Indicating Transducer Patents (Class 29/595)
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Patent number: 8800130Abstract: A charge-coupled device (CCD) image sensor includes multiple vertical charge-coupled device (VCCD) shift registers and independently-controllable gate electrodes disposed over the VCCD shift registers and arranged into physically separate and distinct sections that are non-continuous across the plurality of VCCD shift registers. The CCD image sensor can be configured to operate in two or more operating modes, including a full resolution charge multiplication mode.Type: GrantFiled: May 25, 2011Date of Patent: August 12, 2014Assignee: Truesense Imaging, Inc.Inventors: Antonio S. Ciccarelli, Eric J. Meisenzahl
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Publication number: 20140197712Abstract: A resonant transducer includes a resonator, a resonator electrodes connected to an end part of the resonator, at least one fixed electrode arranged in the vicinity of the resonator, and a buried part formed between the fixed electrode and the resonator electrode. The resonator, the resonator electrodes and the fixed electrode are formed by the same active layer on a substrate.Type: ApplicationFiled: January 13, 2014Publication date: July 17, 2014Applicant: YOKOGAWA ELECTRIC CORPORATIONInventors: Takashi YOSHIDA, Shigeto IWAI, Yoshitaka SASAKI
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Patent number: 8776337Abstract: The present disclosure includes methods of forming capacitive sensors. One method includes forming a first electrode array of the capacitive sensor on a first structure. Forming the first electrode array can include: forming a dielectric material on a substrate material; forming an electrode material on the dielectric material; removing portions of the electrode material to form a number of electrodes separated from each other; and removing at least a portion of the dielectric material from between the number of electrodes. The method can include bonding the first structure to a second structure having a second electrode array of the capacitive sensor formed thereon such that the number of electrodes of the first electrode array face a number of electrodes of the second electrode array.Type: GrantFiled: July 30, 2010Date of Patent: July 15, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Brian D. Homeijer, Robert G. Walmsley, Rodney L. Alley, Dennis M. Lazaroff, Sara J. Homeijer
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Patent number: 8739407Abstract: A method of assembling an optical sensor assembly for a carriage of a carriage printer, the method includes providing a flexible circuit subassembly including a photosensor and a light source; providing a mounting member including a first cavity and a second cavity having an orientation that is different than an orientation of the first cavity; mounting the flexible circuit subassembly on the mounting member such that the photosensor is disposed in the first cavity and the light source is disposed in the second cavity; and affixing the mounting member to an outer housing, wherein a connector end of the flexible circuit subassembly extends outwardly from the mounting member and the outer housing.Type: GrantFiled: December 9, 2011Date of Patent: June 3, 2014Assignee: Eastman Kodak CompanyInventors: Juan Manuel Jimenez, Richard A. Murray
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Publication number: 20140109390Abstract: Wearable Oximeters integrated with wireless devices and computing devices that provide the wearers of the device information on their heart rate, oxygen saturation, breathing and calories expended whilst the device is worn. Using these biometric readings, software on the computing device will enable users to compare the readings from previous sessions when the device was worn. It is envisaged that amateur and professional athletes will use the devices and software to monitor their performance during physical activities.Type: ApplicationFiled: October 24, 2012Publication date: April 24, 2014Inventor: Robert Leslie Manning
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Patent number: 8677605Abstract: A method for manufacturing a sensor unit includes the steps of: Step 1 is providing a substrate having sensor unit areas. Each sensor unit area is partitioned into two individual circuit areas. A signal emitting device and a signal detecting device are respectively disposed on the two circuit areas. Step 2 is forming a packaging structure to cover the two circuit areas, the signal emitting device, the signal detecting device, and a cutting area between the two circuit areas using a mold. Step 3 is cutting the packaging structure along the cutting area to form a separation cut groove. Step 4 is assembling a separation member onto each sensor unit area. The separation member is disposed on the separation cut groove so that the signal emitting device and the signal detecting device on the same sensor unit area are isolated from each other.Type: GrantFiled: July 22, 2011Date of Patent: March 25, 2014Assignee: Lite-On Singapore Pte. Ltd.Inventors: Sin-Heng Lim, Teck-Chai Goh
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Publication number: 20140069198Abstract: High temperature pressure sensing devices and methods are disclosed. In some embodiments, a high temperature pressure sensor including intrinsic zero output and span correction versus temperature is disclosed. In addition, ways in which to improve high temperature performance through the use of intermediate circuits located towards the distal end of the high temperature pressure sensor as well as configurations to reduce thermally induced stresses within the pressure sensor are disclosed. The disclosed embodiments also detail ways in which to reduce signal loss due to various stray capacitances within the pressure sensor to improve signal fidelity and sensitivity.Type: ApplicationFiled: September 7, 2012Publication date: March 13, 2014Applicant: Dynisco Instruments LLCInventors: Leo E. Barron, John A. Czazasty
