Abstract: In some examples, a coil electrode assembly includes a coil electrode including a plurality of windings and extending from an electrode proximal end to an electrode distal end, the coil electrode defining an electrode lumen from the electrode proximal end to the electrode distal end. The coil electrode assembly further includes an insulative tube extending within the lumen of the coil electrode such that the coil electrode extends along an outer surface of the insulative tube. The coil electrode is partially embedded within the insulative tube when the insulative tube is in an expanded state to maintain a spacing between the windings.

Abstract: A wire assembly includes a cable and a contact. The wire includes at least an inner conductor and an insulating jacket surrounding the inner conductor, wherein a tip of the inner conductor is exposed at a first end. The contact is welded to the tip of the inner conductor at the first end.

Abstract: A pressure vessel includes a liner including a cylinder part and side parts provided at both ends of the cylinder part, each side part having a dome shape, and a carbon fiber layer including a first hoop layer surrounding a part of an outer circumferential surface of the cylinder part and second hoop layers surrounding other parts of the outer circumferential surface of the cylinder part, each of the second hoop layers having a thickness different from a thickness of the first hoop layer.

Abstract: A bonding wire for a semiconductor device, characterized in that the bonding wire includes a Cu alloy core material and a Pd coating layer formed on a surface of the Cu alloy core material, the bonding wire contains an element that provides bonding reliability in a high-temperature environment, and a strength ratio defined by the following Equation (1) is 1.1 to 1.6: Strength ratio=ultimate strength/0.2% offset yield strength.

Abstract: A wire bonding system is provided. The system includes a bond head, a bonding tool carried by the bond head, a wire supply configured for bonding by the bonding tool, and a wire shaping tool carried by the bond head. The wire shaping tool is independently moveable with respect to the bond head and the bonding tool.

Abstract: An improvement in the quality of wire bonding is achieved by reducing the vibration of a lead frame or a wiring substrate after wire bonding. Over a heat block in a wire bond portion of a wire bonder, there is provided a cooling blower for cooling a wire-bonded matrix frame so that the temperature thereof may decrease stepwise. After wire bonding, cold air is blown from the cooling blower to the matrix frame, and temperature control of the matrix frame is performed so that the temperature of the matrix frame after wire bonding may decrease stepwise. Or, the wire-bonded matrix frame is fixed with a holding tool such as a frame holding member, a guide member, a roller means, or an elastic means until cooling is completed.

Abstract: In one embodiment, a support structure comprises a base, a compliant layer, and a protective layer which is used to secure a semiconductor device, such as a lead-frame, to a window clamp during a bonding process. The compliant layer distributes even loading over the surface of the semiconductor device while clamped. In other embodiments, the compliant layer may be segmented into individual portions corresponding with openings in the window clamp. The window clamp may also have a compliant layer and a protective layer and may be used with or without a compliant layer on the support structure. Features on the protective layer may be included to support structures of the semiconductor device.

Abstract: A process for reducing aluminum pick-up and adherence during the ultrasonic welding of aluminum braids which are welded in a vertically and/or horizontally adjustable compression chamber of an ultrasonic welding device. The static tool parts which delimit the compression chamber have working surfaces made from polycrystalline diamond (PCD).

Abstract: A wire bonding method for bonding a ball 11 which is formed at a tip end of a bonding wire to a pad 2 that is a first bond point to form a first bonding part 12 and bonding the wire 10 to an interconnect wiring 4 that is a second bond point to form a second bonding part, thus connecting the pad 2 and the interconnect wiring with the wire, wherein after the ball is bonded to the first bond point and a capillary 6 is ascended, examination is performed to find any bonding failure of the first bonding part; and when the bonding failure at the first bond point is found, then the capillary is caused to descend to execute bonding to bond the first bonding part to the first bond point.

