Abstract: A method of producing an acoustic wave device includes: forming an interdigital electrode on a piezoelectric substrate; forming a barrier film so as to cover the interdigital electrode; forming a medium on the barrier film; measuring a frequency characteristic of an acoustic wave excited by the interdigital electrode; and forming, in an excitation region, an adjustment region having a thickness different from other portions by patterning the barrier film or further providing an adjustment film. When forming the adjustment region, an area T of the adjusting area is adjusted in accordance with the measured frequency characteristic.

Abstract: A method of manufacturing a microphone comprising a substrate, a transducer element that is mounted on a top side of the substrate, a covering layer that covers the transducer element and forms a seal with the top side of the substrate, a shaped covering material that covers the substrate, the transducer element and the covering layer, and a sound opening that extends through the covering material and the covering layer. Methods for manufacturing a microphone and for manufacturing a plurality of microphones are also disclosed.

Abstract: An electroacoustic transducer has a ring-shaped magnetic assembly that generates a magnetic field, an elastic suspension connected to the magnetic assembly, a support connected to the elastic suspension and supporting a coil adapted to move in the magnetic field generated by the magnetic assembly, and an acoustic membrane connected to the support of the coil in order to vibrate and emit a sound. The magnetic assembly has a thin housing and support structure made of non-magnetic material, and a plurality of magnets with magnetic axis (A) and axial anisotropy, said magnets being disposed side by side, inside said thin housing and support structure that acts as bearing structure for the transducer and as containment structure for the magnets.

Abstract: A bone conduction transducer for a wearable computing system is provided. The bone conduction transducer includes a magnetic diaphragm configured to vibrate in response to a time-changing magnetic field generated by an electromagnetic coil operated according to electrical input signals. The magnetic diaphragm is elastically suspended over the electromagnetic coil to allow excursion toward and away from the coil by a pair of cantilevered leaf springs projected from opposing sides of the transducer to connect to opposing sides of the magnetic diaphragm. The bone conduction transducer is included in the wearable computing system to be worn against a bony structure of the wearer that allows acoustic signals to propagate to the wearer's inner ear and achieve sound perception in response to vibrations in the bone conduction transducer.

Abstract: According to certain described aspects, multiple acoustic sensing elements are employed in a variety of beneficial ways to provide improved physiological monitoring, among other advantages. In various embodiments, sensing elements can be advantageously employed in a single sensor package, in multiple sensor packages, and at a variety of other strategic locations in the monitoring environment. According to other aspects, to compensate for skin elasticity and attachment variability, an acoustic sensor support is provided that includes one or more pressure equalization pathways. The pathways can provide an air-flow channel from the cavity defined by the sensing elements and frame to the ambient air pressure.

Abstract: A method of making finger sensor packages may include advancing a flexible circuit tape along a predetermined path of travel. The flexible circuit tape may include a flexible layer and conductive traces thereon defining individual flexible circuits. The method may include, as the flexible circuit tape is advanced along the path of travel, securing a respective finger sensing integrated circuit (IC) and surrounding sensor package frame to each flexible circuit, applying at least one fluid fill material adjacent each finger sensor IC while using the corresponding sensor package frame as a dam to thereby define finger sensor packages, and stamping out the finger sensor packages from the flexible circuit tape to form at least one flush common edge of each sensor package frame and individual flexible circuit.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: A headphone sound-generating structure includes a sound-generating module and a plurality fastening elements. The sound-generating module includes a first perforated plate, a first ring-shaped spacer, a diaphragm assembly, a second ring-shaped spacer, a second perforated plate, and a second ring-shaped mounting frame, which are sequentially superposed in a receiving space defined on an ear cup. The fastening elements are extended through third mounting holes of the second ring-shaped mounting frame and fourth mounting holes of the ear cup to thereby quickly secure the sound-generating module to the ear cup to complete a headphone sound-generating structure, which can be manufactured at lowered cost and increased good yield, and allows convenient maintenance without wasting any material. A method of assembling the headphone sound-generating structure is also introduced.

Abstract: A surface acoustic wave device includes first interconnections and second interconnections connected to a potential different from a potential connected to the first interconnections that are arranged on a piezoelectric substrate. The first interconnections three-dimensionally intersect with the second interconnections with insulating layers made of a thermosetting resin, disposed therebetween. Interdigital electrodes defining IDTs are films which have six-fold rotational symmetric spots appearing in an XRD pole figure and which are defined by Al films or Al—Cu alloy films containing Cu in an amount not greater than the solubility limit at about 25° C.

