Abstract: A fabrication method of a flexible electronic device is provided. A flexible substrate is placed directly on a rigid substrate. A portion of an edge of the flexible substrate is heated, such that the heated portion of the edge of the flexible substrate constitutes a melted edge. An electronic element is formed on the flexible substrate and located in an area region surrounded by the melted edge. A separation process is performed, such that the melted edge is separated from the flexible substrate to form a flexible electronic device.

Abstract: A surgical instrument includes an end effector extending along a jaw centerline. A staple cartridge is received in the end effector. The staple cartridge includes deck, staples, a wedge sled, and a driver assembly. The staples are positioned in respective openings formed through the deck. The wedge sled is slidable through the staple cartridge. The driver assembly has a first driver and a second driver. The first driver receives a first staple of the plurality of staples. The second driver receives a second staple of the plurality of staples. The driver assembly is configured to be engaged by the wedge sled sliding toward the distal sled position and thereby be forced toward a first jaw of the end effector, thereby forcing the first and second staples toward an anvil of the first jaw for formation in tissue. The driver assembly is positioned along the centerline.

Abstract: A support structure for a light-emitting diode utilizes the configuration of a sacrifice structure to achieve safe separation of a light-emitting diode from a carrier substrate. Specifically, when an external force is applied on the light-emitting diode or the carrier substrate, a breaking layer of the sacrifice structure is the first layer to be broken, so that the light-emitting diode and carrier substrate will become separated from each other.

Abstract: A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The body portion defines a non-contact region adjacent the contact region. The bonding tool also includes a heat resistant coating applied to the non-contact region.

Abstract: A dual heat transfer assembly includes upper and lower heat transfer elements received in a separator channel of a port separator of a receptacle cage. The upper heat transfer element includes an upper thermal interface extending into an upper module channel to interface with an upper pluggable module. The lower heat transfer element includes a lower thermal interface extending into a lower module channel of the receptacle cage to interface with a lower pluggable module. The heat transfer elements include inner ends located in the separator channel. The heat transfer elements include biasing members engaging the heat transfer elements and biasing the heat transfer elements into thermal engagement with the pluggable modules.

Abstract: The present disclosure provides a flexible display panel and a method of manufacturing the same. The method includes: manufacturing a flexible substrate; performing a cutting at a position between at least two adjacent flexible chip bonding regions to form a strip slit or hollowed region to structurally separate and space the at least two adjacent flexible chip bonding regions; attaching a backing film and cutting away a portion of the back film at the position corresponding to the strip slit or hollowed region; and bonding a flexible chip with a printed circuit on the flexible chip. Embodiments of the present disclosure also provide a flexible display panel.

Abstract: An optical device includes a housing part that includes an open window disposed inside the housing part, an optical element into which light enters via the window, and a window glass plate that blocks the window. The window glass plate includes a light-transmissive base material and a metal coating film provided on an outer peripheral part of the light-transmissive base material. The window glass plate is fixed to the housing part with a solder layer provided between the metal coating film and the housing part. The housing part includes an edge part located toward the window, and the edge part includes an overhanging part that protrudes further than an inner peripheral-side edge part of the metal coating film in a direction toward a center part of the window.

Abstract: Co-planarity adjustment systems and methods, gantries capable of applying high force without imposing moment loads to their bearings, systems and methods for achieving rapid heating and cooling and efficient slidable seal systems capable of sealing a chamber and injecting one or more fluids into the chamber as well as actively recovering portions of such fluid which have migrated into the seal itself are disclosed in the context of thermo-compression bonding systems, apparatuses and methods, although many alternative uses will be apparent to those of skill in the art.

Abstract: A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.

