Of Electrical Article Or Electrical Component (i.e., Not Insulator, Per Se) Patents (Class 264/614)
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Publication number: 20030047849Abstract: A method to fabricate a printed circuit board with a low temperature coefficient of resonant frequency comprising the steps of mixing a volume of glass particles, a volume of filler material, and a volume of finely modifier powder. The function of the finely modifier powder is to adjust the low temperature of resonant frequency. The mixture is sintered at a temperature to form a low temperature cofired ceramic which will have a low temperature coefficient of resonant frequency that is approximately zero.Type: ApplicationFiled: September 11, 2001Publication date: March 13, 2003Applicant: Motorola, Inc.Inventors: Xunhu Dai, Rong Fong Huang
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Patent number: 6531209Abstract: A suspension adhesive comprised of a matrix material and a particulate filler material is useful for bonding, sealing, repairing, and modifying ceramic, glass, and powdered metal components in a light source. A method for making the suspension adhesive includes the selection of a filler material and a volume percentage of the filler material. Additionally, a matrix material is selected and the filler material is dispersed throughout the matrix material. The suspension adhesive is used to bond and seal components to form, for example, an arc tube for a light source.Type: GrantFiled: December 1, 2000Date of Patent: March 11, 2003Assignee: General Electric CompanyInventors: Daniel Polis, Vishal Gauri
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Patent number: 6517924Abstract: The present invention provides a laminated body, comprising: a first sheet layer comprising an aggregate of a first powder, at least a part of the first powder being in a sintered state; a second sheet layer disposed so as to make contact with the first sheet layer and comprising an aggregate of a second powder, the second powder being in a non-sintered state; and the first powder and the second powder being solidified to each other by allowing a part of the first sheet layer material to diffuse or to flow into the second sheet layer.Type: GrantFiled: April 28, 1999Date of Patent: February 11, 2003Assignee: Murata Manufacturing Co. LtdInventors: Hirokazu Kameda, Shuya Nakao, Kenji Tanaka
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Patent number: 6514453Abstract: This invention describes a method of rapidly monitoring the temperature of a medium and a method of preparing a quantum confined device that can enable such measurements. The monitoring principle uses changes in impedance of nanostructured devices, i.e. devices in which one or more materials have the domain size precision engineered to less than 500 nanometers, preferably to dimensions less than the domain sizes where quantum confinement effects become significant and modify the electrical or thermal properties of the materials. The invention can be used to monitor absolute values of and changes in temperature of gases, inorganic and organic liquids, solids, suspensions, and mixtures of one or more of the said phases. The invention can be used to monitor radiation, power, heat and mass flow, charge and momentum flow, and phase transformation.Type: GrantFiled: February 17, 1998Date of Patent: February 4, 2003Assignee: NanoProducts CorporationInventors: Anthony Vigliotti, Tapesh Yadav, Clayton Kostelecky, Carrie Wyse
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Patent number: 6485672Abstract: A method of manufacturing a dielectric ceramic composition comprising at least a main component of BaTiO3, a second subcomponent as represented by (Ba, Ca)xSiO2+x (where, x=0.8 to 1.2), and other subcomponents. The main component and at least part of the subcomponents except the second subcomponent are mixed to prepare a pre-calcination powder and the pre-calcination powder is calcined to prepare a calcined powder. The second subcomponent is at least mixed in the calcined powder to obtain a dielectric ceramic composition having a ratio of each subcomponent to the main component of BaTiO3 of a predetermined molar ratio.Type: GrantFiled: October 24, 2000Date of Patent: November 26, 2002Assignee: TDK CorporationInventors: Takeshi Nomura, Shigeki Sato
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Publication number: 20020171182Abstract: A high density ceramic thick film is fabricated by providing vehicle comprising an organic binder and solvent, dispersing ceramic powders into the vehicle to be paste, forming the paste to thick film by screen printing, removing the organic binder from the film, applying sol or sol-like solution to the surface of the film so that the sol or sol-like solution can infiltrate into the film, removing remaining sol or sol-like solution from the surface of the film, drying and preheating the film, and sintering the film.Type: ApplicationFiled: April 4, 2002Publication date: November 21, 2002Inventors: Tae-Song Kim, Yong-Bum Kim, Hyung-Jin Jung
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Publication number: 20020163108Abstract: A process of producing a plasma display panel comprising the steps of: forming a photosensitive paste composition layer on a carrier film; transferring the photosensitive paste composition layer onto a substrate; exposing the photosensitive paste composition layer; removing the carrier film; and baking the exposed composition layer to fabricate at least one of barrier ribs, electrodes, resistors, dielectrics, phosphors, a color filter array, and a black matrix.Type: ApplicationFiled: April 30, 2002Publication date: November 7, 2002Inventors: Kiminori Oshio, Tomoyuki Inoue, Hitoshi Setsuda, Hiroyuki Obiya