Abstract: An ultrasonic sensor device includes a housing, a transducer, a securing unit, a circuit board and a sealing cap. The housing includes an enclosing portion. The enclosing portion has a first opening and an opposite second opening. The transducer is secured to the enclosing portion at the second opening. The securing unit secures the transducer to the enclosing portion of the housing, and includes at least one securing rib that extends toward the first opening of the enclosing portion. The circuit board is disposed in the enclosing portion. The sealing cap is disposed to cover the first opening of the enclosing portion and has an inner cap surface that abuts against the securing rib of the securing unit.

Abstract: An ophthalmic surgical instrument comprises a multi-diameter shaft, a horn fixedly threaded into the shaft, a surgical tip for ophthalmic surgery including a tip end and threadably engaging the horn opposite the shaft, and a plug on the shaft. Weld material holds the plug on the shaft in a selected angular and longitudinal position with an angle-locating recess on the plug's circumference having a predetermined angular clocked relation to a face direction of the tip end. The plug's recess engages an irrigation tube on a subassembled handle with shell and irrigation tube, such that the subassembled handle has a known clocked position relative to the tip end of the tip, thus facilitating use by a surgeon. A related method is also disclosed and claimed.

Abstract: According to certain described aspects, multiple acoustic sensing elements are employed in a variety of beneficial ways to provide improved physiological monitoring, among other advantages. In various embodiments, sensing elements can be advantageously employed in a single sensor package, in multiple sensor packages, and at a variety of other strategic locations in the monitoring environment. According to other aspects, to compensate for skin elasticity and attachment variability, an acoustic sensor support is provided that includes one or more pressure equalization pathways. The pathways can provide an air-flow channel from the cavity defined by the sensing elements and frame to the ambient air pressure.

Abstract: A method for manufacturing a surface acoustic wave element that prevents curvature of a piezoelectric substrate when forming an electrode pattern includes a first step of bonding to a first principal surface of a piezoelectric substrate a support member having a linear expansion coefficient lower than a linear expansion coefficient of the piezoelectric substrate to form a composite substrate, a second step of forming a plurality of grooves in the support member of the composite substrate from a surface that is opposite to a bonding interface between the support member and the piezoelectric substrate, a third step of forming electrode patterns including at least one IDT electrode on a second principal surface of the piezoelectric substrate of the composite substrate, and a fourth step of dividing the composite substrate on which the electrode patterns are formed to form individual surface acoustic wave elements.

Abstract: Aspects of the subject disclosure include, for example, obtaining a mechanical resonating structure comprising a compensating structure, where the compensating structure comprises one or more materials having an adaptive stiffness that reduces a variance in a resonating frequency of the mechanical resonating structure (f0), and adjusting at least one of a value of f0 of the obtained mechanical resonating structure or a value of a temperature for which temperature coefficient of frequency of the obtained mechanical resonating structure is approximately zero (T0) by altering a thickness of at least one targetable material of the mechanical resonating structure. Other embodiments are disclosed.

Abstract: In an exemplary method for manufacturing a piezoelectric device, a lid wafer, a piezoelectric wafer, and a base wafer are prepared. Each wafer defines multiple lids, multiple piezoelectric vibrating pieces, and multiple bases, respectively. The piezoelectric vibrating pieces comprise respective first and second electrodes, and the base wafer is made of glass. The bases comprise respective first and second metal wires extending therethrough, each wire having a respective end and a respective side surface at the end that protrudes at least partially from the first surface. A wafer sandwich is formed with the three wafers co-aligned with each other, with the protruding ends of the wires contacting respective first and second electrodes. The layers are anodic bonded together, which also bonds the protruding ends of the first and second wires to the respective first and second electrodes. The bonded wafer sandwich is cut into separate individual piezoelectric devices thus formed in the sandwich from each other.

Abstract: An acoustic resonator with improved quality factor and electro-mechanical coupling is disclosed. In one embodiment, the acoustic resonator includes an acoustic mirror formed on the top surface of a substrate or in the substrate, a first electrode having a end portion, formed on the acoustic mirror, a piezoelectric layer formed on the first electrode; and a second electrode formed on the piezoelectric layer, where at least one of the first electrode and the second electrode and the piezoelectric layer define a gap in a region that overlaps the end portion of the first electrode. In one embodiment, a dielectric film is deposited on the surface of the end portion of the first electrode to form completely planarized surface before the piezoelectric layer deposition. In another embodiment, a gap between the second electrode and the piezoelectric layer, so that the piezoelectric coupling in the end portion area of the first electrode is minimally contributed into the whole resonator.