Abstract: A cathode electrode, cathode pad electrodes, cathode wiring electrodes, an anode electrode, an anode pad electrode, and an anode wiring electrode are disposed on the surface of a vertical-cavity surface-emitting laser device. A light-emitting-region multilayer portion having active layers sandwiched by clad layers and DBR layers is formed directly below the anode electrode. A region where the light-emitting-region multilayer portion is formed serves as a light-emitting region. The light-emitting region is positioned closer to one end of the first direction than is a suction region onto which a flat collet sucks with respect to the first direction, in such a way that the light-emitting region is substantially in contact with or spaced a predetermined distance from the suction region.

Abstract: A package structure includes a lead frame, a selective-electroplating epoxy compound, conductive vias and a patterned circuit layer. The lead frame includes a metal stud array having metal studs. The selective-electroplating epoxy compound covers the metal stud array. The selective-electroplating epoxy compound includes non-conductive metal complex. The conductive vias are directly embedded in the selective electroplating epoxy compound to be respectively connected to the metal studs and extended to a top surface of the selective-electroplating epoxy compound. Each of the conductive vias includes a lower segment connected to the corresponding metal stud and an upper segment connected to the lower segment and extended to the top surface, and a smallest diameter of the upper segment is greater than a largest diameter of the lower segment. The patterned circuit layer is directly disposed on the top surface and electrically connected to the conductive vias.

Abstract: A die bonding device includes: a wafer holder supporting a wafer where a die is formed; an ejector holder disposed at the wafer holder below the wafer and supporting a die ejector that assists separating the die from the wafer; a support unit supporting a substrate where the die is to be attached; a bonding unit that picks up the die from the wafer and attaches the picked-up die to the substrate; an ejector buffer unit that receives the die ejector; and a replacing unit that transfers the die ejector between the ejector holder and the ejector buffer unit.

Abstract: A through-type furnace for substrates comprises a furnace with a channel and a transport system for the transport of the substrates through the channel. The channel is bounded by a base, a front side wall, a rear side wall and a top part. The base contains a plurality of first holes which are connectable to a protective gas source so that protective gas can be supplied during operation. The front side wall of the channel comprises a longitudinal slit which extends parallel to the passage direction and which is bounded by a bottom edge and an upper edge. The transport system comprises at least one clamp for transporting the substrates through the channel. The clamp is movable back and forth along the longitudinal slit of the channel. Such a through-type furnace is in particular suitable for use in a soft solder die bonder.

Abstract: Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards.

Abstract: A method of manufacturing an LED light bar comprises: providing a reflow oven and a clamping device mounted on a transmitting belt of the reflow oven, the reflow oven comprising a heating area and a cooling area; providing a semi-finished LED light bar comprising a printed circuit board and a plurality of LEDs arranged on the print circuit board with solder paste applied between the LEDs and the printed circuit board, and mounting the semi-finished LED light bar in the clamping device; and starting the reflow oven and thus the transmitting belt carrying the clamping device and the semi-finished LED light bar moving together to pass through the reflow oven, whereby the solder paste is firstly melted in the heating area and then solidified in the cooling area to fix the LEDs on the printed circuit board to form the LED light bar.

Abstract: A clamping module for a pipe line-up system uses bell crank linkages to transmit pipe alignment and clamping forces between radially moving clamping feet and a central axially moving driving head. The clamping feet are arranged in axially spaced sets to internally engage two pipe sections to be welded independently on either side of a weld zone between the pipe sections, with welding shoes in between the clamping feet and spanning the weld zone. The bell crank linkages provide a force multiplier between the driving heads and the clamping feet.

Abstract: In a heat insulating load jig 11 of the present invention, a solder material 14 having a melting point or a solidus temperature in a range between a thermal resistance temperature of a semiconductor chip 13 and a temperature 100° C. below the thermal resistance temperature is interposed between a circuit board 12 and the semiconductor chip 13; a heat insulating body 17 is placed on an upper side of the semiconductor chip 13 in this state; a metal weight 16 is disposed on the heat insulating body 17; and load is applied to the semiconductor chip 13 while the solder material 14 is melted and solidified.

