Deposition Of Diamond (epo) Patents (Class 257/E21.107)
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Patent number: 8039301Abstract: A gate after diamond transistor and method of making comprising the steps of depositing a first dielectric layer on a semiconductor substrate, depositing a diamond particle nucleation layer on the first dielectric layer, growing a diamond thin film layer on the first dielectric layer, defining an opening for the gate in the diamond thin film layer, patterning of the diamond thin film layer for a gate metal to first dielectric layer surface, etching the first dielectric layer, depositing and defining a gate metal, and forming a contact window opening in the diamond thin film layer and the first dielectric layer to the ohmic contact.Type: GrantFiled: December 5, 2008Date of Patent: October 18, 2011Assignee: The United States of America as represented by the Secretary of the NavyInventors: Francis Kub, Karl Hobart
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Patent number: 7939367Abstract: The invention is a method for growing a critical adherent diamond layer on a substrate by Chemical Vapor Deposition (CVD) and the article produced by the method. The substrate can be a compound semiconductor coated with an adhesion layer. The adhesion layer is preferably a dielectric, such as silicon nitride, silicon carbide, aluminum nitride or amorphous silicon, to name some primary examples. The typical thickness of the adhesion layer is one micrometer or less. The resulting stack of layers, (e.g. substrate layer, adhesion layer and diamond layer) is structurally free of plastic deformation and the diamond layer is well adherent to the dielectric adhesion layer such that it can be processed further, such as by increasing the thickness of the diamond layer to a desired level, or by subjecting it to additional thin film fabrication process steps. In addition to preventing plastic deformation of the layer stack, the process also reduces the formation of soot during the CVD process.Type: GrantFiled: December 18, 2008Date of Patent: May 10, 2011Assignee: Crystallume CorporationInventors: Firooz Nasser-Faili, Niels Christopher Engdahl
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Patent number: 7888171Abstract: In one aspect, a method includes fabricating a gallium nitride (GaN) layer with a first diamond layer having a first thermal conductivity and a second diamond layer having a second thermal conductivity greater than the first thermal conductivity. The fabricating includes using a microwave plasma chemical vapor deposition (CVD) process to deposit the second diamond layer onto the first diamond layer.Type: GrantFiled: December 22, 2008Date of Patent: February 15, 2011Assignee: Raytheon CompanyInventors: Ralph Korenstein, Steven D. Bernstein, Stephen J. Pereira
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Patent number: 7884373Abstract: In one aspect, a method includes fabricating a gallium nitride (GaN) layer with a first diamond layer having a first thermal conductivity and a second diamond layer having a second thermal conductivity greater than the first thermal conductivity. The fabricating includes using a microwave plasma chemical vapor deposition (CVD) process to deposit the second diamond layer onto the first diamond layer.Type: GrantFiled: April 2, 2010Date of Patent: February 8, 2011Assignee: Raytheon CompanyInventors: Ralph Korenstein, Steven D. Bernstein, Stephen J. Pereira
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Patent number: 7736435Abstract: A method for producing a single crystals by preferential epitaxial growth of {100} face, comprising the steps of (1) growing the crystal on a single crystal {100} substrate; (2) forming on the side of the grown crystal a surface parallel to a {100} face different from the {100}face in the growth direction, and (3) growing the crystal on the formed {100} surface; and the steps (2) and (3) being performed once or more than once. A method for producing a single-crystal diamond using a metallic holder for the single-crystal diamond having a crystal holding portion which is raised above an outer peripheral portion of the holder, is part from the outer peripheral portion of the holder, and has a recessed shape. The methods enable the production of a large single-crystal diamond in a comparatively short time at low cost.Type: GrantFiled: November 16, 2005Date of Patent: June 15, 2010Assignee: National Institute of Advanced Industrial Science and TechnologyInventors: Yoshiaki Mokuno, Akiyoshi Chayahara, Yuji Horino, Naoji Fujimori
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Publication number: 20090286352Abstract: The present invention provides methods of forming high quality diamond bodies under high pressure, and the diamond bodies produced by such methods. In one aspect, a method is provided for growing a diamond body, including providing a non-particulate silicon carbide (SiC) mass having a pre-designed shape, placing the SiC mass under high pressure in association with a molten catalyst and a carbon source, and maintaining the SiC mass under high pressure to form a substantially monocrystalline diamond body. The diamond body may be formed across substantially all of the SiC mass having surface area exposed to the molten catalyst. As such, the diamond body may conform to the shape of the exposed surface area of the SiC mass.Type: ApplicationFiled: August 4, 2008Publication date: November 19, 2009Inventor: Chien-Min Sung
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Patent number: 7368317Abstract: The invention relates to a method of producing an n-type diamond. The inventive method comprises an n-doping stage during which a donor species is vacuum diffused in a diamond that was initially doped with an acceptor, in order to form donor groups containing the donor species, at a temperature that is less than or equal to the dissociation temperature of the complexes formed between the acceptor and the donor species.Type: GrantFiled: June 3, 2005Date of Patent: May 6, 2008Assignees: Centre National de la Recherche Scientifique-CNRS, Universite de Versailles St-Quentin En YvelinesInventors: Jacques Paul Marie Chevallier, Zephirin Symplice Teukam, Dominique Ballutaud