Clasp-down Patents (Class 248/510)
  • Patent number: 11938988
    Abstract: A cart and rack assembly for transporting a planar material includes a rack and a cart. The rack includes a frame coupled to a base. The frame has an upper portion and a lower portion. The upper portion has a first width, and the lower portion has a second width. The cart is configured to reversibly receive the base. The cart includes a guide member configured to guide either of the base or the cart into a predetermined position when the base is received by the cart. The assembly further includes a bracket having a first end and a second end which is configured to selectively secure the planar material to the assembly. The base has a series of apertures configured to accept the first end of the bracket. The second end of the bracket is configured to be selectively coupled with the upper portion of the frame.
    Type: Grant
    Filed: February 28, 2023
    Date of Patent: March 26, 2024
    Assignee: BBJ SOLUTIONS, LLC
    Inventors: Brian Burns, Brad Burns, Jeff Erickson
  • Patent number: 11553622
    Abstract: The present disclosure provides a connector assembly including a receptacle connector, a shielding shell and a heat sink. The shielding shell covers the receptacle connector. The heat sink is assembled to the shielding shell and includes a heat dissipating base plate and a heat dissipating fin soldered on the heat dissipating base plate. The heat dissipating base plate has a soldering region on which solder is provided and a recessed channel provided between a rim of the heat dissipating base plate and an outer periphery of the soldering region. The solder is provided within the soldering region in a manner such that a face of the soldering region is covered by the solder.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: January 10, 2023
    Assignee: Molex, LLC
    Inventor: Chien-Chih Chen
  • Patent number: 10532627
    Abstract: A fastening arrangement for fastening at least two components together may be utilized in a motor vehicle. The fastening arrangement may include a plurality of screw-on brackets provided on a first component, and a number of retaining pegs provided on a second component. The screw-on brackets may include a through hole that may receive a respective projection of the number of retaining pegs when the first component and the second component are assembled with one another. At least one retaining pegs may include a cover plate that may facilitate receiving an associated screw-on bracket laterally and clip the screw-on bracket between the at least one retaining peg and the cover plate. A screw-in peg having a screw-in opening may be disposed on the second component. A hold-down may be securable to the screw-in peg to secure an associated screw-on bracket and an associated retaining peg.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: January 14, 2020
    Assignee: Mahle International GmbH
    Inventors: Erich Philippin, Ulrich Schneider
  • Patent number: 9500417
    Abstract: A thermal module connection structure providing a substrate, a heat generation unit disposed on the substrate, includes: a heat dissipation unit disposed on the heat generation unit, a protrusion section outward extending from each of two sides of the heat dissipation unit; and a locating assembly including a first locating member and a second locating member mounted on two sides of the heat generation unit, which sides are free from the protrusion sections. A carrier member is disposed at each of two ends of the first locating member. The protrusion sections of the heat dissipation unit are positioned on the carrier members. One end of the carrier member is pivotally connected with the first locating member, while the other end is latched with the second locating member. The carrier member has a press member for pressing the protrusion section against the carrier member to fix the heat dissipation unit.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: November 22, 2016
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Sheng-Huang Lin
  • Patent number: 8939425
    Abstract: A mounting device for mounting a fan includes a base board and two fixing assemblies. The fan includes two opposite boards. The base board forms four rods. Each fixing assembly includes a receiving member and an engaging member. The receiving member includes a first pole capable of extending through a corresponding one of the boards and a first block abutting against an outer surface of the board. The engaging member includes a second pole capable of extending though the other one of the boards to be engaged in the first pole, and a second block abutting against an outer surface of the other board. Each of the first and second blocks defines a fixing hole through which a corresponding one of the rods is capable of extending.
    Type: Grant
    Filed: April 17, 2012
    Date of Patent: January 27, 2015
    Assignee: ScienBiziP Consulting (Shenzhen) Co., Ltd.
    Inventor: Zheng-Heng Sun
  • Publication number: 20140321064
    Abstract: At least one implementation provides a hold down for an electronic device. The electronic device includes a support frame, a circuit board coupled to the support frame and having at least one component, a thermal pad thermally coupled to the component, and a heat sink associated with the thermal pad. The hold down includes a generally planar portion adapted to be positioned over a surface of the heat sink. The hold down also includes a plurality of connecting structures extending angularly from the generally planar portion. The connecting structures and configured to engage the support frame to cause the hold down to apply the biasing force to retain the thermal pad against at least one of the heat sink or the component when the heat sink and the thermal pad are positioned between the hold down and the support frame. A method is also provided for attaching the hold down.