Abstract: A laser welding tool comprises a first and a second tool part for fixing a first welding article to a second welding article. The two welding articles are arranged at least partially between the two tool parts. The second tool part comprises at least two partial elements which are displaceable independently of one another toward the first tool part for pressing the second welding article against the first welding article.

Abstract: Devices and methods for assembling co-planar electrical contacts in a connector are provided herein. In one aspect, an exemplary method of assembly comprises depositing solder in a connector plug enclosure, positioning electrical contacts on the solder deposits, advancing the hotbar toward the enclosure contacting each of the electrical contacts so as to planarize a top surface of each of the electrical contacts with the enclosure and melting the solder with the heated hotbar to solder the electrical contacts to the enclosure. In one aspect, an exemplary hotbar device includes a magnet for releasably coupling the electrical contacts to the hotbar. In another aspect, the hotbar includes metallic portions for heating the electrical contacts and insulated ceramic portions for contacting the enclosure. In another aspect, an electrically conductive hotbar includes side portions that extend away from the bottom heating surface facilitating more uniform current flow through the hotbar.

Abstract: An element pressing apparatus includes: a base casing having first and second bases couplable to or separable from each other to form an arrangement space where a board and a plurality of electronic components having different heights are arranged while the first and second bases are coupled to each other; oil encapsulated in the arrangement space; an oil seal member deformed depending on a pressure of the oil; and a hydraulic pressure change portion that changes the pressure of the oil, wherein the pressure of the oil changes by the hydraulic pressure change portion to press the oil seal member to a plurality of electronic components and press the electrode terminals against the electrodes when the board and a plurality of electronic components are arranged in the arrangement space by positioning and placing each of the electrode terminals on each of the electrodes.

Abstract: A flip chip assembly apparatus includes at least one warpage-suppressor assembly. Each warpage-suppressor assembly can include a side heater, a deformable material pad, and an actuator assembly for moving the side heater and the deformable material pad. Each side heater provides additional heat to peripheral solder balls during bonding of two substrates, thereby facilitating the reflow of the peripheral solder balls. Each deformable material pad contacts, and presses down on, a surface of one of the two substrates under bonding. The deformable material pad(s) can prevent or minimize warpage of the contacted substrate.

Abstract: A method for manufacturing a semiconductor device, includes preparing a solder, a soldering article, a base material, a weigh having a foot where a center of gravity of the weight is shifted from a center of the soldering article, a positioning jig having a hole for holding the soldering article in the base material, and a dam member; disposing the dam member on a side having a relatively lower height due to a warp of an edge portion of the base material; placing the positioning jig on a principal surface of the base material; placing the soldering article on the solder in the hole; placing the weight on an upper surface of the soldering article to position the center of gravity on the side having relatively lower height; and raising the temperature of the solder to a temperature equal to or higher than the melting point of the solder.

Abstract: An element pressing apparatus includes: a base casing having first and second bases couplable to or separable from each other to form an arrangement space where a board and a plurality of electronic components having different heights are arranged while the first and second bases are coupled to each other; oil encapsulated in the arrangement space; an oil seal member deformed depending on a pressure of the oil; and a hydraulic pressure change portion that changes the pressure of the oil, wherein the pressure of the oil changes by the hydraulic pressure change portion to press the oil seal member to a plurality of electronic components and press the electrode terminals against the electrodes when the board and a plurality of electronic components are arranged in the arrangement space by positioning and placing each of the electrode terminals on each of the electrodes.

Abstract: A device and method for minimizing the forces that may compromise a lead frame mount to a support structure in an integrated circuit die package during various packaging method steps. When a window clamp is used to provide pressure during a lead frame bonding step or during a wire bonding step during packaging, the vertical force applied by the window clamp may be transferred in lateral direction by the physical contour of the top plate of the support structure. By changing the physical contour of the top plate of the support structure, such as by disposing a specific kind of contoured protrusion, one may minimize or eliminate the lateral forces that act against achieving a solid bond of the lead frame to the support structure. Further, during wire bonding, the same minimization or elimination of lateral forces lead to improved wire bonding.