Abstract: For selecting suitable bonding parameters for forming wire bonds onto bond pads of a substrate, one or more indentations are made onto at least one bond pad of the substrate with an indentation tool by applying a series of predetermined forces onto the at least one bond pad with the indentation tool. A depth-force profile of the substrate is measured comprising a relationship between each predetermined force that is applied and a resultant depth of the indentation made by the indentation tool. An appropriate set of bonding parameters suitable for forming wire bonds on the substrate is determined based on the measured depth-force profile.

Abstract: Provided is a bonding apparatus capable of forming even loops at high speed. According to a bonding apparatus 1, a capillary 5 is lowered to a bonding position to bond an initial ball 10 to a pad 104 on an overhanging die 100. Here, a position of the capillary 5 in a Z direction and a load detected by a load sensor 7 are detected and stored every predetermined time period. A load change point is detected by referring to the stored load and the stored position. By subtracting the bonding position from a load changing position of the capillary 5 at the load change point, a movement amount Z of the capillary 5 from the load changing position to the bonding position is calculated. After the capillary 5 is lifted by the movement amount Z, a wire loop is formed between the pad 104 and a lead 105.

Abstract: An annealed platinum free air ball is bonded to a first contact and to a second contact. The bonding work hardens the platinum so that a work hardened platinum ball is resistant to temperature induced creep.

Abstract: A wedge wire bonder comprises a wedge that is operative to oscillate along a transducer axis for bonding a wire onto a surface and a wire clamp comprising a pair of parallel clamping plates for clamping the wire. The clamping plates having clamping surfaces that are oriented substantially perpendicularly to the transducer axis. Lateral guides are arranged on opposite sides of the wire, such that the lateral guides and the wire are generally aligned parallel to the clamping surfaces of the clamping plates for guiding the wire towards the wedge.

Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.

Abstract: A method of calibrating a wire payout related to predetermined looping motions used during formation of a wire loop is provided. The method includes the steps of: (a) determining a first wire payout length related to predetermined wire looping motions used in the formation of a first of the wire loop, the predetermined looping motions being performed on a first wire bonding system; (b) determining a second wire payout length related to the predetermined wire looping motions used in the formation of a second of the wire loop; and (c) adjusting at least one wire bonding process variable, and repeating step (b) with the at least one adjusted wire bonding process variable such that the second wire payout length determined in the repeated step (b) is closer to the first wire payout length than the second wire payout length determined in the initial step (b).

Abstract: Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.

Abstract: The invention discloses apparatus and methods for the formation of bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires are preferably non-identical, for example, being of different gauges and/or material composition. According to a preferred embodiment of the invention, dual capillary bond head apparatus includes a rotatable ultrasonic horn with a pair of capillaries for selectably dispensing separate strands of bond wire and for forming bonds on bond targets. According to another aspect of the invention, a method is provided for dual capillary IC wirebonding including steps for using two dual capillary bond heads for contemporaneously attaching non-identical bond wires to selected bond targets on one or more IC package assemblies.

Abstract: An electrical bond connection system between a first electrical contact surface and a second electrical contact surface having at least one first electrical conductor, which is bonded to at least one of the contact surfaces via at least one first bond connection. At least one additional second electrical conductor (9) is bonded to the first electrical conductor (8) via at least one second bond connection (10, 13), the two bond connections (10) being offset from one another. The present invention also relates to a method for manufacturing an electrical bond connection system existing between a first electrical contact surface and a second electrical contact surface.

Abstract: A method of forming a conductive bump is provided. The method includes the steps of: (1) bonding a free air ball to a bonding location using a bonding tool to form a bonded ball; (2) raising the bonding tool to a desired height, with a wire clamp open, while paying out wire continuous with the bonded ball; (3) closing the wire clamp; (4) lowering the bonding tool to a smoothing height with the wire clamp still closed; (5) smoothing an upper surface of the bonded ball, with the wire clamp still closed, using the bonding tool; and (6) raising the bonding tool, with the wire clamp still closed, to separate the bonded ball from wire engaged with the bonding tool.