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Publication number: 20020160265Abstract: A negative electrode for lithium secondary battery characterized in that the electrode is obtained by sintering a mixture of an active material alloy and a binder disposed on a current collector, or a mixture of an active material alloy, conductive metal powder and a binder disposed on a current collector, and the active material alloy after sintered is substantially amorphous.Type: ApplicationFiled: January 17, 2002Publication date: October 31, 2002Inventors: Takuya Hashimoto, Atsushi Fukui, Hiroshi Nakamura, Shin Fujitani
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Publication number: 20020158374Abstract: Semiconductor wire bonding tools used in the assembly and interconnection of integrated circuits (ICs) are micromolded from a mixture of ultrafine particulate materials mixed with an organic binder. Following extraction of the binder the green bonding tools are sintered during which they undergo isotropic, constant and accurately predetermined shrinkage. Hence semiconductor wire bonding tools can be produced with virtually no limit to miniaturization, thus allowing the fabrication of higher integrated semiconductor products.Type: ApplicationFiled: February 18, 2002Publication date: October 31, 2002Inventors: Romain L. Billiet, Hanh T. Nguyen
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Patent number: 6471805Abstract: A method of forming low resistance contact pads on a metal support substrate for a multilayer ceramic printed circuit board comprising forming a patterned layer of a conductive metal on the metal support substrate made of the same metal as that used to form the circuitry on the ceramic circuit board, and firing the support substrate. The patterned conductive metal can be formed by electroplating, by screen printing from a fritless conductor ink or by screen printing from a glass frit-containing conductor ink that includes a reducing agent.Type: GrantFiled: November 4, 1999Date of Patent: October 29, 2002Assignee: Sarnoff CorporationInventors: Barry Jay Thaler, Ashok Narayan Prabhu
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Publication number: 20020140134Abstract: An AlN substrate is disclosed that can be bonded to a copper foil by a direct-copper-bonding (DCB) method. The bonding surface of the AlN substrate includes at least one auxiliary layer containing at least 50 wt. % CuAlO2 and an excess of Cu2O. Also disclosed is a process for preparing the auxiliary layer by applying a material containing copper, copper oxide and/or other copper-containing compounds, followed by an oxidation and reduction process.Type: ApplicationFiled: March 11, 2002Publication date: October 3, 2002Applicant: ELECTROVAC, FABRIKATION ELEKTROTECHNISCHER SPEZIALARTIKEL GESELLSCHAFT M.B.H.Inventor: Herbert Topitsch
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Patent number: 6451244Abstract: The present invention is intended to provide piezoelectric ceramic materials having far better strain characteristics than that of conventional piezoelectric ceramics, as well as a novel method for producing such piezoelectric ceramics, and the present invention involves solid solution piezoelectric ceramics primarily comprising the complex perovskite compound Pb(Ni⅓Nb⅔)O3, the simple perovskite compound PbTiO3, and PbZrO3, wherein the aforementioned ceramics primarily comprise compositions within a triangle in which the compositional vertices are (X=52, Y=34, Z=14), (X=49, Y=37, Z=14), and (X=49, Y=34, Z=17), where Pb(Ni⅓Nb⅔)O3 is X mol %, PbTiO3 is Y mol %, and PbZrO3 is Z mol % (X+Y+Z=100) among the triangular coordinates in the phase diagram in which the vertices are Pb(Ni⅓Nb⅔) O3, PbTiO3, and PbZrO3, as well as a method for producing such solid solution ceramics.Type: GrantFiled: December 28, 1999Date of Patent: September 17, 2002Assignee: Japan as represented by Secretary of Agency of Industrial Science and TechnologyInventors: Keiji Kusumoto, Tadashi Sekiya
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Patent number: 6436332Abstract: The dielectric constant of low loss tangent glass-ceramic compositions, such as cordierite-based glass ceramics, is modified over a range by selective addition of high dielectric constant ceramics, such as titanates, tantalates and carbides and metals, such as copper. The low loss tangent is retained or improved over a range of frequencies, and the low CTE of the glass-ceramic is maintained. BaTiO3, SrTiO3 and Ta2O5 produce the most effective results.Type: GrantFiled: November 2, 2000Date of Patent: August 20, 2002Assignee: International Business Machines CorporationInventors: Benjamin V. Fasano, Robert A. Rita
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Patent number: 6436333Abstract: A method for manufacturing molded articles from a ceramic composite structure, in particular from a combination of tri-silicon tetranitride and a metal silicide, in which gas pressures up to 100 bar are used and the sintering additive content can be reduced to under 10 mass percent. This inert gas sintering pressure method makes possible larger molding free spaces in complicated geometrical structures of the molded articles, in contrast to the known methods. In addition, the electrical properties of this composite structure can be regulated by adjusting a defined nitrogen partial pressure.Type: GrantFiled: September 30, 1999Date of Patent: August 20, 2002Assignee: Robert Bosch GmbHInventors: Guenter Knoll, Gert Lindemann, Friederike Lindner