    Type: Application
    Filed: November 21, 2012
    Publication date: October 30, 2014
    Inventors: William Hofmann Bose, Mickey Jay Hunt
  • Patent number: 8833034
    Abstract: Weather protection systems, for use in protecting structures and structural elements during severe weather events, are disclosed. Also disclosed are methods of assembling and installing weather protection systems. Weather protection systems of this invention provide fabric to cover a structural element; the fabric is connected to the structure via a clip. A clip of is invention may include features such as fastening points, anchor points, and engaging members; a clip may also introduce a desirable point of flexibility into a system of this invention. Other features of weather protection systems of this invention may include resin and straps.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: September 16, 2014
    Assignee: Hurricane Fabric, LLC
    Inventors: Robert Gorman, Yehuda Ozari, Aaron Feinberg
  • Patent number: 8746647
    Abstract: A device for aiding in storing implements comprising a retractable support adapted to engage a hook. The support being held to an implement via a monolithically formed, or attached, base portion. The device being capable of use with a wide variety of implements and having various forms adaptable for use to aid in hanging implements or for assisting them to stand alone. The support being retractable and capable of being held in various positions via an interference fit.
    Type: Grant
    Filed: March 1, 2005
    Date of Patent: June 10, 2014
    Inventor: Kenneth G. Stewart, III
  • Patent number: 8668181
    Abstract: Devices associated with an interface that is advantageous for the customized attachment of pieces of furniture to the floor of an aircraft. The interface includes rails extending longitudinally in the aircraft cabin, able to receive anchoring devices for connecting the furniture elements to these rails. The anchoring devices include axial and radial claw clamping devices which are associated together in pairs and operated together in pairs by a single and same lever (58, 95).
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: March 11, 2014
    Assignee: Airbus Operations S.A.S.
    Inventors: Francis Dazet, Francois Rouyre, Alain Depeige
  • Patent number: 8616516
    Abstract: Embodiments of the present invention provide a mounting bracket for use in connection with a rail, for assembling cabin interior components into an aircraft.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: December 31, 2013
    Assignee: Intertechnique S.A.
    Inventors: Wolfgang Rittner, Rudiger Meckes, Hasso Weinmann
  • Patent number: 8572909
    Abstract: A flat roof racking system configured for receiving solar panels having electrically conductive frames, the racking system comprising substantially parallelly disposed panel support structures, spacer bars and retaining and grounding clips pairs, each panel support structure comprises a first end, a second end, a top member having a first channel section connected to a second channel section and two ends, and a bottom member having a channel section and two ends. The first and second channel sections are disposed in a plane but at an angle from one another and each end of the bottom member is fixedly connected to an end of the top member such that the top member is configured to make a first tilt angle at the first end with the bottom member and a second tilt angle at the second end with the bottom member.
    Type: Grant
    Filed: March 21, 2012
    Date of Patent: November 5, 2013
    Assignee: Solar Mounting Solutions, LLC
    Inventors: Angel M. Rivera, Stanley E. Mayer
  • Patent number: 8482923
    Abstract: Provided is a heat sink clip for fastening a heat sink on a printed circuit board (PCB). The heat sink clip includes two hooks and a wire clip. The two hooks are inversely fixed to the PCB at two opposite sides of the heat sink. The wire clip includes a pressing wire pressing the heat sink, two pairs of deforming wires extending from the lateral of the pressing wire along two radial directions of the pressing wire and away from the PCB, and two engaging wires engaging with the respective hooks such that the deforming wires are bent towards the PCB.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: July 9, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Liang Tan, Xiao-Feng Ma
  • Patent number: 8413944
    Abstract: Mounting systems for mounting solar panels to a surface are disclosed and can include panel clamp assemblies and rail clamp assemblies. Panel clamp assemblies can comprise a panel clamp having a base and arms extending from edges of the base, the base having an aperture, a rail clamp having a central portion with an aperture and two flexible tabs extending from the central portion on opposing sides of the aperture and a fastener threaded through the apertures such that that flexible tabs contact a head of the fastener and the arms extend in an opposite direction from the flexible tabs. Rail clamp assemblies can comprise a base member having a bottom and two side walls, the bottom having at least one aperture and each side wall having an elongated aperture, two clamping members and a fastener, wherein the side walls of the base member are positioned such that the opening is of sufficient size to receive the rail.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: April 9, 2013
    Assignee: Applied Energy Technologies
