Abstract: Disclosed systems and methods for the remote detection of atmospheric gas may include (1) receiving, at a collector, thermal infrared energy from at least one atmospheric column, (2) receiving, at optical subsystems, the thermal infrared energy over optical paths, (3) focusing the thermal infrared energy onto diffraction gratings that disperse the thermal infrared energy at a wavelength within a mid-wavelength infrared (MWIR) spectral region and a wavelength within a long-wavelength infrared (LWIR) spectral region, (4) receiving, at detectors, the thermal infrared energy dispersed from the diffraction gratings within the MWIR spectral region and the LWIR spectral region, (5) determining spectral component data associated with the thermal infrared energy in the MWIR spectral region and the LWIR spectral region, (6) sending the spectral component data to a computing device, and (7) identifying an atmospheric gas based on the spectral component data.

Abstract: An image processing device is provided in the invention. The image processing device includes a main camera, a thermal camera, a G-sensor and a processor. The main camera generates a main image of a scene, wherein the main image has a main-image size. The thermal camera generates a thermal image of the scene, wherein the thermal image has a thermal-image size and the thermal-image size is smaller than the main-image size. The G-sensor generates relative-position information of the main camera and the thermal camera. The processor calculates the offset quantity between the main image and the thermal image, extracts an extracted image from the main image according to the relative-position information, the offset quantity and the thermal-image size, and generates a composite image according to the extracted image and the thermal image.

Abstract: Various embodiments disclosed herein describe a divided-aperture infrared spectral imaging (DAISI) system that is adapted to acquire multiple IR images of a scene with a single-shot (also referred to as a snapshot). The plurality of acquired images having different wavelength compositions that are obtained generally simultaneously. The system includes at least two optical channels that are spatially and spectrally different from one another. Each of the at least two optical channels are configured to transfer IR radiation incident on the optical system towards an optical FPA unit comprising at least two detector arrays disposed in the focal plane of two corresponding focusing lenses. The system further comprises at least one temperature reference source or surface that is used to dynamically calibrate the two detector arrays and compensate for a temperature difference between the two detector arrays.

Abstract: Backside illuminated (BSI) image sensor devices are described as having pixel isolation structures formed on a sacrificial substrate. A photolayer is epitaxially grown over the pixel isolation structures. Radiation-detecting regions are formed in the photolayer adjacent to the pixel isolation structures. The pixel isolation structures include a dielectric material. The radiation-detecting regions include photodiodes. A backside surface of the BSI image sensor device is produced by planarized removal of the sacrificial substrate to physically expose the pixel isolation structures or at least optically expose the photolayer.

Abstract: Electromagnetic sensor of an oxygen-rich vanadium oxide and the system thereof are provided. The electromagnetic sensor of an oxygen-rich vanadium oxide according the embodiment of the present invention comprises; the first substance layer containing silicon doped with an n-type dopant; and the second substance layer arranged on the first substance layer, and containing a vanadium oxide represented by the molecular formula of VxOy. Dopant concentration of the first substance layer can be higher than 1.0×10?5 cm?3 and lower than 1.0×1019 cm?3, while the ratio of y to x in the molecular formula can be larger than 2 and smaller than 2.5.

Abstract: Methods and devices are disclosed for sensing radiation emitted by an object. For example, one device includes a substrate and a movable layer coupled to the substrate. The movable layer is configured to receive radiation from the object and move relative to the substrate to a position in response to a change in temperature. The device also includes a sensor that is configured to produce a signal responsive to the position of the movable layer. The signal is indicative of the radiation emitted by the object.

Abstract: The present disclosure relates to a method for the registration of a 3-dimensional all-round view of a moving human or animal body surface. The method accordingly comprises the steps: determination (A) of a movement velocity of at least one region of the body surface and registration (B) at least of the region of the body surface at a timing point at which the value of the movement velocity of this region falls below a defined threshold value.

Abstract: An imaging method includes receiving electromagnetic radiation at a focal plane array of a handheld device. The electromagnetic radiation is processed within the handheld device, and visible images are displayed on the handheld device. The displayed visible images are indicative of a scene, and include a designator and a designator identifier when a high frequency laser pulse is in the scene. The designator and designator identifier represent the high frequency pulsed electromagnetic radiation received by the focal plane array when a high frequency pulse is present in the scene.

