shaft hub surrounds the transmission shaft with bearings being disposed between the shaft hub and the transmission shaft. The fixing plate assembly is arranged at the lower end of the shaft hub and engages with the soldering pot by way of screw threads.

Abstract: An apparatus for locally applying solder to a plurality of sets of preselected conductive areas on each printed circuit board to which component leads are joined. The apparatus includes a flux station with flux nozzles, a preheater station, and a wave solder station with solder nozzles, arranged in line to receive and process printed circuit boards. The flux nozzles and the solder nozzles are arranged in a pattern identical to that of the preselected conductive areas on each of the board. A conveyor system is arranged to simultaneously transporting the boards from one station to another.

Abstract: A method for separating dross floating on solder into solder and a residue, comprising of repeatedly cutting through the dross with at least one knife extending substantially parallel to the direction of movement and removing the residue from the solder. The invention also relates to an apparatus for separating dross floating on solder present in a vessel into solder and a residue, wherein the apparatus comprises at least one knife which is movable along a path extending through the vessel, and wherein the at least one knife is adapted to cut through the dross during the movement along the path. Due to the above stated cutting operation the units of the dross formed by nuclei of solder enveloped by metal oxides are destroyed, whereby the solder enveloped by metal oxides are destroyed, whereby the solder is released and added to the solder already present in the bath, and the released metal oxide will float on the solder. A considerable volume and mass reduction of dross to metal oxide herein takes place.

Abstract: An automated soldering apparatus includes a conveyor for transporting a printed circuit board along a predetermined path, a fluxer located below the conveyor for coating the circuit board and the electronic components with flux, and a preheater located downstream of the fluxer for heating the circuit board and the electronic components to a predetermined temperature. A molten solder bath is provided downstream of the preheater for applying a molten solder to selected areas of the circuit board. A cooling assembly is arranged downstream of and adjacent to the molten solder bath. The cooling assembly is operable to cool the applied molten solder at a rate of approximately as high as 1.0° C. per second until the molten solder reaches its solidus temperature.

Abstract: A soldering apparatus for soldering a printed wiring board, including a solder vessel for containing a molten solder, a nozzle disposed in the vessel and having a first opening and a second opening, and an electromagnetic pump secured in the vessel and including a tubular member defining a solder flow path therein and having an inlet and an outlet connected to the second opening of the nozzle. The pump has cores and coils disposed at a position below the surface level of the molten solder and arranged to generate a moving magnetic field in the path when the coils are electrically energized, so that the molten solder is fed from the inlet to the outlet and is projected from the first opening of the nozzle to form a solder wave.

Abstract: A system and method for providing via-hole filling for microelectronic interconnections, is disclosed. Gallium metal is melted and mixed with a measured amount of copper and nickel, thereby creating a gallium alloy. Via holes are drilled within a substrate and filled with the gallium alloy. Excess gallium alloy is removed from the substrate. The substrate, having the filled via-holes therein, is then cured within the temperature range of room temperature to approximately 200 degrees Celsius. The gallium alloy may also be used for printing interconnect lines on a board surface.

Abstract: The present invention discloses an apparatus applied to the wave former of the wave soldering system to increase the wave height of molten solder. The apparatus comprises a block board and a gland, wherein the block board is mounted on the enclosing walls of the wave former to increase the total height of enclosing walls thereof for increasing the wave height, and the gland is disposed on the partial opening of the wave former to press the molten solder for have higher solder wave on other partial opening of the wave former uncovered by the gland.

Abstract: This invention relates to a packaging method using lead-free solder, characterized by including a reflow-soldering step in which a surface mount device is soldered to a circuit board with a lead-free solder paste; an inserting step in which the lead or terminal of a insertion mount device is inserted into the circuit board; a step in which a warp preventing jig is attached to the circuit board; a flux applying step in which flux is applied to the foregoing circuit board; a preheating step in which, after applying flux, the lower surface of the circuit board is preheated; a flow-soldering step in which the upper surface of the circuit board the lower surface of which was preheated in the preheating step is heated, and by applying lead-free solder paste to the lower surface of the circuit board, the lead or terminal of the insertion mount device is flow-soldered to the circuit board; and a temperature controlling step where temperatures of both surfaces of a circuit board are adjusted, the upper surface of the

Abstract: An automatic wave soldering apparatus includes a solder reservoir for holding a supply of molten solder and a solder nozzle vertically disposed in the solder reservoir to establish a solder wave through which a printed circuit board is moved. A pair of trapezoidal elements are secured within the nozzle. A Y-shaped baffle is disposed between the trapezoidal elements to form upwardly inclined narrowed upstream and downstream outlets. The upstream and downstream outlets are inclined at an acute angle against and in the direction of movement of the printed circuit board, respectively. A pair of valves are disposed at opposite sides of the baffle to selectively open and close the outlets. The bottom side of each of the trapezoidal elements forms a step to promote turbulence in the solder wave. The trapezoidal elements and the baffle collectively serve to increase the flow velocity of the molten solder through the outlets.

