Abstract: A heat sink used in an interface card includes a supporting base, a first heat-dissipating body and a second heat-dissipating body. The supporting base has a side. The first heat-dissipating body is mounted on the supporting base. The first heat-dissipating body is constituted of a plurality of overlapping heat-dissipating pieces. The heat-dissipating pieces are arranged obliquely with respect to the side. The second heat-dissipating body overlaps on the first heat-dissipating body. The second heat-dissipating body comprises a plurality of heat-dissipating pieces. Via the above arrangement, the heat-dissipating efficiency of the interface card can be increased and the lifetime thereof can be extended.

Abstract: The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component from a circuit assembly or any other embodiment where a heat generating component can be functionally and operatively coupled. In a proposed embodiment, at least one heat pipe is used to transfer heat from the condensation portion of a vapor chamber to cool a bottom portion of a finned heat dissipation space and transfer the heat to a colder location on the heat fins. In another proposed embodiment, the water vapor chamber is placed in a heat sink and is adapted to thermally connect to at least one heat pipe.

Abstract: A heat dissipating structure for a heat source includes a position-adjusting unit, a first heat dissipating element, a second heat dissipating element and a first heat conducting element. The position-adjusting unit has an elastic element. The first heat dissipating element is connected with the position-adjusting unit. The second heat dissipating element contacts with the heat source. One end of the first heat conducting element contacts with the first heat dissipating element, and the other end of the first heat conducting element contacts with the second heat dissipating element. The position-adjusting unit adjusts the position of the first heat dissipating element relative to the second heat dissipating element by the elastic element.

Abstract: A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate.

Abstract: A light-emitting element, in particular a light-emitting diode, having at least one light-emitting chip crystal, in particular a semiconductor crystal, is described. At least free surfaces of the light-emitting chip crystal are covered with an inert material—liquid fluid—which is in direct contact with the light-emitting chip crystal.

Abstract: A semiconductor device capable of dissipating heat, which has been produced in an ESD protection element, to the exterior of the device rapidly and efficiently includes an ESD protection element having a drain region, a source region and a gate electrode, and a thermal diffusion portion. The thermal diffusion portion, which has been formed on the drain region, has a metal layer electrically connected to a pad, and contacts connecting the drain region and metal layer. The metal layer has a first wiring trace extending along the gate electrode, and second wiring traces intersecting the first wiring trace perpendicularly. The contacts are connected to intersections between the first wiring trace and the second wiring traces. Heat that has been produced at a pn-junction of the ESD protection element and transferred through a contact is diffused simultaneously in three directions through the first wiring trace and second wiring trace in the metal layer and is released into the pad.

Abstract: A chip unit has a stack of at least two electronic chips stacked one on top of the other, a through-chip connection within the stack, the through-chip connection including a bounding material having an inner and outer perimeter, the inner perimeter defining an interior volume longitudinally extending through at least one of the at least two chips and at least partially into another of the at least two chips so as to form a tube extending between the one and the other of the chips, and an amount of working fluid hermetically sealed within the tube, the working fluid having a volume and being at a pressure such that the working fluid and tube will operate as a heat pipe and transfer heat from the stack of chips to the working fluid.

Abstract: A power semiconductor module comprises a housing. The housing comprises a casing and at least one coating of high resistance to surface tracking. A plurality of electrical conductors is provided on the housing. The coating is provided on a creepage distance that is provided between the electrical conductors.

Abstract: A method of bonding aluminum (Al) electrodes formed on two semiconductor substrates at a low temperature that does not affect circuits formed on the two semiconductor substrates is provided. The method includes: (a) forming aluminum (Al) electrodes on the two semiconductor substrates, respectively, and depositing a metal alloy that comprises aluminum (Al) and copper (Cu) onto the aluminum (Al) electrodes; (b) arranging the aluminum (Al) electrodes of the two semiconductor substrates to face with each other; and (c) heating the aluminum (Al) electrodes at a temperature lower than the melting point of the deposited metal alloy, and applying a specific pressure onto the two semiconductor substrates. Accordingly, bonding can be carried out at a temperature lower than the melting point of an Al0.83Cu0.17 alloy without having an effect on circuits formed on two semiconductor substrates, and can be selectively carried out at regions where pressure is applied.

Abstract: A method for bonding microstructures to a semiconductor substrate using attractive forces, such as, hydrophobic, van der Waals, and covalent bonding is provided. The microstructures maintain their absolute position with respect to each other and translate vertically onto a wafer surface during the bonding process. The vertical translation of the micro-slabs is also referred to herein as “in-place bonding”. Semiconductor structures which include the attractively bonded microstructures and substrate are also disclosed.

Abstract: A power semiconductor module (1) with a housing (2) and at least one semiconductor chip (3, 3?) located in it is devised. At least one semiconductor chip (3, 3?) has a first main electrode side (31) and a second main electrode side (32) opposite the first main electrode side, the first main electrode side (31) making thermal and electrical contact with the first base plate (4, 4?). The first cooling device (6) makes thermal and electrical contact with the side of the first base plate (41) facing away from the first main electrode side. The second main electrode side (32) makes thermal and electrical contact with a second base plate (5, 5?). A second cooling device (7) makes thermal contact with the side of the second base plate (51) facing away from the second main electrode side. The heat sink (65) of the first cooling device is supported against the housing (2).