Abstract: Computing devices and microphone assemblies including acoustic waveguides are described. According to some examples, a computing device may include an enclosure, a microphone which may be spaced apart and angled relative to the interior surface of the enclosure to which the microphone may be coupled. The computing device may further include an acoustic waveguide disposed between the microphone and the interior surface of the enclosure, the acoustic waveguide having a passage for allowing acoustic energy to be transmitted from a microphone opening in the enclosure to the receiving element of the microphone (also referred to as sensing element, or microphone sensor).

Abstract: A canalphone system may include a canalphone housing, and an ambient vent opening in the canalphone housing larger than 0.04 square inches. The system may also include an acoustic damper adjacent the ambient vent opening. The system may further include a liquid diverter carried by the canalphone housing that limits liquid flow into the ambient vent opening.

Abstract: A method of manufacturing a boundary acoustic wave device includes the steps of forming an electrode on a first medium layer, forming a second medium layer so as to cover the electrode on the first medium layer, and forming a sound absorbing layer on an external surface of the second medium layer. The sound absorbing layer has an acoustic velocity of transverse waves that is lower than an acoustic velocity of transverse waves of the second medium layer.

Abstract: A method of manufacturing an electronic device that comprises a microelectromechanical (MEMS) element, the method comprising the steps of: providing a material layer (34) on a first side of a substrate (32); providing a trench (40) in the material later (34); etching material from the trench (40) such as to also etch the substrate (32) from the first side of the substrate (32); grinding the substrate (32) from a second side of the substrate to expose the trench (40); and using the exposed trench (40) as an etch hole. The exposed trench (40) is used as an etch hole for releasing a portion of the material layer (34), for example a beam resonator (12), from the substrate (32). An input electrode (6), an output electrode (8), and a top electrode (10) are provided.

Abstract: A method for fabricating an acoustic wave device includes the steps of forming an insulating material layer on a piezoelectric substrate, forming a patterned photoresist on the insulating material layer, patterning the insulating material layer, and forming a piezoelectric-substrate exposed depression corresponding to a region where an interdigital transducer electrode is to be formed on a first insulator layer composed of the insulating material layer, depositing a metallic material on the piezoelectric substrate to form the interdigital transducer electrode in the piezoelectric-substrate exposed depression such that the overall interdigital transducer electrode is thinner than the first insulator layer and coating the photoresist with a metallic material, removing the photoresist and the metallic material on the photoresist, and depositing a second insulator layer so as to cover the interdigital transducer electrode and the first insulator layer.

Abstract: A sound transducer structure includes a membrane, a counter electrode, and a plurality of elevations. The membrane includes a first main surface, made of a membrane material, in a sound transducing region and an edge region of the membrane. The counter electrode is made of counter electrode material, and includes a second main surface arranged in parallel to the first main surface of the membrane on a side of a free volume opposite the first main surface of the membrane. The plurality of elevations extend in the sound transducing region from the second main surface of the counter electrode into the free volume.

Abstract: A measurement device determines a volume flow based on acoustic flow measurement methods in a pump system and a method produces the measurement device. The measurement device includes a measurement path with two coupling wedges with two sound transducers disposed on the coupling wedges. The pump system and the coupling wedges are made of metal or a metal alloy.

Abstract: A plate attached to the back shell of an earphone includes an exit cavity corresponding in dimension to and aligned with a first opening through the back shell. A channel in the bottom surface of the plate begins at a point aligned with a second opening through the back shell and ends at an aperture through a side wall of the exit cavity. The channel and the outer surface of the back shell together form a reactive acoustic port from a back cavity enclosed by the back shell to the exit cavity, the first opening through the shell forms a resistive acoustic port from the back cavity to the exit cavity, and the exit cavity couples the reactive acoustic port and the resistive acoustic port to free space without introducing additional acoustic impedance. In some examples, a water-resistant screen covers the upper aperture of the exit cavity.

Abstract: An ultrasonic transducer includes a plurality of transducer modules, a substrate on which each of the plurality of transducer modules is arranged, and a buffer member which buffers the movements of the upper portions of the transducer modules, wherein the buffer member is disposed on the substrate between the plurality of transducer modules and on the substrate outside of the plurality of transducer modules.