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Patent number: 6432238Abstract: Disclosed is a method for fabricating a piezoelectric/electrostrictive thick film, using a seeding layer. On a substrate is formed the seeding layer which is prepared from a ceramic sol solution or a ceramic paste, both identical or similar in composition to the piezoelectric/electrostrictive film. The ceramic paste is prepared from a mixture of a ceramic oxide powder, which has a particle size of 5 &mgr;m or less and is prepared from Pb and Ti-based piezoelectric/electrostrictive elements by a non-explosive oxidation-reduction combustion reaction at 100-500° C., and a ceramic sol solution in water or an organic solvent, identical or similar in composition to the ceramic oxide powder. Then, the seeding layer is subjected to an after-treatment. A piezoelectric/electrostrictive film is directly formed on the seeding layer. Alternatively, a piezoelectric/electrostrictive film, separately formed and sintered, is attached on the seeding layer.Type: GrantFiled: June 11, 1999Date of Patent: August 13, 2002Assignee: Samsung Electro-Mechanicals Co., Ltd.Inventors: Sang Kyeong Yun, Dong-Hoon Kim
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Patent number: 6410471Abstract: Disclosed is a method for the preparation of a high-quality sintered body of a rare earth oxide or a composite oxide of a rare earth oxide and an adjuvant oxide such as aluminum oxide. The method comprises shaping a rare earth oxide powder characterized by specified particle diameter distribution values of D50 and D90 and a specified specific surface area or a powder blend of the rare earth oxide and adjuvant oxide into a powder compact and subjecting the powder compact to a sintering heat treatment at a specified sintering temperature by increasing and decreasing the temperature up to and from the sintering temperature each at a rate not exceeding a specified upper limit.Type: GrantFiled: February 15, 2001Date of Patent: June 25, 2002Assignee: Shin-Etsu Chemical Co., Ltd.Inventor: Masami Kaneyoshi
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Publication number: 20020063365Abstract: Methods for lowering processing and raw material costs are disclosed. Specifically, the use of nanostructured powders is disclosed for faster and lower sintering temperatures whereby electrodes currently employing platinum can be substituted with lower melting point metals and alloys.Type: ApplicationFiled: December 3, 2001Publication date: May 30, 2002Inventors: Anthony Vigliotti, Tapesh Yadav, Clayton Kostelecky, Carrie Wyse
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Patent number: 6387295Abstract: An alkali metal-containing niobate-based piezoelectric material composition comprises a solid solution represented by a composition formula (ANbO3) (A: alkali metal), and at least one additive selected from Cu, Li and Ta.Type: GrantFiled: February 23, 2000Date of Patent: May 14, 2002Assignee: Kabushiki Kaisha Toyota Chuo KenkyushoInventor: Yasuyoshi Saito
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Publication number: 20020041061Abstract: A method of production of a dielectric ceramic composition having at least a main component of Ba2TiO3, a second subcomponent including at least one compound selected from SiO2, MO (where M is at least one element selected from Ba, Ca, Sr, and Mg), Li2O, and B2O3, and other subcomponents, comprising the step of: mixing in said main component at least part of other subcomponents except for said second subcomponent to prepare a pre-calcination powder, calcining the pre-calcination powder to prepare a calcined powder, and mixing at least said second subcomponent in said calcined powder to obtain the dielectric ceramic composition having molar ratios of the subcomponents to the main component of predetermined ratios. As the other subcomponents, there is a third subcomponent including at least one compound selected from V2O5, MoO3, and WO3. A ratio of the third subcomponent to 100 moles of the main component is preferably 0.01 to 0.1 mole.Type: ApplicationFiled: August 20, 2001Publication date: April 11, 2002Applicant: TDK CORPORATIONInventors: Takeshi Nomura, Shigeki Sato
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Patent number: 6361735Abstract: The invention relates to a method of forming a composite article comprising the steps of forming a plurality of green ceramic elements, wherein the green ceramic elements are arranged side by side, and the green ceramic elements are spaced from each other by gaps; filling the gaps with a second material; and sintering the green ceramic elements with the second material to form the composite article. The second material, after being sintered, acts as a reflector layer to prevent substantially all light in one of the sintered ceramic elements from reaching an adjacent sintered ceramic element. The step of filling the gaps may be carried out by forming a slurry containing the second material in powder form and immersing the green ceramic elements in the slurry. The process of cosintering the green ceramic elements with the reflector composition provides improved dimensional control during sintering and reduces processing costs.Type: GrantFiled: September 1, 1999Date of Patent: March 26, 2002Assignee: General Electric CompanyInventors: Venkat Subramaniam Venkataramani, Charles David Greskovich, Steven Jude Duclos, James Anthony Brewer
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Patent number: 6309589Abstract: A method is proposed for manufacturing a pin heater that has a substantially internal insulating layer and an external conductive layer, the two layers composed of a ceramic composite structure, wherein before the pin heater is sintered, its shaping is accomplished by way of the ceramic injection molding technique or by cold combined axial/isostatic pressing.Type: GrantFiled: October 12, 2000Date of Patent: October 30, 2001Assignee: Robert Bosch GmbHInventors: Guenter Knoll, Gert Lindemann, Wilfried Aichele, Friederike Lindner, Harry Schlachta
