Abstract: A liquid cooled thermal heat sink is provided. A plurality of jet orifices provide an exit for pressurised liquid to exit a plenum chamber and impinge on a thermal surface whereby they effect a cooling of the thermal surface, the heated liquid being transferred through an exit channel to dissipate heat away from the thermal surface.

Abstract: The present disclosure relates to a laser diode system. The system may have at least one laser diode emitter having a substrate, at least one laser diode supported on the substrate, and a facet which a laser beam generated by the laser diode is emitted. A cooling subsystem is included which is disposed in contact with the substrate of the laser diode emitter. The cooling subsystem includes a plurality of cooling fins forming a plurality of elongated channels for circulating a cooling fluid therethrough to cool the laser diode emitter. The cooling fluid also flows over the facet of the laser diode emitter.

Abstract: An imaging apparatus mounted in a vehicle includes an imager substrate, a housing, and a heat dissipator. The imager substrate has an image sensor mounted thereon. The housing is equipped with a rear wall extending in an in-plane direction perpendicular to a thickness of the imager substrate and has the imager substrate disposed therein. The heat dissipator is arranged between the imager substrate and the rear wall in contact therewith to transfer heat from the imager substrate to the rear wall. The rear wall has a substrate-facing surface facing the imager substrate through the heat dissipator and also has a retainer arranged on the substrate-facing surface to hold the heat dissipator thereon. This structure ensures enhanced stability in releasing thermal energy from the image sensor or the imager substrate.

Abstract: An electronic module includes a semiconductor package including a die carrier, a semiconductor transistor die disposed on the die carrier, an electrical conductor connected to the semiconductor die, and an encapsulant covering the die carrier, the semiconductor die, and the electrical conductor so that a portion of the electrical conductor extends to the outside of the encapsulant. The electronic module further includes an interposer layer on which the semiconductor package is disposed, and a heat sink through which a cooling medium can flow. The interposer layer is disposed on the heatsink.

Abstract: A liquid-cooled plate radiator is disclosed. The liquid-cooled plate radiator includes a radiator body. A coolant liquid runner for circulating a coolant liquid is formed inside the radiator body. The coolant liquid runner includes a plurality of radiating sub-runners. Then, a plurality of fin units are arranged on the radiating sub-runners along a flow direction of the coolant liquid. The fin unit has a plurality of fins extending side by side along the flow direction of the coolant liquid. Moreover, the fins of the front and rear adjacent fin units on the radiating sub-runners are staggered, thereby increasing the radiating area, enhancing the disturbance of the coolant liquid when flowing inside the radiating sub-runners, and improving the radiating efficiency. Thus, the technical problems of limited radiating area and low radiating efficiency caused by a single linear coolant liquid runner are solved.

Abstract: Various embodiments may relate to a liquid cooling module. The liquid cooling module may include a main body. The main body may include a cooling core including a microfluidic structure configured to carry a cooling liquid. The main body may also include a plurality of slots. The liquid cooling module may further include a sealing pad configured to transmit heat from an electronic device to the cooling core. The liquid cooling module may additionally include a plurality of fins extending from the main body, each of the plurality of fins including an internal circulating liquid duct such that the liquid cooling module includes a plurality of internal circulating liquid ducts in fluidic communication with the microfluidic structure.

Abstract: Circuit board, defining a plurality of switching arms connected in parallel so as to convert a first voltage into a second voltage, at least one of which is DC voltage. The board includes a plurality of controllable electronic switches mounted pairwise in series on either side of a midpoint, so as to produce the switching arms connected in parallel. A plurality of decoupling capacitors are connected in parallel to one another, and in parallel to the DC voltage. Two electrically conductive layers are arranged parallel to one other, one of which is at the highest potential of the DC voltage and the other of which is at the lowest potential of the DC voltage. Each of the decoupling capacitors having one terminal connected to one of these electrically conductive layers and its other terminal connected to the other of these electrically conductive layers.

Abstract: Methods, apparatuses and systems to provide for technology to that includes a first power electronics module including a plurality of first transistors that are diagonally offset from each other, and a second power electronics module stacked on the first power electronics module. The second power electronics module includes second transistors that are diagonally offset from each other. The second transistors are staggered relative to the first transistors.

