Abstract: By a method of determining the state of an iron tip according to the present invention, in a soldering device including: an iron tip that includes a solder hole into which a solder piece is supplied and that heats and melts the solder piece in the solder hole; a gas supply source that supplies a gas; and a gas supply portion that makes the gas supply source communicate with the solder hole and that supplies the gas from the gas supply source into the solder hole, the total flow rate of the gas flowing through the gas supply portion or a supply pressure is constant, a physical quantity of the gas flowing within the gas supply portion is measured and the measured physical quantity is compared with a previously provided reference value or table such that the state of the iron tip is determined. In this way, it is possible to constantly accurately determine the state of the iron tip.

Abstract: A solder paste transfer process is provided and includes defining multiple arrangements of solder pad locations on a surface, applying solder paste onto multiple transfer tools coupled to a fixture in a pre-defined configuration reflective of the multiple arrangements, disposing the fixture such that the multiple transfer tools are disposed in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the multiple transfer tools to the solder pad locations.

Abstract: The invention relates to a method for dispensing solder and a method for mounting a semiconductor chip on the dispensed solder. The substrate is heated to a temperature which lies above the melting temperature of the solder and a solder portion is applied. A pin is thereafter immersed in the solder portion until it touches the solder portion and presses against the substrate. The pin is subjected to ultrasonic sound in such a way that ultrasonic waves are generated in the pin, which are directed perpendicularly or angularly in relation to the surface of the substrate, and is then moved along a predetermined path in order to distribute the solder. The treatment with ultrasonic sound locally improves the wettability of the substrate. The temperature of the pin is preferably lower than the melting temperature of the solder.

Abstract: A solder feeder having a housing member with a proximal end and a distal end. A guide member fixed to an interior wall of the housing member and extending through and projecting from the housing member for receiving solder. A trigger, having in combination, a short portion having a plurality of teeth thereon and a long portion. The trigger pivotably attached to the housing member so that the short portion of the trigger extending through an opening in a wall of the housing member in alignment with and cooperating with a slot in a wall of the guide member and the long portion extending externally along a length of the housing member.

Abstract: A soldering device includes a tip member and a temperature sensor embedded within the tip member by a buckled copper pipe that is thermally conductive. A soldering device includes a tip member and a temperature sensor embedded within the tip portion by application of a crimping force that deforms the tip portion onto the temperature sensor. A soldering device includes a tip member, a heater member, and a thermally conductive wedge that is pushed into a gap between the tip member and the heater member. A soldering device includes a tip cartridge carried by a handle assembly that includes an o-ring and an o-ring cover that keeps the o-ring from falling off of the handle assembly. The o-ring cover includes a hook portion that engages a catch feature of the handle housing.

Abstract: An automatic soldering machine includes a frame assembly, an electric iron and a movable module fixed on the frame assembly. The movable module is used for making the electric iron connected with the movable module randomly move to a specified position at a predetermined area. The movable module includes a first driving unit having a first leading element movable along a first axis, a second driving unit having a second leading element movable along a second axis perpendicular to the first axis, a third driving unit having a third leading element movable along a third axis perpendicular to the first and second axis and a rotating unit capable of rotating around an axis thereof. The third driving unit is connected with the first leading element. The second driving unit is connected with the third leading element. The rotating unit is connected with the second leading element.

Abstract: A pin for allowing material having adhesive properties to adhere thereon, the pin comprising: a shaft having a longitudinal axis, a distal end and a proximal end opposite to the distal end; and a first tapered portion disposed on the longitudinal axis of the shaft, the tapered portion tapering from a first circumference to a second smaller circumference in a direction toward the proximal end of the shaft.

Abstract: A process by which molten solder is purified in-situ, making the soldering process more efficient and yielding better results, particularly for lead-free soldering. Lead-free solder becomes practical for use since the temperature for reliable soldering is reduced. A layer of active additive is maintained on the surface of molten solder for scavenging metal oxide from the solder and assimilating metal oxide into a liquid layer. The active additive is an organic liquid having nucleophilic and/or electrophilic groups. As an example, a layer of dimer acid maintained on a wave soldering apparatus scavenges metal oxide from the bath, and assimilates dross that may form on the surface. Scavenging metal oxide cleanses the bath and lowers viscosity of the solder, and PC boards or the like soldered on the wave have reliable solder joints.

