Double-base Diode (epo) Patents (Class 257/E29.172)
  • Patent number: 7671379
    Abstract: A semiconductor system for voltage limitation includes a first cover electrode, a highly p-doped semiconductor layer that is connected to the first cover electrode, a slightly n-doped semiconductor layer that is connected to the highly p-doped semiconductor layer and a second cover electrode. At least one p-doped semiconductor layer and two highly n-doped semiconductor layers are provided next to one another in an alternating sequence between the slightly n-doped semiconductor layer and the second cover electrode.
    Type: Grant
    Filed: July 15, 2005
    Date of Patent: March 2, 2010
    Assignee: Robert Bosch GmbH
    Inventor: Alfred Goerlach
  • Publication number: 20080315260
    Abstract: An open-base semiconductor diode device has an emitter, base, and collector layers. The layers are configured and doped such that the device has an IV characteristic with: i. a punchthrough region beginning at a voltage Vpt with positive resistance, followed by, and ii. an avalanche region including a positive resistance stage beginning with conductivity modulation at Vcrit and Icrit and having a resistance Rcrit, iii. wherein the values of Vcrit, Icrit and Rcrit are set according to the layer configuration and doping. The device may have a double-base structure, and the width of a lower-doped base region may be minimised such that current density Jcrit at which the conductivity modulation occurs due to avalanche is increased. In one example, the device comprises a N-N+ or a P-P+ double-emitter. Thickness of N? or P? layers may be minimised such that the current-carrying capability is maximised and the doping of this layer does not affect the current-carrying capability of the device.
    Type: Application
    Filed: March 22, 2006
    Publication date: December 25, 2008
    Inventor: Russell Duane
  • Patent number: 7211851
    Abstract: A ferroelectric memory comprises a first transistor connected between N1 and N2 nodes, a second transistor connected between the N2 node and an N3 node, a first transistor connected between P1 and P2 nodes, a second transistor connected between the P2 node and a P3 node, a first wiring formed in a first wiring layer to interconnect the N1 node and the P1 node, a second wiring formed in the first wiring layer to interconnect the N3 node and the P3 node, a third wiring formed in a second wiring layer different from the first wiring layer to interconnect the N2 node and the P2 node, a first capacitor whose first electrode is connected to the first wiring, and a second capacitor whose first electrode is connected to the second wiring. Second electrodes of the first and second capacitors are both connected to the N2 node or the P2 node.
    Type: Grant
    Filed: March 21, 2005
    Date of Patent: May 1, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tadashi Miyakawa, Daisaburo Takashima