    Inventors: John Henry Harberts, Aaron Faust, John Edward Klinkman, Ronald Paul Katt, David Wayne Raffler
  • Patent number: 8398040
    Abstract: A fastening apparatus for pressurized-gas vessels is provided on a carrier. The fastening apparatus makes it possible to fasten a pressurized-gas vessel as well as to adapt the fastening apparatus to differently sized pressurized-gas vessels with one manipulative step. The fastening apparatus includes a carrier, a belt, a locking device, fastening points and redirection points for the belt.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: March 19, 2013
    Assignee: Draeger Safety AG & Co. KGaA
    Inventor: Alexander Busch
  • Patent number: 8379383
    Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a cooling unit includes a radiator unit on the circuit board, and a cooling fan connected to the radiator unit and supported outside the circuit board in a floating state, a keyboard on a top wall of the housing, opposed to the circuit board and the cooling fan, a first supporting member disposed between the cooling fan and the keyboard and configured to support the keyboard when a key is depressed, and a second supporting member disposed between the cooling fan and a bottom wall of the housing and configured to support the cooling fan when a key is depressed. At least one of the first and second supporting members is formed of an elastic material.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: February 19, 2013
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yusuke Sugiura, Yuichi Koga
  • Publication number: 20120241585
    Abstract: An anchoring device for a wastebasket includes a locking plate that adheres to a hard surface (e.g. a floor) using Command™ adhesive strips or other comparable means of adhesion. The locking plate includes a tongue and a rail. A bottom outer surface of the wastebasket includes a corresponding groove and track into which the tongue and rail of the locking plate are inserted, allowing the wastebasket to be anchored to the locking plate and the easy removal of trash liners, without having the wastebasket lift off the floor. A second embodiment includes a base to which the wastebasket is attached by a pivot mechanism. The bottom surface of the base has the corresponding groove and track that anchors to the locking plate in an identical manner, allowing a full trash liner to be removed from the wastebasket while in the tilted orientation without lifting the wastebasket from the underlying surface.
    Type: Application
    Filed: March 14, 2012
    Publication date: September 27, 2012
    Inventor: Conor John Doyle
  • Patent number: 8201788
    Abstract: A side arm clamp assembly is formed of a molded body having a clip receiver slot, a retention clip formed of a retention portion and an insertion portion that is slidingly receivable into the clip receiver slot. A detent is provided between the clip receiver slot and the insertion portion of the retention clip received thereinto. Means are provided for securing the molded body relative to an electronics platform with the retention portion of the retention clip projected over a mounting surface thereof.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: June 19, 2012
    Inventor: Jeffrey D. Carnevali
  • Patent number: 8074942
    Abstract: A mounting apparatus includes a bracket for receiving a storage device, and a latching member. The bracket includes a sidewall, and a top wall perpendicular to the sidewall. The latching member includes a main body pivotably fixed to the sidewall of the bracket, and a latching portion retainable on the top wall of the bracket. The main body forms two pins to extend through the bracket for fixing the storage device.
    Type: Grant
    Filed: November 17, 2006
    Date of Patent: December 13, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Bin Huang, Ding-Fang Li, Chun-Chi Liang
  • Publication number: 20110220601
    Abstract: An apparatus is provided for organizing and cleaning fasteners used in a dynamoelectric machine. The apparatus includes a frame having a first end wall and a second end wall opposed to the first end wall, and a plurality of shelves connected to and located between the first end wall and the second end wall. At least one of the shelves includes a plurality of concave regions, that are configured to retain at least one of the fasteners. A mounting region is provided for the attachment of a fastener clamp. The fasteners from the dynamoelectric machine can be stored on the plurality of shelves and displayed.
    Type: Application
    Filed: March 9, 2010
    Publication date: September 15, 2011
    Inventors: John W. Herbold, Ryan M. Pastrana, Kahwai G. Muriithi, Jennifer L. Gant, Coy Y. Jackson, Jeffrey J. Nelson
  • Patent number: 7924567
    Abstract: A clip includes a main body, a pair of locking members integrally formed at opposite ends of the main body, and a securing member secured onto one of the locking members. The one locking member includes an upper portion, a lower portion wider than the upper portion, and a step between the upper and lower portions. The securing member includes a handling portion and an engaging portion extending downwardly from the handling portion. A pair of flanges are formed on the engaging portion facing the main body and abutting the step. A clearance is defined between the flanges and the engaging portion receiving the upper portion. One of the engaging portion and the one locking member forms an engaging hole, and the other one forms a hook engaging into the engaging hole.