Abstract: To provide a solder jet machine with which a molten solder wave with stable height can be obtained. A satisfactory and stable molten solder wave is obtained by forming wall portions surrounding solder ejecting ports, which are arranged in a first, a second and a third ejecting-port rows on a solder wave forming plate, in such a manner that they are allowed to project upwardly, in addition, by forming groove portions, which are for introducing the ejected solder in such a direction as to be allowed to flow down, around the above-described solder ejecting ports, so that the molten solder ejected from the solder ejecting ports in the third row and the second row can flow down rapidly between adjacent solder ejecting ports in the first row without disturbing any wave of the molten solder ejected from the first row.

Abstract: An automatic soldering apparatus comprises a solder bath, and a plurality of component parts such as a jet flow nozzle, bolts, nuts and washers equipped in the solder bath, wherein a relative density of such component parts equipped in the solder bath of the automatic soldering apparatus is smaller than that of lead-free solder to be used in the automatic soldering apparatus. Preferably each piece of the component parts are made of titanium material or ceramic material having relative density of around 4.5. Further the lead-free solder includes 2.5 weight % of silver, 0.5 weight % of cupper, 1.0 weight % of bismuth, and tin for the rest, and having a relative density of around 7.5. Accordingly, in case of dropping the piece of components parts into the melting solder, the dropped piece can float on the melting solder without breaking the apparatus.

Abstract: A delivery system a soldering paste to an electronics package includes a pressurized supply of via fill paste and a pressure head attached to the pressurized supply of via fill paste. The pressure head includes a main body and a wear portion. Attached to the wear portion is a gasket positioned along one surface of the pressure head. The pressure head also includes a flow dispersion regulator which includes a feed tube positioned within the main body, the feed tube has a plurality of flow regulating openings. The flow regulating openings in the feed tube are sized to maintain a substantially constant pressure at each of the flow regulating openings. Positioned between the main body and the wear portion is a flow equalization grid. The flow equalization grid includes a multiplicity of openings. Attached to the wear element is a gasket. The pressure source preferably includes a ram press.

Abstract: Apparatus for use in wave soldering applications can include an adjustable wing device, a front gate and/or a mounted member. Each of these components are easily adjustable, thereby improving the quality of the soldered product and allowing for improved process efficiency and decreased downtime of the wave soldering equipment.

Abstract: The invention relates to a machine for wave soldering or tinning comprising a solder reservoir (9); means that can form at least one solder wave with a so-called laminar form (8b); a conveyor system (2) that can bring a piece (1) to be soldered or tinned into contact with said laminar wave; and means for injecting (12) a gas in the vicinity of the wave; characterized in that the said injection means includes an injector located in a position adjacent to and downstream from the wave and provided with a wall (17) facing the solder wave, wherein the wall of the injector has at least a first group (15) of openings positioned so as to provide a first gas jet directed toward the flat surface of the solder wave.

Abstract: A method of soldering a circuit board comprises moving a circuit board through various stations including a preheater station and a solder station.

Abstract: In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.

Abstract: The invention relates to a gas distribution system which can be connected to a gas supply, the purpose of said gas distribution system being to admit and distribute a non-oxidizing gas in a shroud (17, 20, 21, 23) covering at least one solder container (22). Printed circuit modules (12) are transported through said shroud and while they are being transported, are brought into contact with a wave of solder (24). The gas distribution system has at least one gas distributor situated above and at least one gas distributor (19, 31) situated below the printed circuit modules (12) in order to produce a protective gas atmosphere with low residual oxygen values. Both gas distributors are provided with flow elements (48, 49, 51 to 56, 59; 35, 37, 44, 45). Said flow elements produce a displacement gas blanket which is distributed homogeneously over the discharge surfaces (59, 44, 45) directed towards the solder container.

Abstract: An automatic wave soldering apparatus includes a solder reservoir for holding a supply of molten solder and a solder nozzle vertically disposed in the solder reservoir to establish a solder wave through which a printed circuit board is moved. A pair of trapezoidal elements are secured within the nozzle. A Y-shaped baffle is disposed between the trapezoidal elements to form upwardly inclined narrowed upstream and downstream outlets. The upstream and downstream outlets are inclined at an acute angle against and in the direction of movement of the printed circuit board, respectively. A pair of valves are disposed at opposite sides of the baffle to selectively open and close the outlets. The bottom side of the trapezoidal elements forms a step to promote turbulence in the solder wave. The trapezoidal elements and the baffle collectively serve to increase the flow velocity of the molten solder through the outlets.