Abstract: The present application discloses a fixture-free, hands-free soldering apparatus having a base support assembly and a solder assembly. The base support assembly has a base member supporting a power supply and an electronic temperature, time and speed control system, and an actuator for remotely actuating the solder assembly without the use of the operator's hands or fixtures. The solder assembly is supported on the base member by vertically movable support arms. A main body supports a spool of solder, a solder feed mechanism operated by the actuator and a solder mechanism having adjustable operating temperature, speed and position. The main body and adjustable solder mechanism of the solder assembly adjust the angle and position of the solder being fed by the solder feed mechanism and an adjustable solder head supporting a concave solder tip. In addition to vertical movement, the main body is rotatable by about 60 degrees with respect to a central horizontal plane along the main body.

Abstract: A device and method are provided for reflow soldering workpieces wherein a plasma device for an atmospheric plasma treatment of the workpiece is upstream of a solder application and/or upstream of a soldering zone, and wherein the method subjects the workpiece to an atmospheric plasma treatment with the aid of a plasma device prior to the application of the solder and/or prior to the soldering process.

Abstract: A handheld fluid cooled electric solder tweezers. A pair of soldering heads extend from a pair of tweezer members, respectively, and are operatively connected to a cooling apparatus. The cooling apparatus of each tweezer member includes a pair of heat dissipating tubes that travel in an associated tweezer member, with distal ends thereof in fluid communication with an associated soldering head, and with a proximal end of one thereof fluidly communicating with a fluid source. A crossover tube fluidly communicates the proximal end of one tube of one tweezer member with the proximal end of one tube of the other tweezer member.

Abstract: This invention provides a system capable of melting solder and removing the melted solder from a substrate. The heating system includes a desoldering tool having at least two handles, a first handle and a second handle. This way, an operator may grip the first handle or the second handle depending on the operator's preference of gripping the desoldering tool. The first handle has a cavity adapted to releaseably receive a storage where the melted solder can be deposited and stored. The storage may have a divot adapted to receive a key from the first handle so that the storage may be orientated in a predetermined position relative to the cavity. The cavity in the first handle is exposed so that the storage can be readily inserted or replaced. This allows the operator to easily replace and maintain the desoldering tool without a significant downtime.

Abstract: A method and apparatus for soldering terminal ends of an antenna embedded in a plastic smart card to contact terminals of an IC module disposed on the card are shown. The enamel coated antenna terminal ends are pre-coated with solder with a heater having horizontal opening with melted solder retained therein. The solder pre-coated terminal ends are maintained in a secured contact with the terminal contacts of the IC module by heating coils mounted at a free front end of two pivotal elongated cantilever arms. A piece of predetermined amount of solder is dropped into the cavity of each heating coil, and the heating coils are actuated with a low electrical current to generate a concentrated intense heat to melt the piece of solder to form secure permanent solder joints between the terminal ends of the antenna to the contact terminals of the IC module.

Abstract: A solder machine that can automatically solder a fiber optic cable to a package. The solder machine includes a fixture for supporting the cable and the package. The machine has a gas heater that emits a heated inert gas. The gas heats at least a portion of the package to a soldering temperature. The machine also includes a solder dispenser that dispenses solder into the heated package. The solder attaches the fiber optic cable to the package. The inert gas prevents undesirable oxidation at the solder site. The use of an inert gas eliminates the need for solder flux. The heating, gassing and dispensing steps can be controlled by a computer to automate the entire process. The package and fiber optic cable can be supported by a pallet that is loaded and then unloaded from the machine to further improve the ease of operation and decrease the cost associated with the solder process.