Abstract: A heatsink may include a base and a plurality of fins, configured to be disposed in an air flow, that extend orthogonally from the base. The plurality of fins may have at least one of a height, an inter-fin spacing, or a thickness that varies in a direction of the air flow.

Abstract: A heat dissipation device includes a radiator, a first tank, and a pump assembly. The radiator cools liquid and extends in a first direction. The first tank is connected to the radiator, and the liquid passes through the first tank. The pump assembly is connected to the first tank and circulates the liquid flowing in from the first tank. The radiator includes a pipe through which the liquid passes. The pipe extends along the first direction. The pump assembly is located on one side in the first direction of the radiator. The pump assembly includes a first pump, a second pump, and a flow path portion. The first pump feeds and circulates the liquid. The second pump feeds and circulates the liquid. The flow path portion guides the liquid fed from the first pump and the second pump toward an outside of the pump assembly.

Abstract: Semiconductor packages and/or assemblies having microchannels, a microchannel module, and/or a microfluidic network for thermal management, and associated systems and methods, are disclosed herein. The semiconductor package and/or assembly can include a substrate integrated with a microchannel and a coolant disposed within the microchannel to dissipate heat from a memory device and/or a logic device of the semiconductor package and/or assembly. The microchannel can be configured beneath the memory device and/or the logic device.

Abstract: One general aspect includes a hybrid thermal management system for vehicle electronics. The hybrid thermal management system also includes a bottom piece being injection molded and may include of polymer, the bottom piece may include a plurality of coolant channels, an input port and an output port. The hybrid thermal management system also includes a thermal plate covering the bottom piece and the plurality of coolant channels and configured to dissipate thermal energy from a vehicle high performance computing (HPC) to a coolant within the plurality of coolant channels. The hybrid thermal management system also includes the input port configured to supply the coolant to the plurality of coolant channels. The hybrid thermal management system also includes the output port configured to collect coolant from the plurality of coolant channels and convey thermal energy away from the system.

Abstract: A power conversion unit includes a plurality of semiconductor modules, a gate drive circuit, a first substrate having a flat plate shape, and a second substrate having a flat plate shape. The first substrate has a first surface facing a bottom plate of a casing accommodating the semiconductor modules and the gate drive circuit, and a second surface on an opposite side to the first surface. The second substrate is arranged above the first substrate in parallel with the second surface. The semiconductor modules are mounted on the first surface. The gate drive circuit is formed on a surface of the second substrate on a side that does not face the second surface. The power conversion unit further includes a connector provided on the second surface and connected to a surface on a side facing the second substrate.

Abstract: A method comprising providing a carbonaceous material, the substrate having a first thermal conductivity. The method further comprises depositing a first masking layer having a second thermal conductivity on at least a portion of the substrate, a ratio of the second thermal conductivity to the first thermal conductivity being less than or equal to 1:30. The method further comprises depositing a second masking layer on the first masking layer to form an etch mask, and etching an exposed portion of the substrate.

Abstract: The present description concerns an electronic chip (202) formed on top and inside of a semiconductor substrate including, one the side of a first surface (202B), at least one active component and, on the side of a second surface (202T) opposite to the first surface, at least one channel for the circulation of a liquid intended to cool the chip.

Abstract: The disclosure relates to a device for cooling components. The device includes a main body and cylindrical and/or conical cooling fins which are formed in the main body and around which a coolant may flow, wherein the cooling fins are formed in parallel first rows and equally spaced apart from one another. Neighboring first rows are arranged offset from one another in the row direction in such a way that the axes of neighboring cooling fins of the neighboring first rows are offset by at least 25% of the hydraulic diameter of the cooling fins. The disclosure also relates to a converter and an aircraft including a device of this type.

Abstract: A refrigerator according to an embodiment of the present invention comprises an inlet port and an outlet port which are formed in a sink body forming a heat sink, so as to guide coolant inflow and coolant outflow respectively, wherein the center line of the inlet port passes through the center of a thermoelectric element attached to the heat sink.