    Type: Grant
    Filed: May 13, 2009
    Date of Patent: April 12, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventor: Xin-Xiang Zha
  • Patent number: 7817427
    Abstract: A fastener includes a fastener post, a sleeve, a nut and an elastic element. The fastener post includes a shaft, a tapered portion and a threaded portion. The sleeve includes a smooth portion and a clamp portion having a number of resilient strips. The nut is threaded onto the threaded portion. The elastic element is disposed around the sleeve and compressed between the nut and an ear of a heat sink to generate a resilient force. The resilient force moves the tapered portion of the fastener post into the sleeve such that the strips of the clamp portion of the sleeve are tilted outwardly to tightly abut against a bottom of a printed circuit board on which the heat sink is mounted.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: October 19, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Min Li, Lei Cao
  • Patent number: 7768784
    Abstract: A heat dissipation assembly includes a heat sink, a retention module surrounding the heat sink, and a pair of wire clips pivotably attached to the retention module to press the heat sink against an electronic component on a printed circuit board. The retention module includes three walls surrounding a rectangular opening through which the heat sink contacts with the electronic component. Two barbs and two supporting members are formed on the three walls. Each clip includes a pivoting section retained in one supporting member, an abutting section pressing the heat sink toward the electronic component, and a locking section locked with one barb, a connecting section connecting the abutting section with the pivoting section, and a handle formed from the locking section. Each clip is entirely located at a corresponding side of the heat sink.
    Type: Grant
    Filed: November 12, 2008
    Date of Patent: August 3, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Jin-Song Feng
  • Patent number: 7746651
    Abstract: A heat sink assembly includes a heat sink and a clip for mounting the heat sink to an electronic component of a printed circuit board. The heat sink includes a base and a plurality of fins extending from the base. The clip includes a pressing member and a pair of elongated arms formed on opposite ends of the pressing member. The pressing member has a lower portion protruding toward the base of the heat sink. A middle one of the fins extends upwardly through the pressing member in a manner such that the lower portion of the pressing member resiliently abuts against the heat sink. The two arms are located on opposite lateral sides of the heat sink and bent downwardly to engage with the printed circuit board so that the pressing member exerts a force on the heat sink toward the electronic component.
    Type: Grant
    Filed: July 31, 2007
    Date of Patent: June 29, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jian-Ping Yu, Dong-Yun Li, Wei Wu
  • Patent number: 7746645
    Abstract: A heat sink assembly includes a heat sink and a clip assembly. The clip assembly includes a clip and a pair of movable fasteners pivotally connected to the clip. The clip includes a main body, two pressing portions extending from two opposite ends of the main body and two locking arms extending oppositely from the two pressing portions, respectively. The movable fasteners each include a main body, a pair of receiving portions curved upwardly from the main body and receiving a corresponding locking arm therein and a hook extending downwardly from the main body and engaging with a clasp on a printed circuit board. A distance from each of the hooks of the movable fasteners to a corresponding clasp can be adjustable via rotation of the movable fasteners around the locking arms of the clip.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: June 29, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Xiang-Yang He, Jing Zhang
  • Patent number: 7746643
    Abstract: A heat sink assembly includes a heat sink having a first shoulder and a second shoulder, and a locking device having a retention module, a first clip and a second clip. The first clip has two extension portions engaging with the retention module and a pressing portion between the two extension portions. The second clip comprises a pressing portion located on the second shoulder, an axle connecting with the pressing portion and pivotably engaging with the retention module and a locking portion connecting with the pressing portion. The second clip can rotate around the axle thereof when the heat sink assembly is in an unlocked position; the locking portion engages with the retention module and the pressing portion presses the second shoulder of the heat sink toward the retention module when the heat sink assembly is in a locked position.
    Type: Grant
    Filed: July 31, 2007
    Date of Patent: June 29, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hao Li, Jun Long, Tao Li
  • Patent number: 7729124
    Abstract: A mounting apparatus includes a heat sink with two first mounting holes receiving two screws respectively, and a printed circuit board (PCB) with a second mounting hole, and a third mounting hole corresponding to the first mounting holes. The second mounting hole includes a second inserting hole, and a second accommodating hole extending from the second inserting hole along a first axis. The third mounting hole includes a third inserting hole, and a third accommodating hole extending from the third inserting hole along a second axis. One screw is inserted into the second inserting hole, and moved along a first axis to be received in the second accommodating hole. Another screw is angled into the third inserting hole, released to return to an upright position and received in the third accommodating hole.
