Abstract: An electronic component system cabinet includes a plurality of electronic component system bays, and a plurality of electronic component systems mounted in respective ones of the plurality of electronic component system bays. The electronic component system cabinet further includes a cooling system including a plurality of coolant reservoirs. Each of the plurality of coolant reservoirs is associated with at least one of the plurality of electronic component system bays. The cooling system further includes at least one pump fluidly connected to each of the plurality of coolant reservoirs. The at least one pump is selectively operated to circulate a supply of coolant to each of the plurality of coolant reservoirs.

Abstract: An array of electrically conductive waveguides is made a method including defining slots in broad surfaces of planar dielectric slabs. The surfaces of the slabs, including slots, are metallized. The broad sides of the slabs are juxtaposed, with the slots registered with the planar surfaces of another slab, to form one or more closed waveguides. The waveguides may feed microchips, or act as antennas. The slabs may include electrical conductors andor heat pipes. Heat pipes are made by defining apertures with the dielectric slabs, and introducing wick material into the apertures.

Abstract: The present application provides a method and semiconductor packaging structure comprising a conductive substrate having a first surface, a first lateral surface and a second lateral surface adjacent to the first surface. A first electrode line with two ends are provided on the first surface and the first lateral surface, and a second electrode line with two ends are provided on the first surface and a second lateral surface respectively. A semiconductor device is provided on the first surface of the conductive substrate which electrically connected to the first electrode line and the second electrode line, a protective plate with through holes covers the first surface, and a sheathing overlays the semiconductor device.

Abstract: A thermal interface material includes a carbon nanotube array, a transition structure, and a matrix. The carbon nanotube array includes a plurality of carbon nanotubes. The transition structure covers at least a part of the surfaces of carbon nanotubes. The matrix encompasses the carbon nanotubes. A component package using the thermal interface material includes a die, a heat spreader, and a thermal interface material. The thermal interface material is disposed between the die and the heater spreader.

Abstract: A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate.

Abstract: A cooling device for cooling a light-emitting semiconductor device, such as a LED device (20), comprises a ceramic plate (15) having coolant-conveying channels (12) incorporated therein. The ceramic plate (15) is adapted for forming an integral part of the optical system of the light-emitting semiconductor device (20) and to cool a light-emitting portion (26) of the light-emitting semiconductor device (20). A method of forming a cooling device comprises the steps of forming a charge of ceramic particles, embossing the charge with a stamp to form coolant-conveying channels in the charge, hardening the charge, and providing a cover on top of the channels to seal them.

Abstract: A system for removing heat includes a sealed container, and an evaporator, housed within the sealed container. The evaporator includes an evaporator inlet, a plurality of evaporator outlet ports and a plurality of tubes, each tube connecting the evaporator inlet with a tube outlet to the sealed container. The system further includes a condenser, also housed within the sealed container, having a plurality of condenser inlet ports from the sealed container, a condenser outlet and closed condenser channels connecting the condenser inlet ports with the condenser outlet. The system further includes a conduit joining the condenser outlet to the evaporator inlet.

Abstract: An apparatus includes a plurality of islands each carrying multiple cantilevers. The apparatus also includes a fluidic network having a plurality of channels separating the islands. The channels are configured to provide fluid to the islands, and the fluid at least partially fills spaces between the cantilevers and the islands. Heat from the islands vaporizes the fluid filling the spaces between the cantilevers and the islands to transfer the heat away from the islands while driving the cantilevers into oscillation. The apparatus may also include a casing configured to surround the islands and the fluidic network to create a vapor chamber, where the vapor chamber is configured to retain the vaporized fluid. The islands and the fluidic network could be formed in a single substrate, or the islands could be separate and attached together by a binder located within the channels of the fluidic network.