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract: A method and an adjustable clamp system for clamping a die assembly during wire bonding. The system includes at least one pair of opposing base walls, each of the base walls has a base clamping surface. There is at least one pair of clamping members, each one of the clamping members being movable towards a respective base clamping surface to thereby clamp a lead frame of the die assembly. A die assembly support is disposed between the pair of opposing base walls and the die assembly support and pair of opposing base walls provide a cavity. There is a position sensor coupled to a controller and there is also a drive that is controllable by the controller. The drive provides movement of the die assembly support relative to each the base clamping surface to thereby adjust a depth of the cavity.

Abstract: The invention discloses apparatus and methods for the formation of bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires are preferably non-identical, for example, being of different gauges and/or material composition. According to a preferred embodiment of the invention, dual capillary bond head apparatus includes a rotatable ultrasonic horn with a pair of capillaries for selectably dispensing separate strands of bond wire and for forming bonds on bond targets. According to another aspect of the invention, a method is provided for dual capillary IC wirebonding including steps for using two dual capillary bond heads for contemporaneously attaching non-identical bond wires to selected bond targets on one or more IC package assemblies.

Abstract: A work clamp and a wire bonding apparatus that can sufficiently restrain oxidation of a bonding area even while reducing an amount of antioxidant gas that is used are provided. The work clamp includes an interior hollow portion 10 providing an atmosphere of the antioxidant gas, a lower opening portion 11a provided below the interior hollow portion, for containing the bonding area in the interior hollow portion, an upper opening portion 11 provided above the interior hollow portion, for exposing the bonding area, a cavity 13 covering the interior hollow portion and having an area larger than an opening area of the upper opening portion, gas introduction ports 14a, 14b provided at the cavity, for introducing the antioxidant gas into the cavity, and holes 21 connected to below the cavity, for blowing the antioxidant gas introduced from the gas introduction port to a portion other than the bonding area of the work.

Abstract: A wire tensioner is provided for a wire bonder, the wire tensioner comprising a tubular body having a bore through which bonding wire is receivable and a bore outlet at an end of the tubular body from which the bonding wire is extendable towards a bonding tool. A chamber is formed next to the bore outlet that substantially encloses the bore outlet, the chamber including an air inlet connected to it that is operative to introduce clean air into the chamber. A vacuum outlet is connected to a side of the tubular body and is in fluid communication with the chamber via the bore, the vacuum outlet being operative to draw air from the bore outlet through the bore whereby to pull the wire.

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract: Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.

Abstract: A method of correcting bonding coordinates according to locations of a die and leads loaded for bonding is provided. The method includes searching for locations of die recognition areas and lead recognition areas, comparing the detected locations of the recognition areas, and correcting bonding coordinates of the die and the leads according to the result obtained by the comparison; and if a search for the locations of the die recognition areas fails, searching for reference bond pads, comparing locations of the detected reference bond pads with setting locations, and correcting bonding coordinates of a die and leads to be bonded according to the result obtained by the comparison.

Abstract: A holding tool for fixing an electronic component (2) during a manufacturing process, the electronic component (2) comprising a winding assembly (20) and an electronic circuit (24), wherein the holding tool (1) includes a holding tool body (10), first and second jaws (12, 14) disposed at the holding tool body (10) relatively movable to each other in a first direction (A), and first and second wire guide means (3, 4) characterized in that the first and second wire guide means (3, 4) are disposed at the holding tool body (10) remote from the jaws (12, 14).

Abstract: A thermal insulation system is provided for a component of a bonding system, such as an optical system. The thermal insulation system comprises multiple insulation layers located between the component and a heat source. The multiple insulation layers comprise at least one layer of moving air injected into the layer and a cover layer enclosing the layer of moving air. The multiple insulation layers may further comprise a layer of static air.

Abstract: A tail wire cutting method and bonding apparatus executing the same, in which a capillary raised to a predetermined height and a clamper disposed above the capillary and gripping a wire are caused to make reciprocating oscillation movement on, for instance, a circular arc that has an apex at the above-described predetermined height, thus forming (minute) cracks in a portion between the tail wire and a bonding end of a bonding point, and then cutting of a tail wire sticking out of the tip end of the capillary is executed by way of raising the capillary and clamper.

