Abstract: A clamping ring design that eliminates the Wafer sticking problem. In the first embodiment of the present invention the wafer clamp ring is redesigned to sharply reduce the wafer to wafer-ring contact area. In the second embodiment of the present invention a clamp ring guide is added to prolong the lifetime of the clamp ring.

Abstract: A solder clamp having a common base and first and second clamp levers or jaws that are capable of independent operation. Positioning slots are preferably provided in the common base and the first and second clamp levers to properly align two wires or similar articles to be joined. The common base and clamp levers are formed of a durable plastic or similar lightweight, durable and inexpensive material. Torsion, coil or flat springs or similar mechanisms are provided to bias the first and second clamp lever towards the common base.

Abstract: A compact portable vise of the type designed to hold a fishing hook while a fly-like lure is formed, using methods known as "fly-tying," on the hook for use in the sport of fly fishing. The vise is particularly small to be shirt-pocket portable and alternatively may be supported by a clamp directly engaging a support or by a vise clamp that is mounted with screws on a railing, a gunwale, a board, or a tree, either fallen or erect. The vise head is connected to such support by an articulated arm that engages the support. The arm includes at least one pivot link that permits it to be bent about a first axis and a second pivot link connecting the vise head that permits the head to pivot on an axis perpendicular to said first axis and close to and parallel to the longitudinal axis of the head. These two pivot links permit easy and flexible manipulation of the vise head for viewing the work piece from a myriad of angles. The articulated arm bends to wrap around the clamp for compact storage.

Abstract: A mounting clamp for holding together metal sheets and a tool for removing the clamp. The clamp has two legs that define a clamping gap that terminates in a bore hole. The free ends of the legs are provided with bevels with an insertion angle of 20.degree. to 40.degree. relative to the clamping gap. The insertion opening has a width that is slightly larger than the width of the widest stack of sheets to be held by the clamp. The clamping gap has a height that is at least three-times the width of the clamping gap. The diameter of the bore hole is at least one-and-one-half times greater than the width of the clamping gap. The removal tool has an insertion pin arranged at one end of a handle part and can be introduced into the bore hole of the clamp with slight play. The insertion pin is provided with a slit that runs in the longitudinal direction of the handle part.

Abstract: Apparatus and method for retaining a laser bar during a facet coating operation and releasing the laser bar subsequent to the operation. The apparatus includes a pair of opposing spacers that hold the laser bar when compressed, each spacer including a compliant spring on an inner portion thereof. A compression device applies a force to the spacers sufficient to compress the springs against opposite sides of the laser bar to thereby retain the laser bar during the facet coating operation. Subsequent to the facet coating operation, the compressive force is released to decompress the springs and thereby release the laser bar. Due to the spring action, the laser bar is released without substantially adhering to either one of the spacers.

Abstract: An apparatus for accurately positioning and retaining at least one component, comprising a substantially rigid frame comprising a side having at least one opening therein that is larger in size than the component, a layer of compliant material attached to the side of the frame and having at least one opening therein, the frame opening and the layer opening cooperating to define a component receiving opening sized for receiving the component, said component receiving opening having an inner sidewall having at least a portion thereof consisting of compliant material, the compliant material being in substantially uniform contact with the side of the frame.

Abstract: An apparatus for accurately positioning and retaining at least one component, comprising a substantially rigid frame comprising a side having at least one opening therein that is larger in size than the component, a layer of compliant material attached to the side of the frame and having at least one opening therein, the frame opening and the layer opening cooperating to define a component receiving opening sized for receiving the component, said component receiving opening having an inner sidewall having at least a portion thereof consisting of compliant material, the compliant material being in substantially uniform contact with the side of the frame.

Abstract: A device for fixing an object to the edge of a flat support, the support having a top face on which the object is to be fixed and a lower face. A vertical section piece, positionable close to the edge of the support, is perpendicular to the plane of the support. The upper end of the section piece has an element which engages and holds the object on the top face of the support, e.g. rods projecting into a cavity in the object. An arm extending perpendicular to the section piece supports at one end thereof a cam for being selectively moved to press against and released from pressing against the lower face of the support. The section piece passes through an opening in the arm and the arm with the cam thereon is tiltable with reference to the section piece for locking the arm along the section piece. A lever then rotates the cam to press against the lower face of the support.

