Abstract: The present invention provides an iron particulate-reinforced tin based matrix composite alloy tin solder ball and a flip chip ball placement method using the same. A tiny metal iron particle is added in an alloy solder ball to form an alloy solder ball containing iron powder, whereby magnetic equipment can be used to attract and effectively hold the composite alloy solder ball so as to help positioning of a micro alloy solder ball in a flip chip ball placement process by securely attracting and filling the ball in a cavity defined in a stencil. By further employing a proper ball removal process to remove excessive alloy solder balls, the cluster aggregation phenomenon caused by surface moisture absorption and electrostatic force of the micro alloy solder ball can be eliminated to allow for smooth placement of balls and improve the bonding between a micro circuit board substrate and electronic components.

Abstract: An object of the present invention is to improve a yield of electronic devices in a ball mounting process by preventing a micro-bonding and change in color of the solder balls, and to improve a bonding reliability of the solder balls by reducing an oxide film on a surface of the solder ball. The solder ball has a surface thereof coated with an organic compound containing a cyclic structure and an aliphatic hydrocarbon group.

Abstract: A solder preform has gaps extending from the boundary of preform towards the preform center. During reflow soldering, the gaps close from the center towards the boundary. This allows flux and gasses to escape the interface between the solder and the substrate. Particularly, flux accumulates in the spaces formed by the gaps and is forced to the edge of the solder preform as the gap closes. In further embodiments, channels are formed on one or both surfaces of the solder preform. In addition to further assisting in the escape of gas and flux during reflow, the channels and gaps increase the effectiveness of oxygen purging using inert or reducing gasses in the reflow chamber. Additionally, the channels and gaps increase the effectiveness of vacuum solder.

Abstract: A clad solder thermal interface material is described. In one example the material has a a first layer of solder having a melting temperature lower than a temperature of a particular solder reflow furnace, a second layer of solder clad to the first layer of solder, the second layer having a melting temperature higher than the temperature of the solder reflow furnace, and a third layer of solder clad to the second layer of solder opposite the first layer, the third layer having a melting temperature lower than the temperature of the solder reflow furnace.

Abstract: A bonding structure that a bonding region can endure a high temperature environment and the bonding can be maintained with high reliability is provided as a bonding material capable of maintaining reliable bonding in high temperature environment in place of solder including Pb. In the bonding structure for a first member and a second member, solder and glass are used to bond the first member and the second member together and the glass seals the solder. Thereby, electrical conductivity is ensured and the outflow of melting solder in high temperatures can be inhibited to improve the durability.

Abstract: An electrical bond connection system between a first electrical contact surface and a second electrical contact surface having at least one first electrical conductor, which is bonded to at least one of the contact surfaces via at least one first bond connection. At least one additional second electrical conductor (9) is bonded to the first electrical conductor (8) via at least one second bond connection (10, 13), the two bond connections (10) being offset from one another. The present invention also relates to a method for manufacturing an electrical bond connection system existing between a first electrical contact surface and a second electrical contact surface.

Abstract: A braze material and processes for making and using the material, such as for use in the manufacturing, coating, repair, and build-up of superalloy components. The braze material is composed of particles with melt-modifying constituents that are limited to the surfaces of the particles, yet are capable of sufficiently promoting the heating of the particles by conventional means and microwave radiation to achieve at least partial melting of the particles. The melt-modifying constituents are in the form of particulates embedded in the outer surface region of each particle. The particulates are formed of melting point depressant(s) and/or microwave coupling enhancer(s), are much smaller than the particle in which they are embedded.

Abstract: A wire (10) for use in a brazing or soldering operation has an elongated body (12) of a metallic material. The elongated body (12) has an outer surface (18). A channel (14) is formed along a length of the body. The channel (14) has an opening (A1). A flux solution (22) is deposited within the channel (14) and along the length of the body. The flux solution (22) covers a portion of the outer surface (18). A portion of the flux solution (22) is exposed through the opening (A1) in the channel (14).

Abstract: A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.

Abstract: In accordance with the invention, containers or interfaces having two surfaces 201a and 201b to be joined, and a region to be sealed, are fused by providing between the surfaces 201a and 201b a thin strip or wire of RCM 102 embedded within a fusible material 101, applying pressure 205 and igniting the RCM 102. The released energy from the ignited RCM 102 results in a melting of the fusible material 101 and subsequent bonding of the fusible material 101 upon cooling to the 101 surrounding surfaces 201a and 201b, achieving a hermetic seal there between without the use of a separate gasket component.