    Type: Grant
    Filed: January 13, 2009
    Date of Patent: June 1, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Chin-Wen Yeh, Zhen-Neng Lin
  • Patent number: 7717386
    Abstract: A support device includes a support arm and a support plate in which the support arm has two opposite clamps each having an arrangement for laterally moving a height adjustment mechanism so that after performing both vertical and horizontal adjustments of the clamps pressing pivotably connected arm members will secure a visual display (e.g., computer LCD display) onto the support plate.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: May 18, 2010
    Inventor: Nai-Hsuan Wang
  • Patent number: 7656668
    Abstract: A secure device for a heat sink and CPU includes a main support arm and an operation handler. The main support arm has a first hook section at one end thereof and provides a contact face and a movable second hook section at another end thereof. The operation handle further includes a main operation part and a handle part and the main operation part provides a guide groove with a first end and a second end. The guide groove extends along radial direction of main operation part from the first end to the second end and a uvula is formed between the first end and the second end. The circumferential side of the main operation part defines a press section for touching the contact face and a pivotal shaft is movably joined to the guide groove and the second hook section to actuate the second hook section moving upward or downward to selectively perform engagement or loosening while the pivotal shaft moving along the guide groove between the first and second ends.
    Type: Grant
    Filed: May 1, 2007
    Date of Patent: February 2, 2010
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Sheng-Huang Lin
  • Patent number: 7652886
    Abstract: A heat sink assembly for dissipating heat from an electronic component (12) mounted on a printed circuit board (10) includes a heat sink (20) resting on the electronic component, and a fastener assembly (30) for securing the heat sink to the electronic component. The fastener assembly includes a hollow post (36) having a threaded hole (360) defined therein, a screw (32) threadedly engaged in the threaded hole, a coil spring (34) compressibly disposed between the heat sink and a top portion of the screw, and a latch (38) pivotably engaging with a bottom portion of the post. When the screw moves downwardly towards the printed circuit board, the latch is pushed by the screw to rotate and press the heat sink towards the printed circuit board, thus securing the heat sink to the electronic component.
    Type: Grant
    Filed: July 31, 2007
    Date of Patent: January 26, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Min Li, Lei Cao
  • Patent number: 7643299
    Abstract: A clip for mounting a heat sink on a circuit board includes a positioning coil for rotatably engaging with the heat sink. Two elongated arms extend from two ends of a line bisecting the positioning coil respectively, and a pair of hooks formed at distal portions of the two arms respectively for engaging with the circuit board.
    Type: Grant
    Filed: August 17, 2007
    Date of Patent: January 5, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsiu-Chang Lai, Hung-Yi Wu, Zhen-Xing Ye, Ke Sun, Xiao-Zhu Chen, Ming-Ke Chen
  • Patent number: 7639497
    Abstract: A heat dissipation device for dissipating heat from a heat-generating electronic element includes a heat sink for contacting with the heat-generating electronic element, a fan placed on the heat sink for providing an airflow through the heat sink and two wire clips. The fan comprises a frame. Each wire clip comprises a V-shaped main body and two locking parts at two opposite ends of the main body. Middles of the main bodies of the two wire clips are securely attached to two lateral sides of the heat sink by two screws. The locking parts of the wire clips are fastened to the frame of the fan, with the main bodies being deformed and pushing the fan toward the heat sink.
    Type: Grant
    Filed: December 10, 2007
    Date of Patent: December 29, 2009
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Hong-Bo Xu
  • Patent number: 7619892
    Abstract: A positioning device for connecting a heatsink to a chip set includes a rectangular frame having a through hole in a center thereof, two side plates extending from two opposite sides thereof and each side plate has one hook extending from an inside thereof. Two positioning rods extend from the other two opposite sides of the rectangular frame, and a plurality of flexible rods extend from insides of the rectangular frame. The heatsink extends through the through hole of the rectangular frame and the positioning rods insert through apertures in the heatsink. The hooks are hooked to two sides of the chip set and the flexible rods press on the heatsink.
    Type: Grant
    Filed: February 5, 2008
    Date of Patent: November 17, 2009
    Assignee: Malico Inc.