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Publication number: 20010026035Abstract: A ceramic pin heating element having exterior heating conductors and integrated electrical connection surfaces, and method for making same. A first body is injection molded from a first injection-moldable ceramic composite compound having a first electrical resistance, and a second body is injection-molded from a second injection-moldable ceramic composite compound having a second electrical resistance about the first body so as to form a compound body. The compound body is then sintered. The resulting ceramic pin heating element is directly formed without additional steps for protecting (insulating) the element so as to prevent the exterior, complementary heating conductors from contacting the housing and/or terminal bolts. The danger of breakage of the pins at the mounting location and/or at the seal seat through variations in the thickness of contact and/or insulation coatings is minimized.Type: ApplicationFiled: June 5, 2001Publication date: October 4, 2001Inventors: Gert Lindemann, Wilfried Aichele, Friederike Lindner
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Patent number: 6296793Abstract: Composition for preparing water-repellent coatings on optical substrates, comprising a porous, electrically conductive molding and an organosilicon compound, obtainable by mixing an electrically conductive or semiconductive support material with a binder and subjecting the mixture to compression molding to form a compression molding, sintering the compression molding at preferably 1100 to 1500° C. in air to form a porous molding, impregnating the molding with the organosilicon compound, and ageing the impregnated molding by storage in air for at least 3 days.Type: GrantFiled: June 4, 1999Date of Patent: October 2, 2001Assignee: Merck Patent Gesellschaft mitInventors: Uwe Anthes, Reiner Dombrowski
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Patent number: 6274079Abstract: A ceramic pin heating element having exterior heating conductors and integrated electrical connection surfaces, and method for making same. A first body is injection molded from a first injection-moldable ceramic composite compound having a first electrical resistance, and a second body is injection-molded from a second injection-moldable ceramic composite compound having a second electrical resistance about the first body so as to form a compound body. The compound body is then sintered. The resulting ceramic pin heating element is directly formed without additional steps for protecting (insulating) the element so as to prevent the exterior, complementary heating conductors from contacting the housing and/or terminal bolts. The danger of breakage of the pins at the mounting location and/or at the seal seat through variations in the thickness of contact and/or insulation coatings is minimized.Type: GrantFiled: June 23, 1999Date of Patent: August 14, 2001Assignee: Robert Bosch GmbHInventors: Gert Lindemann, Wilfried Aichele, Friederike Lindner
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Patent number: 6270716Abstract: A process for the production of dielectric porcelain composition includes: a first step of admixing Bi2O3 and CuO with a BaO—TiO2—ReO{fraction (3/2)} main material, wherein Re is a lanthanoid element, to give a material mixture; a second step of calcining the material mixture at a temperature of 950° C. or higher; a third step of milling the calcined material mixture to a mean particle diameter of about 2.0 &mgr;m or less; a fourth step of admixing a B2O3—SiO2 glass component and CuO with the milled material mixture to give a material for a dielectric porcelain composition; and a fifth step of forming the material into a target shape and firing the shaped material at a temperature of 1000° C. or lower. The obtained dielectric porcelain composition is sinterable at low temperatures and has a high specific dielectric constant and Q-value and a satisfactory thermostability.Type: GrantFiled: November 30, 1999Date of Patent: August 7, 2001Assignee: Murata Manufacturing Co., Ltd.Inventor: Yasutaka Sugimoto
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Publication number: 20010009314Abstract: This invention describes a method of rapidly monitoring the temperature of a medium and a method of preparing a quantum confined device that can enable such measurements. The monitoring principle uses changes in impedance of nanostructured devices, i.e. devices in which one or more materials have the domain size precision engineered to less than 500 nanometers, preferably to dimensions less than the domain sizes where quantum confinement effects become significant and modify the electrical or thermal properties of the materials. The invention can be used to monitor absolute values of and changes in temperature of gases, inorganic and organic liquids, solids, suspensions, and mixtures of one or more of the said phases. The invention can be used to monitor radiation, power, heat and mass flow, charge and momentum flow, and phase transformation.Type: ApplicationFiled: February 17, 1998Publication date: July 26, 2001Inventors: ANTHONY VIGLIOTTI, TAPESH YADAV, CLAYTON KOSTELECKY, CARRIE WYSE
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Patent number: 6248262Abstract: Carbon fiber-filled, thermoplastic resin compositions having improved electrical properties at a given level of carbon fibers are formed from thermoplastic resin and carbon fibers associated into bundles with a binder. The thermoplastic resin and the binder are selected to be incompatible such that the adhesion of the fiber to the resin is poor. An exemplary composition is formed from a thermoplastic polymer selected from among polystyrene, high impact polystyrene, polycarbonate, polybutylene terephthalate, polyethylene terephthalate, polyphenylene ether, polyether imide and blends thereof; and carbon fibers associated into bundles with a polyamide terpolymer binder. The bundles are dispersed within the thermoplastic polymer. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include electronic devices, dust handling equipment and notebook computer enclosures.Type: GrantFiled: February 3, 2000Date of Patent: June 19, 2001Assignee: General Electric CompanyInventors: Kazunao Kubotera, Nirajkumar Patel