Abstract: A method of forming at least a component of a heat exchanger comprises introducing a feed material comprising a first portion including a matrix material and a second portion including a sacrificial material on a surface of a substrate, exposing at least the first portion to energy to form bonds between particles of the matrix material and form a first thickness of a structure, introducing additional feed material comprising the first portion over the first thickness of the structure, exposing the additional feed material to energy to form a second thickness of the structure, and removing the sacrificial material from the structure to form at least one channel in the structure. Related heat exchangers and components, and related methods are disclosed.

Abstract: A semiconductor package includes a die and an encapsulant. The die has an active surface and an opposite backside surface. The encapsulant wraps around the die and has a recess reaching the backside surface. A span of the recess differs from a span of the backside surface and a span of the encapsulant.

Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

Abstract: A stacked heat exchanger has a high temperature layer with a number of channels into which a high temperature-side fluid is introduced; and a low temperature layer superposed on the high temperature layer having a number of channels into which a low temperature-side fluid is introduced at a temperature lower than the temperature of the high temperature-side fluid. Each channel of the low temperature layer has an upstream-side part in which at least some of the low temperature-side fluid evaporates by being heated by the high temperature-side fluid flowing within the high temperature layer; and a downstream-side part in which the low temperature-side fluid that has evaporated in the upstream-side part is heated by the high temperature-side fluid flowing within the high temperature layer. The upstream-side parts of the low temperature layer occupy a total area smaller than a total area of the downstream-side parts of the low temperature layer.

Abstract: Semiconductor packages including a computing device with a heat source, and related devices and methods, are disclosed herein. For example, the computing device may have a heatsink physically and thermally coupled with the heat source. The heatsink may include a structural element internal to the heatsink. The structural element may cause a surface of the heatsink to deform to a non-planar configuration when the heatsink is coupled to the heat source.

Abstract: A loop heat pipe includes two outermost metal layers, an intermediate metal layer provided between the outermost metal layers, an evaporator, a condenser, and liquid and vapor pipes connecting the evaporator and the condenser and forming a loop shaped passage. The intermediate metal layer includes a pair of walls forming a part of a pipe wall of the evaporator, the condenser, the liquid pipe, and the vapor pipe, a porous body provided between the pair of walls, and a strut penetrating the porous body and bonding the outermost metal layers, and one or more metal layers. Each of the one or more metal layers includes a first part forming a part of the pair of walls, a second part connected to the first part and forming a part of the porous body, and a third part connected to the second part and forming a part of the strut.

Abstract: A cooling assembly includes a housing defining a fluid chamber, wick structures arranged on an interior surface of the fluid chamber such that one or more flow channels are present therebetween, and a divider. The divider includes an outer frame comprising a first side and a second side and one or more bridging supports extending between and connecting the first side and the second side of the outer frame. The one or more bridging supports are aligned with the one or more flow channels between the wick structures. Each one of the one or more bridging supports define a plurality of vapor flow paths extending therethrough. The one or more bridging supports further define a plurality of vapor spaces between the one or more bridging supports that are aligned with the wick structures. The plurality of vapor flow paths are fluidly coupled to the vapor spaces.

Abstract: A fluid cooling device includes an endothermic cover, an endothermic base and a fluid pump. The endothermic cover has a port; and a heat exchange chamber formed between the longitudinally affixed endothermic base and endothermic cover, and a heat exchange unit installed in the heat exchange chamber. The fluid pump includes a pump housing and a driving element, and the pump housing has a pump space and a coupling tube communicating to each other. A vane of a driving element is received in the pump space, and the coupling tube is longitudinally plugged into the port and seamlessly combined and fixed to each other, and the pump housing maintains an insulation gap with the endothermic cover through the coupling tube. Therefore, the heat of the heat sink will not be conducted to the fluid pump and no seam is produced and thus no waterproof gasket is needed.

Abstract: An immersion cooling system includes a sealed tank having a chamber. A circulating layer and a working layer are respectively formed by first and second working liquids filled in the chamber and are contiguous to each other. The boiling point of the second working liquid is higher than that of the first working liquid. The density of the second working liquid is lower than that of the first working liquid. The first and second working liquids do not dissolve in each other. A circulating cooling module includes a circulating pipeline having first and second ports located in the chamber. The circulating pipeline also has a heat absorbing section and a condensation section located between the first and second ports. The heat absorbing section is located in the working layer. The first working liquid flows into the circulating pipeline from the first port and circulates in the circulating pipeline.