Abstract: A processing method for processing a workpiece includes a holding step of holding the front surface side of the workpiece on which an alignment mark is formed by a holding table having a holding surface that reflects a near-infrared ray and exposing the back surface side and an imaging step of emitting the near-infrared ray toward the back surface side of the workpiece held by the holding table and imaging the workpiece by an imaging unit that has sensitivity to the near-infrared ray and faces the back surface side of the workpiece to form a captured image. The processing method also includes an alignment mark detection step of detecting the alignment mark based on the captured image and a processing step of processing the workpiece held by the holding table by a processing unit based on the detected alignment mark.

Abstract: Device and method of forming a device are disclosed. The device includes a substrate with a transistor component disposed in a transistor region and a micro-electrical mechanical system (MEMS) component disposed on a membrane over a lower sensor cavity in a hybrid region. The MEMS component serves as thermoelectric-based infrared sensor, a thermopile line structure which includes an absorber layer disposed over a portion of oppositely doped first and second line segments. A back-end-of-line (BEOL) dielectric is disposed on the substrate having a plurality of inter layer dielectric (ILD) layers with metal and via levels. The ILD layers include metal lines and via contacts for interconnecting the components of the device. The metal lines in the metal levels are configured to define a BEOL or an upper sensor cavity over the lower sensor cavity, and metal lines of a first metal level of the BEOL dielectric are configured to define a geometry of the MEMS component.

Abstract: The present invention relates to uncooled microbolometers which can be integrated in future thermal instruments engaged in land imaging on future observatories. The present invention includes: (1) developing and characterizing a microstructured VOx thin film, and, (2) fabricating an uncooled microbolometer array over the 8-14 micron spectral band.

Abstract: Embodiments disclosed herein generally relate to a method for monitoring optical power in a HAMR device. In one embodiment, the method includes enhancing a thermal sensor bandwidth through advanced electrical detection techniques. The advanced electrical detection techniques include obtaining calibration waveform data for a thermal sensor by calibrating the thermal sensor, obtaining real-time waveform data for the thermal sensor that may deviate from the calibration waveform data, updating the calibration waveform data to include the real-time waveform data, repeating obtaining real-time waveform data and updating the calibration waveform data during writing operations. By updating the calibration waveform data, the bandwidth of the thermal sensor is determined by a fixed sampling time interval, and the thermal sensor rise time to steady state would not be a limitation to its response time.

Abstract: A surveillance sensor system is described. The surveillance sensor system includes a polygonal-shaped assembly having four substantially identical quadrant segments. Each of the quadrant segments includes a first set of lens, a second set of lens, and a third set of lens. Images captured by the first, second and third sets of lens can be combined to form a telecentric image on an intermediate image plane. The surveillance sensor system also includes a relay optic module having a set of lens, multiple focal plane array detectors and a dewar. The relay optic module can re-image the telecentric image located on the intermediate image plane onto an image plane.

Abstract: A semiconductor device has a semiconductor die containing a base material having a first surface and a second surface with an image sensor area. A masking layer with varying width openings is disposed over the first surface of the base material. The openings in the masking layer are larger in a center region of the semiconductor die and smaller toward edges of the semiconductor die. A portion of the first surface of the base material is removed by plasma etching to form a first curved surface. A metal layer is formed over the first curved surface of the base material. The semiconductor die is positioned over a substrate with the first curved surface oriented toward the substrate. Pressure and temperature is applied to assert movement of the base material to change orientation of the second surface with the image sensor area into a second curved surface.

Abstract: Various embodiments disclosed herein describe a divided-aperture infrared spectral imaging (DAISI) system that is adapted to acquire multiple IR images of a scene with a single-shot (also referred to as a snapshot). The plurality of acquired images having different wavelength compositions that are obtained generally simultaneously. The system includes at least two optical channels that are spatially and spectrally different from one another. Each of the at least two optical channels are configured to transfer IR radiation incident on the optical system towards an optical FPA unit comprising at least two detector arrays disposed in the focal plane of two corresponding focusing lenses. The system further comprises at least one temperature reference source or surface that is used to dynamically calibrate the two detector arrays and compensate for a temperature difference between the two detector arrays.

Abstract: Methods for identifying and quantifying wrinkles in a composite structure by processing infrared image data. The intensity and first and second time derivatives thereof at a particular time can be displayed as thermography line profiles on a graph in which the horizontal axis represents the pixel number across the field of view of an infrared camera. The spatial derivatives of the foregoing thermography line profiles can also be calculated and displayed as a graph. The maximum amplitude (i.e., height) of an out-of-plane wrinkle can be determined using a correlation/calibration curve that is constructed by correlating infrared image data with optical measurement data. In addition, the wavelength and maximum amplitude of an in-plane wrinkle can be measured directly from the thermography line profiles.

