Abstract: A bottle rack is provided. For example, a bottle rack can include a reservoir, a perforated tray and a first pivot housing member. The reservoir is for retention of a liquid. The perforated tray can enable the liquid to pass through to the reservoir. The first pivot housing member includes a first peg to hold an article. The first pivot housing member comprises an axle within the first pivot housing member. The first peg is rotatable via the axle.

Abstract: The present invention relates to a device designed to capture the detached particles from an object being processed by the tool. The device includes an inlet opening to an internal space. The device includes guiding means configured to lead particles, which is detached during a machining process, the inner space of the container via the inlet opening and the inner space comprises a first material that has a consistency such that it has the ability to receive and retain detached particles, which are led into the inner space during the machining process.

Abstract: Embodiments of the present invention generally relate to a support ring for supporting a substrate during thermal processing in a process chamber. The support ring generally includes a ring body, an outer rib extending from a first surface of the ring body, a midrib extending from the first surface of the ring body, and a substrate support extending from a second surface of the ring body. The support ring reduces thermal coupling between a substrate and the support ring.

Abstract: In accordance with the embodiment of the present invention, there is provided a susceptor which includes an annular first susceptor portion for supporting the peripheral portion of a silicon wafer and further includes a second susceptor portion provided in contact with the peripheral portion of the first susceptor portion and covering the opening of the first susceptor portion. The second susceptor portion is disposed so that, when the silicon wafer is supported on the first susceptor portion, a gap of a predetermined size is formed between the silicon wafer and the second susceptor portion, and so that another gap of a size substantially equal to the predetermined size and directly connected to the above gap is formed between the first susceptor portion and the second susceptor portion.

Abstract: Embodiments of edge rings for substrate supports of semiconductor substrate process chambers are provided herein. In some embodiments, an edge ring for a semiconductor process chamber may include an annular body having a central opening, an inner edge, an outer edge, an upper surface, and a lower surface, an inner lip disposed proximate the inner edge and extending downward from the upper surface, and a plurality of protrusions extending upward from the inner lip and disposed along the inner edge of the annular body, wherein the plurality of protrusions are arranged to support a substrate above the inner lip and over the central opening, wherein the inner lip is configured to substantially prevent light radiation from travelling between a first volume disposed above the edge ring and a second volume disposed below the edge ring when a substrate is disposed on the plurality of protrusions.

Abstract: An adjustable angle workpiece positioning disc includes a partial quarter section defining confronting and intersecting surfaces that form an orthogonal angle therebetween. A central through hole located at the center of the disc. Disc coordinate axes originated at the center of the central through hole. Pluralities of angle through holes are arrayed about the central through hole. The disc is mountable to the plate by doweling the central through hole with a dowel pin receiving hole and by doweling one angle through hole with a dowel pin receiving hole in accordance with a desired revolved angle between the disc coordinate axes and the plate coordinate axes.

Abstract: Apparatus for providing electrical currents and substrate supports utilizing the same are provided. In some embodiments, a feedthrough structure may include a body having a wall defining one or more openings disposed through the body from a first end to a second end; one or more first conductors and one or more second conductors each disposed in the wall from the first end to the second end; and a plurality of conductive mesh disposed in the wall, at least one conductive mesh surrounding a first region of the wall including the one or more first conductors and at least one conductive mesh surrounding a second region of the wall including the one or more second conductors, wherein the plurality of conductive mesh substantially electrically insulates the first and second regions from respective first and second external electromagnetic fields respectively disposed outside the first and second regions.

Abstract: An aspect of one embodiment, there is provided a supporting substrate, including a first supporting substrate, an outer diameter being larger than a diameter of a semiconductor substrate and an inner diameter being smaller than the diameter of the semiconductor substrate, and a second supporting substrate, an outer diameter being smaller than the inner diameter of the first supporting substrate.

Abstract: A screen installation device is used for assembling a screen plate to a frame, the screen installation device, and includes a positioning device and a plurality of connection devices. The positioning device is for locating the frame. The connection devices are detachably assembled to the positioning device and are arranged around the screen plate, and part of each connection device is located and retained between the screen plate and the frame to create a constant width gap between the screen plate and the frame.

Abstract: Apparatus for improving temperature uniformity across a substrate are provided herein. In some embodiments, a deposition ring for use in a substrate processing system to process a substrate may include an annular body having a first surface, an opposing second surface, and a central opening passing through the first and second surfaces, wherein the second surface is configured to be disposed over a substrate support having a support surface to support a substrate having a given width, and wherein the opening is sized to expose a predominant portion of the support surface; and wherein the first surface includes at least one reflective portion configured to reflect heat energy toward a central axis of the annular body, wherein the at least one reflective portion has a surface area that is about 5 to about 50 percent of a total surface area of the first surface.