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Patent number: 6231788Abstract: Carbon fiber-filled PC-ABS resin compositions which have improved electrical properties at a given level of carbon fibers, and which do not suffer from as significant a decrease in impact strength as would result from the introduction of generic carbon fibers are achieved using carbon fibers treated with a polyamide terpolymer binder. The bundles are dispersed within the PC-ABS blend. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include, but are not limited to electronic devices, dust handling equipment and notebook computer enclosures.Type: GrantFiled: February 3, 2000Date of Patent: May 15, 2001Assignee: General Electric CompanyInventor: Nirajkumar Patel
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Patent number: 6224703Abstract: A method of making a laminate ceramic substrate with domed pads is provided. In the method, a ceramic green sheet is prepared which has a pair of first and second opposite main surfaces and a plurality of through holes extending between the first and second main surfaces. The ceramic green sheet is placed upon a flat elastic sheet in such a manner that the first main surface of the ceramic green sheet is in contact with the flat elastic sheet. Metallizing ink is filled into the through hole so that a portion of the ink protrudes beyond the first main surface to form domed protruded portions by elastic deformation of the elastic sheet. The green sheet (optionally placed upon at least one other green sheet in such a manner that the second main surface is in contact with the other green sheet) is then sintered, thereby forming the domed, protruded portions of the metallizing ink into domed pads.Type: GrantFiled: January 7, 1999Date of Patent: May 1, 2001Assignee: NGK Spark Plug Co., Ltd.Inventors: Kozo Yamasaki, Hideshi Matsubara, Kazuo Kimura, Motohiko Itai
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Patent number: 6197246Abstract: A plasma generating electrode device including a substrate 31 made of a dense ceramic, and an electrode 55 buried in said substrate 31, wherein said electrode 55 is isolated from a setting face of said substrate 31, and plasma is generated over said substrate. It is preferable that the minimum thickness of an electromagnetic wave permeation layer 37 is not less than 0.1 mm, the average thickness of the electromagnetic wave permeation layer is not less than 0.5 mm, the electrode 55 is a planar electrode made of a metal bulk, and the electrode is a monolithic sinter free from a joint face. This structure can be applied to an electric dust collector, an electromagnetic shield device or an electrostatic chuck. These can be preferably installed inside a semiconductor production unit using a halogen-based corrosive gas.Type: GrantFiled: March 2, 2000Date of Patent: March 6, 2001Assignee: NGK Insulators, Ltd.Inventors: Yusuke Niori, Koichi Umemoto, Ryusuke Ushikoshi
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Patent number: 6191075Abstract: A method of preparing a high temperature superconductor. A method of preparing a superconductor includes providing a powdered high temperature superconductor and a nanophase paramagnetic material. These components are combined to form a solid compacted mass with the paramagnetic material disposed on the grain boundaries of the polycrystaline high temperature superconductor.Type: GrantFiled: December 21, 1993Date of Patent: February 20, 2001Assignee: University of ChicagoInventors: Uthamalingam Balachandran, Richard W. Siegel, Thomas R. Askew
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Patent number: 6165927Abstract: A dielectric material based on BaO-RE.sub.2 O.sub.3 -TiO.sub.2 is disclosed, which has a relatively high relative permittivity .epsilon..sub.r, a small absolute value of the temperature coefficient of resonance frequency .tau..sub.f and a high coefficient of unloaded quality Q.sub.u. Processes for producing the dielectric material are also disclosed. The dielectric material comprises 100 parts by weight of main ingredients having a composition represented by xBaO-yRE.sub.2 O.sub.3 -zTiO.sub.2 (wherein RE represents a rare earth element and x+y+z=100) and up to 5 parts by weight of at least one alkali metal oxide. This alkali metal oxide serves to improve .epsilon..sub.r and Q.sub.u without a considerable sacrifice of .tau..sub.f. The RE preferably consists of samarium or a combination of samarium with neodymium and/or lanthanum.Type: GrantFiled: April 24, 1998Date of Patent: December 26, 2000Assignee: NGK Spark Plug Co., Ltd.Inventors: Motohiko Sato, Hitoshi Yokoi, Kazushige Ohbayashi
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Patent number: 6143238Abstract: Ceramic raw powder containing conductive ceramic powder is mixed with a prescribed quantity of a molding assistant containing carbon component. This mixture is molded into a prescribed shape of a resistive heating element to thereby produce a heating element mold. A composite mold is prepared by embedding the heating element mold into molds of a ceramic substrate. The composite mold is sintered at a sintering temperature of 1700.degree. C. or higher. During a process of rising temperature to the sintering temperature, the composite mold is kept in an oxygen containing atmosphere having an oxygen partial pressure of 2.times.10.sup.-4 to 1.0 Torr for 7 minutes or longer at a temperature of 1200.degree. C. or higher.Type: GrantFiled: January 29, 1999Date of Patent: November 7, 2000Assignee: NGK Spark Plug Co., Ltd.Inventors: Masahiro Konishi, Shindo Watanabe