Abstract: Tools used to detect underlying structures, such as behind the surface of a wall, can include a first sensor, such as an electromagnetic sensor, configured to generate data indicative of the location of the underlying structure. Tools can include an indicator that provides an indication to a user based on the data. Tools can additionally or alternatively include an infrared imaging device for generating infrared image data indicative of the heat pattern of a scene. A display can display the generated infrared image data. Underlying structures may be visible in the heat pattern of the scene. The tool can indicate the presence of an underlying structure feature to an operator via one or both of the display and the indicator.

Abstract: The present disclosure provides a human body detecting device capable of increasing the sensitivity. Multiple first infrared ray reception paths are defined by any one of multiple lenses and multiple detecting units. Multiple second infrared ray reception paths are defined by one lens adjacent to the any one of multiple lenses and multiple detecting units. Lens array is configured so that one of multiple first infrared ray reception paths and one of multiple second infrared ray reception paths overlap with each other. The front-side electrodes of detecting units respectively corresponding to one first infrared ray reception path and one second infrared ray reception path of the multiple detecting units have the same polarity.

Abstract: An imager array may be provided as part of an imaging system. The imager array may include a plurality of infrared imaging modules. Each infrared imaging module may include a plurality of infrared sensors associated with an optical element. The infrared imaging modules may be oriented, for example, substantially in a plane facing the same direction and configured to detect images from the same scene. Such images may be processed in accordance with various techniques to provide images of infrared radiation. The infrared imaging modules may include filters or lens coatings to selectively detect desired ranges of infrared radiation. Such arrangements of infrared imaging modules in an imager array may be used to advantageous effect in a variety of different applications.

Abstract: A single slope analog to digital converter includes a comparator having a positive input and a negative input and a comparator output, a counter and a latch connected to an output of the counter and that includes a trigger input. Also included is a pulse generator coupled to the comparator output that produces a pulse of a defined width each time a signal on the negative input transitions from a voltage level that is below a voltage level on the positive input to a voltage level that is above the voltage level on the positive input.

Abstract: Various techniques are provided for using one or more shielded (e.g., blinded, blocked, and/or obscured) infrared sensors of a thermal imaging device. In one example, a method includes capturing a signal from a shielded infrared sensor that is substantially blocked from receiving infrared radiation from a scene. The method also includes capturing a signal from an unshielded infrared sensor configured to receive the infrared radiation from the scene. The method also includes determining an average thermographic offset reference for the shielded and unshielded infrared sensors based on the captured signal of the shielded infrared sensor. The method also includes determining an absolute radiometric value for the scene based on the average thermographic offset reference and the captured signal of the unshielded infrared sensor.

Abstract: The present invention provides a scanning optical system and radar that can suppress longitudinal distortion and spot rotation of a spot light radiated on an object. A light flux emitted from a light source is reflected on a first mirror surface of a mirror unit, then, proceeds to a second mirror surface, further is reflected on the second mirror surface, and is projected so as to scan on an object correspondingly to rotation of the mirror unit. The light flux emitted from the light projecting system is made longer in a sub scanning angle direction than in a scanning angle direction in a measurement range of the object and satisfies the following conditional expression, |?1?90|×|?|?255 . . . (1); in the expression, ?1 is an intersection angle (°) between the first mirror surface and the second mirror surface, and ? is a rotation angle (°).

Abstract: A method for manufacturing a multi-spectral photodiode array in a CdxHg1-xTe semiconductor layer constituted of pixels, the method including a step of producing a PN junction in each pixel and further includes producing a cadmium-rich structure on the semiconductor layer, structured so that all the pixels are not surmounted by a same quantity of cadmium atoms, this quantity being able to be zero; and inter-diffusion annealing, realizing the diffusion of cadmium atoms from the cadmium-rich structure to the semiconductor layer. Pixels that do not all have the same cutoff wavelength are thereby obtained.