Abstract: An installation tool, fastener, and method for installing the fastener are disclosed. The installation tool has control fingers which control the position of the fastener with respect to the plunger and workpiece to which the fastener is to be attached during the entire travel of the fastener from the entry into the installation tool to installation in the workpiece. The fingers are pivotally mounted to the plunger and travel with the plunger throughout the installation path. The fingers are adapted to engage the fastener in a displaced area on the fastener so that the fingers can control the fastener through installation of the fastener into the workpiece. The displaced area is positioned between the top and bottom of the fastener so that the fingers can maintain control throughout installation.

Abstract: A device and method for folding a hackle feather for fly tying purposes. The invention is designed to facilitate folding of the barbs of a feather in a uniform direction from the quill so that the feather may be used for fabricating artificial flies for fishing. The invention provides for a pair of flexible resilient members with pliant corresponding concave faces. One member is slightly larger than the other. The resilient members are held together at their base and the concavity of each member forces them together at their extended ends. The smaller of the two resilient members has a tapered edge which forms a notch between the outward end portions of the members. The feather to be folded is maneuvered into the notch, and inserted between the pliant faces of the two members. The concave faces then are pressed together, folding the feather.

Abstract: A retaining tool for grasping ends of a broken wire in a wire bundle and maintaining them in fixed relationship, including a thin generally U-shaped body with legs having alligator clips at each end thereof. Spurs are formed along each leg, each spur depending generally perpendicularly from a leg. An optional handle may be formed on the body to extend therefrom. The body may be coated with an electrical insulator or portions thereof may be enclosed by a non-conductive sleeve.

Abstract: A mounting clamp for holding together metal sheets and a tool for removing the clamp. The clamp has two legs that define a clamping gap that terminates in a bore hole. The free ends of the legs are provided with bevels with an insertion angle of 20.degree. to 40.degree. relative to the clamping gap. The insertion opening has a width that is slightly larger than the width of the widest stack of sheets to be held by the clamp. The clamping gap has a height that is at least three-times the width of the clamping gap. The diameter of the bore hole is at least one-and-one-half times greater than the width of the clamping gap. The removal tool has an insertion pin arranged at one end of a handle part and can be introduced into the bore hole of the clamp with slight play. The insertion pin is provided with a slit that runs in the longitudinal direction of the handle part.

Abstract: A wire clamper for a bonding apparatus includes a pair of clamper arms having tip portions, respectively. The tip portions clamp or release a wire therebetween when at least one of the clamper arms is operated. The wire clamper further includes a giant-magnetostrictive actuator having a giant-magnetostrictive alloy and a coil wound around the giant-magnetostrictive alloy for generating a magnetic field. The giant-magnetostrictive alloy is displaced according to the magnetic field generated by the coil so as to operate at least one of the clamper arms.

Abstract: Spring-tension pliers are disclosed having two clamping arms (2, 3) mounted see-saw fashion on a pivot pin (1), the arms forming a handle (4) with their legs, the legs being pivotable toward one another against the force of a spring (5) to open a clamping mouth formed by the other ends of the legs (6), with clamping jaws (7) being associated with the free ends of the clamping legs (6). The clamping jaws (7) are pivotable around a pivot axis (8') parallel to the pivot joint axis, end sections (9) of the clamping legs are rounded concentrically with respect to jaw pivot axis (8'), and these rounded areas (11) each fit into a correspondingly rounded recess (10) of the clamping jaws.

Abstract: A metallic tray unit for testing a semiconductor device is disclosed including: a unit body on the bottom having a cavity in which a semiconductor device for testing is placed; and fixing equipment for holding the semiconductor device in the cavity when the semiconductor device is moved to the lower part of the unit body. The unit body has rectangular openings, one of which is opened in the direction of the upper part of the cavity and another which is opened toward the cavity. The fixing equipment includes plate springs that are installed on side walls of the openings in parallel thereto. The plate springs are opened as the device is inserted into the cavity, and then are returned to their former condition after insertion of the device thereto, whereby their ends exposed to the cavity catch the device.