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Patent number: 6129886Abstract: The object of the present invention is to realize the piezoelectric ceramics which, even when used as high frequency elements utilizing third harmonics wave of thickness longitudinal vibration, are small in temperature coefficient of resonant frequency and high in mechanical Q value and easy to correspond to the trend toward miniaturization and low voltage driving. When the piezoelectric ceramics with lead titanate as its main component are manufactured in order to achieve this object, it was decided that the piezoelectric ceramics be manufactured by the manufacturing method, wherein a heat treatment is performed between a firing process and a polarization process in the atmosphere of oxygen partial pressure less than the oxygen partial pressure of the atmospheric pressure at temperatures more than 500.degree. C. and not more than the firing temperatures.Type: GrantFiled: March 27, 1998Date of Patent: October 10, 2000Assignee: TDK CorporationInventors: Kazushi Tachimoto, Mahoko Takada, Kenji Horino, Kazuo Miyabe, Hitoshi Oka
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Patent number: 6107227Abstract: A high purity dielectric ceramic composition is disclosed. This composition provides improved electrical properties in the form of ultra-high electrical Q, a low (T.sub.f) property and a high dielectric constant (K). This composition is also amenable to large scale manufacturing processes and operations. The composition provides a multi-oxide dielectric with BaO--Nd.sub.2 O--Sm.sub.2 O.sub.3 --TiO.sub.2 --La.sub.2 O.sub.3 Bi.sub.2 O.sub.3 and ZnO as constituents. The composition materials effectively provide these desirable properties in a custom composition of various oxide materials advantageously including samarium oxide (Sm.sub.2 O.sub.3).Type: GrantFiled: August 3, 1998Date of Patent: August 22, 2000Assignee: CTS CorporationInventors: Jeffrey Jacquin, Dean A. Anderson, Randy Rose
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Patent number: 6093667Abstract: The present invention provides novel ceramic materials with excellent electrostrictive property, and the present invention relates to electrostrictive ceramics consisting of solid solution ceramics which can be obtained by combining about 30 molar % of primitive perovskite-type compound PbTiO.sub.3 with a composite perovskite compound Pb(Ni.sub.1/3 Nb.sub.2/3)O.sub.3.Type: GrantFiled: February 11, 1999Date of Patent: July 25, 2000Assignee: Agency of Industrial Science and TechnologyInventors: Keiji Kusumoto, Tadashi Sekiya
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Patent number: 6080703Abstract: A method for producing a high temperature superconductor system having the composition TlBiBaCaCuO. The system exhibits a T.sub.c of at least 116 K. The method includes the steps of mixing compounds including Tl, Bi, Ba, Ca, Cu, and O to create a mixture. The mixture is heated. The mixture is then cooled.Type: GrantFiled: November 13, 1998Date of Patent: June 27, 2000Assignee: University Technology CorporationInventors: Allen M. Hermann, Veeraraghavan Badri
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Patent number: 6051534Abstract: A process for producing the 2223 phase of (Pb,Bi)SrCaCuO that is much faster than existing processes has the steps of: calcining a precursor powder mixture while maintaining intimate mixing of this precursor mixture by intermediate grindings during calcination; compressing the calcination product into a consolidated body; and heating the calcination product while maintaining intimate mixing of the calcination product, to form essentially phase pure 2223 (Pb,Bi)SrCaCu). A fast process for making a (Pb,Bi)SrCaCuO part with a high J.sub.c has the steps of: pressing calcined and reacted (Pb,Bi)SrCaCuO powder into a green body having the shaped of the part; and sintering the green body for a selected time, most preferably between 6 and 8 hours, that is long enough to establish superconducting electrical contact between grains of (Pb,Bi)SrCaCuO but short enough to prevent void formation or part shape distortion. The part made by this process has a high density, at least about 4 or 5 g/cm.sup.3.Type: GrantFiled: April 21, 1993Date of Patent: April 18, 2000Assignee: The United States of America as represented by the Secretary of the NavyInventors: Roy Rayne, Louis E. Toth, Barry A. Bender, Steven H. Lawrence
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Patent number: 6017485Abstract: A controlled dielectric loss, sintered aluminum nitride body having a density of greater than about 95% theoretical, a thermal conductivity of greater than about 100 W/m-K, and a dissipation factor measured at room temperature at about 1 KHz selected from:(a) less than or equal to about 0.001; and(b) greater than or equal to about 0.01.A process for producing a controlled dielectric loss, sintered aluminum nitride body, comprising heat treating an aluminum nitride body at sintering temperatures, including providing a heat treatment atmosphere which effects a selected nitrogen vacancy population in the aluminum nitride body at the sintering temperatures, and cooling the aluminum nitride body from sintering temperatures at a controlled rate and in a cooling atmosphere effective to control the selected nitrogen vacancy population.Type: GrantFiled: March 28, 1996Date of Patent: January 25, 2000Assignee: Carborundum CorporationInventors: Rudolph C. Enck, Jonathan H. Harris, Robert A. Youngman, Thomas S. Nemecek