Abstract: A condenser for a power module combines a plurality of aluminum materials to form a casing equipped with a channel for coolant therein, thus making it possible to keep material costs low. Moreover, thanks to the excellent workability of the aluminum materials, it is possible to adopt a configuration with a complex concave-convex configuration for a superior heat radiation performance. A channel for coolant with high heat radiation performance can also be structured inside the casing. The relatively thick bottom plate secures the rigidity required by the casing, while the relatively thin top plate can have a rigidity intentionally structured lower. In this manner, stress generated on joining surfaces of the condenser and an insulative substrate can be mitigated due to active deformation of the top plate.

Abstract: A flow distribution module (5) for distributing a flow of cooling fluid across a surface. Is adapted to be connected to another at least substantially identical module (5). Makes it possible to provide a cooling unit which may be customized to meet specific cooling needs without requiring special adaptation of the ‘building blocks’. Thereby provides a flexible, yet simple, system. Furthermore a stack of flow distribution modules (5). Provides a very compact cooling unit when cooling is needed for several surfaces, no need for a cooling unit having a large surface area because the modules may be stacked in stead of positioned side-by-side.

Abstract: A semiconductor power module includes one or more power semiconductor power devices sandwiched between a fluid conducting base and a fluid conducting cover joined to the base. Fluid coolant entering the base diverges into a first flow path through the base and a second parallel flow path through the cover, and then converges and discharges through an outlet. The semiconductor devices have upper and lower active areas that are thermally coupled to inboard faces of the cover and base for low double-sided thermal resistance, and the devices are electrically accessed through a set of terminals formed on the base. Multiple sets of semiconductor power devices are double-side cooled by joining multiple fluid conducting covers to the base such that the coolant successively diverges and then re-converges at the locations where each cover is joined to the base. Preferably, the flow paths in both the base and cover include integral features for enhancing the surface area in contact with the coolant.

Abstract: A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-out channels formed thereon. A permanent solder mask is laminated over the cut-out channels to form thermal dissipation channels, which are in fluid communication with input and output ports. The C4 solder joints include solder balls that electronically connect terminals on the chips to corresponding attach pads on the substrate that are exposed through the mask. The thermal dissipation channels extend along rows of attach pads. A cooling fluid, such as inert perfluorocarbon fluid, flows through the thermal dissipation channels to remove heat and to mitigate strain on the solder balls due to coefficient of thermal expansion (CTE) mismatch between the chips and the substrate.

Abstract: A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.

Abstract: A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is molded with high-thermal-conductivity resin having an electrical insulating property. The radiator base has a cooling-medium channel therein or radiating fins on the outside. Alternatively, the radiator base is housed in a second radiator base.

Abstract: A heat dissipation member includes a first plate-shaped member and a second plate-shaped member. The first plate-shaped member has a first surface thermally connectable with a heat generating element and a second surface. The second plate-shaped member is thermally connected with the second surface of the first plate-shaped member. The first plate-shaped member and the second plate-shaped member form a laminated-plate-shaped member. The laminated-plate-shaped member defines an inlet for admission of a fluid and an outlet communicating with the inlet for ejection of the fluid. The second surface of the first plate-shaped member forms asperities thereon.

Abstract: A semiconductor module has a housing, including a power semiconductor, a cooler bearing against the latter and serving for dissipating heat loss. In at least one embodiment, a spring element, which is supported between housing and cooler, is arranged on the side of the cooler remote from the power semiconductor and prestresses the cooler against the power semiconductor.

Abstract: Apparatus and methods are provided for packaging multi-chip modules with liquid cooling modules designed to provide different thermal resistances for effectively conducting heat from various chips with disparate cooling requirements while minimizing mechanical stresses in thermal bonds due to thermal excursions.

Abstract: A cooling system for a rack-mount server includes a fan disposed within the rack-mount server and configured to produce an airflow through the rack-mount server, and a heat exchanger disposed within the rack-mount server in a path of the airflow through the rack-mount server. The heat exchanger includes a liquid circulation path structure and an airflow path structure. The airflow path structure is configured to shield electromagnetic interference.