Abstract: Disclosed is a welding wire for joining cast iron and stainless steel, having a composition of 0.03 wt % or less of C, 2.0˜3.0 wt % of Si, 12.0˜14.0 wt % of Mn, 7.0˜9.0 wt % of Cr, 45.0˜47.0 wt % of Ni, 0.5˜0.8 wt % of Nb, and 2.0˜3.0 wt % of Mo, with a balance of Fe. Using the welding wire, a weld zone which has no hot cracks and is sound and good can be obtained.

Abstract: There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one kind or two kinds of Pt and Pd of 1000 to less than 5000 ppm in total, Ir: 1 to 200 ppm, Ca: 20 to 100 ppm, Eu: 10 to 100 ppm, Be: 0.1 to 20 ppm, if necessary, and La: 10 to 100 ppm, if necessary. The total amount of at least two kinds of Ca, Eu, Be, and La is in a range of 50 to 250 ppm.

Abstract: A solder coating (10), particularly for a blade tip of a gas turbine, comprises at least two superimposed layers (14, 16). A first layer (14) comprises a solder and a binding agent. A second layer (16) comprises particles (18) of an MCrAlY alloy, grinding particles (20) and a binding agent. The heating of solder coating (10) leads to at least a partial dissolution of particles (18) of the MCrAlY alloy by means of the liquid solder before the MCrAlY alloy melts.

Abstract: A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.

Abstract: Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduce or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state.

Abstract: Improved solder and soldering methods are disclosed. In accordance with one technique, a solder having a plurality of individual wire strands braided together is used. In accordance with another technique, the braided solder comprises both the same solder composition and wire gauge in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different solder compositions used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different wire gauges used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least one wire strand where the primary surface is coated with a thin layer of a noble metal. In accordance with another technique, the braided solder comprises at least one wire strand where flux material is present.

Abstract: A consumable insert (10) formed of material particles (14) contained within a sheath (12). The particles may be a melting point depressant that has a concentration that is greater in a center region (16) of the insert than in the surface region (18) of the insert, thereby facilitating complete melting of the insert during a transient liquid phase bonding process. Alternatively, the particles may be a low-ductility material, such as a superalloy or an MCrAlY alloy, contained within a high ductility sheath material formed into a ribbon shape, thereby allowing the low-ductility material to be delivered in ribbon form during a coating process.

Abstract: Techniques and structures have been developed for providing lead-free column grid array interconnect structures. An exemplary interconnect has a body, a first joint, and a second joint, all having compositions off the eutectic composition in a ternary alloy system, the first joint having a ternary composition distinct from the body composition, and the second joint having a ternary composition distinct from the body composition and the first joint composition. The interconnect may be formed by solidifying a solder, having a Sn-poor ternary composition in the Sn—Ag—Cu alloy system, in contact with a column, having a Ag-rich Cu-deficient composition in the same system, and a bonding pad or bare substrate. A second solder, having a Sn-rich ternary composition, may be solidified in contact with the column and a second bonding pad or bare substrate. In some embodiments joints may be severed and reformed by remelting and resolidifying the lower-liquidus solder.

Abstract: A Sn—Ag—Cu based lead-free solder ball which does not undergo yellowing of its surface when formed into a solder bump on an electrode of an electronic part such as a BGA package. The solder ball has excellent wettability and does not form voids at the time of soldering, even when it has a minute diameter such as 0.04-0.5 mm. It has a composition comprising 1.0-4.0 mass % of Ag, 0.05-2.0 mass % of Cu, 0.0005-0.005 mass % of P, and a remainder of Sn.

Abstract: A foamed solder or a nano-porous solder is formed on a substrate of an integrated circuit package. The foamed solder exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed solder is used as a solder bump for communication between an integrated circuit device and external structures.

Abstract: An adhesive tape electrically connecting conductive members contains a resin, a solder powder and a curing agent having flux activity, wherein the solder powder and the curing agent having flux activity are contained in the resin.

Abstract: A brazing product for fluxless brazing comprises a substrate and a filler metal-forming composition applied to the substrate. The substrate preferably comprises aluminum, an aluminum alloy or another metal and may include at least one layer of a ceramic, carbide or nitride. The filler metal-forming composition comprises a liquid-forming layer comprising silicon and a braze-promoting layer comprising one or more metals selected from the group comprising nickel, cobalt, palladium and iron. The liquid-forming layer comprises one or more material layers. Where the liquid-forming layer comprises a plurality of layers, it may include at least one layer consisting essentially of silicon.