Abstract: A wire bonding method including the steps of: descending a capillary 5 from above an external lead 1 to press a wire 10 to such an extent that the wire is not completely connected to the external lead 1, thus forming a thin part 16 in the wire; next ascending the capillary 5 and the thin part 16 to substantially the same height as a first bonding point A, then moving the capillary 5 in a direction away from the first bonding point A, thus making a linear wire portion 18 and then cutting the wire at the thin part 16; then connecting the end 19 (thin part) of the linear wire portion 18 and the wire tip end 20 at the lower end of the capillary 5 are connected to the external lead 1; and then separating the wire tip end 20 from the external lead 1.

Abstract: A bonding apparatus comprising a bond arm and a wire bonding tool mounted to the bond arm is provided with thermal insulation in the form of a thermal shield substantially enclosing the bonding tool for insulating the bonding tool from ambient heat.

Abstract: A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.

Abstract: A horn-holder pivot type bonding apparatus including a horn holder for holding an ultrasonic horn, and a motor for driving the horn holder to pivot, with an imaginary pivot point of the horn holder being positionally fixed on a bonding surface. The motor is provided substantially in the center of the upper portion of the horn holder. The horn holder is formed with circular arc sections in the forward and rearward portions with respect to the imaginary pivot point; and a bonding head has, at portions corresponding to the circular arc sections of the horn holder, forward and rearward cams so that the cams are pivotable by supporting shafts. The forward and rearward cams have circular arc sections that contact the circular arc sections of the horn holder, the circular arc shape of the circular arc sections of the forward and rearward cams being centered on the supporting shafts.

Abstract: A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).

Abstract: While fabricating a packaged semiconductor chip, a wire is bonded on a chip contact pad using a wire bonding machine. A bond head of the wire bonding machine is moved relative to the chip contact pad, thereby pulling a first length of the wire out of the wire bonding machine. Part of the wire passes through a space between a first outer edge of a first bearing race and a second outer edge of a second bearing race during the pulling of the first length. The wire is bonded on a lead. A first piezoelectric element is energized in the bond head, thereby causing it to expand and press against the first bearing race, which brakes the first bearing race and brakes the wire between the first and second races. The bond head is moved relative to the lead during the braking and severs the wire proximate to the lead.

Abstract: An apparatus and method for automatically controlling a clamp gap between clamping arms of a wire clamp is provided wherein a motor generates an actuation force for moving the clamping arms relative to each other. A resilient member is positioned such that the actuation force acts upon and flexes the resilient member to an extent that is proportional to the clamp gap, and the clamp gap is controlled by adjusting the amount of actuation force according to a predetermined relationship between the actuation force and the clamp gap.

Abstract: A system for determining wire bonding tool placement for use with a wire bonder and an optical imager is provided. The system includes a prism disposed below the optical imager and the wire bonding tool. The system also includes at least one lens positioned between the prism and a lower portion of the wire bonding tool along a first optical axis. The at least one lens and the prism define an object plane between the at least one lens and the lower portion of the wire bonding tool. The at least one lens is positioned between the prism and the optical imager along a second optical axis. The at least one lens and the prism define an image plane between the at least one lens and the optical imager.

Abstract: A bonding arm swinging type bonding apparatus that has a rotational center 13 of the bonding arm 1 beneath the bonding arm. The rotating shaft parts 11 of circular arc form rotary motors 10 that rotate about the rotational center 13 of the bonding arm 1 are attached to the bonding arm 1, and the rotating shaft parts 21 of circular arc form air bearings 20 that rotate about this rotational center 13 are provided so that the rotating shaft parts of the circular arc form air bearings 20 are rotatable as a unit with the rotating shaft parts 11 of the rotary motors 10.