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Patent number: 8661650Abstract: A method of making a handheld, electromechanical device useful in mammalian body-care includes the steps of: a) forming a one-piece housing having a single opening defined by a rim; b) assembling a unitary insert; c) inserting the unitary insert through the single opening of the housing; d) removably applying a cover having an exterior surface to close the opening of the one-piece housing; and e) attaching the unitary insert to at least one of the one-piece housing and the removable cover. The rim of the one-piece housing circumscribes a rim area, and the one-piece housing has a projected area that is substantially larger than the rim area. The unitary insert is dimensioned to be insertable through the opening defined by the rim, and it has a frame having disposed thereon electromechanical elements interconnected in an electrical circuit. The cover closes off the opening of the one-piece housing.Type: GrantFiled: September 27, 2011Date of Patent: March 4, 2014Assignee: Johnson & Johnson Consumer Companies, Inc.Inventors: Jorge M. Da Silva, Emanuel P. Morano, John Rytel
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Patent number: 8627559Abstract: A method for manufacturing a Micro-Electro-Mechanical System pressure sensor, including forming a gauge wafer including a diaphragm and a pedestal region. The method includes forming an electrical insulation layer disposed on a second surface of the diaphragm region and forming a plurality of sensing elements patterned on the electrical insulation layer disposed on the second surface in the diaphragm region, forming a cap wafer with a central recess in an inner surface and a plurality of through-wafer embedded vias made of an electrically conductive material in the cap wafer, creating a sealed cavity by coupling the inner recessed surface of the cap wafer to the gauge wafer, such that electrical connections from the sensing elements come out to an outer surface of the cap wafer through the vias, and attaching a spacer wafer with a central aperture to the pedestal region with the central aperture aligned to the diaphragm region.Type: GrantFiled: September 14, 2012Date of Patent: January 14, 2014Assignee: S3C, Inc.Inventors: James Tjanmeng Suminto, Mohammad Yunus
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Patent number: 8624585Abstract: A proximity sensor includes a circuit board provided with a processing circuit, a light emitting device mounted on the surface of the circuit board, and a light-transmitting cylindrical light guide surrounding the portion of the circuit board having the light emitting device mounted thereon and guiding the outgoing light from the light emitting device to be emitted to outside. The cylindrical light guide includes the first light emitting surface as the first light outgoing region causing the light emitted from the light emitting device to pass therethrough and directly emitting the light to outside, a reflective surface reflecting the light emitted from the light emitting device to guide the light through the cylindrical light guide in the circumferential direction, and the second light emitting surface as the second light outgoing region emitting, to outside, the light reflected on the reflective surface and propagated through the cylindrical light guide.Type: GrantFiled: February 2, 2011Date of Patent: January 7, 2014Assignee: OMRON CorporationInventors: Hiroyuki Mizusaki, Daisuke Inoue, Susumu Kutsuhara
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Publication number: 20130340530Abstract: The present application provides an ultrasonic testing device. The ultrasonic testing device may include a conical backing and an ultrasonic transducer assembly positioned on the conical backing. The ultrasonic transducer assembly may include a printed circuit substrate with a number of separate transducer elements.Type: ApplicationFiled: June 20, 2012Publication date: December 26, 2013Applicant: GENERAL ELECTRIC COMPANYInventor: York Oberdoerfer
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Publication number: 20130342188Abstract: A disassociated split sensor coil manufactured from hemi-toroidal cores. Each core includes a surface channel extending from end to end, with wire sections being wound about the core to form a helical sensor coil electrically connected to a connecting wire returned through the surface channel. The connecting wires are interconnected to form a continuous electrical path, with terminal wires being electrically connectable to a monitoring circuit. Also, a method of manufacturing including obtaining a hemi-toroidal core having a surface channel, placing a first length of a wire within the surface channel so as to extend from end to end, winding a second length of the wire so as to form a helical coil section extending from end to end, providing a third length of the wire extending from one end, and repeating the steps to form a disassociated split sensor coil electrically connectable by joining the first lengths of wire.Type: ApplicationFiled: June 21, 2012Publication date: December 26, 2013Applicant: GRID SENTRY LLCInventor: Michael Wayne McKinley