Abstract: A semiconductor package with a heat dissipating device and a fabrication method of the semiconductor package are provided. A chip is mounted on a substrate. The heat dissipating device is mounted on the chip, and includes an accommodating room, and a first opening and a second opening that communicate with the accommodating room. An encapsulant is formed between the heat dissipating device and the substrate to encapsulate the chip. A cutting process is performed to remove a non-electrical part of structure and expose the first and second openings from the encapsulant. A cooling fluid is received in the accommodating room to absorb and dissipate heat produced by the chip. The heat dissipating device covers the encapsulant and the chip to provide a maximum heat transfer area for the semiconductor package.

Abstract: A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a working fluid including a chemical compound that reacts endothermically to absorb heat produced by the devices and releases the heat in a reverse reaction to the enclosure.

Abstract: A low thermal pathway is provided from the top surface of a silicon substrate to the bottom surface of the silicon substrate by first forming aluminum plugs in the bottom surface of the silicon substrate that contact the silicon substrate and extend up towards the top surface, and then heating the aluminum plugs to a temperature for a period of time sufficient to cause spikes to grow from the sides of the aluminum plugs.

Abstract: A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a supercritical fluid that transports heat from the devices to a heat sink in thermal contact with the enclosure.

Abstract: Provided is a semiconductor device including a semiconductor chip, a film (first film) which is provided so as to cover an active region with a peripheral portion of the semiconductor chip being uncovered, and is made of a dielectric material having a low dielectric constant, and a package molding resin (sealing resin) provided so as to cover the semiconductor chip and the film. As a result, deterioration in contact property with the sealing resin is suppressed and a high frequency characteristic can be enhanced.

Abstract: According to one embodiment, an electronic device is provided with a heat transfer unit and a pressing member. The heat transfer unit includes a heat receiving portion thermally connected to a heat generating component, a heat radiating section thermally connected to a heat radiating part, and a plurality of passages through which fluid flows. The heat transfer unit includes first and second members being flexible and mutually bonded. The second member includes a plurality of passage parts which form spaces to be the passages between the first member and the second member, and a flat part being located between the adjacent passage parts and in contact with the first member. The pressing member presses the flat part toward the heat generating component, avoiding the plurality of passage parts.

Abstract: A chip unit has a stack of at least two electronic chips stacked one on top of the other, a through-chip connection within the stack, the through chip connection including a bounding material having an inner and outer perimeter, the inner perimeter defining an interior volume longitudinally extending through at least one of the at least two chips and at least partially into another of the at least two chips so as to form a tube extending between the one and the other of the chips, and an amount of working fluid hermetically sealed within the tube, the working fluid having a volume and being at a pressure such that the working fluid and tube will operate as a heat pipe and transfer heat from the stack of chips to the working fluid.

Abstract: A power semiconductor module with its thermal resistance and overall size reduced. Insulating substrates with electrode metal layers disposed thereon are joined to both the surfaces of a power semiconductor chip by using, for example, soldering. Metal layers are disposed also on the reverse surfaces of the insulating substrates and the metal layers are joined to the heat spreaders by using brazing. Heat radiating fins are provided on the heat radiating surface of at least one of the heat spreaders. The heat radiating side of each of the heat spreaders is covered by a casing to form a refrigerant chamber through which refrigerant flows to remove heat transmitted from the semiconductor chip to the heat spreader.

Abstract: A semiconductor package is disclosed. In one embodiment the package includes a semiconductor chip including an active surface with a plurality of chip contact areas and a package substrate including a plurality of first contact areas and a plurality of second contact areas on its bottom surface. The chip is mounted on the package substrate with its active surface facing the package substrate. A plurality of conducting means provide electrical contact between the chip contact areas and the first contact areas. A heat spreading means comprises a planar area and at least one protrusion. The planar area is attached to the upper surface of the chip and the protrusion is attached to the upper surface of the package substrate.

Abstract: A method for fabricating a multi-layer wick structure of a heat pipe includes providing a first and a second weaving meshes, overlaying and winding the first and the second weaving meshes to form an open circular structure with the first weaving mesh encircling the second weaving mesh, inserting the open circular structure into a tubular member of the heat pipe, pressing the tubular member towards an central axis thereof such that the open circuit structure is forced into a close circular wick structure, and melting the first waving mesh to be attached on an interior surface of the tubular member.

Abstract: A structure. The structure includes a substrate and an interposer. The substrate includes a heat source and N continuous substrate channels on a first side of the substrate (N?2). The interposer includes N continuous interposer channels coupled to the N substrate channels to form M continuous loops (1?M?N). Each loop independently consists of K substrate channels and K interposer channels in an alternating sequence. For each loop, K is at least 1 and is subject to an upper limit consistent with a constraint of the M loops collectively consisting of the N interposer channels and the N substrate channels. Each loop is independently open ended or closed. The first side of the substrate is connected to the interposer. The interposer is adapted to be thermally coupled to a heat sink such that the interposer is interposed between the substrate and the heat sink.

