Abstract: The invention relates to a coating solution for forming transparent conductive tin oxide film, a method for producing transparent conductive tin oxide film, and transparent conductive tin oxide film. The coating solution is capable of forming, from an inexpensive starting material such as tin oxide or tin chloride, strong tin oxide film endowed with excellent conductivity and transparency. The coating solution, which is intended to be used for forming, by way of coating, transparent conductive film predominantly containing tin oxide, contains stannic acid as its major component, and a water-soluble polymer having a polar group which is dissolved in the presence of at least one compound selected from the group consisting of ammonia and water-soluble amines.

Abstract: The present invention discloses a conductive composition, comprising: (a) at least one polymer; (b) at least one conductive filler, dispersed in the polymer; and (c) a coupling agent, applied to improved the adhesion between the polymer and the conductive filler and having a structure as follows: 1

Abstract: A method of making carbon foam is described which involves pyrolizing a mixture containing at least one pyrolizable substance and at least one unpyrolizable material and then removing the unpyrolizable material to obtain the carbon foam. Carbon foam made by this process is also described. Incorporating the carbon foam in a variety of end use applications including electrodes, thermal insulation material, polymers, and the like is also described.

Abstract: Ar indium zinc oxide based hexagonal layered compound characterized as being represented by the general formula (ZnO)n.In2O3 (m=2-20) and having a mean thickness of 0.001-0.3 &mgr;m and a mean aspect ratio (mean major diameter/mean thickness) of 3-1,000.

Abstract: As an electrically conductive paste for via-holes, an organic vehicle and an electrically conductive metal powder coated with a resin which is insoluble in the organic vehicle are prepared. Filling via-holes with the electrically conductive paste for via-holes produces a monolithic ceramic. Filling characteristics of the electrically conductive paste into via-holes are improved, and cracks and elevations of the conductive metal and cracks of the ceramic barely form during the baking step. Further, the resulting monolithic ceramic substrate can maintain excellent soldering wettability and plating characteristics.

Abstract: A conductive polymer composite material comprises: a minor phase material comprising a semicrystalline polymer; a conductive filler material dispersed in said minor phase material in an amount sufficient to be equal to or greater than an amount required to generate a continuous conductive network in said minor phase material; and a major phase material, said major phase material being a polymer which when mixed with said minor phase material will not engage in electrostatic interactions that promote miscibility, said major phase material having said minor phase material dispersed therein in an amount sufficient to be equal to or greater than an amount required to generate a continuous conductive network in said major phase material, forming a (semi)conductive ternary composite having distinct co-continuous phases.

Abstract: An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.