Abstract: A three-way spring clamp is provided that is useable as an edge clamp for applying clamping forces to workpieces in three directions. The clamp includes two lever arms, each having a jaw end and a handle end. The lever arms are pivotally connected to each other at a pivot point located between the jaw ends and the handle ends such that the lever arms can be moved between a closed gripping position in which the jaw ends are proximate to each other, and an opened position in which the jaw ends are spaced apart. A coil spring is provided for biasing the lever arms toward the closed gripping position. A spring engagement member is mounted between the lever arms. The engagement member includes a central body portion engageable with a surface of an article to be clamped. The body portion is positioned between the pivot point and the jaw ends and may have a generally concave configuration from the perspective of the pivot point when the lever arms are in the closed gripping position.

Abstract: Semiconductor wafer clamp device includes at least one clamp apparatus, the clamp apparatus including a removable clamp finger coupled to a connecting block by a connector. The device allows access to clamp apparatus from a top surface of a substrate holder, eliminating the need to remove the substrate holder in order to perform maintenance or repair operations on clamp apparatus. Tempered springs in the clamp apparatus reduce resilience losses experienced with non-tempered springs. Plastic clamp shaft bushings and spring retainers extend the useful life of clamp apparatus components by eliminating wear caused by metal-to-metal contact of moving parts.

Abstract: A motorized case trimmer is disclosed having a lever operated case holder and a motor driven trimming blade. The motor and blade are slidably mounted upon rails for quick and easy movement to provide sufficient clearance for loading a case into the case holder. A motor handle further simplifies the movement of the blade and motor whereby a simple one-step motion of the handle moves the blade and motor and locks them into a retracted position. Releasing the motor handle, permits the motor and blade to slide freely along the rails under urging by a pair of springs. The components of the case trimmer are mounted upon an elongate platform that permits adjustability of the position of the components for accommodating various size cases and for adjusting the cutting force of the blade against the cartridge case.

Abstract: A pneumatically actuated clamp and gripped including a clamp arm supported for movement about a pivot, the clamp arm including a workpiece engaging portion spaced from the pivot and a driving member that is reciprocally moveable between a retracted position and a clamping position. The clamp further includes a link connected to the driving member and connected to the clamp arm in spaced relation from the pivot so that movement of the driving member from the retracted position toward the clamping position causes movement of the workpiece engaging portion of the clamp arm toward the workpiece, the link including a spring portion, the spring portion limiting the clamp force applied by the clamp arm to the workpiece.

Abstract: A clip assembly for retaining a semiconductor wafer on a pedestal during processing of the wafer, and releasing the wafer for removal from the pedestal after processing, includes a pair of tines each having a lower sloping surface for contacting an edge of an associated semiconductor wafer, and a ledge provided immediately above the lower sloping surface inward from a shared leading edge serves to catch debris or particulate material, preventing it from falling onto the surface of the semiconductor wafer. A metal spring, biasing the clip head into contact with the wafer, has an upper portion molded into the electrically non-conductive material of the clip head behind a front face thereof, whereby the spring and clip head form a monolithic assembly.

Abstract: A clamping mechanism is provided for securing a workpiece proximate a power tool on a work surface of the type having a support surface defined thereon and extending generally orthogonal thereto. The clamping mechanism applies a force to the workpiece to secure the workpiece between the clamping mechanism and the support surface. The force applied to the workpiece has a component directed substantially perpendicular to the support surface, and an additional component which is directed substantially parallel to the support surface in a direction away from the power tool to resist pulling forces which are applied by the power tool to the workpiece. Further, in a preferred embodiment of the invention, the clamping mechanism is oriented proximate a work head of the power tool without entering an effective work area of the power tool.

Abstract: A body tube is plugged at one end so as to receive hair and stack the hair against that end. Two gathering slides have tapered holes and move opposite each other crosswise of the body tube to gather the hair. A clamp tube lies against the body tube and holds clamp jaws away from the hair until the clamp tube is withdrawn. Hair is quickly stacked and clamped for use in tying fishing flies.