Abstract: A high-power thyristor module includes a housing configured with an inner receiving space, and a thyristor unit disposed in the inner receiving space in the housing and including a mounting frame, and a plurality of high-power thyristors mounted on the mounting frame. Each thyristor has a gate. The mounting frame includes a dielectric top plate disposed on a top side of the housing, and a plurality of electrodes mounted on the top plate so that the electrodes are exposed outwardly of the housing, and coupled respectively to the gates of the thyristors. Cooling oil is contained in the inner receiving space so that the thyristors are submerged thereby.

Abstract: The invention concerns a power electronic arrangement comprising an insulating substrate, a cooling element arranged beneath the insulating substrate and one or more power electronic components disposed on a respective metallization surface of the insulating substrate. Disposed on the surface of the insulating substrate is a metal layer portion which projects beyond the insulating substrate at all sides. The region of the metal layer portion, that projects beyond the insulating substrate, forms a metal flange which borders the insulating substrate. The cooling element, on its side towards the insulating substrate, beneath the insulating substrate, has one or more recesses, whereby a cavity delimited by the insulating substrate and wall surfaces of the one or more recesses is formed beneath the insulating substrate for receiving a liquid cooling agent. The metal flange is further connected to the cooling element.

Abstract: A power semiconductor circuit has a power semiconductor module (2) embodied as a flat assembly. A particularly compact and space-saving production of a power semiconductor circuit may be achieved with the possibilities provided by an embodiment of the power semiconductor module, whereby the power semiconductor module (2) is arranged directly on a top track (3) of a power supply and/or output tracking (11) and a cooling device (5) is integrated in the tracking (11).

Abstract: A stacked array of channeled semiconductor chips defining a power electronic circuit is mounted in a sealed container provided with inlet and outlet passages for liquid coolant. Leadframe terminals supported by the container engage selected terminals of the semiconductor chips and form leads for mounting the container on a circuit board having electrical and fluid interconnects.

Abstract: An array of crystalline silicon dies on a substrate and a method for yielding the array are provided. The method comprises: delineating an array of die areas on a crystalline semiconductor wafer; implanting the die areas with hydrogen ions; overlying the die areas with a layer of polymer to form, for each die, an aggregate including a die area first wafer layer; polymerically bonding an optically clear carrier to the die areas; thermally annealing the wafer to induce breakage in the wafer; forming, for each die, an aggregate wafer second layer with a thickness less than the die thickness; and, for each die, conformably attaching the aggregate wafer second layer to a substrate. The substrate can have an area of up to approximately two square meters and the wafer second layer can have a thickness of greater than and equal to approximately 20 nanometers.

Abstract: A heat exchanger is connected with a heat source in order to dissipate heat generated by the heat source. The fastening apparatus includes a first bracket and a second bracket, both connected to the base, and a first latch element. There is a first opening formed in the first bracket. The first latch element is connected to one side of the heat exchanger, and includes a first protrusion and a first contact section. The first protrusion penetrates through the first opening making the first bracket provide movement limitation to the heat exchanger. The second bracket provides additional movement limitation to the heat exchanger. To separate the heat exchanger from the base, the first contact section is pressed to make the first protrusion move out of the first opening.

Abstract: A multi-fluid cooling system and methods of fabrication thereof are provided for removing heat from one or more electronic devices. The cooling system includes a multi-fluid manifold structure with at least one first fluid inlet orifice and at least one second fluid inlet orifice for concurrently, separately injecting a first fluid and a second fluid onto a surface to be cooled when the cooling system is employed to cool one or more electronic devices, wherein the first fluid and the second fluid are immiscible, and the first fluid has a lower boiling point temperature than the second fluid. When the cooling system is employed to cool the one or more electronic devices and the first fluid boils, evolving first fluid vapor condenses in situ by direct contact with the second fluid of higher boiling point temperature.

