Abstract: A process for demounting a tire P, and a tread-bearing support S internal thereto, from an integral mounting rim J, which comprises first and second rim seats, the two rim seats being inclined towards the outside and extended axially to the outside by projections of low height. The process includes the steps of inserting, into a lubricated gap between the toe of the first bead Bo and the corresponding rim seat, a demounting insert I in the form of a portion of a circular ring of triangular meridian section of small dimensions, and then ejecting the first bead Bo from the rim J before or simultaneously with the ejection of the tire/support assembly.

Abstract: A semiconductor chip pickup jig which separates semiconductor chips affixed to an adhesive sheet from the adhesive sheet includes first and second thrust pin groups and a pin holder on which base portions of the first and second thrust pin groups are mounted. The thrust pins of the first thrust pin group are arranged in positions corresponding to corner portions of the semiconductor chip and thrust up the semiconductor chip by use of first front end portions thereof with the adhesive sheet disposed therebetween. The thrust pins of the second thrust pin group are arranged in positions corresponding to a nearby portion of a central portion of the semiconductor chip with second front end portions thereof being set lower than the first front end portions and thrust up the semiconductor chip by use of the second front end portions thereof with the adhesive sheet disposed therebetween.

Abstract: A method for preparing a multi-layer metal tube, comprises the steps of breaking the adhesion between at least a portion of a polymeric layer and an outer surface circumference of a metal tube having a corrosion resistant layer applied thereto, thereby causing the polymeric layer portion to retract and loosely adhere to a non-retracted polymeric layer adjacent the polymeric layer portion; and mechanically removing the retracted portion of the polymetric layer while leaving the corrosion resistant layer intact. An apparatus for achieving the mechanical removal is also disclosed.

Abstract: A tool is provided for separating a first circuit board and a second circuit board to prevent the damage thereof. In one aspect of the invention the tool includes a piston assembly and a handle. A first blade and second blade are coupled between the handle and the piston assembly. The first blade and the second blade are normally biased outwardly. The handle has a first position and a second position relative to the piston assembly. In the first position the blades are biased outwardly and in the second position the piston assembly biases the blades inwardly to engage the first circuit board.

Abstract: A terminal removal jig, for removing a terminal within a connector housing, having an outer case with a guide groove, a positioning member which has a protruding portion to be engaged with a terminal insertion hole at a front end of the connector housing, an elastic body for urging the positioning member and an unlocking plate secured on the outer case and having an unlocking pin to be mated with a locking lance within the connector housing. The unlocking pin is located behind the protruding portion and is kept in contact with the outer wall of the positioning member. The protruding portion is engaged with the terminal insertion hole and the tip of the unlocking pin faces a terminal removal jig insertion hole opposite to the locking lance. A protruding strip is formed on the outer wall and a front guide hole is formed in the unlocking plate.

Abstract: A windshield lift acting between the floor of a vehicle and the inside surface of the windshield with the aid of suction cups to apply an outward force to place the seal which bonds the windshield to the vehicle frame under tension. The peripheral seal can then be easily cut with a knife.

Abstract: The specification discloses a method for reusing garment hangers with size indicia mounted thereon. The method provides a closed loop for reusing the garment hangers by shipping hangers and the size indicia to clothing manufacturers, assembling the hangers with the size indicia and also hanging garments thereon, grouping the hangers with size indicia and garments thereon into batches which are then sent to retail stores for display and sale, at the point of sale removable a percentage of the hangers from the clothing and returning them to a reuse center where the size indicia is removed and the hangers cleaned before the hangers are returned to the clothing manufacturers to repeat the process and augmenting the supply of hangers sent back to the clothing manufacturers with newly molded hangers to maintain a constant and adequate supply.

Abstract: A position sensor for an electronic control pedal is carried by the pedal mounting bracket and includes a linear potentiometer having a slider operable along a substrate in only a linear direction for providing an output voltage representative of slider displacement. A drive arm is connected to the pedal shaft for rotation during pedal movement. A coupler connected to the slider is slidable within a slot in the drive arm for providing the linear displacement through a rotational movement of the shaft. The drive arm has an inner arm in a telescoping connection with an outer arm for setting the drive arm at a desired length after potentiometer calibration. The longitudinal axis of the slot is at an non-zero angle to the longitudinal axis of the drive arm for desensitizing the sensor calibration and adjustment process.