Abstract: The jeweler's saw vise is for holding a relatively thin workpiece to permit a jeweler to use a saw to cut the workpiece firmly held by the vise. The vise comprises a pair of elongated upper and lower jaws having a front surface and a rear surface. The upper jaw is superimposed over the lower jaw which has a length longer than the upper jaw. The rear portion of the lower jaw forms a mounting tab for attaching the vise to a support. A biasing spring is interposed between the jaws to resiliently bias the jaws to a closed position. The jaws at the front surface are provided with a V-notch, with the widest part of the notch being located in the front surface to form an entrance to a V-notch provided in the jaws of the vise where the cutting of the material or workpiece occurs.

Abstract: Four non-magnetic substrate members are coupled in parallel with each other by a pair of guide plates, and a plurality of receiving grooves, which can slidably receive strip portions of lead frames, are formed in the upper surface of each substrate member in parallel with each other. Permanent magnets for attracting the lead frames are fixed in proximity to bottoms of the receiving grooves. Lead frames, to which electronic component elements are mounted, can be easily inserted into and taken out from the receiving grooves by simply sidewardly slid into and from the receiving grooves, and the lead frames inserted in the receiving grooves are stably held by the permanent magnets due to magnetic force.

Abstract: A wafer clamping member for clamping a wafer in a plasma reaction chamber. The clamping member has a design which minimizes particle contamination of the wafer and allows more wafers to be processed before it is necessary to clean built-up deposits from the clamping member. The clamping member includes a clamping portion which clamps an outer periphery of the wafer against a bottom electrode and a shadow portion which provides a gap between an inner edge of the clamping member and the upper surface of the wafer. The gap is open to the interior of the plasma reaction chamber and preferably has a height equal to about a mean free path of a gas activated to form a plasma in the plasma reaction chamber.

Abstract: An apparatus for releasably clamping a substrate to a support platform, or other support system, at a face of the substrate is described. In one embodiment, a retractable clamp holds a substrate near its edges on a support platform when the clamp is in its fully extended position. One or more leaf springs are mounted to the clamp and apply force to the substrate at respective points in the event the substrate adheres to the clamp, thereby releasing the substrate from the clamp. In a preferred embodiment of the present invention, one or more activators are positioned in cooperative relationship to the leaf springs to cause the leaf springs to retract into recesses in the clamp when the clamp is extended against the substrate. In their retracted position, the leaf springs do not contact the substrate so as to minimize the generation of particle contamination and the chance of the release leaf springs themselves adhering to the substrate.

Abstract: A clamp device for securing a bending press punch on its punch holder, the clamp device being capable of securing punches having a straight, or flat, contacting surface and those having a groove on the contacting surface. The clamp device comprises a plurality of spring members each secured about a bolt; an upper punch clamp plate member having a punch contacting surface; and a lower flanged punch clamp plate member having a punch contacting surface. The spring members provide the force necessary to return the upper punch clamp plate member to a position wherein a portion thereof is within the groove when the grooved punch is used. When the flat surface punch is utilized, the punch contacting surface portion of the lower punch clamp plate member and the punch contacting surface of the upper punch clamp plate member are positioned against the contacting surface of the punch thus providing solid surface contact when either punch design is utilized.

Abstract: A clip assembly for retaining a semiconductor wafer on a pedestal during processing of the wafer, and releasing the wafer for removal from the pedestal after processing, includes a pair of tines each having a lower sloping surface for contacting an edge of an associated semiconductor wafer, and a ledge provided immediately above the lower sloping surface inward from a shared leading edge serves to catch debris or particulate material, preventing it from falling onto the surface of the semiconductor wafer. A metal spring, biasing the clip head into contact with the wafer, has an upper portion affixed to a front face of the clip head via an electrically nonconductive rectangularly shaped retainer for substantially reducing voltage arcing between the highly electrically charged plasma used in processing a semiconductor wafer and the clip head.