Abstract: According to one embodiment, a cooling assembly includes a cooling plate to be attached to an electronic device and a bidirectional connector for circulating cooling fluid to the cooling plate. The bidirectional connector includes a first tubing structure having a first fluid channel therein to supply the cooling fluid flowing in a first direction to the cooling plate, a second tubing structure that encloses the first tubing structure therein. The first tubing structure is positioned spaced apart from the second tubing structure to form a second fluid channel between an outer surface of the first tubing structure and an inner surface of the second tubing structure. The second fluid channel is configured to receive the cooling fluid returned from the cooling plate. The first and second fluid channels are configured to operate a supply and a return fluid streams in opposite directions, respectively.

Abstract: A system for overvoltage protection on loads for use in an electric aircraft is presented. The system includes an energy storage element configured to produce an electrical output, a bus element, wherein the bus is configured to transfer the electrical output from the energy storage element, a plurality of inverters, wherein each inverter is configured to generate a regulated output as a function of the electrical output and detect an overvoltage output as a function of the regulated output, and a plurality of load devices connected to the plurality of inverters, wherein each load device includes a fault protection device.

Abstract: A heat sink for use in drawing heat away from electronic devices such as solid state drives (SSDs) includes microchannels formed along its length. The microchannels may have a triangular cross-section and may be formed by additive manufacturing. Two pairs of microchannels are provided, with coolant fluid running in a first direction through the first pair, and in a second opposite direction in the second pair to minimize thermal gradients along the length of the SSD and heat sink. The walls of the microchannel may be formed with a roughness that provides turbulent flow through the microchannels. The turbulent flow together with the large surface area of the three sides of the triangular microchannels increases the heat transfer coefficient of the microchannels, while the triangular shape and pumping fluid through a pair of microchannels reduces pressure drop along the microchannels.

Abstract: A water-cooling heat dissipation device includes a water-cooling radiator. The water-cooling radiator includes a radiating pipe unit, a water outlet reservoir, and a water inlet reservoir. The water-cooling radiator is provided with a first water pump and a second water pump. Each water pump is configured to pump cold water in a corresponding water outlet chamber to a corresponding water-cooling block to exchange heat and become hot water, hot water flows back to a corresponding water inlet chamber and flows into the corresponding radiating pipe unit to be cooled by radiating fins, and then cold water flows into the corresponding water outlet chamber.

Abstract: A heatsink for distributing heatsink load across a processor module with separable input/output (I/O) connectors, comprising: a thermal conductor; and one or more pistons aligned with one or more separable interconnects of the processor module.

Abstract: Embodiments include a microelectronic device package structure having a first die on the substrate. One or more additional dice are on the first die, and a thermal electric cooler (TEC) is on the first die adjacent at least one of the one or more additional dice. A dummy die is on the TEC, wherein the dummy die is thermally coupled to the first die.

Abstract: A loop thermosyphon can combine the best of heat-pipes and traditional liquid-cooling systems that include a mechanical pump. A disclosed heat-transfer device includes a first heat-transfer component and a second heat-transfer component fluidly coupled with each other by a first conduit and a second conduit. A first manifold is positioned in the first heat-transfer component and defines a first plurality of liquid pathways. The first manifold fluidly couples with the first conduit. A second manifold is also positioned in the first heat-transfer component and defines a second plurality of liquid pathways fluidly coupled with and extending from the first plurality of liquid pathways. The second manifold further defines a plurality of boiling channels, a plurality of accumulator channels and a vapor manifold. The boiling channels extend transversely relative to and are fluidly coupled with the second plurality of liquid pathways.

Abstract: A light sintering device is provided. The light sintering device can comprise: a housing having, therein, a cooling hollow portion in which cooling water flows; a beam guide mounted on one side of the housing so as to form one wall of the cooling hollow portion, and guiding sintered light; and an optical filter mounted on the other side of the housing so as to face the beam guide, thereby forming the other wall of the cooling hollow portion, and filtering out a specific wavelength of the sintered light.