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Patent number: 6004503Abstract: A method of making a ceramic arc tube for a metal halide lamp comprises the steps of forming as an integral unit a hollow body having one open end and a substantially closed end. The substantially closed end includes an outwardly extending capillary tube having an electrode receiving aperture therein that communicates with the hollow body. An end cap is then formed for closing the open end. The end cap comprises an annular portion and an extending capillary tube, The end cap is fitted into the open end of the hollow body to form a pre-assembly. The pre-assembly is then fired to seal the end cap to the hollow body to form an assembly and the assembly is subsequently fired to sinter the same.Type: GrantFiled: October 2, 1998Date of Patent: December 21, 1999Assignee: Osram Sylvania Inc.Inventor: Jeffrey T. Neil
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Patent number: 6004644Abstract: A zirconia diaphragm structure, and a method of producing such structure in which the zirconia diaphragm structure includes a zirconia substrate having at least one window, and a zirconia diaphragm plate formed integrally with the zirconia substrate so as to close each window, the zirconia substrate comprising a zirconia material as a major component, and containing 0.1-3.0% by weight of alumina, 0.1-3.0% by weight of silica, 0.1-5.0% by weight of alumina and silica, 0.1-5.0% by weight of alumina and magnesia, or 0.1-5.0% by weight of alumina, silica and magnesia.Type: GrantFiled: August 16, 1996Date of Patent: December 21, 1999Assignee: NGK Insulators, Ltd.Inventors: Yukihisa Takeuchi, Hideo Masumori, Katsuyuki Takeuchi, Tsutomu Nanataki
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Patent number: 6004500Abstract: A process for making ceramic composites includes the steps of: a) forming a polymer composition into a three-dimensional mold; b) filling said three-dimensional mold with one or more ceramic containing compositions; c) heating said filled mold to dry and sinter the ceramic; d) removing at least a portion of said three-dimensional mold thereby forming voids; and e) filling the voids with a second composition which has a piezoelectric coefficient which is substantially different from the piezoelectric coefficient of said ceramic structure. Steps a through e yield a controlled, non-random piezoelectric ceramic composite having 2-3, 3-2 or 3--3 connectivity with respect to the sintered ceramic and the second composition throughout the composite.Type: GrantFiled: May 19, 1998Date of Patent: December 21, 1999Assignee: Rutgers, The State University of New JerseyInventors: Ahmad Safari, Victor F. Janas, Amit Bandyopadhyay, Rajesh K. Panda, Mukesh Agarwala, Stephen C. Danforth
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Patent number: 6001777Abstract: A method of forming a textured superconductor wire includes constraining an elongated superconductor precursor between two constraining elongated members placed in contact therewith on opposite sides of the superconductor precursor, and passing the superconductor precursor with the two constraining members through flat rolls to form the textured superconductor wire. The method includes selecting desired cross-sectional shape and size constraining members to control the width of the formed superconductor wire. A textured superconductor wire formed by the method of the invention has regular-shaped, curved sides and is free of flashing. A rolling assembly for single-pass rolling of the elongated precursor superconductor includes two rolls, two constraining members, and a fixture for feeding the precursor superconductor and the constraining members between the rolls.Type: GrantFiled: July 29, 1997Date of Patent: December 14, 1999Assignee: American Superconductor Corp.Inventors: Kenneth L. DeMoranville, Qi Li, Peter D. Antaya, Craig J. Christopherson, Gilbert N. Riley, Jr., Jeffrey M. Seuntjens
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Patent number: 5997800Abstract: A method of manufacturing a ceramic multilayer component, comprising electrically conductive and electrically insulating layers which are stacked in alternate arrangement in a multilayer structure, which method comprises the following steps:providing three extrudable polymeric mixtures, each mixture comprising a binder and a particulate filler, whereby:(a) a first mixture comprises a ceramic filler;(b) a second mixture comprises a metallic filler and a first binder;(c) the third mixture comprises a metallic filler and a second binder;with the aid of an extrusion device having an extrusion channel which is provided with a layer-multiplication element, manufacturing an extruded multilayer stack comprising a plurality of the basic units abac, in which layers a,b,c correspond respectively to the first, second and third mixtures, the stack having two oppositely situated side walls along which part of each layer is exposed;with the aid of a first solvent, dissolving away part of each layer b exposed along a first sType: GrantFiled: October 26, 1998Date of Patent: December 7, 1999Assignee: U.S. Philips CorporationInventors: Reinhold Wimberger Friedl, Peter P. Koets, Johan G. De Bruin