Abstract: A head gimbal assembly (HGA) carrier comprises a body; an HGA mounting location on the body to mount an HGA mounting member to the body; and an adjustable protective bar coupled to the body, the adjustable protective bar being moveable from a first position to a second position to provide access to an HGA mounted on the HGA mounting member.

Abstract: The present invention relates to an ultrasonic soldering tool for soldering wires to a solder tab of an electrochromic device located between the layers of an insulated glass unit. The soldering tool includes an ergonomically designed handle and soldering tip head to increase operator comfort during use while also providing features to ensure that the surface of the insulated glass unit is not contacted by the soldering tip. One embodiment of the invention provides an automatic feed soldering tool which may have a soldering tip with a trough to create an ideal solder joint. The invention also includes a clamp for securing a wire to a substrate in a correct position while serving as a guide for the soldering tool to provide further protection from errant contact between the soldering tip and the insulated glass unit. The invention also includes a method of creating an ideal solder joint.

Abstract: A lead frame support plate 200 and a window clamp 400 for wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plate 200 includes a network of suction grooves 218 provided on a support surface 212, each suction groove 218 being arranged to be in fluid communication with at least a vacuum hole 216 to enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamp 400 having slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.

Abstract: Some exemplary implementations of this disclosure pertain to an integrated circuit package that includes a substrate, a first die and a second die. The substrate includes a first set of traces and a second set of traces. The first set of traces has a first pitch. The second set of traces has a second pitch. The first pitch is less than the second pitch. In some implementations, a pitch of a set of traces defines a center to center distance between two neighboring traces, or bonding pads on a substrate. The first die is coupled to the substrate by a thermal compression bonding process. In some implementations, the first die is coupled to the first set of traces of the substrate. The second die is coupled to the substrate by a reflow bonding process. In some implementations, the second die is coupled to the second set of traces of the substrate.

Abstract: A soldering fixture is disclosed having a unitary base member configured to maintain a printed circuit board and an electrical connector in a particular orientation during soldering. The unitary base member includes a lateral channel dimensioned to maintain a plurality of wire leads associated with the electrical connector in a spaced relationship with the printed circuit board. The unitary base member further includes a wire alignment tool configured to align the plurality of wire leads in the particular orientation such that the plurality of wire leads are in juxtaposition with a plurality of solder pads affixed to one or more surfaces of the printed circuit board.

Abstract: The described embodiment relates generally to the field of inductive bonding. More specifically an inductive heater designed for use in assembling electronics is disclosed. A number of methods for shaping a magnetic field are disclosed for the purpose of completing an inductive bonding process without causing harm to unshielded adjacent electrical components.

Abstract: Devices and methods for assembling co-planar electrical contacts in a connector are provided herein. In one aspect, an exemplary method of assembly comprises depositing solder in a connector plug enclosure, positioning electrical contacts on the solder deposits, advancing the hotbar toward the enclosure contacting each of the electrical contacts so as to planarize a top surface of each of the electrical contacts with the enclosure and melting the solder with the heated hotbar to solder the electrical contacts to the enclosure. In one aspect, an exemplary hotbar device includes a magnet for releasably coupling the electrical contacts to the hotbar. In another aspect, the hotbar includes metallic portions for heating the electrical contacts and insulated ceramic portions for contacting the enclosure. In another aspect, an electrically conductive hotbar includes side portions that extend away from the bottom heating surface facilitating more uniform current flow through the hotbar.

Abstract: In aspects of the assembly jig and method of the invention, when a packaging substrate is curved concaving upward at temperatures of melting solder, the gap between the assembly jig and the packaging substrate can be made smaller than the dimension of the sum of the thickness of the semiconductor chip and the thickness of the melted solder by allowing a part of the bottom surface of the chip positioning piece to become always, or substantially always, in contact with the upper surface of the packaging substrate owing to the weight of the chip positioning jig itself. As a consequence, the semiconductor chip does not slip aside out of the opening of the chip positioning piece. Therefore, the semiconductor chip can be positioned accurately on the packaging substrate.