    Inventor: Robert Liang
  • Patent number: 7606037
    Abstract: A fastener for a heat-dissipating device is adapted to secure a heat sink on a securing seat. The fastener includes a fastening arm having a plate body and a coupling member adapted to couple with one positioning member of the securing seat, a fastening member disposed spacedly below the plate body opposite to the coupling member and adapted to couple with another positioning member, and two linkage sets. Each linkage set is disposed between the plate body and the fastening member, and includes first and second resilient connecting elements connected respectively to the plate body and the fastening member. The linkage sets are pivotable toward each other to cause the plate body to displace toward the fastening member such that the linkage sets engage two openings in the securing seat.
    Type: Grant
    Filed: September 11, 2007
    Date of Patent: October 20, 2009
    Assignee: Aopen Inc.
    Inventor: Chun Chang
  • Patent number: 7564689
    Abstract: A clip (100) includes a body (10), a handle (30) and a movable fastener (20). The body has a first end terminating in a supporting portion (16) and a second end terminating in a latching leg (14). The handle has a cam portion (32) supported on the supporting portion and a pivot axis (36) provided on the cam portion. The movable fastener extends through the supporting portion and pivotally couples to the cam portion. The movable fastener defines a slot (22) therein, and the slot starts from an entrance defined in an outer edge at a side of the movable fastener and extends in the movable fastener. The cam portion is pivotally connected to the movable fastener via the pivot axis sliding into the slot from the entrance. The handle is turnable relative to the movable fastener between a locked position and a relaxed position.
    Type: Grant
    Filed: May 5, 2008
    Date of Patent: July 21, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Qing-Lei Guo, Shou-Li Zhu, Ming Yang, Jun Tong
  • Patent number: 7558067
    Abstract: A retaining tool for a heat sink includes a frame, at least an operation member and at least an engaging member. The frame is attached to an upper portion of the heat sink with a projection at two opposite sides thereof and the projection has a contact face. The operation member provides a main operation part and a stir part. The main operation part is disposed on top of the contact face and the stir part is angularly lifted for the main operation part being capable of moving relative to the contact face. The engaging member further has a follower part piercing the projection with an end of the follower part connecting with the main operation part pivotally and another end of the follower part being joined to a first elastic part and a second elastic part respectively.
    Type: Grant
    Filed: May 1, 2007
    Date of Patent: July 7, 2009
    Assignee: Asia Vital Conponents Company Ltd.
    Inventor: Sheng-Huang Lin
  • Patent number: 7554810
    Abstract: A heat dissipating apparatus includes a plurality of posts for being detachably attached to a circuit board adjacent a socket mounted thereon, a mounting frame for being attached to the heat dissipation module, and a plurality of support devices. Each support device comprises an enlarged flange portion, a support portion extending up from an upper surface of the flange portion, and a coupling portion extending down from a lower surface of the flange portion and detachably installable to a corresponding post, thereby suspending the heat dissipation module over the socket. A plurality of sleeve bodies is for respectively receiving the posts, and configured for being sandwiched between the corresponding flange portions and the circuit board. A plurality of fasteners extending from the mounting frame is engagable with the support portions respectively.
    Type: Grant
    Filed: December 29, 2007
    Date of Patent: June 30, 2009
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Ke Sun, Zhen-Xing Ye, Ming-Ke Chen, Xiao-Zhu Chen
  • Patent number: 7522420
    Abstract: A clip module and heat-dissipation device having the same is disclosed. The heat-dissipation device includes a retention module (RM) disposed on a circuit board having a heat-source, a heat sink disposed on the heat-source, and a clip module. The clip module is across in the heat sink and is clipped with the RM. The clip module includes a body, a fastener, and a pressing structure. One end of the body is clipped with the RM, and the heat sink is pressed on the heat-source by the body. The fastener is disposed in the other end of the body. One end of the fastener is clip with the RM, and a guiding portion is disposed in the other end of the fastener. The guiding portion is slid in a guiding groove of the pressing structure, so that the pressing structure is connected with the fastener.
    Type: Grant
    Filed: December 5, 2007
    Date of Patent: April 21, 2009
    Assignee: AMA Precision Inc.