Abstract: A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire has a crushed part formed therein by crushing the part of the wire and a top of a ball bonded to the first bonding point with a capillary. The wire loop is formed by a wire bonding method which includes: bonding the wire to the first bonding point; moving the capillary horizontally and vertically while carrying out loop control; bonding the wire to the vicinity of the top of the ball bonded to the first bonding point; and thereafter, moving the capillary horizontally and vertically to the second bonding point while delivering the wire and carrying out loop control, and then bonding the wire to the second bonding point.

Abstract: A packaged IC including insulated wire for electrically connecting conductive structures of the packaged IC. In some embodiments, the packaged IC includes an IC die attached to a package substrate, where bond pads of the IC die are electrically connected to bond fingers of the substrate with insulated wire. The insulated wire has a conductive core and an insulator coating. In some examples, the insulator coating includes an inorganic covalently-bonded substance that is not an oxide of the electrically conductive core such as, e.g., silicon nitride or silicon oxide. In one example, the insulator coating is applied to a conductive core by a chemical vapor deposition (CVD) process such as a plasma enhanced chemical vapor deposition (PECVD).

Abstract: A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).

Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

Abstract: A two step wire bonding process is used to ultrasonically attach a wire (18) to a contact pad (13) on a semiconductor device (10). A first step is used to flatten a rounded tip (19) of the wire (18), and to start the bonding process. This is accomplished by applying a relatively large force to the rounded tip (19), and a relatively low vibrating displacement to the flattened wire tip (19). During a second step the large force is reduced, however; the vibrating displacement is increased. The total time for the two step wire bonding process is slightly less than a prior art one step process.

Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame. The wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

Abstract: In a wire cutting and feeding device used in a wire bonding apparatus, piezo-electric actuators are used as the driving source of a slide block which moves wire clamper toward and away from a workpiece upon which bonding is performed. The piezo-electric actuators include a feeding piezo-electric actuator, which causes expansion and contraction of the slide block, and two clamping piezo-electric actuators, which are alternately operated and clamp the slide block. The slide block is caused to move by means of respective power-"on"/power-"off" combinations of the feeding piezo-electric actuator and the two clamping piezo-electric actuators.

Abstract: A wire bonding method in the manufacture of, for instance, a semiconductor device in which first bonding points or pads of a chip and second bonding points or leads of a lead frame are connected by wires, and the bonding by wires is initiated from one end of the row of the first bonding points (pads) and is successively performed in one direction toward a center of the row, and after bonding has been performed up to an approximate center of the row, then bonding is initiated from another end of the row in the opposite direction toward the center of the row.

Abstract: A gold alloy wire for wedge bonding, comprising 1 to 100 parts per million by weight of calcium (Ca), the remainder being gold and inevitable impurities, said gold alloy wire having a tensile strength of not less than 33.0 kg/mm.sup.2 and an elongation of 1 to 3%. The gold alloy wire has a gold purity of not less than 99.9% or further comprises 0.2 to 5.0% by weight of at least one element selected from the group consisting of Pd, Ag and Pt.

Abstract: A wire bonding method for joining a metal wire with a bonding pad disposed on a semiconductor element by using a load and supersonic wave vibration, comprising: during interval of time from contact of the metal wire with the bonding pad to application of the supersonic wave vibration, continuously applying a first bonding load and a second bonding load which is lower than the first bonding load; and after application of the supersonic wave vibration, continuously applying a third bonding load of a size of about 50% of the load of the second bonding load and a fourth bonding load which is lower than the first bonding load and higher than the third bonding load. The reliability of the fine wire bonding joint is improved remarkably, whereby a high quality semiconductor device cna be produced at a low cost.

Abstract: The present invention concerns a self locking system for holding a wire bonding tool in a wire bonding transducer and comprises an unitary cam key rotatably mounted in a cam key aperture extending through an anti-node end of an ultrasonic transducer. A cam surface on the cam key is operable to lock a bonding tool mounted in a substantially vertical bonding tool aperture when rotated less than 360.degree. in said cam key aperture.