Abstract: An object of the present invention is to improve a yield of electronic devices in a ball mounting process by preventing a micro-bonding and change in color of the solder balls, and to improve a bonding reliability of the solder balls by reducing an oxide film on a surface of the solder ball. The solder ball has a surface thereof coated with an organic compound containing a cyclic structure and an aliphatic hydrocarbon group.

Abstract: A method of manufacturing irregular shapes of solder wires comprising the steps of: (a) acquiring materials of solder wire; (b) placing the materials into wire manufacturing machines to form solder wires into specifically designed profiles; (c) transporting the resulted solder wires to forming equipment and tools to form solder wires into specific shapes. The invention also provides products made with above-mentioned methods of manufacturing irregular shapes of solder wires.

Abstract: Briefly, a novel material process is disclosed wherein one or more nucleation modifiers are added, in trace amounts, to a lead-free tin-rich solder alloy to produce a solder composition with reduced or suppressed undercooling temperature characteristics. The modifier being a substance which facilitates the reduction of extreme anisotropic properties associated with body-centered-tetragonal tin based lead-free solder. The addition of the nucleation modifiers to the solder alloy does not materially effect the solder composition's melting point. As such, balls of solder with the nucleated composition freeze while other solder balls within the array remain in the melt. This effectively enables one substrate to be pinned to another substrate by one or more predetermined solder balls to secure the package while the remaining solder joints are in the liquid state.

Abstract: A die attach process employs a temperature gradient lead free soft solder metal sheet or thin film as the die attach material. The sheet or thin film is formed to a uniform thickness and has a heat vaporizable polymer adhesive layer on one surface, by which the thin film is laminated onto the back metal of the silicon wafer. The thin film is lead-free and composed of acceptably non-toxic materials. The thin film remains semi-molten (that is, not flowable) in reflow temperatures in the range about 260° C. to 280° C. The polymer adhesive layer is effectively vaporized at the high reflow temperatures during the die mount.

Abstract: Disclosed is a hydrofluoroether compound comprising two terminal fluoroalkyl groups and an intervening substituted or unsubstituted oxymethylene group, each of the fluoroalkyl groups comprising only one hydrogen atom and, optionally, at least one catenated (that is, in-chain) heteroatom; with the proviso that the hydrogen atom is part of a monofluoromethylene moiety.

Abstract: In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.

Abstract: The present invention relates to methods and arrangements for forming a solder joint connection. One embodiment involves an improved solder ball. The solder ball includes a perforated, metallic shell with an internal opening. Solder material encases the shell and fills its internal opening. The solder ball may be applied to an electrical device, such as an integrated circuit die, to form a solder bump on the device. The solder bump in turn can be used to form an improved solder joint connection between the device and a suitable substrate, such as a printed circuit board. In some applications, a solder joint connection is formed without requiring the application of additional solder material to the surface of the substrate. The present invention also includes different solder bump arrangements and methods for using such arrangements to form solder joint connections between devices and substrates.

Abstract: A structure for joining members which is suited for joining of thin members together and suited for joining of members made of different materials. The structure includes a nut, a first member superposed on the nut such that a preliminarily formed hole on the first member is contiguous with the threaded hole of the nut, and a second member superposed on the first member so as to cover the hole.

Abstract: A filler material improves the quality of a joint seam formed during thermal joining of two metallic structural components and includes a core and a coating that surrounds the core at least in sections Because the filler material comprises a coating on the core, the alloying material for the coating may be selected largely independently of any possibly limiting metallurgical requirements in relation to the base material for the core so that with the use of the heterogeneous filler material optimal joint seam characteristics of the joined structural components always result, largely irrespective of the materials composition of the core If an essentially H-shaped cross-sectional geometry of the filler material used, moreover, preliminary fixing or alignment of the structural components that are to be joined in a thermal joining process becomes possible.