Abstract: One embodiment of the present inventions sets forth a method for decreasing a temperature coefficient of frequency (TCF) of a MEMS resonator. The method comprises lithographically defining slots in the MEMS resonator beams and filling the slots with a compensating material (for example, an oxide) wherein the temperature coefficient of Young's Modulus (TCE) of the compensating material has a sign opposite to a TCE of the material of the resonating element.

Abstract: In one embodiment, a cymbal system includes a cymbal and a transducer couplable to the cymbal. The transducer has a sound pressure microphone, and a casing hermetically sealing the sound pressure microphone to prevent communication of air pressure differentials into the sound pressure microphone. The cymbal may be a perforated low volume cymbal. In one embodiment, a method for making a cymbal transducer includes sealing a sound pressure microphone in an airtight enclosure, and configuring the sealed sound pressure microphone for attachment to a cymbal.

Abstract: A speaker comprises a support structure having a circumferentially extending rim, a vibration member configured to be displaced relative to the support structure during operation of the speaker, and a suspension member suspending the vibration member relative to the support structure. The suspension member includes a radially outer portion attached to the rim of the support structure, a radially inner platform portion attached to the vibration member, and a plurality of beams. Each beam of the plurality of beams may extend from the radially outer portion to the radially inner platform portion. The plurality of beams is configured such that a resonant frequency of the vibration member attached to the radially inner platform portion of the suspension member scales linearly with a beam width of the beams of the plurality of beams.

Abstract: An ultrathin electromagnetic vibrating device and its manufacturing method, wherein the ultrathin electromagnetic vibrating device includes: a base frame, a vibrating reed, a set of surrounds, a voice coil and a magnetic circuit system, wherein the surrounds include an upper surround and a lower surround, respectively connected with an upper surface and a lower surface of the vibrating reed to fixedly connecting the vibrating reed with a base of the base frame. Due to an application of the lower surround to form a combined action of the upper and lower surround, the vibrating reed is only able to keep vibrating up and down vertically, a first end of the voice coil is fixedly provided on the lower surface of the vibrating reed, similarly, while a stroke of the voice coil drives the vibrating reed to vibrate up and down vertically, the voice coil achieves an up-and-down vertical stroke.

Abstract: An ultrasound transducer includes an array of PZT elements mounted on a non-recessed distal surface of a backing block. Between each element and the backing block is a conductive region formed as a portion of a metallic layer sputtered onto the distal surface. Traces on a longitudinally extending circuit board—preferably, a substantially rigid printed circuit board, which may be embedded within the block—connect the conductive region, and thus the PZT element, with any conventional external ultrasound imaging system. A substantially “T” or “inverted-L” shaped electrode is thereby formed for each element, with no need for soldering. At least one longitudinally extending metallic member mounted on a respective lateral surface of the backing block forms a heat sink and a common electrical ground. A thermally and electrically conductive layer, such as of foil, transfers heat from at least one matching layer mounted on the elements to the metallic member.

Abstract: In one general aspect, various embodiments are directed to an ultrasonic surgical instrument that comprises a transducer configured to produce a standing wave of vibrations along a longitudinal axis having a node and an anti-node at a predetermined frequency. In various embodiments, an ultrasonic blade extends along the longitudinal axis and is coupled to the transducer. In various embodiments, the ultrasonic blade includes a body having a proximal end and a distal end, wherein the distal end is movable relative to the longitudinal axis by the vibrations produced by the transducer. In one general aspect, various embodiments are directed to a method of assembling the transducer for the ultrasonic surgical instrument. In various embodiments, the method comprises selecting piezoelectric elements and arranging the piezoelectric elements relative to the node to minimize the difference in magnitude between the currents drawn by the piezoelectric elements.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: A module for containing an earpiece for an audio device, the earpiece having at least one protruding electrical contact. The module comprises a first portion and a second portion, the first portion and the second portion being opposable and forming a cavity sized to accommodate an earpiece. The module further comprises at least one electrical contact within the cavity, on one of the first portion and the second portion. The electrical contact is positioned to engage a protruding electrical contact of the earpiece positioned within the cavity.