Abstract: A cold plate for cooling a heat-generating component in a computer system is disclosed. The cold plate includes a lid member with a lower supply manifold housing and a lower collection manifold housing. The cold plate includes a base member having coolant channels defined by fins. Each of the fins have a top section and a bottom section attached to the base member. An interior cavity is defined by an arc-shaped section of the fins, the interior surface of the base, and the lower supply manifold housing. An interior corner is formed by the lower supply manifold housing of the lower manifold housing at the top of the fins to trap debris. An upper inlet manifold has a connector to receive coolant. An upper outlet manifold has a connector to circulate coolant. The upper manifolds are in fluid communication with the collection manifold housings.

Abstract: In some respects, concepts disclosed herein generally concern systems, methods and components to detect a presence of a liquid externally of a desired primary flow path through a segment of a fluid circuit, e.g., throughout a cooling loop. Some disclosed concepts pertain to systems, methods, and components to direct seepage or leakage of a liquid coolant toward a lead-detection sensor. As but one example, some disclosed liquid-cooled heat exchangers incorporate a leak-detection sensor, which, in turn, can couple with a computing environment that monitors for detected leaks, and, responsive to an indication of a detected leak, invokes a task to control or to mitigate the detected leak.

Abstract: A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base and at least one heat dissipation fin. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet.

Abstract: Disclosed is a microchannel heat exchanger comprising a primary core including a first header and a second header and a secondary core including a first auxiliary header and a second auxiliary header, further comprising a first header interconnect extending between the first header and the first auxiliary header and having a first interconnect fluid passage extending therethrough; and a second header interconnect extending between the second auxiliary header and the second header and having a second interconnect fluid passage extending therethrough.

Abstract: An immersion cooling tank includes a tank body and a liquid flow tube. The tank body holds a coolant and an electronic device. The tank body defines an inlet and an outlet. The inlet and the outlet are respectively located at opposite ends of the electronic device for inputting and outputting the coolant. The coolant flows through the electronic device. The liquid flow tube includes at least one adjuster. The liquid flow tube is located inside the tank body and coupled to at least one of the inlet or the outlet. The at least one adjuster faces the electronic device for controlling an amount of the coolant flowing in or out of the tank body.

Abstract: A microfluidic apparatus is provided that includes a thermoelectrically-activated pixel array, a microfluidic chip, and control circuitry. The pixel array may include a plurality of thermal pixels, with each thermal pixel including a thermoelectric device. The microfluidic chip may include a microfluidic channel disposed adjacent to the thermal pixels such that thermal energy generated by the thermal pixels is received by the microfluidic channel to form a localized spot within the microfluidic channel corresponding to each thermal pixel. The control circuitry may be electrically coupled to each of the thermal pixels and configured to control the thermal energy being generated by each thermal pixel to control a temperature at each localized spot within the microfluidic channel.

Abstract: The disclosure provides a cooling device, for cooling devices that generate heat during their operation. The cooling device includes single phase cooling plates to be attached to the devices to dissipate a majority of the heat from the devices while a first coolant is circulated through the single phase cooling plates. The cooling device also includes a unified cooling plate. The plate is directly attached on top of the single phase cooling plates. The unified cooling plate dissipates a portion of the heat transferred from the single phase cooling plates to the unified cooling plate while a second coolant is circulated through the unified cooling plate and when the first coolant is insufficient to remove the portion of the heat from at least one of the single phase cooling plates. The cooling device may be used as part of an electronic rack, a data center, and in other environments.

Abstract: The power conversion device includes: a housing; an electric wiring board stored in the housing; a first heat generating component provided on the one surface of the electric wiring board; a second heat generating component which has a lower heat generation density than the first heat generating component and of which a protruding height from the electric wiring board is equal to or smaller than a protruding height of the first heat generating component, the second heat generating component being provided on the one surface of the electric wiring board; and a third heat generating component which has a lower heat generation density than the first heat generating component and of which a protruding height from the electric wiring board is greater than the protruding height of the first heat generating component, the third heat generating component being provided on another surface of the electric wiring board.

Abstract: A semiconductor device includes a chip package comprising a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die having an active surface, a back surface opposite to the active surface, and a thermal enhancement pattern on the back surface; and a heat dissipation structure connected to the chip package, the heat dissipation structure comprising a heat spreader having a flow channel for a cooling liquid, and the cooling liquid in the flow channel being in contact with the thermal enhancement pattern.