Abstract: A wave soldering apparatus includes a frame having a first end and wave solder equipment supported with respect to the frame. The wave solder equipment is configured to apply solder to a circuit board. A circuit board transporter is supported with respect to the frame, and is configured to receive a circuit board adjacent the first end of the frame, to move the circuit board away from the first end of the frame and over the wave solder equipment which applies solder to the circuit board, and to return the circuit board for retrieval adjacent the first end of the frame.

Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by means of a lead-free solder material, wherein the molten solder material is supplied and attached to a predetermined portion of the board in a solder material supplying zone, and thereafter the board is cooled by a cooling unit in a cooling zone such that the solder material adhering to the board is rapidly cooled to solidify.

Abstract: A carriage for a printed circuit board in a soldering apparatus has clamps which clamp opposite edges of the board to hold it during transport. As the carriage is lowered to a board delivery station, the clamp members are opened automatically. The board is slid between the clamp members and the carriage then raised, allowing the clamp members to close on the board.

Abstract: A first electromagnetic induction pump is disposed in a first reservoir, and a second electromagnetic induction pump is disposed in a second, independent, reservoir. Each reservoir is adapted to contain molten brazing filler metal. The electromagnetic induction pumps are effective to eject the brazing filler metal upward through wave forming portions into contact with an underside of a workpiece being conveyed along a workpiece conveyance path. The second reservoir is disposed downstream of the first reservoir in the direction of conveyance. At least one of the first and second reservoirs include a height adjusting device which permits adjusting the relative heights of the wave forming portions to adapt to the needs of the workpiece. The apparatus may be adapted to contain an intermediate space and an intermediate processing device between the reservoirs.

Abstract: Soldering apparatus designed to apply soldering, by means of jetting out streams of molten solder, which is gathered in a solder bath, to a piece to be soldered carried in a predetermined direction. While jetting out molten solder from the solder bath, a drive means in the apparatus supplies drive for setting the relative position between the end of the jet-stream nozzle and the piece and a control means also available outputs control signals matching a predetermined condition to the drive means to carry out micro-adjustment of the jet-stream nozzle in short time with high accuracy. At the same time, remote operation can also be performed.

Abstract: A soldering apparatus has a solder container and a casing to accommodate a protective-gas atmosphere for soldering printed circuit boards. During transport of the circuit boards through a casing the circuit boards are brought into contact with a solder wave in the container. The casing has an inlet for printed circuit board on an inlet side and an outlet on its outlet side. In addition, the casing has a supply of non-oxidizing gas and an arrangement for admitting gas into the casing. The casing is designed as a modular construction kit having subassemblies and/or constructional elements which comprise an input tunnel, an entry tunnel, at least two covering elements, an outlet tunnel and a detachable connection on the solder container and/or the sub-assemblies and/or constructional elements to connect the sub-assemblies and/or constructional elements and the solder container.

Abstract: A soldering apparatus is adapted for making solder connections to through-hole technology components on substantially surface mount technology printed circuit boards. Lifter assemblies raise and lower solder pump assemblies. Solder pump assemblies in turn each support a nozzle support assembly. Each nozzle support assembly in turn supports either a nozzle assembly or a wave nozzle assembly. In operation, a nozzle assembly having a solder discharge configuration indicated by, and compatible with, the pin configuration of the component to be soldered is raised by the appropriate lifter assembly. Where no nozzle assembly is appropriate for the configuration of the component to be soldered, a wave nozzle assembly is raised, and the PCB moved into position adjacent to the wave nozzle assembly.

Abstract: An automated soldering apparatus includes a conveyor for transporting a printed circuit board along a predetermined path, a fluxer located below the conveyor for coating the circuit board and the electronic components with flux, and a preheater located downstream of the fluxer for heating the circuit board and the electronic components to a predetermined temperature. A molten solder bath is provided downstream of the preheater for applying a molten solder to selected areas of the circuit board. A cooling assembly is arranged downstream of and adjacent to the molten solder bath. The cooling assembly is operable to cool the applied molten solder at a rate of approximately as high as 1.0° C. per second until the molten solder reaches its solidus temperature.

Abstract: An apparatus and method for manufacturing solder balls used for an electrical and/or mechanical connection between a semiconductor chip and a substrate are provided. The apparatus includes a melting furnace having a nozzle through which a molten solder paste flows and drops, for producing solder balls; a vibrating mechanism attached to the nozzle of the melting furnace, for applying vibration to the nozzle; and a vibration controlling mechanism for controlling the vibration frequency of the vibrating mechanism to adjust the size of the solder balls dropped from the nozzle. The method includes the steps of setting a vibration frequency according to a desired solder ball size, applying vibration to a nozzle with the set vibration frequency, making the molten solder paste flow through the nozzle to manufacture solder balls of a predetermined size according to the vibration frequency, and measuring the size of the manufactured solder balls.