Abstract: A compound clamp ring secures a semiconductor wafer having a wafer flat portion to a wafer pedestal during wafer processing while maintaining a continuous seal between the wafer edges and the wafer pedestal to prevent leakage of coolant gases circulated at the backside of the wafer into the process environment. The clamp ring has an annular wafer clamp surface adapted to press a round portion of the wafer into sealing abutment with the wafer pedestal. A cavity formed in the clamp ring securely receives a comb-like array of resilient flexures that are adapted to apply a yieldable bias to the flat portion of the wafer to complete the seal between the wafer and the pedestal at the flat portion of the wafer; and encloses the flexures to shield the flexures from process gases.

Abstract: A holder and carrier for a plurality of holders is constructed to engage the band-like edge of a thin disk-shaped workpiece. The holder comprises a plurality of spring bars which are connected at corners to form a polygon which engages the outer edge of the workpiece. Each corner is held within a slot shaped receptacle which in turn is defined in a frame for holding the workpiece with minimum shadowing and minimum danger of scratches, warping of other disadvantageous effects.

Abstract: An apparatus for consistently applying a predetermined centrally located compressive force to an element positioned between a first compressive member and a second compressive member is disclosed. The apparatus includes a bracket which holds compressive members in a clamping relationship about the element. The bracket includes a force generating web, a first leg and a second leg. The bracket is arranged to provide a centrally located compressive force when in the clamped relationship.

Abstract: A fiber holding chuck comprising a silica glass rod having a fiber groove or fiber chuck for an optical fiber. The optical fiber lies in the fiber groove, and a clamping mechanism holds the optical fiber in place. The fiber holding chuck positions the optical fiber without damaging the fiber in order to align the fiber with another fiber. The clamping mechanism maintains the position of the aligned fiber. The fiber chuck mounts in a chuck groove of a chuck mounting fixture. The chuck mounting fixture attaches to a fiber positioning mechanism, and the positioning mechanism positions the chuck mounting fixture along with the fiber chuck and the optical fiber to align and splice two optical fibers together while reducing the risk of damage to the optical fiber.

Abstract: In order to dispose substrates, such as lenses, having different sizes in a working installation, a holding arrangement comprises a spring clasp (3) provided for the clamping holding of the substrates or lenses, which spring clasp is suitable for disposition in a holding device (9) of the arrangement.

Abstract: An improved clamping ring apparatus is disclosed comprising a clamping ring means for yieldably engaging a generally circular semiconductor wafer to peripherally clamp the wafer to a support pedestal to provide a peripheral seal between the wafer and the surface of the pedestal facing the wafer, adjacent the generally circular end edge of the wafer by providing a central generally circular opening in the clamping ring and a series of slots which radially extend outwardly from the central opening in the clamping ring means to thereby divide the inner portion of the clamping ring means into a series of yieldable fingers inwardly extending toward the central opening in the clamping ring means.

Abstract: A wire clamping device which is used to clamp bonding wire in the wire bonding of electronic components comprising: a fixed arm; a movable arm that is positioned so that the end of the fixed arm faces the and of the movable arm with a suitable gap, the movable arm being capable of bending so that the end of the movable arm approaches the end of the fixed arm; and a piezoelectric element that is attached to the movable arm which bends the movable arm by mechanical deformation of the piezoelectric device in order to clamp wire between the end of the movable arm and the end of the fixed arm. A wire clamping method for clamping bonding wire comprising bending a movable arm toward a fixed arm during wire bonding of electronic components by means of mechanical deformation of a piezoelectric element, the deformation being generated by applying a voltage to the piezoelectric element.

Abstract: Semiconductor wafers having patterns of steps and grooves defining microcircuit elements thereon are coated with metallic film by supporting the wafers individually adjacent a respective ring-shaped sputtering source in stationary relationship thereto. To effectuate such individual wafer processing on a continuous basis and preserve the evacuated argon environment, a vacuum chamber sputter coating apparatus is provided which has a number of work stations therein, at least one of which includes said ring-shaped sputtering source. Also included is a load lock, and an intermittently rotting vertical plate-like wafer carrier means therewithin positioned closely adjacent the chamber entrance, and carrying wafers in turn from the load lock to the work stations. The carrier includes apertures each accepting a wafer therewithin in an upright position, with the wafers edgewise resiliently supported by clip means, without the use of any externally-originating supports such as platens.