Abstract: A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow forming device that forms parallel coolant flow paths that are provided so as to be in contact with the other surface of the base plate.

Abstract: A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a working fluid including a chemical compound that reacts endothermically to absorb heat produced by the devices and releases the heat in a reverse reaction to the enclosure.

Abstract: The present invention relates to a semiconductor chip coolant path, a semiconductor package utilizing the semiconductor chip coolant path, and a cooling system for the semiconductor package. For effective dissipation of heat generated during semiconductor chip operation, a semiconductor chip having a coolant path formed through or adjacent to its backside and a semiconductor package utilizing the semiconductor chip are provided. In addition, a cooling system for the semiconductor package circulates a coolant through the coolant path within the semiconductor package to directly contact and cool the semiconductor chip.

Abstract: The light-emitting module according to the present invention comprises a heat dissipation element, a substrate for example a metal core printed circuit board (MCPCB), or FR4 board which is coupled to one or more light-emitting elements and provides a means for operative connection of the light-emitting elements to a source of power. The substrate is positioned such that it is thermally coupled to the heat dissipation element. The light-emitting module further comprises a housing element which matingly connects with the heat dissipation element, wherein the housing element may further comprise an optical element integrated therein for manipulation of the light generated by the one or more light-emitting elements.

Abstract: A cooling system for a computer is provided. In one implementation, the cooling system includes a heat spreader that is in thermal contact with a heat generating component in the computer, a frame casting, and a heat pipe to passively dissipate heat generated from the heat generating component in the computer to the frame casting. The heat pipe includes a first portion that is co-planar with and in direct contact with the heat generating component, and a second portion that is in thermal contact with the frame casting.

Abstract: The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate. The heat conductive pipe further comprises a connecting part connected to a top portion of the thermal substrate, and a bending part which is bended and extended upward away from the thermal substrate. A plurality of sets of heat fins connecting to end portions of the bending part of the heat conductive pipe are supported and elevated by the heat conductive pipe so that an air space is formed between the thermal substrate and the sets of heat fins. A fan locating on a top part of the heat fins, wherein a plurality of air passages are formed in between those heat fins so that cool air ventilates from the fan through the air passages of the heat fins to the thermal substrate.

Abstract: A semiconductor device includes 1) a conductive pipe including an inner surface forming an inner space shaping a path of an insulative cooling refrigerant liquid and an outer surface including a plane potion partially formed thereof, 2) a power semiconductor element fixed onto the plane portion of the conductive pipe through a bonding layer such as solder, 3) a first external connecting terminal including an inner lead part including a tip portion bonded onto the plane portion of the conductive pipe and an outer lead part continuous with the inner lead part, 4) a second external connecting terminal which is in the state of floating above the outer surface, and 5) a mold resin covering the whole surface of the power semiconductor element, the whole of the inner lead parts of the external connecting terminals, and the whole of the outer surface covering a central portion of the conductive pipe.

Abstract: A method and device for cooling an integrated circuit is provided. A method and device using a gas to cool circuit structures such as a number of air bridge structures is provided. A method and device using a boiling liquid to cool circuit structures is provided. Further provided is a method of controlling chip temperature. This allows circuit and device designers an opportunity to design more efficient structures. Some properties that exhibit less variation when temperature ranges are controlled include electromigration, conductivity, operating speed, and reliability.

Abstract: An electronic device. The electronic device includes a circuit board, a heat dissipation module, and a light-emitting diode. The circuit board includes a heating element thereon. The heat dissipation module is disposed on the circuit board and the heating element. The light-emitting diode is disposed on the heat dissipation module. The heat dissipation module is connected to the heating element and the light-emitting diode.

Abstract: A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semiconductor modules are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules are sandwiched by coolant tube having folded portions with fixing members. As a consequence, both surfaces of the semiconductor module can be cooled by a single coolant tube with a uniform pinching force.

Abstract: According to some embodiments, a microchannel is provided to transport a coolant. The microchannel may be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. Moreover, a movable portion may be provided to adjust a volume of a space associated with the microchannel (e.g., when the coolant freezes).

Abstract: A printed circuit board (PCB) for a package substrate of a multi-package module (MPM). The PCB comprises a substrate and a heat sink thereon. The heat sink comprises a first portion under the package substrate of the MPM. The heat sink further comprises a second portion adjacent to the first portion, comprising at least one fin.

Abstract: A power semiconductor module (1) with a housing (2) and at least one semiconductor chip (3, 3?) located in it is devised. At least one semiconductor chip (3, 3?) has a first main electrode side (31) and a second main electrode side (32) opposite the first main electrode side, the first main electrode side (31) making thermal and electrical contact with the first base plate (4, 4?). The first cooling device (6) makes thermal and electrical contact with the side of the first base plate (41) facing away from the first main electrode side. The second main electrode side (32) makes thermal and electrical contact with a second base plate (5, 5?). A second cooling device (7) makes thermal contact with the side of the second base plate (51) facing away from the second main electrode side. The heat sink (65) of the first cooling device is supported against the housing (2).