Abstract: The invention proposes a brazing alloy, which can be produced in particular as a homogenous, ductile, amorphous brazing foil and consists of 2 to 20 atom % of nickel, 2 to 12 atom % of tin, 0.5 to 5.0 atom % of zinc, 6 to 16 atom % of phosphorus, remainder copper and incidental impurities. The total amount of copper, nickel, tin and zinc is between 80 and 95 atom %. The addition of more than 0.5 atom % of zinc produces excellent resistance to surface oxidation in air and/or atmospheric humidity. These brazing alloys can be used to produce excellent brazed joints.

Abstract: System for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

Abstract: A method of casting a multi-layered metal ingot including the steps of delivering a metallic divider member into a direct chill mold, pouring a first molten metal into the mold on one side of the divider member, and pouring a second molten metal into the mold on the other side of the divider member, and allowing the first molten metal and the second molten metal solidify to form a metal ingot which includes the divider metal layer disposed there between.

Abstract: There is provided a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of connection pads formed on a substrate. The conductive ball mounting apparatus includes: an outer frame; an inner cylinder provided in the outer frame, wherein an upper surface and a lower surface of the inner cylinder are opened; a sieve provided in the inner cylinder, wherein the inner cylinder is partitioned into an upper space and a lower space by the sieve; an inlet port for supplying an air from an outside to the lower space of the inner cylinder; a mask provided to a lower end of the outer frame and having openings, the openings being provided to correspond to conductive ball mounting positions; and an exhaust port for exhausting an air from an upper surface of the mask to the outside and being provided to the lower end of the outer frame, wherein the inner cylinder is adapted to vibrate without being restricted by the outer frame.

Abstract: An electronic component having a semiconductor element bonded to a substrate with solder has a decreased bonding strength if there is not a suitable clearance between the semiconductor element and the substrate. Therefore, a solder preform having high melting point metal particles dispersed in solder has been used in the manufacture of electronic components. However, when an electronic component was manufactured using a conventional solder preform, there were cases in which the semiconductor element leaned or the bonding strength was not adequate. A solder preform according to the present invention has a variation in the size of high melting point metal particles which is at most 20 micrometers when the metal particle diameter is 50 micrometers, and an alloy layer of the high melting point metal particles and the main component of solder is formed around the high melting point metal particles. In addition, no voids at all are present in the solder.

Abstract: A braze ring includes a generally annular body and an outer annular channel formed on an outer surface of the body. A method of connecting a straight tubular end to a flared tubular end includes locating a substantially annular braze ring substantially concentrically around the straight tubular end, inserting the straight tubular end into the flared tubular end so that the braze ring engages the flared tubular end, and heating the braze ring so that flux separates from an exterior channel of the braze ring and the separated flux from the exterior channel contacts at least one of a faying surface of the flared tubular end and a faying surface of the straight tubular end. Another braze ring includes a body having a substantially symmetric cross-sectional shape forming an inner channel and an outer channel and flux carried within each of the inner channel and the outer channel.

Abstract: A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 ?m are present 16% or more, and a sum of the particles having a particle size of below 10 ?m and particles having a particle size of 10 ?m or more and below 20 ?m is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.

Abstract: An assembly is disclosed for exothermic welding comprising a mold which is formed of a material which withstands exothermic welding temperatures and includes a weld cavity therein for positioning at least two members which are to be exothermically welded together, and an ignition cavity communicating with the weld cavity. The mold is capable of accommodating any one of several exothermic welding procedures which may involve either a flint igniter or the use of an electrical igniter which is readily accommodated by the mold in the performance of several of the procedures. The electrical igniter is formed of a pair of flat, longitudinally extending conductor strips with a sheet of insulation laminated therebetween, a filament adjacent one end of the strips, and one or more positioning tabs adjacent one end of the strips. A cartridge is also provided which contains the weld metal and the electrical igniter and which may be positioned in the ignition cavity of the mold.

Abstract: A method of attaching a solder ball to a bonding pad includes disposing flux on the bonding pad, attaching a conductive metal ring to the pad using the flux, and placing the solder ball in the ring. A reflow operation is performed that secures the ring to the pad and melts the solder ball into and around the ring. A solder joint is formed between solder ball and the pad, with the ring secured within the ball. Use of the ring allows for higher stand-off height to be achieved with similar solder ball size, without having to use bigger ball size as in the conventional method, which causes solder ball bridging. With higher stand-off height, better board level reliability performance can be obtained.

Abstract: A solder preform for use to attach an electronic component to a substrate. The preform is for placement by a pick-and-place machine using a vacuum nozzle which picks the preform from a preform holder. Each of the sides of the preform configured to function as a vacuum side pick up surface has an enlarged planar surface area. Methods for forming such solder preforms are also disclosed.