Abstract: A hand tool or clamp, which locks itself to a work-piece to thereby free the hands of the user, includes a fixed jaw secured to one end of a slide bar and a movable jaw mounted to the slide bar for movement therealong toward and away from the fixed jaw. The movable jaw is normally spring-biased toward the fixed jaw by a flat coil spring supported on the fixed jaw and connected at its free end to the movable jaw. The spring is uncoiled as the jaws are pulled apart to receive a work-piece, and when either jaw is released, rewinds and rapidly advances the movable jaw along the slide bar into clamping engagement with the work-piece. Additional clamping pressure is provided by a screw mechanism associated with the movable jaw which cooperates with the slide bar to advance the movable jaw toward the fixed jaw and increase the clamping pressure between them.

Abstract: A clip for removably securing a semi-conductor wafer to the treatment surface of a semi-conductor wafer processing pedestal. The clip is constructed with a pair of spaced apart, forwardly extending tines adapted to engage outer edges of a semi-conductor wafer supported upon the treatment surface. A clip tail is oppositely disposed from the tines and affords resilient movement of the tines toward and away from the edges of the pedestal treatment surface to enable the installation and removal of the wafer therefrom.

Abstract: A pliers for gripping small pieces of glass to be ground as a support foot which can ride on a surface from which the grinder projects and a clamping jaw which can hold the piece of glass against a resting surface formed on this foot.

Abstract: A brazing fixture apparatus is disclosed for holding a heat exchanger core during a brazing operation. The fixture includes a generally rectangular frame including a contact member disposed on one side of the frame and a single lever extending axially along the length of the frame. The lever pivots from a first position to allow placement of the core onto the frame to a second position, in response to gravity, such that in the second position, the lever applies a constant compressive force on the core to hold the core together during the brazing operation.

Abstract: A clip for removably securing a semi-conductor wafer to the treatment surface of a semi-conductor wafer processing pedestal. The clip is constructed with a pair of spaced apart, forwardly extending tines adapted to engage outer edges of a semi-conductor wafer supported upon the treatment surface. A clip tail is oppositely disposed from the tines and affords resilient movement of the tines toward and away from the edges of the pedestal treatment surface to enable the installation and removal of the wafer therefrom.

Abstract: An apparatus (10) for providing a consistent registration of a semiconductor wafer undergoing process work includes a platen (38) upon which a surround (14) is registered. The surround registers to the platen (38) by matching two pins (42), (40) that protrude from the platen (38) to a hole (44) and a notch (46) in the surround (14), respectively. A first registration surface (16) for registering a flat (20) of a semiconductor wafer (12) is permanently mounted to the surround (14). A second registration surface (18) for registering a point (24) on the circumference of the semiconductor wafer (12) is permanently mounted to the surround (14). A third, adjustable registration surface (26) also registers to a point (28) on the circumference of the wafer (12). This third registration surface (26) is springloaded to accommodate for slight diameter variations in successively processed semiconductor wafers, and to provide a force to hold the wafer (12) in place.

Abstract: The sheet workpiece positioning device (10) is designed for supporting a sheet workpiece (5) along three adjacent sides thereof, by means of opposing supporting members (12 and 14) and a supporting member (13) set at right angles to the former supporting member. Preferably, at least one of the former supporting member (12 and 14) is designed to be able to slide along the latter supporting member (13). The sheet workpiece is gripped by a plurality of independent gripping devices (19, 119 and 20), evenly spaced out, side by side, and held, respectively, by the supporting members (12, 13 and 14). The gripping devices, which are long and thin, comprise a gib (39) and a front edge (45) of a U-shaped elastic member (46). An upper prong (48) of the U-shaped elastic member, interacts with an angle plate (53) held fixed by the gib and set so as to move the second gripper jaw provided on the upper prong towards the first gripping jaw (45) of the gib (39), following the traction of the U-shaped elastic members (46).