Abstract: A chip unit has a stack of at least two electronic chips stacked one on top of the other, a through-chip connection within the stack, the through-chip connection including a bounding material having an inner and outer perimeter, the inner perimeter defining an interior volume longitudinally extending through at least one of the at least two chips and at least partially into another of the at least two chips so as to form a tube extending between the one and the other of the chips, and an amount of working fluid hermetically sealed within the tube, the working fluid having a volume and being at a pressure such that the working fluid and tube will operate as a heat pipe and transfer heat from the stack of chips to the working fluid.

Abstract: A device, comprising (a) a chamber having a liquid disposed therein, (b) an LED array having a first surface which is in contact with said liquid, and (c) at last one actuator adapted to dislodge vapor bubbles from said first surface through the emission of pressure vibrations.

Abstract: A heat-dissipating component including a heat-generating device such as a power semiconductor chip and a mounting structure is provided with coolant channels having a stair-stepped internal geometry that enhances cooling performance with both single-phase and two-phase cooling modes without unduly restricting coolant flow or significantly increasing manufacturing cost. The stair-stepped geometry enhances both single-phase and two-phase cooling modes by increasing the surface area of the channels, and further enhances the two-phase cooling mode by providing numerous high-quality bubble nucleation sites along the length of the channels. The stair-stepped channels are formed in the heat generating device and/or the mounting structure, and the stepped sidewalls may extend toward or away from the center of the channel.

Abstract: The density of components in integrated circuits (ICs) is increasing with time. The density of heat generated by the components is similarly increasing. Maintaining the temperature of the components at reliable operating levels requires increased thermal transfer rates from the components to the IC package exterior. Dielectric materials used in interconnect regions have lower thermal conductivity than silicon dioxide. This invention comprises a heat pipe located in the interconnect region of an IC to transfer heat generated by components in the IC substrate to metal plugs located on the top surface of the IC, where the heat is easily conducted to the exterior of the IC package. Refinements such as a wicking liner or reticulated inner surface will increase the thermal transfer efficiency of the heat pipe. Strengthening elements in the interior of the heat pipe will provide robustness to mechanical stress during IC manufacture.

Abstract: An improvement for an assembly for use in a computing device which includes a microprocessor and a motherboard and a socket for receiving and making electric contact with the microprocessor. A heat sink is included which is in thermal contact with the microprocessor whereby a water barrier is applied to and proximate the socket for preventing water of condensation from contacting areas covered by the water barrier and a moisture absorbent surrounding the heat sink.

Abstract: A reconfigurable high performance computer occupies less than 360 cubic inches and has an approximate compute power of 0.7 teraflops per second while consuming less than 1000 watts. The computer includes a novel stack of semiconductor substrate assemblies. Some semiconductor substrate assemblies involve field programmable gate array (FPGA) dice that are directly surface mounted, as bare die, to a semiconductor substrate. Other semiconductor substrate assemblies of the stack involve bare memory integrated circuit dice that are directly surface mounted to a semiconductor substrate. Elastomeric connectors interconnect adjacent semiconductor substrates proceeding down the stack. Tines of novel comb-shaped power bus bar assembly structures extend into the stack to supply DC supply voltages. The supply voltages are supplied from bus bars, through vias in the semiconductor substrates, and to the integrated circuits on the other side of the substrates.

Abstract: An electronic system comprises an enclosure, a printed circuit board in the enclosure, and a heat sink assembly comprising a holding member. The enclosure comprises a first panel and a second panel perpendicularly connecting with the first panel. The printed circuit board is mounted on the first panel of the enclosure. The heat sink assembly has a first end mounted on the printed circuit board for contacting a heat-generating electronic device on the printed circuit board, and a second end opposite to the first end. The holding member connects the second panel of the enclosure with the second end of the heat sink assembly.