Abstract: An apparatus of motion amplification to communicate biological vital signs includes a first frequency filter that applies a frequency filter to at least two images, a regional facial clusterial module that is coupled to the first frequency filter and that applies spatial clustering to output of the first frequency filter, a second frequency filter that is coupled to the regional facial clusterial module and that is applied to output of the regional facial clusterial module, thus generating a temporal variation, a vital-sign generator that is coupled to the second frequency filter that generates at least one vital sign from the temporal variation, and a display device that is coupled to the vital-sign generator that displays the at least one vital sign.

Abstract: A method for forming a plurality of semiconductor devices includes forming a plurality of trenches extending from a first lateral surface of a semiconductor wafer towards a second lateral surface of the semiconductor wafer. The method further includes filling a portion of the plurality of trenches with filler material. The method further includes thinning the semiconductor wafer from the second lateral surface of the semiconductor wafer to form a thinned semiconductor wafer. The method further includes forming a back side metallization layer structure on a plurality of semiconductor chip regions of the semiconductor wafer after thinning the semiconductor wafer. The method further includes removing a part of the filler material from the plurality of trenches after forming the back side metallization layer structure to obtain the plurality of semiconductor devices.

Abstract: A method of correcting an infrared image including a plurality of pixels arranged in an input image array, a first pixel in the plurality of pixels having a first pixel value and one or more neighbor pixel with one or more neighbor pixel values. The first pixel and the one or more neighbor pixels are associated with an object in the image. The method includes providing a correction array having a plurality of correction pixel values, generating a corrected image array by adding the first pixel value to a correction pixel value in the correction array, and detecting edges in the corrected image array. The method also includes masking the detected edges in the corrected image array, updating the correction array, for each correction pixel value in the correction array and providing an output image array based on the correction array and the input image array.

Abstract: An imaging element includes: a first substrate; first light receiving elements regularly disposed on the first substrate; first color filters each of which is disposed on a light receiving surface of the first light receiving elements; a second substrate disposed so that light transmitted through the first substrate is emitted thereto; second light receiving elements regularly disposed on the second substrate; second color filters each of which is disposed on a light receiving surface of the second light receiving elements; and a signal processor which generates a pixel signal corresponding to each of the plurality of first light receiving elements using the first signal and the second signal.

Abstract: Various techniques are provided for binning (e.g., clustering or grouping) two or more infrared sensors of a focal plane array (FPA) to permit configuration of the FPA to various dimensions and/or pixel sizes. For example, according to one or more embodiments, switchable interconnects may be implemented within the FPA, wherein the switchable interconnects comprise a plurality of switches adapted to selectively connect or disconnect infrared sensors of the FPA to/from column lines, row lines, and between each other. The switchable interconnects may also comprise another set of switches adapted to selectively connect adjacent column lines together. By selectively opening and closing appropriate switches of the switchable interconnects, two or more neighboring infrared sensors may be binned together to form a binned detector. Advantageously, the binned detector, along with the array and associated circuitry, may provide increased sensitivity, reduced power consumption, and/or increased frame rate.

Abstract: Embodiments include a system and method for activity monitoring using video data from multiple dissimilar sources. The video data is processed to remove any dependency of the system on types of video input data. The video data is processed to yield useful human readable information regarding events in real time, such as how many people move through a line in a period of time.

Abstract: Techniques, systems, and articles of manufacture for application and situation-aware community sensing. A method includes processing one or more sensor data requirements for each of multiple sensing applications and one or more user preferences for sensing, determining a sensing strategy for multiple sensors corresponding to the multiple sensing applications based on the one or more sensor data requirements and the one or more user preferences for sensing, wherein said sensing strategy comprises logic for executing a sensing task, and scheduling a sensor duty cycle and a sampling frequency for each of the multiple sensors based on the sensing strategy needed to execute the sensing task.

Abstract: Proactive systems for monitoring, diagnosing, and providing a plan of corrective action for Radio Frequency (RF) hardware components as part of a greater system or network in telecommunications. The system can be used for remote sites and in conjunction with current network management tools as the most prolific and fundamental piece of instrumentation in telecommunication networks. The system can be used simply as an RF development instrument for any industry requiring the use of high frequency signals. It consists of four sensor modules that are wirelessly linked to a receiver module which could be miles away. The sensors are: RF power detector, Spectrum Analyzer, Interference Cancelling Synthesizer, dual function RF power detector and spectrum analyzer. The data gathered allows the user to create a profile for specific malfunctions in the RF chain, as well as interference direction, strength and source type leading to remotely deployed solution, and a mobile network.