Abstract: A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a bump forming method are provided. After a resin 14 containing a solder powder 16 and a gas bubble generating agent is supplied to a space between a circuit board 21 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 12, the resin 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 14. The resin 14 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof and self-assembled between the connecting terminals 11 and the electrode terminals 12. By further heating the resin 14 and melting the solder powder 16 contained in the resin 14 self-assembled between the terminals, connectors 22 are formed between the terminals to complete a flip chip mounting body.

Abstract: The present invention provides a braze foil comprising titanium and zirconium layers covered by one or more layers of copper, nickel or an alloy of copper and nickel such that neither the zirconium or titanium layers are exposed to the atmosphere. The braze foil may further be layered onto a base material during production to form a braze-clad base material. Methods for brazing a base material with the braze foil are also provided.

Abstract: A method and apparatus for handling and positioning half plated balls for socket application in ball grid array packages. The half plated balls, comprising a first side adapted to be soldered and a second side adapted to establish reliable solderless electrical contact, are embedded in a soft foil, with a common orientation. The soft foil is positioned on a clam-receiving tool and a vacuumed caved cover clam is fitted on the balls and then pushed to cut and separate the polymer sheet from the copper ball surface. The vacuumed caved cover clam is then lifted with the oriented copper balls entrapped inside and the vacuumed caved cover clam places the entrapped balls on the laminate pads, with a deposit of low melt alloy. The air vacuum is deactivated and the cover is lifted, leaving the balls positioned on the pads while the soldering process is initiated and solder joints are formed to fix the balls.

Abstract: Improved interconnects are produced by injection molded solder which fills mold arrays with molten solder so that columns that have much greater height to width aspect ratios greater than one are formed, rather than conventional flip chip bumps. The columns may have filler particles or reinforcing conductors therein. In the interconnect structures produced, the cost and time of a subsequent underfill step is reduced or avoided. The problem of incompatibility with optical interconnects between chips because underfills require high loading of silica fillers which scatter light, is solved, thus allowing flip chips to incorporate optical interconnects.

Abstract: There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one kind or two kinds of Pt and Pd of 1000 to less than 5000 ppm in total, Ir: 1 to 200 ppm, Ca: 20 to 100 ppm, Eu: 10 to 100 ppm, Be: 0.1 to 20 ppm, if necessary, and La: 10 to 100 ppm, if necessary. The total amount of at least two kinds of Ca, Eu, Be, and La is in a range of 50 to 250 ppm.

Abstract: A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn. This solder exhibits a satisfactory solderability in solder joints and shows a high resistance to electrode leaching upon soldering or when the resulting soldered article is left at high temperatures.

Abstract: Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.

Abstract: The present invention relates to an aluminum alloy brazing sheet (1) for a heat exchanger improved in a life including a fatigue in a plastic area and an aluminum alloy heat exchanger tube (11) using the brazing sheet, which is composed of: a core material (2) of an Al—Mn series alloy; a skin material (3) of any one of an Al—Zn series alloy, an Al—Zn—Mg series alloy, an Al—Si—Mn—Zn series alloy, and an Al—Si—Mn—Mg—Zn series alloy clad on one side of the core material; and a brazing material (4) of an Al—Si series alloy clad on the other side of the core material, and is adapted so that an X-ray diffraction intensity ratio of the aluminum alloy brazing sheet satisfies a relational expression of I200/(I111+I200+I220+I311)?0.4.

Abstract: An aluminum alloy brazing sheet having high strength comprising: a core alloy; an Al—Si-based filler alloy cladded on one side or both sides of the core alloy, wherein the core alloy is composed of an aluminum alloy containing 0.3-1.2% (mass %, the same applies the below) Si, 0.05-0.4% Fe, 0.3-1.2% Cu, 0.3-1.8% Mn, 0.05-0.6% Mg, and containing one or more elements selected from the group consisting of 0.02-0.3% Ti, 0.02-0.3% Zr, 0.02-0.3% Cr and 0.02-0.3% V, the balance of Al and unavoidable impurities; and wherein, after the aluminum alloy brazing sheet is subjected to brazing, the core alloy features a metallic structure in which a density of intermetallic compounds having a grain diameter of at least 0.1 ?m is at most ten grains per ?m2.