Abstract: A pair of soldering irons are fixed to a sliding plate at a predetermined interval. The soldering irons are integrally moved so as to reciprocate in a rectangular direction relative to a conveyor belt. One of the soldering irons is conveyed to a working position of the conveyor belt and the other of them is separated from the conveyor belt. While one of the soldering irons solders a circuit board, the other is cleaned. The circuit board has a slit into which a metal plate is inserted and soldered. For the slit, a soldering land constituted of a main-land and a sub-land is provided. The main-land is formed along one of longer sides of the slit. The sub-land is elongated from the main-land along a shorter side of the slit. The soldering land is not formed all around the slit so that the slit is not closed by solder when the circuit board is dip-soldered.

Abstract: Material in fluid form is applied to a region where a joint is to be formed between an airfoil and an adjacent structure by simultaneously directing streams of the material into the joint region on the suction side of the airfoil and into the joint region on the pressure side of the airfoil. The material may be so applied using a syringe type applicator that has a nozzle with a first arm and a second arm. The first arm is in flow communication with a source of the material and the suction side surface of the airfoil. The second arm is flow communication with a source of the material and the pressure side surface of the airfoil. Applying the material simultaneously to the joint regions on the suction side and the pressure side of the airfoil reduces the amount of time and effort needed to apply such material.

Abstract: Device for the singled-out application of joining material deposits (30), particularly solder beads, from a joining material reservoir (11) with an application device (13) and a singling-out device (12) for singling-out joining material deposits from the joining material reservoir, wherein the singling-out device (12) is designed as a conveying device (20) for the singled-out transfer of joining material deposits (30) to the application device (13).

Abstract: An electronic element producing apparatus comprises a bonding tool 1 which has a first supply hole 2 for passing a bonding wire 3 used to bond a bonding pad 6 of a semiconductor device 5 and an external conductor which is to be connected electrically with the bonding pad 6, and contacts a leading end 3b of the bonding wire 3 protruded outside from the first supply hole 2 to the bonding pad 6, and which also has a second supply hole 12 to supply a bonding material to bond the bonding pad 6 and the leading end 3b of the bonding wire 3, the second supply hole 12 being formed to supply the conductive material to a contact point between the bonding wire 3 and the bonding pad 6. Therefore, the bonding pad 6 and the bonding wire 3 can be bonded without applying a dynamic or thermal load to the semiconductor device 5.

Abstract: The misapplication or misplacement of solder bumps on chips and/or circuit boards presents financially significant waste and cost efficiency problems in the manufacture of electronic components. The present invention describes an article and a process for using the article to more quickly remove such spurious solder during manufacture of components. The present invention may comprise an article for assisting in the removal of solder from a surface comprising: a) a surface layer of textured material which can be wet by molten solder, b) a first thermally conductive layer having a surface which is in thermal contact with said surface layer, and c) preferably a flux which is present on at least one of said surface layer and said thermally conductive layer having a surface in thermal contact with said surface layer. The article may be preferably provided where the first thermally conductive layer comprises a sheet of flexible, thermally conductive metal, especially aluminum.

Abstract: A tool for soldering pin-in-hole electronic circuit components includes a tool plate with a set of via holes corresponding to the holes of a circuit board on which a circuit component is soldered. The board is aligned with the tool plate and hot gas is supplied through the set of plate vias to reflow solder in the board holes. The tool is particularly suitable for use in removing and replacing pinned circuit components. Use of particular gases (e.g., nitrogen) allows soldering to be carried out without the use of flux. Advantages of the tool are that it prevents burning the circuit board and/or unintentionally reflowing other circuit components mounted on the board (by directing hot gas only substantially onto the circuit board's solder-containing holes).

Abstract: A one handed soldering tool incorporating a heated tip configured with one or more solder retaining recesses therein. Adjacent this heated tip is an end region of a solder supply conduit through which a solid wire solder passes. During operation, as the heated tip is heated, the adjacent end region of the solder supply conduit is likewise heated. Such heating will melt the wire solder therein thereby causing it to flow out of the conduit and into the recesses in the heated tip. This collection of melted solder can then be used to attach a workpiece in place as desired. Consequently, the user is able to support this workpiece during such operation since the step of continuously biasing the solid solder against the heated tip has been eliminated due to the collection of the solder stored in the solder retaining recesses of the heated tip.