Abstract: The invention concerns a method of image processing involving: receiving, by a processing device, an input image (IB) captured by a pixel array sensitive to infrared radiation; determining, based on the input image and on a column component vector (VCOL), a first scale factor (?) by estimating a level of the column spread present in the input image; generating column offset values (?.VCOL(y)) based on the product of the first scale factor with the values of the vector; determining, based on the input image and on a 2D dispersion matrix (IDISP), a second scale factor (?) by estimating a level of the 2D dispersion present in the input image; generating pixel offset values (?.IDISP(x,y)) based on the product of the second scale factor with the values of the matrix; and generating a corrected image (IC?) by applying the column and pixel offset values.

Abstract: Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.

Abstract: A passive millimeter wave (PMMW) camera includes: a lens forming an entrance aperture for the camera, the lens configured to receive millimeter wave (MMW) radiation from a scene so as to form an image at its focus; a polarization beamsplitter positioned behind the lens, the polarization beamspiltter configured to substantially reflect only one polarization of the radiation, and to substantially pass through other polarizations without reflection; a twist reflector configured to receive the reflected radiation from the beamsplitter, and to reflect the MMW radiation back towards the beamsplitter, the twist reflector further configured to rotate the polarization of the incident MMW radiation by 90 degrees, the twist reflector further configured to swivel back and forth around an axle in a plane of the twist reflector so as to move the image back and forth; and a focal plane array (FPA) of millimeter wave receivers configured to receive the radiation passed through the beamsplitter after its polarization was rota

Abstract: Disclosed are passive millimeter wave detection devices that in some embodiments are useful for detecting objects such as weapons obscured underneath clothing. Also disclosed are methods for detecting objects using millimeter waves, in some embodiments, objects such as weapons, obscured underneath clothing.

Abstract: A method of normalizing FPA system gain and correcting pixel non-uniformity for varying temperature includes determining an FPA temperature, calculating an FPA system gain as a function of the FPA temperature, and applying the FPA system gain at the FPA temperature to condition output of the FPA to produce temperature independent image data. The method also includes calculating a non-uniformity correction map on a pixel by pixel basis for the FPA, wherein non-uniformity correction for each pixel is a function of the FPA temperature, and applying the non-uniformity correction map to the imaging data from the FPA to produce temperature dependent non-uniformity corrected image data. An imaging system includes a focal plane array (FPA), a temperature sensor operatively connected to measure temperature of the FPA, and a module configured for system gain correction and non-uniformity correction as described above.

Abstract: The present disclosure includes apparatuses and methods related to performing corner turn operations using sensing circuitry. An example apparatus comprises a first group of memory cells coupled to an access line and a plurality of sense lines and a second group of memory cells coupled to a plurality of access lines and a sense line. The example apparatus comprises a controller configured to cause a corner turn operation using sensing circuitry on an element stored in the first group of memory cells resulting in the element being stored in the second group of memory cells.

Abstract: A sensor array including at least two image sensors situated one above the other in layers, including at least one organic semiconductor, and subdivided into pixels. The at least two image sensors are different in the size of their pixels.

Abstract: A multi-column electron beam device includes an electron source comprising multiple field emitters fabricated on a surface of a silicon substrate. To prevent oxidation of the silicon, a thin, contiguous boron layer is disposed directly on the output surface of the field emitters. The field emitters can take various shapes including a pyramid, a cone, or a rounded whisker. Optional gate layers may be placed on the output surface near the field emitters. The field emitter may be p-type or n-type doped. Circuits may be incorporated into the wafer to control the emission current. A light source may be configured to illuminate the electron source and control the emission current. The multi-column electron beam device may be a multi-column electron beam lithography system configured to write a pattern on a sample.

Abstract: Various techniques are disclosed for bolometer circuits and related methods for thermal imaging in a difference domain, where each pixel value represents a difference in incident IR radiation intensity between adjacent bolometers. For example, a bolometer circuit may include an array of bolometers each configured to generate a pixel signal in response to a bias and incident infrared radiation. Each column of the bolometer array may comprise an amplifier, a first plurality of switches each configured to selectively provide a supply voltage to a respective one of bolometers of the each column, a second plurality of switches each configured to selectively route a difference of the pixel signals of a respective adjacent pair of the bolometers of the each column to an input of the amplifier, and a third plurality of switches configured to selectively provide a common voltage to a respective one of the bolometers of the each column.