Abstract: A thermal module is provided for absorbing and dissipating heat from a heat generating component. The module comprises a module body, input and output ports, and a channel disposed within the module body. The module body includes a thermally conductive base, a top surface, and a side surface rising from the base toward the top surface. The base is disposable adjacent the heat generating component to facilitate transfer of heat from the heat generating component to the base. The input and output ports are each disposed on the side surface of the body. The channel is encapsulated within the module body and extends from the input port to the output port to define a flow path. The channel is operative to convey a cooling fluid therethrough for absorbing and dissipating the heat from the heat generating component.

Abstract: The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop system; turning on an electromagnet to generate a magnetic field to permeate flexible sidewalls of the cavity; attracting the liquid metal alloy in the cavity towards the electromagnet to expand the flexible sidewalls; inducing a second portion of the liquid metal alloy to enter the cavity from an inlet end of a pipe within the closed-loop system; turning off the electromagnet; repelling the liquid metal alloy in the cavity away from the electromagnet to contract the flexible sidewalls; and inducing a third portion of the liquid metal alloy to exit the cavity to an outlet end of the pipe.

Abstract: In an embodiment, an integrated heat sink for a microchip includes a substrate having a plurality of interconnected electronic devices formed in a plurality of layers. At least one heat sink element is interposed within the layers and includes a microchannel to provide a fluid flow path for heat transfer. Other embodiments include a method of making an integrated heat sink for a microchip.

Abstract: A semiconductor package with a heat dissipating device and a fabrication method of the semiconductor package are provided. A chip is mounted on a substrate. The heat dissipating device is mounted on the chip, and includes an accommodating room, and a first opening and a second opening that communicate with the accommodating room. An encapsulant is formed between the heat dissipating device and the substrate to encapsulate the chip. A cutting process is performed to remove a non-electrical part of structure and expose the first and second openings from the encapsulant. A cooling fluid is received in the accommodating room to absorb and dissipate heat produced by the chip. The heat dissipating device covers the encapsulant and the chip to provide a maximum heat transfer area for the semiconductor package.

Abstract: Systems for cooling the backside of a semiconductor die located in a die-down integrated circuit (IC) package are described. The IC package is attached to the topside of a printed circuit board (PCB) with the backside of the die residing below the topside surface of the PCB. A cooling plate is attached to the backside of the die and thermally connected to a heat sink located above the topside surface of the PCB via conduits that pass through openings in the PCB.

Abstract: An arrangement for cooling a power semiconductor module, the power semiconductor module having a substrate with a ceramic plate and may have a metallization thereon, the arrangement has a container for the intake of a coolant with a heat-conducting plate; the heat-conducting plate having two sides, one side joined to the metallization of the substrate and the other side being in contact with the coolant; wherein the heat-conducting plate is made of materials having a metal matrix composite (MMC) material with a filling content, which results in a thermal expansion of below that of copper.

Abstract: A heat dissipation device to be mounted on a heat-generating component of a graphics card includes a base in contact with the heat-generating component, a heat dissipating member placed on the base, a fan mounted on the base adjacent to an end of the base, and a covering body. The fan is located closely to the heat dissipating member and generates airflow to the heat dissipating member. The dissipating member has a cellular structure integrally formed therein. The covering body includes a top wall in contact with a top of the dissipating member and a sidewall extending downwardly from an edge of the top wall and surrounding the dissipating member and the fan. The cellular structure comprises a plurality of elongated passages extending from the fan to another end of the base away from the fan.

Abstract: A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconductor element via a primary connecting bump, a liquid cooling module cooling said semiconductor element by a liquid refrigerant, in which a heat receiving section of the liquid cooling module is disposed between said semiconductor element and said mounting substrate, and a plurality of secondary connecting bumps provided between said package substrate and said mounting substrate.