Abstract: A soldering tip overcomes the gravitational effects on molten solder and supplies a large molten solder sphere for contact with a surface to which solder is to be applied. A conical or cylindrical spiral or helix of solder-wettable material, preferably in the form of a compressional spring is attached to the soldering tip with the central axis of the helix aligned with the axis of the soldering tip, preferably by welding. Solder supplied to the soldering tip flows between the coils of the helix and forms a meniscus at the lower end of the helix so that only the molten solder meniscus touches the surface during application of solder. The increased surface tension acts to overcome gravitational effects and assures a more even flow of solder to the surface.

Abstract: A delivery device for a solder wire includes a main body, an operating element and an attaching device. The main body has a front end, a mediate portion and a rear end, the front end having a defined exit and the rear end having a defined entrance and the mediate portion having a defined recess. The recess communicates with both the entrance and the exit and the solder wire extends through the main body via the entrance and the exit. The operating element has a first end pivotally engaged to the main body and a pushing bar has a first end pivotally engaged to the operating element and a second end contacting the solder wire in the main body, A resilient element has a first end connecting to the operating element and a second end connecting to the pushing bar between the first and second ends thereof. The attaching device is disposed to an under side of the main body and has a gripping portion to grip the soldering iron.

Abstract: A soldering device includes a tube (1) for delivering a source of heating energy such as gas which is slidingly mounted in a chamber (52) such as a piston cylinder so that only the tube needs to be moved in order to move the heat source up and down with respect to a workpiece. Likewise, in a solder dispenser, the solder is supplied through a rigid tube (33) which may be slidingly mounted in a cylinder (52). The two may be used together in a combined soldering device/dispenser.

Abstract: A feed device for a soldering iron possesses a coil through which current flows, located in the soldering iron itself, and an armature that is displaceably driven in the central bore of the coil. This armature cooperates with a clamping device connected to it. Thus, an intermittent clamping and feeding action may be effected in the clamping device. Such a device is space saving and has substantially no parts subject to wear.

Abstract: In accordance with a preferred embodiment of the present invention, a concavity of an elliptical shape is formed in a chisel-shaped soldering tip to create a reservoir in which a quantity of molten solder is retained by surface tension. In a preferred method of use, the leads of an electronic component and the lands of a circuit board to which they are to be electrically connected are pretreated with flux. The tip, with a blob of solder in its concavity, is drawn along the lead/land region with the blob of molten solder making contact therewith, so that molten solder is wicked into the region, and joints are formed between the leads the lands.

Abstract: A gas flow distribution system for a solder dispensing head includes a base member adapted to be connected to the solder dispensing head and a structure connected to a source of an inert gas for distributing at least one continuous stream of the inert gas radially and axially below the solder dispensing head to exclude oxygen in the surrounding air therefrom.

Abstract: A dispenser has a tube and a tip portion having a flat passage communicated with the tube and an elongated opening at a lower end thereof. The flat passage has a constant sectional area over the entire axial length thereof, so that the solder flows in the passage at a constant rate.

Abstract: An component or connector lead (12) is soldered to a bare copper metallized area (14) on a circuit board (16) using core solder (26) by manually applying heat from a heated tip (24) to a separate one of the lead and metallized area. As the heat is being applied, a vacuum is drawn in the region where the solder is applied to the lead and/or metallized area to draw off any flux vapors created upon heating of the solder. At the same time, hot air is also directed into the region where the solder is being applied to maintain the flux vapors, created upon heating of the solder, in their vaporous state to facilitate such vapors being drawn off, thereby reducing the amount of flux residues resulting from the soldering operation.

Abstract: A desoldering tool has a removable heater cartridge and a base unit having an assembly interior including a solder collection chamber and a removable vacuum source for developing a vacuum in and above the chamber and a removable porous solder retention pad located between the vacuum source and the solder collection chamber, the cartridge having a temperature self-regulating heater therein, a tail pipe extending from a hollow tip of the cartridge to a position above the solder collection chamber, and a vacuum seal between the cartridge and the base unit to maintain the vacuum and reduce transfer of heat from the tip. The tool is readily converted to a soldering iron or a hot air gun.