Abstract: A hot press device includes a spacing strip, a winding roller, a feeding roller and a hot press head. The spacing strip includes a metal layer and a resin layer stacked on the metal layer. The resin layer has a glass transition temperature of greater than 280° C. A contact angle between liquid tin and the metal is smaller than 55 degrees. The ends of the spacing strip are wound around the feeding roller and the winding roller. The hot press head is arranged between the winding roller and the feeding roller. The hot press head has a pressing surface touching the resin layer. A hot pressing method is also related in this disclosure.

Abstract: A new anchoring mechanism for the mold-crucible set to the tube, to which the cable is to be welded is described, and the inclusion and use of some bushings which are inserted between the cable and the mold.

Abstract: In one implementation, a system in package assembly process includes attaching a cladding to a substrate to keep the substrate flat while components are soldered onto the substrate. The cladding may include a supporting member and a clamping member, and the substrate may be received between the clamping member and the supporting member. The clamping member may have a plurality of openings formed therein, and the components may be positioned on the substrate within at least one of the plurality of openings. A predetermined pressure may be applied to the clamping member and/or supporting to keep the substrate flat.

Abstract: A method is provided for bonding a die to a base technology wafer and includes: providing a device wafer having a front, back, at least one side, and at least one TSV, wherein the back contains a substrate material; providing a carrier wafer having a front, back, and at least one side; bonding the wafers using an adhesive; removing the substrate material and wet etching, from the device wafer's back side, to expose at least one metallization scheme feature; processing the device wafer's back side to create at least one backside redistribution layer; removing the device wafer from the carrier wafer; dicing the device wafer into individual die; providing a base technology wafer; coating the front of the base technology wafer with a sacrificial adhesive; placing the front of the individual die onto the front of the base technology wafer; and bonding the individual die to the base technology wafer.

Abstract: A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.

Abstract: A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate.

Abstract: A thermo compression device includes a transmission element, a pressing head, and a guiding element. The transmission element includes a lower surface and defines a guiding recess on the lower surface. The pressing head includes a top surface and a bottom surface opposite to the top surface, and the bottom surface is a smooth surface. The guiding element is rotatably received in the guiding recess, and a part of the guiding element protrudes from the guiding recess and connects to the top surface of the pressing head.

Abstract: A joint apparatus of the present invention includes: a pre-thermal processing unit including a first thermal processing plate mounting and thermally processing a superposed substrate where substrates are superposed on each other with joint portions of the substrates in contact with each other, and a first pressure reducing mechanism; a joint unit including a second thermal processing plate mounting and thermally processing the superposed substrate processed in the pre-thermal processing unit, a pressurizing mechanism pressing the superposed substrate on the second thermal processing plate toward the second thermal processing plate side, and a second pressure reducing mechanism; and a post-thermal processing unit including a third thermal processing plate mounting and thermally processing the superposed substrate processed in the joint unit, and a third pressure reducing mechanism, wherein each of the pre-thermal processing unit and the post-thermal processing unit is hermetically connected to the joint unit.

Abstract: The present invention provides a method and a thermal compression head for flip chip bonding. The thermal compression head includes a main body and a contact portion. The main body has a main body opening. The contact portion has a contact surface and a plurality of openings. The openings communicate with the main body opening. When the contact surface of the contact portion is used to adsorb a chip, the contact surface of the chip has a plurality of adsorbed zones corresponding to the contact surface openings. After the chip is bonded to a substrate, the protrusions of the adsorbed zones are relatively slight. Therefore, the interconnection between the chip and the substrate is ensured.

Abstract: A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.