Abstract: A radiation device for computer or electric appliances includes a heat inhalant block under a CPU of a computer, a heat transmission block positioned next to the heat inhalant block, a bridge block, a peltier device and a cooling source block sequentially disposed on the top of the heat transmission block with a bridge block engaged therebetween, a transparent cover covering the top of the cooling source block to form a left and a right flow canals therein, an upper heat radiation module superimposed a lower heat radiation module positioned next to the heat transmission block, a fan on the top of the upper heat radiation module, a set of the heat pipes extended from the heat inhalant block to the lower heat radiation module through the heat transmission block, a pair of lateral pipes connected between the bridge block and the lower heat radiation module and a set of the cold pipes connected between the cooling source block and the upper heat radiation module.

Abstract: A heat dissipation device includes a base for contacting an electronic device, a fin set located on the base and first, second heat pipes thermally engaged in the base. The first heat pipe comprises a first transferring portion and two second transferring portions extending from two opposite free ends of the first transferring portion. The second heat pipe has first and second transferring sections. The first transferring section of the second heat pipe is located adjacent to the first transferring portion of the first heat pipe and between the first transferring portion and one of the second transferring portions of the first heat pipe, and the second transferring section of the second heat pipe is located adjacent to the one of the second transferring portions of the first heat pipe.

Abstract: In an exemplary apparatus for cooling an electronic component, a housing defines an inlet port and an exhaust port and a foam member is disposed within the housing. The foam member has a shape that conforms to a shape of at least one surface of an electronic component such that the foam member is receivable thereon in thermal communication. The foam member has a pore size of no more than around 50 micrometers and a porosity of at least around 80 percent. The foam member is arranged within the housing such that coolant is flowable through the foam member. Pore size may be around 35 micrometers and porosity may be around 90 percent. Foam may be a ceramic foam that includes silica, aluminum oxide, and aluminum borosilicate fibers. In an application, at least one exemplary apparatus may be received in thermal communication on an upper case of an electronic chip.

Abstract: According to one embodiment, a cooling device includes a heat diffusion plate, a heat receiving portion, a heat sink and a heat pipe. The heat receiving portion is provided on the heat diffusion plate and thermally connected to an object to be cooled. The heat sink is provided on the heat diffusion plate, and it releases the heat of the heat receiving portion to outside. The heat pipe has a first end portion to be connected to the heat receiving portion and a second end portion located on an opposite side to the first end portion and to be connected to the heat sink.

Abstract: A semiconductor device having a higher thermal dissipation efficiency includes a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material and comprises an array of freestanding fins, studs or frames, or a grid of connected fins. A process for fabricating such a semiconductor device includes forming a thermally conducting structure on a carrier and attaching the thermally conducting structure formed on the carrier to a surface of the semiconductor device via soldering.

Abstract: An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation.

Abstract: The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.

Abstract: A heat dissipation device includes a base, a heat-dissipation portion attached to the base, at least one heat pipe connecting the base and the heat-dissipation portion and a fan directly secured to the heat-dissipation portion. The heat-dissipation portion comprises a square, tubular housing having opposite front and rear end portions opening to surroundings and a plurality of fins extending inclinedly and inwardly from an inner circumferential periphery of the housing. The housing of the heat-dissipation portion is employed as a fan duct to guide an airflow generated by the fan through the fins; the inclined orientation of the fins facilitates the airflow to flow toward the inner circumferential periphery of the housing and lower parts of the fins adjacent the inner circumferential periphery, whereby the airflow can effectively take heat away from the heat-dissipation portion.

Abstract: A housing for electronic control units, in particular in motor vehicles, having a bottom section for attaching the electronic control units and having a cooling device that enables heat to be dissipated from the housing via a flowing liquid, a cooling device formed in the bottom section being provided both for improving the cooling capacity and for rigidity. The bottom section is easily manufactured with an integrated cooling channel by injection molding, while cooling is achievable by a medium available in the motor vehicle.

Abstract: Cooling structures and methods, methods of manufacturing semiconductor devices, and semiconductor devices are disclosed. In one embodiment, a cooling structure for a semiconductor device includes at least one channel defined between a first workpiece and a second workpiece. The second workpiece is bonded to the first workpiece. The at least one channel is adapted to retain a fluid.