Condenser Or Resistor Patents (Class 264/272.18)
  • Patent number: 11158465
    Abstract: A winder includes a winding mechanism, a chamber, a vacuum pump, a conveying route and a product case. The winding mechanism winds a belt-shaped raw film around a winding core, the belt-shaped raw film being composed of a plurality of electrodes and a plurality of separating films. The chamber houses the winding mechanism. The vacuum pump sucks air into the chamber. The conveying route has a sealed outer space outside the chamber, an inner space of the chamber leading to the outer space in the conveyance route. The product case is disposed in the conveying route to house a plurality of winding products each formed by winding the raw film with use of the winding mechanism.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: October 26, 2021
    Assignee: KAIDO MANUFACTURING CO., LTD.
    Inventors: Kosuke Kaito, Yoshihide Kitamura
  • Patent number: 10910922
    Abstract: A stator includes a middle point coil of a winding accommodated in slots of a stator core and mounted on the stator core, a thermistor configured to detect a temperature of the middle point coil of the winding, and insulating paper that is wound on the thermistor and an outer circumference of the middle point coil of the winding and both side portions of the insulating paper being adhered with each other, and that is configured to fix the thermistor to the middle point coil of the winding while the thermistor is in a contact state with the middle point coil of the winding.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: February 2, 2021
    Assignee: HONDA MOTOR CO., LTD.
    Inventor: Masashi Inoue
  • Patent number: 10105941
    Abstract: A method for fabricating a micro-truss structure having particular application for a vehicle impact structure. The method includes providing a thin support enclosure having a plurality of walls, where at least one of the walls is transparent to ultraviolet (UV) light. The support enclosure is filled with a liquid photomonomer resin and light from at least one UV source is directed through apertures in a mask and through the at least one transparent wall into the enclosure so as to polymerize and at least partially cure columns of the resin therein to form polymerized struts defining a micro-truss core in the enclosure that is secured to the walls. The support enclosure is then inserted into an outer structural enclosure.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: October 23, 2018
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Nilesh D. Mankame, Elisabeth J. Berger
  • Patent number: 9469744
    Abstract: The subject disclosure presents systems and methods for manufacturing a non-porous thermoformable polyurethane solid by combining an uncured polyurethane resin with Aluminum Trihydrate (ATH), a plurality of particulates, molecular sieves, and color particulates. This combination is mixed in a vacuum for a time period sufficient to initiate an exothermic reaction within the mixture. After the time period, the exothermically reacting mixture is allowed to cure to form the polyurethane solid. The curing may occur in a mold, i.e. by pouring or injecting the mixture into the mold. Alternatively, the mixture may be sprayed on to a surface and allowed to cure.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: October 18, 2016
    Assignee: ETS SURFACES, LLC
    Inventor: Timothy Lee Cox
  • Patent number: 9028736
    Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: May 12, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Youngshin Choi, Kikwon Jeong
  • Patent number: 8647110
    Abstract: An apparatus for fabricating a semiconductor package may include a mold and a molding plate. The mold may define a mold cavity with the mold being configured to receive a circuit board in the mold cavity, and the circuit board may include a semiconductor chip mounted thereon. A molding plate may be moveable in the mold cavity with the molding plate being configured to adjust a volume of the mold cavity. Related methods are also discussed.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: February 11, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Youngshin Choi, Kikwon Jeong
  • Patent number: 8623254
    Abstract: A method for producing a magnetic field sensor for use in drive train of a motor vehicle includes encapsulating an electrical assembly and an end of a connecting cable via injection molding and integrally extruding a fastening tab. After a first injection step in which the electrical assembly and the connecting cable are encapsulated in a core-type first molded part, a second injection molding step in implemented in which a fastening tab is integrally formed via injection molding on the core-type insertion part in a specifiable longitudinal and/or angular position. The core-like insertion part is held in the injection mold in a longitudinally displaceable and/or rotatable manner.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: January 7, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Rolf Goetz, Steffen Schulze, Daniel Matthie, Markus Kny, Frank Weishaeutel
  • Patent number: 6648927
    Abstract: The present invention is directed to a method of encasing electrolytic capacitor stacks or wound rolls to form an external package. First, a plastic sheet is heated to its soft transition temperature. Next, the plastic sheet is draped over a preassembled capacitor stack or wound roll. Then, a vacuum is applied to the capacitor stack or wound roll, such that the sheet is formed around the stack or wound roll. Finally, the plastic sheet is allowed to cool. This process results in a vacuum formed plastic capacitor case assembly which minimizes wasted volume in the capacitor package and minimizes capacitor assembly time.
