Rack-and-pinion Operated Patents (Class 29/46)
  • Publication number: 20040025312
    Abstract: The invention relates to a casting roll for casting and/or supporting a cast strand, in particular for a two-roll casting machine Said casting roll comprises a water cooling system, in which the cooling water is supplied and discharged in cooling channels (8), formed by cooling bores or grooves that are distributed over the periphery of the roll and a pressure chamber (10), which borders a roll casing (5) and is connected in an adjustable manner to a hydraulic fluid source. The casting roll prevents a superelevation of the profile and the formation of a wedge-shape over a significant section of the length of the casting roll, as the internal diameter of the roll casing (5) increases, starting from sealing elements (15) up to the centre of the roll and the hollow chamber (16) can be impinged by the hydraulic fluid in order to modify the profile.
    Type: Application
    Filed: May 16, 2003
    Publication date: February 12, 2004
    Inventors: Gunter Flemming, Hans Streubel
  • Patent number: 6564449
    Abstract: A method of making a wire connection in a semiconductor device, the method comprising: (a) forming an under bump metallurgy (UBM) over a chip including the bonding pad formed thereon; (b) forming a gold bump on the UBM at a location corresponding to the bonding pad; (c) etching the UBM with the gold bump as a mask; and (d) connecting one end of a bonding wire to a conductive lead by ball bonding and the other end thereof to the gold bump on the bonding pad of the chip by stitch bonding. The conductive lead is located external to the chip as a part of a lead frame or a substrate. Alternatively, the semiconductor chip having bumps may be formed by electroless plating a nickel layer on the bonding pads of the chip, and followed by electroless plating a gold layer on the nickel layer. It is noted that the semiconductor chip having metal bumps is formed by wafer bumping process.
    Type: Grant
    Filed: November 7, 2000
    Date of Patent: May 20, 2003
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu Fang Tsai, Jian Wen Chen, Min Lung Huang
  • Patent number: 6385831
    Abstract: A workpiece table, provided for a machine tool, is movable back and forth between two end positions and has for this purpose a rotational drive which has a gear part joined to the workpiece table for rotation thereof, a toothed rack in engagement therewith, as well as a medium-actuated shift drive for displacement of the toothed rack, which thereby performs a linear stroke motion, delimited by stops, between two end locations corresponding to the end positions of the workpiece table. Provided on the workpiece table is a mechanism which acts upon the toothed rack with a higher feed force at the beginning of the linear stroke movement than during the remainder of the linear stroke.
    Type: Grant
    Filed: March 26, 1997
    Date of Patent: May 14, 2002
    Inventor: Peter Grund
  • Patent number: 4454638
    Abstract: A lathe with a number of working tools for making a setting for a gem in metallic objects such as rings or bracelets, the size of the setting being directly determined by taking the diameter of the gem to be set.
    Type: Grant
    Filed: March 30, 1981
    Date of Patent: June 19, 1984
    Inventor: Stanoppi Emilio
  • Patent number: 3975109
    Abstract: A Z-axis drive assembly for a turret machining center incorporates a variable speed DC motor mounted on a vertically adjustable carriage and connected through a harmonic drive unit to rotate a pinion. The pinion forms part of a rack and pinion mechanism, for controlling the vertical elevation of the rack relative to the carriage.
    Type: Grant
    Filed: August 29, 1975
    Date of Patent: August 17, 1976
    Assignee: Houdaille Industries, Inc.
    Inventor: James L. Frazierr