Abstract: The invention relates to a machine for wave soldering or tinning comprising

Abstract: An improved method of manufacturing a piezoelectric element and an improved piezoelectric element are provided. The improved method comprises the steps of causing a gas discharge in a predetermined discharge gas at approximately atmospheric pressure and generating an excited active species of the discharge gas as a result of the gas discharge. Then, at least one of a connecting surface of an electrode formed of a piezoelectric piece on a piezoelectric resonator and a connecting portion of a lead terminal are exposed to the excited active species, whereby the exposed connecting portions are surface treated. Finally, the electrode and the lead terminal are connected together, and at least the electrode and the lead terminal are sealed in a case. The improved piezoelectric element is formed by this process and uses less solder and is more stable than prior art piezoelectric elements.

Abstract: The invention provides a new and improved process and exothermic reaction mixture for producing molten weld metal. The molten weld metal is used in joining one metallic piece with at least one other metallic piece. The process and exothermic reaction mixture have distinct advantages over the prior art. These advantages include a higher filler metal yield, an increased tensile strength, and a higher quality corrosion resistant weld. These advantages are accomplished by a process wherein a reactant mixture is provided which has a reducing agent, a metallic compound, and at least two filler metals that at least in part do not chemically react with the metallic compound, one of which is aluminum. The metallic compound subsequently forms, with the reducing agent, having a high heat of formation which provides an exothermic reaction with sufficient heat to melt the filler metals.

Abstract: In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.

Abstract: Apparatus for use in wave soldering applications can include an adjustable wing device, a front gate and/or a mounted member. Each of these components are easily adjustable, thereby improving the quality of the soldered product and allowing for improved process efficiency and decreased downtime of the wave soldering equipment.

Abstract: A wave soldering apparatus includes a solder reservoir adapted to contain molten solder, and a solder nozzle disposed in the solder reservoir and extending up above the molten solder. The nozzle provides a substantially turbulent free solder wave under a printed circuit board while the board is moved in a predetermined path. A tray is pivotably mounted to the nozzle and angularly moved to vary the flow rate of the molten solder. A shroud is mounted adjacent to and associated with the tray to define a contained space into which an inert gas is supplied to provide an inert gas atmosphere. The shroud includes a canopy extending over a portion of the tray. The canopy extends substantially parallel to the predetermined path and is adjustably positioned in response to angular position of the tray to ensure that the board exits from the solder wave within the inert gas atmosphere.

Abstract: In a soldering method for soldering a thermit case 26 and a pair of bus bars 11a, 19a to be electrically connected to the thermit case 26, a portion to be heated P of the thermit case 26 which is spaced from the respective bus bars 11a, 19a by an approximately equal distance is heated by a gas burner 71, and solders are simultaneously supplied from solder wire supply portions 75a, 75b to a pair of solder joining faces 22 for joining the thermit case 26 and the pair of bus bars 11a, 19a, after the portion to be heated P has been heated. The temperatures of the pair of solder joining faces 22 are made substantially equal to each other by heating the portion to be heated P so that solders are simultaneously supplied to the pair of solder joining faces 22.

Abstract: In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.

Abstract: In a flow soldering apparatus, a substrate is clamped by a pair of nails of a chuck mechanism and transferred over a molten solder barrel while being held in contact with a molten solder. The nails are held resiliently to each other, so that the substrate is allowed to expand thermally between the nails without bowing. The chuck mechanism has a scraper nail which extends transversely over the entire lateral length of the substrate at the front side of the substrate in a substrate transfer direction to push away an oxide film formed on the molten solder. The chuck mechanism is constructed to allow the molten solder to enter underneath the substrate in the lateral direction with respect to the substrate transfer direction. After completing one soldering operation, the nails change the set of the opposing two sides to another set of two opposing sides of the substrate, so that the substrate is subjected to the soldering operation from a direction different from the preceding soldering operation.

Abstract: In a jet soldering method, a substrate is held by an actuator and pre-heated by a pre-heater. The pre-heater has a shield member or the substrate is swung to equalize temperature distribution in the substrate. The substrate is then transferred over a primary jet soldering bath while dipping a treatment surface of the substrate in a primary solder jet, so that solder stick to the treatment surface of the substrate. Then, the substrate is transferred over a secondary jet soldering bath while dipping the treatment surface in a secondary solder jet, so that the solder sticking to the substrate is shaped. The transfer conditions of the substrate are differentiated between transfers over the primary jet soldering bath and the secondary jet soldering bath.