Abstract: The workpiece holder includes a solid jaw and a flexible jaw made of hardened steel and supported by the machine table. The solid jaw and flexible jaw are movable relative to the table such that workpieces of various sizes can be positioned at a predetermined location relative to the machine tool. The solid jaw, once positioned, is unmovable. The flexible jaw can flex approximately 0.002-0.003 of in inch relative to the solid jaw such that the workpiece can be gripped or released by flexing or unflexing the flexible jaw. To provide the flexing movement, the flexible jaw is formed with a narrowed neck portion which can be deformed to create a flex point. A screw extending between the solid jaw and flexible jaw supports a nut which provides the force for flexing the flexible jaw. Because the amount of flex required to grip and release the work piece is very small, the screw and nut arranagmenet can grip and release a workpiece with only a quarter turn of the nut.

Abstract: The present invention relates to a device for forming electric circuits on a lead frame, which has a plurality of process points in a row, each of which is provided with a semiconductor chip. During bonding, for achieving an optimum ultrasonic power transfer necessary for the electric connection of the semiconductor chip (8) to the connection fingers (5) of the lead frame, the individual lead frame (1) is located between a heated bearing element (19) and a correspondingly constructed holding plate (40). In the case of the device (50) according to the invention, the holding plate (40) provided for a contacting member (transducer) with a correspondingly constructed window-like recess (45) is movably mounted relative to the bearing element (19) about at least one axis (S) oriented in the longitudinal direction of the holding plate (40) on two spaced studs (35, 35'), each of which is arranged on a spring element (34, 34').

Abstract: A device for clamping a panel such as a conveyor belt skirt rubber in position, comprising a support body attachable to a fixed support such as a conveyor feed boot or skirt board, a clamp arm pivotally mounted to the support body, and resilient biasing means for urging the clamp arm to turn about the pivotal connection to the support body, in which the resilient biasing means comprises a helical coil stressed in torsion to apply the required resilient biasing to hold the clamp arm in a required position.

Abstract: A mask for protecting edge conductors of printed circuit boards from the spray coating which is sprayed on the board. The mask is molded from a soft silicone-based-elastomer material in a configuration which presents a sharp sealing edge and a large interior angle adjacent the seal which effectively limits migration due to capillary action.

Abstract: A device for releaseably holding a workpiece includes a resilient collet which is attached to a base by an elastomeric member. Typically, the collet is an annular ring. Several fingers for holding the workpiece extend from the collet. The fingers are pivoted by actuating a member which elastically deforms the collet and causes the fingers to pivot from a position for engaging the workpiece to a position for releasing the workpiece and vice-versa. In one application, the base is a platen for supporting a wafer in a semiconductor processing system, and a plurality of the holding devices are arranged around the periphery of a rotating disk. A counterweight ring is attached to the collet to counterbalance the moment generated by the centrifugal force of the wafer pressing against the fingers as the disk is rotated.

Abstract: A holder typically for a portable telephone comprises an upper housing and a lower housing, the latter being adapted for fixing to a surface or object. The upper housing comprises a support plate upon which the telephone may be located, and a pair of movable gripper members which urge the telephone against a fixed member so as to be held firmly therebetween. The distance between the fixed member and movable gripper members may be varied according to the dimensions of the telephone which the holder is receiving, and biasing means on the movable gripper members are provided to insure that there is sufficient force to firmly hold the telephone in the holder between the movable and fixed gripper members.

Abstract: Semiconductor wafers having patterns of steps and grooves defining microcircuit elements thereon are coated with metallic film by supporting the wafers individually adjacent a respective ring-shaped sputtering source in stationary relationship thereto. To effectuate such individual wafer processing on a continuous basis and preserve the evacuated argon environment, a vacuum chamber sputter coating apparatus is provided which has a number of work stations therein, at least one of which includes said ring-shaped sputtering source. Also included is a load lock; and an intermittently rotating vertical plate-like wafer carrier means therewithin positioned closely adjacent the chamber entrance, and carrying wafers in turn from the load lock to the work stations. The carrier includes apertures each accepting a wafer therewithin in an upright position, with the wafers edgewise resiliently supported by clip means, without the use of any externally-originating supports such as platens.