Abstract: To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, a. providing a frame including a tensioned wire, b. providing a holding jig including at least one seat in which the components can be removably and temporarily retained, c. applying the components to the seats with the respective electrodes aligned along a respective longitudinal direction, d. applying the holding jig to the frame and orienting the same so that the longitudinal direction corresponds to the direction of the tensioned wire, the tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e. electrically and mechanically bonding the tensioned wire to the corresponding electrodes, and f. cutting the wire to separate the components from each other thereby forming a respective lead terminal for each electrode.

Abstract: A method includes loading a first package component on a concave boat, and placing a second package component over the first package component. A load clamp is placed over the second package component, wherein the load clamp is supported by a temperature-variable spacer of the concave boat. A reflow step is performed to bond the second package component to the first package component. During a temperature-elevation step of the reflow step, the temperature-variable spacer is softened in response to an increase in temperature, and a height of the softened temperature-variable spacer is reduced, until the load clamp is stopped by a rigid spacer of the concave boat.

Abstract: A manufacturing equipment for manufacturing an LED light bar includes a reflow oven and a clamping device. The LED light bar includes a printed circuit board and a plurality of LEDs arranged on the printed circuit board. The reflow oven includes a hearth box and a transmitting belt extended through the hearth box. The hearth box includes a heating area and a cooling area in an interior thereof. The clamping device is mounted on the transmitting belt. The clamping device defines a receiving space for receiving the LED light bar therein. The clamping device is changed between a clamping state for maintaining the LEDs in positions and a releasing state whereby the LED light bar can be removed from the clamping device.

Abstract: A compression-bonding apparatus includes a support stage and a pressing tool. The pressing tool includes a pressing stage, an elastic member and a plurality of bonding heads. The elastic member is held by the pressing stage. The plurality of bonding heads includes an upper surface attached to the elastic member and a lower surface facing an upper surface of the support stage.

Abstract: Semiconductor die are assembled on a substrate by providing the semiconductor die, substrate, and an elastically deformable foil fixture preformed with one or more sunken regions having sidewalls and a bottom, and placing the semiconductor die in the one or more sunken regions so that the foil fixture is populated with a first side of the semiconductor die facing the bottom of the one or more sunken regions and a second opposing side of the semiconductor die facing away from the bottom of the one or more sunken regions. The substrate is placed adjacent the second side of the semiconductor die with a joining material interposed between the substrate and the semiconductor die. The substrate and the populated foil fixture are pressed together at an elevated temperature and pressure via first and second pressing tool members so that the substrate is attached to the second side of the semiconductor die via the joining material.

Abstract: A joint apparatus of the present invention includes: a pre-thermal processing unit including a first thermal processing plate mounting and thermally processing a superposed substrate where substrates are superposed on each other with joint portions of the substrates in contact with each other, and a first pressure reducing mechanism; a joint unit including a second thermal processing plate mounting and thermally processing the superposed substrate processed in the pre-thermal processing unit, a pressurizing mechanism pressing the superposed substrate on the second thermal processing plate toward the second thermal processing plate side, and a second pressure reducing mechanism; and a post-thermal processing unit including a third thermal processing plate mounting and thermally processing the superposed substrate processed in the joint unit, and a third pressure reducing mechanism, wherein each of the pre-thermal processing unit and the post-thermal processing unit is hermetically connected to the joint unit.

Abstract: Components for use in vacuum electron devices are fabricated from highly oriented pyrolytic graphite (HOPG) and exhibit excellent thermal conductivity, low sputtering rates, and low ion erosion rates as compared to conventional components made from copper or molybdenum. HOPG can be reliably brazed by carefully controlling tolerances, calculating braze joint material volume, and applying appropriate compression during furnace operations. The resulting components exhibit superior thermal performance and enhanced resistance to ion erosion and pitting.

Abstract: A device for assembling components having metal bonding pads includes plates that can move relative to each other, bearing metal components respectively and leaving between them a flat chamber surrounding the components when the latter are in contact with each other. The flat chambers can be saturated with deoxidizing gaseous fluid.