    Inventor: Kung-Jen Yan
  • Patent number: 7518872
    Abstract: A bottom loaded assembly for securing heat sinks to printed circuit boards may use a preloaded spring. The preloaded spring may be positioned on one side of the printed circuit board and the heat sink may be positioned on the opposite side.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: April 14, 2009
    Assignee: Intel Corporation
    Inventors: Donald T. Tran, Ed Unrein
  • Publication number: 20090040729
    Abstract: A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of supporters. Each supporter defines a pivot hole deviated from a center thereof and a retaining slot above the pivot hole. The clip comprises a main body received in the heat sink and two arms extending from the main body and pivotally received in the retaining slots of the supporters. The movable fastener pivotally extends in the pivot holes of the supporters. The movable fastener moves relative to the heat sink and causes rotation of the supporters in a matter such that a distance from the main body of the clip to a bottom of the heat sink is changed, whereby the clip assembly can provide adjustable spring force acting on the heat sink.
    Type: Application
    Filed: August 10, 2007
    Publication date: February 12, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: JIE-CHENG DENG, JUN CAO, SHI-WEN ZHOU
  • Publication number: 20090020661
    Abstract: An improved method for holding a cushioning media on a glass transportation cart. The holding arrangement and method can allow for easy replacement of the cushioning media and extend the operational lifespan of the cushioning media.
    Type: Application
    Filed: November 27, 2007
    Publication date: January 22, 2009
    Inventors: Joseph E. Ludwig, James G. Prete
  • Patent number: 7474530
    Abstract: An apparatus for dissipating heat in a computer system includes a heat sink, at least one fastener which secures the heat sink to at least one first support member, and at least one cup. The first support member has a top side and a bottom side. The at least one cup includes a cylindrical cavity, an upper protruding lip, and a lower base having a hole through which the at least one fastener passes. A method for dissipating heat in a computer system includes, mounting a heat emitting component onto a printed circuit board, pressing a heat sink into thermal contact with a heat emitting component, inserting a cup into an aperture of the heat sink, and supporting a heat sink.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: January 6, 2009
    Assignee: Sun Microsystems, Inc.
    Inventors: Thomas E. Stewart, Daniel Hruska
  • Publication number: 20080315061
    Abstract: A fastening device for flat components, especially solar modules, to be arranged on a framework, includes a first profile mounting rail and a second profile mounting rail that are spaced apart from one another and that are arranged horizontal and parallel on the framework and on which one component can be affixed in the area of its mutually opposing edges. Profile elements, which are arranged on the bottom of a frameless component in the area of the lateral edges, are provided with a retaining rib which projects toward the lateral edge, and connect to the profile mounting rails. A retaining element is provided with a first fastening segment for fastening to a fastening area of the profile mounting rail and with a second fastening segment having two retaining segments that project to both sides and that, in the assembled position, overlap the mutually opposing retaining ribs of two components to be placed next to one another.
    Type: Application
    Filed: April 23, 2008
    Publication date: December 25, 2008
    Inventor: Jan Mirko Fath
  • Patent number: 7423880
    Abstract: A secure device for a heat sink includes a frame and a plurality of cylindrical posts. The frame provides a plurality of elongated projections at the inner side thereof. Each of the cylindrical posts is attached to the outer side of the frame. A plurality of split portions are provided at the upper end of the respective cylindrical post. A reversed deep countersink is provided in the cylindrical post and an engaging piece is disposed at the inner side of the respective split portion. A wedge locator is disposed at one of the split portions corresponding to a lateral side of the heat sink such that the heat sink is capable of being elastically secured with the wedge locator and the elongated projections.
    Type: Grant
    Filed: June 3, 2007
    Date of Patent: September 9, 2008
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Yan-Jiun Tang
  • Patent number: 7423882
    Abstract: Apparatus and methods for mounting of a cooling device coupled to a circuit board include use of a clip that is rotated to mate with and engage the cooling device. Rotation of the clip occurs during installation of the cooling device and slides slots in the clip into interconnection with respective protrusions of the cooling device extending through the circuit board to where the clip is disposed. In an assembled configuration, the clip biases the cooling device to a processing unit coupled to the circuit board on an opposite side from the clip.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: September 9, 2008
  • Patent number: 7405938
    Abstract: A heat sink assembly (100) and a heat sink clip (20) are provided. The heat sink clip (20) includes a pin (22) and a spring (24) disposed around the pin (22). The pin (22) includes an upper section (22a) and a lower section (22b). The upper section (22a) has a head (222) thereon, and the lower section (22a) has a clamping portion (224) and an abutting portion (226) which is located between the head (222) and the clamping portion (224) and is in the form of an annular flange extending radially outwardly from an outer surface of the pin (22). A plurality of slots (22c) are defined through the clamping portion (224) and the lower section (22b) of the pin. The abutting portion (226) engages with a bottom surface of a heat sink (10) before the clip (20) secures the heat sink assembly (100) to a circuit board (40).