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Patent number: 5985067Abstract: The invention provides spacers for separating and supporting a faceplate structure and a backplate structure in a flat panel display, and methods for fabricating these spacers. Each spacer is typically made of ceramic, such as alumina, containing transition metal oxide, such as titania, chromia or iron oxide. Each spacer can be fabricated with an electrically insulating core and electrically resistive skins. The insulating core can be a wafer formed of ceramic such as alumina, and the resistive skins can be formed by laminating electrically resistive wafers, formed from alumina containing transition metal oxide, to the outside surfaces of the insulating core. Each spacer can also have a core of electrically insulating ceramic composition made of a ceramic containing a transition metal oxide in its higher oxide states, and electrically resistive outside surfaces made of a ceramic containing a transition metal oxide in lower oxide states.Type: GrantFiled: October 31, 1997Date of Patent: November 16, 1999Assignee: Candescent Technologies CorporationInventors: Anthony P. Schmid, Christopher J. Spindt, David L. Morris, Theodore S. Fahlen, Yu Nan Sun
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Patent number: 5981445Abstract: The new preparation process for making fine high specific surface ceramic powders suitable as catalysts or precursors for ceramics uses lanthanum (or other rare earth lanthanide) oxide as one of the precursors. The oxide is mixed with water to form a liquid slurry, whereby it is transformed to the hydroxide by reaction with water. The resulting hydroxide slurry, which can be milled to reduce the particle size and to speed up the reaction, is then combined, while stirring vigorously to assure homogenous mixing, with a solution of required amount of remaining metal nitrate precursors, for example strontium and cobalt nitrates. The reaction between lanthanum hydroxide and transition metal nitrates produces a colored (color depending on the transition metal) slurry consisting of metal hydroxides suspended in aqueous nitrate solution with pH>2. This perovskite precursor slurry is spray-frozen and freeze dried.Type: GrantFiled: June 17, 1996Date of Patent: November 9, 1999Assignee: Corporation de I'Ecole PolytechniqueInventors: Jitka Kirchnerova, Danilo Klvana
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Patent number: 5980815Abstract: An indium oxide-tin oxide (ITO) sintered body is prepared by mixing a tin oxide powder with an indium oxide powder, molding the resulting mixed powder to obtain a green body, and sintering the resulting green body. At least the tin oxide powder has beforehand been pulverized by colliding tin oxide particles with each other or against a collision substance in gas streams. At least 90 wt % of the pulverized tin oxide powder is preferably particles having a particle size of 0.2-10 .mu.m. A jet mill can be used for the pulverization. The ITO sintered body has a density as high as 7.08 g/cm.sup.3 or more and, during sputtering, is free from nodule formation and is inhibited from generating particles.Type: GrantFiled: December 11, 1997Date of Patent: November 9, 1999Assignee: Tosoh CorporationInventors: Osamu Matsunaga, Yuichi Nagasaki, Tsutomu Takahata
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Patent number: 5919325Abstract: A process for producing a ceramic multilayer substrate, particularly an LTCC substrate, in which printed circuit traces and plated contactings are produced in a printing process on a plurality of green ceramic foils using a conductive paste which contains a wax as a printing carrier and is free of highly volatile solvents, and the green ceramic foils subsequently being arranged in a stack one upon the other and fired. The otherwise customary, time-consuming drying of the green ceramic foils for the vaporization of the utilized solvent is eliminated. The foils can be stacked and fired immediately after the printing of the printed circuit traces and plated contactings. Furthermore, shrinkage of the printed circuit traces and the green ceramic foils before the firing is avoided, thereby decisively improving the precision of the produced ceramic multilayer substrates.Type: GrantFiled: December 11, 1997Date of Patent: July 6, 1999Assignee: Robert Bosch GmbHInventors: Ulrich Goebel, Walter Roethlingshoefer
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Patent number: 5909083Abstract: A process for producing a plasma display panel, involving the formation of a predetermined pattern for a plasma display panel, including an electrode pattern and a barrier for defining a discharge space, said process comprising the steps of:forming a predetermined pattern-forming material layer on a substrate;forming a mask pattern, comprising a main component of the material layer, on the pattern-forming material layer:etching the pattern-forming material layer with the mask pattern formed thereon, thereby patterning the pattern-forming material layer; andthen firing the pattern-forming material layer with the mask pattern provided thereon and the mask layer, thereby integrating the pattern-forming material layer and at least part of the mask layer with each other.Type: GrantFiled: February 18, 1997Date of Patent: June 1, 1999Assignee: Dai Nippon Printing Co., Ltd.Inventors: Masaaki Asano, Satoru Kuramochi, Yozo Kosaka
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Patent number: 5888446Abstract: Disclosed is a method of forming an aluminum nitride article. The method includes the steps of adding platinum to a composition including a binder, aluminum nitride particles and a sintering aid; forming the composition into an article; placing the article in a substantially non-carbonaceous container; and sintering the article in a reducing atmosphere to cause removal of the binder and densification of the aluminum nitride article, wherein the platinum catalyzes the removal of the binder.Type: GrantFiled: January 15, 1998Date of Patent: March 30, 1999Assignees: International Business Machines Corporation, Crystalline Materials CorporationInventors: Jon A. Casey, Jonathan H. Harris, Lester Wynn Herron, Irvin Huseby, Richard A. Shelleman, Subhash L. Shinde, Robert A. Youngman