    Type: Grant
    Filed: May 25, 2001
    Date of Patent: November 18, 2003
    Assignee: Pacesetter, Inc.
    Inventors: Gregory Scott Fandrich, Thomas Flavian Strange, Thomas V. Graham
  • Patent number: 6423104
    Abstract: A length of metallic lead from having anode terminals and cathode terminals integrally formed with each other extends between upper and lower molds of an apparatus for manufacturing tantalum solid electrolytic capacitors. The cathode terminals are first coated with a thermosetting conductive adhesive, and cathode layers of capacitor elements are then placed on the conductive adhesive. Thereafter, anode leads extending outwardly from the capacitor elements are placed on the anode terminals are joined thereto, respectively, by welding. A pressure is applied to the capacitor elements so that a portion of the conductive adhesive is squeezed out from one surface of each of the plurality of capacitor elements to a neighboring side surface thereof The cathode terminals are then joined to the capacitor elements, respectively, by heat-curing the conductive adhesive, and the capacitor elements are finally covered with a sheathing resin.
    Type: Grant
    Filed: November 15, 2000
    Date of Patent: July 23, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Minoru Omori, Yoshitsugu Uenishi, Osamu Tomita, Nario Kawakita, Masakuni Ogino, Yoji Masuda, Tsuyoshi Yoshino
  • Publication number: 20020089085
    Abstract: A high voltage transformer for a microwave oven includes a core, and primary and secondary coils. An insulation molding part encloses at least a part of the secondary coil and has a sensor accommodation portion formed therein. A temperature sensor is accommodated in the sensor accommodating portion for detecting temperature of the secondary coil. The sensor accommodating portion can be formed inside of the insulation molding part together with the temperature sensor, or formed outside of the insulation molding part in a pocket shape. With either configuration, the temperature sensor can be positioned at the correct sensor position, thereby improving the detecting accuracy of the temperature sensor. In addition, it is easy to repair and/or replace the temperature sensor.
    Type: Application
    Filed: March 11, 2002
    Publication date: July 11, 2002
    Inventor: Cheol-Jin Kim
  • Patent number: 6409775
    Abstract: A hoop metal lead frame (1) having, solid electrolytic capacitor elements (5) on its terminal sections (2) is provided with a crosspiece (3) bridging both sides in terms of the width direction disposed along the length direction in a region between the capacitor elements (5), one crosspiece for two capacitor elements (5). The metal lead frame (1) is placed on a molding die so that the region without having the crosspiece is locating at the sub runner (8), which has branched out from the main runner (7). The capacitor elements (5) are encapsulated with a molding resin injected through the sub runner (8). Since the molding resin is not covering the crosspiece (3), the main runner portion (7) and the sub runner portion (8) can be severed from the metal lead frame (1) without effecting unwanted stress on the solid electrolytic capacitors (10). The solid electrolytic capacitors (10) thus manufactured have a superior property in the tight hermetic sealing.
    Type: Grant
    Filed: February 9, 2000
    Date of Patent: June 25, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masatoshi Tasei, Kenji Kuranuki
  • Patent number: 6368364
    Abstract: A capacitor includes a pellet molded within a protective material and having a cathode termination surface at one end and an anode wire extending from the other end. The cathode termination surface is centered with respect to the longitudinal axis of the capacitor. The method includes centering the pellet body and a tear drop shaped conductive cathode element within a mold and molding a protective coating around them. After the molding is complete a portion of the tear drop shaped member is removed to create a cathode termination.
    Type: Grant
    Filed: May 23, 2000
    Date of Patent: April 9, 2002
    Assignee: Vishay Sprague, Inc.
    Inventors: Tibor Kormendy, Michel J. Richard, John Y. Cadwallader, Kyle E. Clark
  • Patent number: 6341413
    Abstract: An electronic equipment such as a proximity sensor. A groove for discharging air is formed at coil casing (7) arranged at a front surface of the proximity sensor. An opening (43) is formed at a clamp portion (9) holding a code (10) behind a metal casing (8). The proximity sensor (1) is held at a low pressure, and resin is supplied through the opening (43) at the clamp portion (9), whereby the casing can be filled with the resin in a short time.
    Type: Grant
    Filed: August 5, 1999
    Date of Patent: January 29, 2002
    Assignee: Omron Corporation
    Inventors: Takeshi Shimizu, Hideo Uda, Giichi Konishi, Kyouji Kitamura, Kazuhiro Hayashi, Chikashi Niimi, Toshiki Kitani, Satoshi Noda