Abstract: A heat transfer system that includes one or more heat exchangers and one or more variable control pumps that control flow through the one or more heat exchangers. At least one variable control pump is on the source side of the heat exchanger for controlling flow of a first circulation medium and at least one flow controlling mechanical device is on the load side of the heat exchanger for controlling flow of a second circulation medium. Sensors are used for detecting variables of the first circulation medium and the second circulation medium. At least one controller is configured to control at least one parameter of the first circulation medium or the second circulation medium by controlling at least one of the variable control pump or the flow controlling mechanical device using a feed forward control loop calculated from the detected variables to achieve control of the at least one parameter.

Abstract: Among other things, a method of fabricating an integrated electronic device package is described. First trace portions of an electrically conductive trace are formed on an electrically insulating layer of a package structure, and vias of the conductive trace are formed in a sacrificial layer disposed on the electrically insulating layer. The sacrificial layer is removed, and a die is placed above the electrically insulating layer. Molding material is formed around exposed surfaces of the die and exposed surfaces of the vias, and a magnetic structure is formed within the layer of molding material. Second trace portions of the electrically conductive trace are formed above the molding material and the magnetic structure. The electrically conductive trace and the magnetic structure form an inductor. The electrically conductive trace may have a coil shape surrounding the magnetic structure. The die may be positioned between portions of the inductor.

Abstract: A cold plate has, on a surface thereof, an attachment surface for contacting a cooling object, and has, in the interior thereof, an accommodating portion that accommodates a cooling medium. The cold plate is provided with a first opening that communicates with the accommodating portion, a body-side connection pipe is connected to the first opening, a tube-side connection pipe, which has a bendable tube connected to one end thereof, is connected to the body-side connection pipe. The body-side connection pipe and the tube-side connection pipe are connected so as to be able to rotate about the pipe axis.

Abstract: A heat sink comprising a heat exchange device having a large-scale morphology over a scale range and a small-scale texture over a scale range, wherein at least one of the large-scale morphology and the small scale texture has a fractal-like self-similarity over a scale range. The large-scale morphology and small-scale texture may be defined and implemented independently, or be provided with a transitional range. The large-scale morphology may be algorithmically optimized according to a set of geometrically constraints. The small-scale texture may be optimized according to aerodynamic parameters and constraints. The heat sink may be dynamically varying, and/or operated in conjunction with a dynamically varying heat transfer medium supply.

Abstract: A heat exchange module for an energy storage module, having a module housing for heat-transferring contact with an energy storage module; at least one operating medium channel for an operating fluid for heat transport; and at least one fluid connection for at least one external line for the operating fluid of the operating medium channel. There is formed by the at least one operating medium channel at least one receiving opening with a predetermined cross section in a channelward extension of the operating medium channel, in which a plug with a shape filling the predetermined cross section of the receiving opening is received such that the receiving opening is bonded thereto in a fluid-tight manner. With the heat exchange module, efficient use is made of a structural space, while the heat exchange module at the same time is able to be manufactured at low cost.

Abstract: A semiconductor package includes a substrate; a die mounted on a top surface of the substrate in a flip-chip fashion; and a lid mounted on the die and on a perimeter of the substrate. The lid includes a cover plate and four walls formed integral with the cover plate. A liquid-cooling channel is situated between the cover plate of the lid and a rear surface of the die for circulating a coolant relative to the semiconductor package.

Abstract: The present invention provides a water-cooled radiator internally provided with a semiconductor refrigeration system and a fan, the water-cooled radiator comprising: a radiation fin, a water tank structure, water-cooled pipes, a water pump, a water-cooled gear, a semiconductor refrigeration structure and a radiator fan assembly, wherein the radiation fin, the water tank structure, the semiconductor refrigeration structure and the radiator fan assembly are connected into an integrated structure. By means of the semiconductor refrigeration structure, the water temperature of a water storage tank can be rapidly lowered, and the radiator fan assembly can dissipate the heat of and cool a semiconductor, and can dissipate the heat of and cool electronic components around a main board.