    Type: Grant
    Filed: November 30, 2006
    Date of Patent: July 29, 2008
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chih-Hao Yang
  • Patent number: 7385823
    Abstract: A retention module for a heat dissipation assembly is disclosed. In a first embodiment, the retention module may include a frame having an external member and an internal member enclosed within the external member. Furthermore, the internal member is adaptable to seat a heat sink. Additionally, a lever is coupled to the external member, wherein the lever includes a cam. When the lever engages in a first position, the cam pushes the internal member forward to engage the heat sink to a surface. Through the use of the retention module described above, a retention module may be used as a simple method to load and lock heat sinks of varying sizes within a heat dissipation assembly.
    Type: Grant
    Filed: May 9, 2007
    Date of Patent: June 10, 2008
    Assignee: International Business Machines Corporation
    Inventors: Norman B. Desrosiers, Michael D. French, Jr., Dean F. Herring, Paul A. Wormsbecher
  • Patent number: 7382622
    Abstract: A heat sink has a base (10), a plurality of fins (12, 14) and a central receiving groove (16) in the fins. A first positioning portion (1250) extends from a first fin at a side of the receiving groove and a positioning slot (1256) is defined therein. The clip includes a main body (23) and a pair of legs (25). The main body includes a retaining portion (230) and a first pressing portion (232). The main body is received in the receiving groove and the first pressing portion is accommodated in the positioning slot. The retaining portion is offset from the first pressing portion. The legs can be pressed to securely connect with a printed circuit board (3), whereby the heat sink can have an intimate contact with a CPU (4).
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: June 3, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Dong-Yun Li, Min Li, Hong-Cheng Yang
  • Patent number: 7345881
    Abstract: A load frame has an open region exposing a surface of an electronic component. A heat sink is disposed on the load frame and has a surface in thermal contact with the surface of the electronic component. A non-influencing fastener is disposed within a bore in the heat sink and threaded into the load frame for securing the heat sink to the load frame. The non-influencing fastener includes a screw with a head; a tapered ring disposed below the head of the screw and having a tapered lower peripheral surface; a sealing ring engaging the tapered lower peripheral surface of the tapered ring; and a load washer disposed between the sealing ring and the load frame. Compression of the rings by turning of the screw into the load frame causes the sealing ring to expand against the bore of the heatsink. Preferably, the sealing ring has a curved outer surface.
    Type: Grant
    Filed: April 20, 2006
    Date of Patent: March 18, 2008
    Assignee: International Business Machines Corporation
    Inventors: John Lee Colbert, John Saunders Corbin, Jr., Eric Alan Eckberg, James Dorance Gerken, Roger Duane Hamilton, Maurice Francis Holahan
  • Patent number: 7342790
    Abstract: A central processing unit (CPU) assembly is disclosed having: a CPU; a socket removably receiving the CPU; a heat sink removably attaching atop the CPU; and a fastening device removably fastening the heat sink, the CPU, and the socket together. The fastening device is characterized by consisting: an elongated resilient body upon which a contacting surface is disposed for contacting the heat sink and pressing the heat sink against the CPU; two lever bars extending from opposite ends of the resilient body for exerting forces on the fastening device so as to fasten or remove the fastening device; and two latching arms extending from the ends of the resilient body for engaging the fastening device with the socket in an engage position, the latching arms in the engage position exerting an inward resilient force upon the socket at opposite sides thereof.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: March 11, 2008
    Assignee: Aopen Inc.
    Inventor: Cheng Sheng-Hsiung
  • Patent number: 7333341
    Abstract: A heat dissipation device includes a heat sink, a retention module and a clip securing the heat sink to the retention module. The retention module includes a bottom wall and a plurality of sidewalls surrounding the bottom wall. The heat sink includes a plurality of the fins and a plurality of passages defined therebetween. The heat sink is located on the bottom wall of the retention module. The sidewalls of the retention module surround a bottom portion of the heat sink. The sidewalls define a plurality of voids therein for an airflow generated by a fan mounted on the heat sink passing therethrough. The airflow flows through the heat sink and then the voids in the sidewalls of the retention module to cool electronic components located beside the retention module.
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: February 19, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Li He, Tsung-Lung Lee