Abstract: A tool for removing a shim from a dovetail of a fan blade for a turbine engine rotor includes a clip and a handle. The clip includes a release edge configured to engage a flared lip of a dovetail shim. The handle extends from the clip and contacts the exterior surface of the shim. When the handle and the clip are rotated about a longitudinal axis of the handle, the release edge separates the flared lip of the shim from the dovetail and the handle applies a downward force to easily remove the shim from the dovetail.

Abstract: A tool for brake spring maintenance provides the ability both to release brake springs and then hold them out of the way for removal and replacement of brake shoes or for other maintenance operations related to drum brake arrangements. A main support bar is adapted to be received on an exposed wheel mounting member. The bar has a pair of threaded pins and cooperating threaded nuts for controlled axial movement of the pins. The pins have hooked ends and are situated for engaging respective brake springs whenever the tool is properly positioned on the exposed wheel mounting member. By rotating the threaded nuts to move the pins a set axial distance with the pin hooked ends engaged with the brake springs, such springs can be drawn back from their hold on the brake shoes, to permit disassembly and maintenance of the entire drum brake arrangement.

Abstract: The invention concerns an installation comprising continuously and successively: at least a station (A) automatically supplying tires; at least a station (B) for simultaneously removing each of the bead cores present in the tire rims; at least a station (C) for gradually crushing, along their circumference, the tires without bead cores; at least a station (D) for transversely cutting the crushed tires to obtain strip sections; at least a station (E) for treating the strip sections to separate the rubber material and the metal plies of the tire body from the running tread of each of the strip sections by reducing the rubber material to rubber crumb; means (12-13-14) for separately recuperating the rubber crumb and the strands of metal plies; the different stations and means are synchronously controlled for automatically and continuously treating and recycling tires.

Abstract: Semiconductor dice from a scribed wafer are first separated by a stretched cloth. The dice on the stretchable cloth are then lined up with a target unit and transferred by pressure to a target unit to form a matrix. The pressure can be exerted by pressing individually the dice from the stretchable cloth to the target unit. Alternatively, the dice from the stretchable cloth can first be transferred to a transfer unit before being compressed to the target unit. The transfer unit may also be a perforated board to the hold the dice in place before the dice are soldered to the target unit.

Abstract: A demounting apparatus is described which releases semiconductor work pieces from an adhesive support structure. The demounting apparatus includes a conduit with a pair of opposed openings. A support structure is placed over one of the openings with a work piece mounted on a lower surface thereof. A vacuum is exerted on the conduit through a constricted outlet, thereby creating a pressure differential. The lower pressure within the demounting apparatus causes the support structure to elastically deform, thereby reducing its adherence on the work piece. The work piece is dislodged from the support structure and caught by a cushion positioned in the other opening. The cushion is pushed inwardly by the pressure differential. Other structures for releasing the work piece are also disclosed.

Abstract: A device for detaching a suspension assembly, adapted to support a head, staked to an actuator arm of an actuator block of a disc drive. The device includes an expandable device operable between an insertion dimension and a deswaging dimension having a flanged end defining a deswaging surface for forcing the stake from a hole of the actuator arm. In the insertion dimension, the device being sized for insertion through channels of tubular stakes for placement relative to an extended end of the stake. The device being expanded to the deswaging dimension, so that the deswaging surface of the flanged end aligns with an end surface of the stake for removing the stake from the actuator block.

Abstract: A semiconductor chip transferring method and apparatus is described having a movable member, a flexible structure having adhesive on a lower surface thereof, a first transport assembly, and a second transport assembly. The first transport assembly is positioned beneath the support structure and includes a rotatable base upon which is mounted at least one arm. The movable member is extended into and flexes the support structure to transfer a semiconductor chip supported on a first side by the support structure to the arm which supports it on a second side. The first transport assembly moves the chip to the second transport assembly which may, in turn, move it to an output container which supports the second side. The chip has now been inverted from its initial orientation.

Abstract: A direct die feeder picks known good die from a wafer and places them on a conveyor belt, which conveys the die to a pickup location. Frame (111) supports a wafer (105) which is a wafer that is sawed while adhered onto a flexible film, which is then stretched and mounted in a ring (110). A fork member (125), on which a pick head (150) is mounted slides along a horizontal axis and frame (111) slides along a vertical axis to allow the pick head (150) to access any die from the wafer. A camera (160) is directed downward at a 45° mirror (162) adjacent to the pick head to capture images of the wafer and determine the precise locations of die and qualify them. The pick head (150) can pick die from the wafer and place them directly on the conveyor belt (170) in the conventional orientation, or pass the die to a flip head (140) which then shifts to the left and lowers the die down past the pick head, placing the die on the conveyor belt in the flipped orientation.