Abstract: The method of the invention comprises the steps of locating the integrated circuit so that the projecting ends of the pins thereon are in juxtaposition with the corresponding connector pads on the printed circuit board; and applying solder to the connector pads with a heated soldering tool moving over the pads and touching the projecting ends of the pins on the integrated circuit without overlying the pins to solder the projecting ends of the pins to the connector pads. The method of the invention further comprises the step of applying a soldering flux to the pins and connector pads prior to applying the solder with the soldering iron. After the soldering operation is complete, the flux is removed with a flux remover. If the connector pads are new, a base solder is applied to the connector pads prior to placement of the integrated circuit on the printed circuit board.

Abstract: An electric soldering iron includes a barrel and a head portion with a center hole being pivoted to a front end of the barrel. A piston and a piston rod are disposed in the front end of the barrel. A spring embraces the piston rod and bears against the piston. A solenoid is disposed in a rear end of the barrel. A button is disposed at a rear end of the barrel for controlling the solenoid. The piston is pushed forward by the spring when the solenoid is not actuated. A depression of the button actuates the solenoid to draw the piston rearward.

Abstract: A plastic welder that can be held and operated with only one hand. The supply rod or filler rod can be advanced into and through the heating tip of the welder by a trigger that can be actuated by the user with the same hand in which the grip of the plastic welder is held. No air assist is required, as a device is provided for reliably avoiding overheating of the plastic welder by intermittently interrupting the electrical current feeding the heating element at times automatically determined by a temperature setting selected by the user. The heating tip is formed of a major portion of steel infiltrated with a minor portion of copper. The temperature of the heating element with the welder in inoperative condition is maintained at a predetermined level above the temperature of the heating tip when the welder is operative and in use.

Abstract: A device for straightening a welding wire which includes a box-shaped frame of a generally rectangular configuration through which a welding wire is fed, and a plurality of pairs of wire straightening rollers mounted on the frame in longitudinally spaced-apart aligned relation along the path of wire feed, the pairs of rollers each having roller surfaces in transversely spaced-apart opposed relation, and the adjacent pair of rollers being located at a desired phase angle relative to each other.

Abstract: An automatic spot soldering machine incorporates apparatus for automatically sequencing through operations for forming soldered joints at a predetermined position. The sequence includes preforming a quantity of solder from a length of solder wire and positioning it on the joint, and lowering a soldering iron into position for a predetermined period of time. The solder wire is advanced and retracted by a reversible clutch incorporating a rotatable disk and a concentric clamping ring.

Abstract: A soldering gun has a finger actuated rotary solder feed unit and a solder cartridge releasably coupled to the gun. A solder guide tube extends forwardly parallel to the cylinder and guides the solder into engagement with the heated tip. The guide tube is mounted for vertical and angular orientation relative to the cylinder for locating the solder relative to the tip. A rotating ratchet feed wheel is connected to the trigger and has teeth engaging the underside of the solder. A set screw is located in the path of trigger to adjust the trigger stroke and thereby the length of the solder fed to the tip. A pressure wheel is mounted to firmly hold the solder to the feed wheel and is secured to a spring-loaded and pivoted T-shaped lever within the gun housing. The T-shaped lever has the pressure wheel rotatably mounted in the cross bar and the stem projecting upwardly into engagement with a bias spring. The lever has a release arm for manual pivoting of the lever to release of the solder.

Abstract: A soldering iron is provided of a type in which the solder is fed through the interior of the soldering iron to the tip, which is heated by a heating element in the soldering iron. In order to prevent the solder from melting before it reaches the tip, as a result of the heat transmitted from the heating element to the solder, the soldering iron is provided, e.g. on a feed tube for the solder, with an inlet for a coolant, e.g. water or air, which is made to flow through the interior of the soldering iron around the solder, thereby cooling the surroundings of the solder.