Abstract: Methods and apparatus for processing a substrate are provided herein.

Abstract: In accordance with the embodiment of the present invention, there is provided a susceptor which includes an annular first susceptor portion for supporting the peripheral portion of a silicon wafer and further includes a second susceptor portion provided in contact with the peripheral portion of the first susceptor portion and covering the opening of the first susceptor portion. The second susceptor portion is disposed so that, when the silicon wafer is supported on the first susceptor portion, a gap of a predetermined size is formed between the silicon wafer and the second susceptor portion, and so that another gap of a size substantially equal to the predetermined size and directly connected to the above gap is formed between the first susceptor portion and the second susceptor portion.

Abstract: The placement of a wafer can be performed with good positional precision, and the positioning of wafer clamps during maintenance is facilitated. A tapered recess is formed in that portion of the wafer support on which a wafer is placed. When a wafer is placed in the recess, the sloped surface inside this recess comes into contact with the edge of the wafer from beneath the wafer. The wafer is supported in a specific attitude by the sloped surface inside this recess.

Abstract: A holder (2; 22; 82) for coating drill with a ceramic coating by a vapor deposition process has a perforated outer wall (4; 24; 84) into which the drills are inserted with their tips projecting. The holder has a hollow interior in which support means locate the inserted drills parallel and with their tips projecting to the same extent. The support means may comprise a correspondingly perforated inner wall (8; 26; 86) and a back wall (10; 28; 88) against which the drills abut, the outer, inner and back walls being parallel to each other. In one configuration, the holder has a hexagonal plan form with alternate outer walls (4) perforated and each with associated inner and back walls (8, 10). The holder is provided with a lid (52) that shields the interior from ingress of the coating material but provides an air passage to assist cooling of the portions of the drills in the holder interior after the coating has been applied.

Abstract: A system (10) for dousing a fire, such as a tunnel, includes a conduit (11) for delivering a fire extinguishing liquid and a trough (12) extending parallel to the conduit (11) for receiving liquid from the conduit (11). A carriage (27) is arranged to move on a track comprising an upper edge (19) of the trough (12) and the carriage (27) carries a pump having a nozzle (25), a video camera (33) and an inlet (26) each of which can be controlled robotically from a remote control station. The inlet (26) is deployed in the trough (12) to draw liquid from the trough (12). The system avoids complicated docking procedures for the pump.

Abstract: A board for rolling dough comprising a generally flat rectangular board, preferably wood, with an elevated rail system on the surface of at least one side of the board that consists of a raised lip around the perimeter. The invention can be used with a rolling pin that is long enough to straddle parallel sides of the elevated railing. When the user rolls the rolling pin across the elevated railing, the rolling pin flattens the dough to a thickness corresponding to the height of the railing measured relative to the surface of the board.

Abstract: A method and apparatus for the laminating of glass is described. Glass sheets are transported by a gantry which places the sheet on a workstation. The glass sheet is allowed to dish and a second sheet is placed over the first sheet after depositing a resin on the first sheet. The trolley and the workstation from a press to complete the lamination process.

Abstract: A fixture for supporting and masking a portion of a window assembly during a painting operation includes a lower cover pivotally attached to an upper cover for movement between an open position and a closed position. In the open position, a window assembly can be inserted between the covers and in the closed position the covers mask a glass sheet and expose a gasket of the window assembly for painting. The upper and lower covers can be formed with a generally planar floor surrounded by upstanding walls having recessed portions formed in the sidewalls dimensioned to retain and seal the glass sheet. The lower cover can be hingedly connected to a mounting block for approximately 180.degree. of rotation to expose both sides of the extending gasket to a paint spray apparatus. A latching mechanism can be provided to maintain the upper and lower portions in the closed position during the painting operation.

Abstract: A fixture for supporting and masking an encapsulated window assembly includes a generally planar floor having a periphery surrounded by generally upstanding walls. An upper edge of the walls engages an inner surface of a gasket formed on a periphery of the window assembly whereby the fixture masks the inside surfaces of the gasket and a glass sheet forming the window assembly. At least one aperture is formed in the fixture for receiving a reference pin utilized to locate the fixture with respect to a painting apparatus. A sensor is provided for generating a signal representing the engagement of the aperture by the reference pin and a control unit is responsive to the sensor signal for controlling a robot painting apparatus to spray paint an outer surface of the gasket. The fixture further is used to support the window assembly during curing of the paint and subsequent manufacturing operations.