Abstract: An ultrasonic transducer includes: a diaphragm pot that has a surrounding wall; a transducer element mounted in a diaphragm pot on a transducer section on an inner side of the diaphragm for generating the ultrasonic vibrations; a first damping element situated in the diaphragm pot on transducer element for damping the diaphragm; and a second damping element situated within the diaphragm pot in an edge section of the diaphragm around the transducer element for damping vibrations of the wall; the second damping element being connected with force locking, at least section by section, both to the edge section and to the inner side of the wall.

Abstract: CMUT devices are used in many applications e.g. for ultrasound imaging and pressure measurement. These devices operate by sensing a change in capacitance caused by deflection of a membrane (32) comprising one of a pair of electrodes in the device by ultrasound exposure of or pressure applied on, the membrane. The CMUT device may be susceptible to the effects of changing temperature.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's sprinted circuit board.

Abstract: An adjustable open-fit thin tubing system for a hearing aid is provided comprising a generally straight flexible thermoplastic tube, a connector tube molded to one end of the generally straight tube, and a connector plug having a hollow bore molded to the opposite end of the connector tube, wherein the generally straight tube is adapted to be fitted at a distal end to the hearing aid, and wherein the connector plug includes an eartip at a proximal end adapted to be inserted into a human ear. The connector tube may be sound conducting thin flexible tubing manufactured from a heat-treated thermoplastic material, and may describe a single curve toward the ear canal having a radius r. The present hearing aid thin tubing system is modular, open-fit and adapted to fit behind the ear (BTE) hearing aid devices, and is adapted to be aligned and adjusted by the individual user.

Abstract: An electrostatic speaker and a method for manufacturing the speaker are disclosed. Said speaker comprises a vibrating film; an electrode portion disposed on a surface of the vibrating film and joined with the vibrating film; and a conductive backplate spaced from the electrode portion by a distance, the conductive backplate forming a plurality of holes, the vibrating film being deformed and vibrated to generate and release a sound through the holes due to a variation of an electric field generated between the conductive backplate and the electrode portion, wherein the conductive backplate is covered by a polymer layer serving as a protective film. The covering polymer layer on the conductive backplate is capable of improving the stability of the electrostatic speaker and increasing its lifespan.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: A ceramic header configured to form a portion of an electronic device package includes a mounting portion configured to provide a mounting surface for an electronic device. In addition, the ceramic header includes one or more conductive input-output connectors operable to provide electrical connections from a first surface of the ceramic header to a second surface of the ceramic header. The ceramic header also includes one or more thermally polished surfaces.

Abstract: A method for manufacturing a Micro-Electro-Mechanical System pressure sensor, including forming a gauge wafer including a diaphragm and a pedestal region. The method includes forming an electrical insulation layer disposed on a second surface of the diaphragm region and forming a plurality of sensing elements patterned on the electrical insulation layer disposed on the second surface in the diaphragm region, forming a cap wafer with a central recess in an inner surface and a plurality of through-wafer embedded vias made of an electrically conductive material in the cap wafer, creating a sealed cavity by coupling the inner recessed surface of the cap wafer to the gauge wafer, such that electrical connections from the sensing elements come out to an outer surface of the cap wafer through the vias, and attaching a spacer wafer with a central aperture to the pedestal region with the central aperture aligned to the diaphragm region.

Abstract: An embodiment of the present invention provides a method, comprising breaking an electrode into subsections with signal bus lines connecting said subsections and a solid electrode to improve Q.

Abstract: Provided is a capacitive transducer having a wide frequency band width and an improved transmitting and receiving sensitivity, the capacitive transducer including an element including a plurality of cells: each of the plurality of cells including: a first electrode; a vibrating film including a second electrode, the second electrode being opposed to the first electrode with a gap; and a supporting portion that supports the vibrating film, in which the element includes a first cell and a second cell as the cell, the first cell including the vibrating film having a first spring constant, the second cell including the vibrating film having a second spring constant smaller than the first spring constant; and a distance between the first electrode and the second electrode of the first cell is smaller than a distance between the first electrode and the second electrode of the second cell.

Abstract: Provided is a capacitive transducer including an element including a plurality of cells: each of the plurality of cells including: a first electrode; and a vibrating film including a second electrode, the second electrode being opposed to the first electrode with a gap; and a vibrating film supporting portion that supports the vibrating film so as to form the gap, in which the element includes a first cell and a second cell, the first cell including the vibrating film having a first spring constant, the second cell including the vibrating film having a second spring constant lower than the first spring constant; and a voltage to be applied between the first electrode and the second electrode of the first cell is higher than a voltage to be applied between the first electrode and the second electrode of the second cell.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.