Abstract: In at least one embodiment a thermoelectric generator is provided. The thermoelectric generator includes a cap and a thermopile. The cap is coupled to a heat generating device for receiving thermal energy therefrom. The thermopile includes superlattice quantum well materials and an absorber for contacting the cap to receive the thermal energy and to generate an electrical output to one of store the electrical output on a storage device and power a first device with the electrical output in response to the thermal energy.

Abstract: An imaging apparatus includes sensor arrays each having a plurality of subarrays having a plurality of sensors which output signals based on radiation or light, and a plurality of temperature sensors which output signals based on temperatures of the sensor arrays. In this case, a signal output from one subarray of the plurality of subarrays and a signal of one temperature sensor of the plurality of temperature sensors are read out through a line to which the sensor included in the one subarray and the one temperature sensor are commonly connected.

Abstract: A method of manufacturing a detector capable of detecting a wavelength range [?8; ?14] centered on a wavelength ?10, including: forming said device on a substrate by depositing a sacrificial layer totally embedding said device; forming, on the sacrificial layer, a cap including first, second, and third optical structures transparent in said range [?8; ?14], the second and third optical structures having equivalent refraction indexes at wavelength ?10 respectively greater than or equal to 3.4 and smaller than or equal to 2.3; forming a vent of access to the sacrificial layer through a portion of the cap, and then applying, through the vent, an etching to totally remove the sacrificial layer.

Abstract: A processor comprises instructions to adjust a bias of an input signal in order to decrease a duty cycle of a pulse modulated optical signal. The bias can be increased, decreased, or maintained in response to one or more measured values of the signal. In many embodiments, a gain of the signal is adjusted with the bias in order to inhibit distortion. The bias can be adjusted slowly in order to inhibit audible noise, and the gain can be adjusted faster than the bias in order to inhibit clipping of the signal. In many embodiments, one or more of the bias or the gain is adjusted in response to a value of the signal traversing a threshold amount. The value may comprise a trough of the signal traversing the threshold.

Abstract: A system for controlling an auxiliary vehicle light is described, whereby a wearable controller that may be worn on a user's head or coupled to an article of clothing located on a user's head is useful for transmitting a position and orientation of a user's head to an auxiliary vehicle light located on a surface of a vehicle. The auxiliary vehicle light may include a pivotable body capable of panning, tilting, or rolling. The wearable controller includes sensors to determine an orientation and angular displacement of a user's head. Both the auxiliary vehicle light and the wearable controller includes transceivers for wirelessly communicating with each other.

Abstract: A sensor device is disclosed. The sensor device include: a detector having a contact formation region; an insulating layer disposed over the detector; a conductive pad disposed over the insulating layer opposite to a side of the detector; a contact plug formed in the insulating layer for electrically coupling the contact implant region and the conductive pad; and a read-out integrated circuit bonded to the insulating layer through the conductive pad. An image sensor array and a manufacturing method of a sensor device are also disclosed.

Abstract: A sensor device, a sensor package, and method for fabricating a sensor device are described that include an integrated light blocker disposed on the thermopile device and a lens configured to direct light to the thermopile device. In an implementation, the thermopile device includes a substrate; a thermopile membrane disposed on the substrate, the thermopile membrane including at least one passivation layer; a thermopile disposed within the thermopile membrane, the thermopile including at least one thermocouple; and a light blocking layer disposed proximate to the thermopile membrane, the light blocking layer including an aperture disposed proximate to the thermopile.

Abstract: A method and apparatus for detecting an energetic material on a surface. Electromagnetic radiation is generated. A beam of the electromagnetic radiation is transmitted from a handheld device towards the surface. Reflected electromagnetic radiation from the beam reflecting off of the surface is detected at the handheld device to generate test data. The test data is analyzed at a base unit that is separate from the handheld device to determine whether the energetic material is present on the surface.

Abstract: A method of determining a temperature of a patient includes determining a temperature associated with a measurement site of the patient with a temperature device, and without contacting the patient with the device. The method also includes estimating a temperature of the patient based at least in part on the temperature associated with the measurement site. The temperature device includes a sensing element configured to determine the temperature associated with the measurement site, an imaging device, and a controller configured to estimate the temperature of the patient based on the temperature associated with the measurement site.

Abstract: The invention relates to a vibration based mechanical IR detector having one or more than one resonating pixel structure and an IR imaging method for measuring incoming IR radiation by means of mechanical resonance of the resonating pixels.