Abstract: The soldering apparatus of the invention includes a soldering wire feeding mechanism for feeding soldering wire from a storage spool. The soldering wire feeding mechanism includes a motor which drives a feeding wheel for engaging and transporting the soldering wire into a flexible feeding tube. An eccentric adjusting cylinder is mounted adjacent the wheel and can be turned to fit the diameter of the soldering wire being used. The feeding tube connects to the soldering iron of the invention, which has a metal guide tube through which the soldering wire extends and is fed to the soldering area. The soldering wire travels from the feeding tube to the guide tube through a sleeve to which both tubes are threaded. The free end section of the guide tube adjacent to the tip of the soldering iron extends rectilinearly from a bend or curve such that the soldering wire leaving the tube is rectilinear and not bent.

Abstract: Soldering apparatus which comprises a frame member and a reciprocating member movably mounted on the frame member for movement with respect to an anvil member having a component to be soldered supported thereon. A soldering tip is mounted on the reciprocating member and has a soldering face which is moved on an advance stroke into contact with the component on the anvil member to heat the component to soldering temperature. A generally vertical passage is formed through the soldering tip and opens at the lower end through the soldering face. A roll of solder wire is provided for supplying a predetermined quantity of flux-cored solder into the upper end of the passage to fall into contact with the heated component whereby the flux is automatically heated and melted to clean the surface of the component before the solder is melted to form the soldered joint. An air jet or a reamer is also provided for cleaning the passage during a return stroke.

Abstract: A soldering iron for withdrawing by suction resin-containing soldering fumes includes an electric heating element (2) enclosed in a metallic casing and extending from one end of a handle (1), a metallic fume suction nozzle (6) has one end (7) lying in proximity to a soldering tip (5) mounted to the outer end of the heating (2) and its other end (8) connected proximate the one end of the handle to the first end of a flexible plastic e.g., silicone polymer; suction hose (10) removably extending through a bore (15) in the handle (1) and connected at its other end to suction source (11). The nozzle (6) is coupled in metallic heat transfer contact with the casing of the heating element (2) by metallic member (12, 13) and is thereby maintained at a temperature such that resins present in the fumes do not precipitate in the nozzle (6) but instead condense in the plastic suction hose (10), which can be easily removed from the handle for cleaning.

Abstract: A one-handed soldering apparatus comprises a solder dispensing unit and a solder melting unit mounted in a cooperating manner to provide for one-handed dispensing and melting of solder from a single combination device. A unique solder discharging device provides for the controllable flow of a solder paste which flow is begun and halted upon command with a minimum of unwanted oozing of excess paste.

Abstract: A device for feeding solder wire from a spool to the heated tip of a pencil-type solder iron. The device includes a rigid support strip secured by a pair of spaced bands to the front and rear ends of the elongated handle of the soldering iron. The strip extends longitudinally of the handle and is at one side of the handle. A guide provided with a wire-receiving passage therethrough is carried by the support strip. The guide includes a flexible tube which extends forwardly from the front end of the handle. The forward end of the tube is open and is located near the tip of the soldering iron. A spool of solder wire is rotatably mounted on the support strip near the rear end thereof. A first wheel is adjustably mounted on the support strip forwardly of the spool for fictionally engaging the solder wire extending through the guide to advance the solder wire forwardly through the guide when the first wheel is rotated in one direction relative to the support.

Abstract: A device of the gun type adapted to carry a soldering torch and to feed a strip of solder adjacent the nozzle of the torch. This solder feeding gun is characterized by being adapted to carry such torch and to feed the strip of solder with only one hand, by allowing to feed either a bar or a wire of solder, and by allowing use of both the torch and the solder feeding gun separate from each other. This solder feeding gun comprises a body forming a hand grip portion, a holder portion for a soldering torch, a holder for a supply of coiled solder, and a piston chamber portion, with a piston and a finger actuated lever to feed the solder adjacent the nozzle of the soldering torch. An attachment is also particularly adapted to fit on the nozzle to enhance heating and melting of a strip of solder and to channel the flow of the melted solder.

Abstract: A soldering tool having a handle, a heating element, and a feeder mechanism for feeding wire or strip soldering metal through a passage in the handle arranged as a unit in an attachment piece let into the handle and comprises a manually operated member which can be depressed towards the handle, and a slide which is displaceable in one direction against spring bias by depression of the manuallY operated member. The slide has a driving dog for displacement of the soldering metal together with the slide in said one direction to advance the soldering metal towards the tip of the heating element through a guide tube which is arranged on a bracket supported by the handle, to be adjustable in relation to the heating element. A latch member is arranged to prevent backward movement of the soldering metal at the return of the slide under the spring bias in the other direction.

Abstract: An attachment for a soldering tool which allows selective feed of the solder wire to the heated tip with the same hand that holds the tool. A novel double-acting slide mechanism feeds the solder forwardly by pulling a trigger, or other actuating means, and retracts the end of the solder away from the tip on a portion of the return stroke of the slide mechanism.

Abstract: An improved soldering device has a magazine to hold preformed solder shapes for dispensing them through a tubular duct onto a channel formed in a soldering bit. The channel leads to an opening formed in the bit to permit passage therethrough of the preformed solder shapes. An actuator is affixed to the magazine to dispense the preformed solder shapes one at a time. The preformed solder shapes do not become molten until passing through the opening in the bit.

Abstract: An improved soldering device is provided, one that is structured for the reception of and use with a new cartridge that is a self-contained supply of solder. When the cartridge is inserted within the soldering device, an operator, using only one hand, is able to advance the solder from out of the cartridge and to a location in close proximity with the soldering tip of the device. With that same single hand, the operator can energize the heating element to supply heat to the soldering tip. The advancing and energizing structure permits the device to remain energized throughout the advancing operation or, optionally, to smoothly effect an intermittent energization and deenergization of the heating element to reduce the total quantity of heat supplied to the soldering tip even while the solder is being advanced.

Abstract: A body is provided defining an elongated handgrip and an elongated support projecting angularly outwardly of one end portion of the handgrip. A motor is carried by the body and a pair of generally parallel peripherally engaged side-by-side rollers are journaled from the end of the support remote from the handgrip for rotation about axes extending transversely of the support and disposed on opposite sides of a plane extending longitudinally of the support. The end of the handgrip remote from the support rotatably mounts a spool of ribbon therefrom and the handgrip includes guide structure for guiding a ribbon being unwound from the spool along the handgrip and, at the end of the handgrip remote from the spool, toward the rollers.

Abstract: An apparatus--for brazing tungsten carbide tips (also known as "inserts") on circular saw teeth--which includes instrumentalities to practice a method comprising, with respect to each saw tooth, the following steps: (1) clamping an initially separate tip between two opposed carbon electrodes interposed in a resistance circuit; (2) closing the circuit whereby the clamped-in-placed tip is heated red hot; (3) opening the circuit and then delivering a small quantity of brazing paste (flux and solder) on the hot tip; (4) moving an arbor-mounted circular saw until a selected tooth thereof bears on the clamped-in-place tip--the brazing paste then being between said tip and an edge of the tooth; and (5) then re-energizing the resistance circuit whereby the tip again becomes red hot and brazes to said tooth.

Abstract: Soldering method and apparatus comprising a soldering device having a hand grip portion and an electrically heated soldering element extending from said hand grip portion and terminating in a soldering tip, a housing structure adapted to be supported in a position disposed in spaced relation from the solder device, the housing structure supporting a solder wire supply spool to be unwound therefrom, a tubing structure extending from the housing structure and connected with the soldering device for closely peripherally confining a leading portion of solder wire of substantial longitudinal extent extending from the spool with the free end thereof adjacent the soldering tip and for maintaining such confinement during longitudinal movement thereof in a direction wherein the free end engages the soldering tip while enabling the soldering device to be substantially freely manually moved in spaced relation relative to the housing structure by an operator grasping the hand grip portion thereof, the tubing structure in