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Publication number: 20130305520Abstract: This invention provides a method of fabricating transduction devices on flexible electronics that allows a complete mechatronic system to be incorporated into one system. The method uses the interconnects and pads in flexible electronics substrates to make coils, windings and electrodes for electromagnetic and electrostatic transduction. By building these systems directly into the substrate it is possible to make a complete sensing and actuating system that can be fitted onto machinery that requires power and control. The end result is a flexible, 3-dimensional structure that contains transduction, power, and control interconnections, and is customized for complex mechatronic structures and applications. This gives designers of electromechanical control systems the ability to produce a complete feedback system with sensors, actuators, connectors and electronics; all made out of one component.Type: ApplicationFiled: May 20, 2012Publication date: November 21, 2013Inventor: Trevor Graham Niblock
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Patent number: 8584345Abstract: Because reprocessing or refurbishing of physiological sensors reuses large portions of an existing sensor, the material costs for refurbishing sensors is significantly lower than the material costs for making an entirely new sensor. Typically, existing reprocessors replace only the adhesive portion of an adhesive physiological sensor and reuse the sensing components. However, re-using the sensing components can reduce the reliability of the refurbished sensor and/or reduce the number of sensors eligible for refurbishing due to out-of-specification sensor components. It is therefore desirable to provide a process for refurbishing physiological sensors that replaces the sensing components of the sensor. While sensing components are replaced, generally, sensor cable and/or patient monitor attachments are retained, resulting in cost savings over producing new sensors.Type: GrantFiled: March 7, 2011Date of Patent: November 19, 2013Assignee: Masimo CorporationInventors: Ammar Al-Ali, Yassir Abdul-Hafiz, Massi Joe E. Kiani
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Publication number: 20130291650Abstract: An ultrasonic flowmeter includes a meter body including a flow passage having wetted surfaces through which fluid flow is to be measured. The flowmeter includes a non-stick coating adhered to the wetted surfaces of the meter body. The flowmeter includes a first transducer and at least a second transducer arranged around the flow passage to transmit and receive ultrasonic energy. The flowmeter includes an electronic unit designed to generate and receive electronic signals from the transducers and to process the signals in order to compute information related to the fluid flow rate through the passage. A method for measuring fluid flow with an ultrasonic flowmeter. A method of making an ultrasonic flowmeter.Type: ApplicationFiled: May 4, 2012Publication date: November 7, 2013Inventors: Gregor J. Brown, Donald R. Augenstein, Calvin R. Hastings, William R. Freund, JR.
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Publication number: 20130269428Abstract: A measurement transducer of a thermal mass flow meter for determining the flow rate of a medium that flows through a pipe, which comprises at least one thin film resistance thermometer, which is arranged in a sheath, wherein the sheath comprises a first open end, out of which at least one cable for electrical contact with the resistance thermometer is led out of the sheath, wherein the cable in the sheath is embedded in a first fill material, at least in sections, and wherein the thin film resistance thermometer is at least partially covered by a second fill material, which is a gaseous, liquid, semi-liquid, powder or solid and in the case cited last, comprises a hardness of at most Shore A 90, and that the first fill material comprises a hardness of at most Shore D 98.Type: ApplicationFiled: June 20, 2011Publication date: October 17, 2013Applicant: Endress + Hauser Flowtec AGInventors: Tobias Baur, Fanos Christodoulou, Axel Pfau, Martin Barth, Arno Lang
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Patent number: 8558705Abstract: A RF resonator for sensing a physical or an environmental parameter includes a substrate having a substrate surface. A polymer-derived ceramic (PDC) element is positioned on or within the substrate surface. The RF resonator has a resonant frequency that changes as a function of the physical or environmental parameter. A system for wirelessly sensing at least one physical or environmental parameter includes at least one RF resonator and a wireless RF reader located remotely from the RF resonator for transmitting a wide-band RF interrogation signal that excites the RF resonator. The wireless RF reader detects a sensing signal retransmitted by the RF resonator and includes a processor for determining the physical or environmental parameter at the location of the RF resonator from the sensing signal.Type: GrantFiled: June 23, 2010Date of Patent: October 15, 2013Assignee: University of Central Florida Research Foundation, Inc.Inventors: Xun Gong, Linan An
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Patent number: 8555483Abstract: A vibrating element manufacturing method by which adhesion is stabilized and yield is improved, a vibrating element, a vibrating actuator, a lens barrel and a camera system. A vibrating element manufacturing method is provided with a first step of arranging an elastic body on a holding member, a second step of forming an electromechanical transducing element by injection molding on the surface of the elastic body, and a third step of sintering the electromechanical transducing element by heating and bonding the elastic body with the electromechanical transducer element.Type: GrantFiled: March 30, 2007Date of Patent: October 15, 2013Assignee: Nikon CorporationInventor: Takahiro Sato
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Patent number: 8549733Abstract: A transducer and method of forming a transducer is disclosed. The method comprises locating a feed wire for forming a drive pin on a reed surface, welding a first end of the feed wire to the reed, cutting the feed wire to form a drive pin, and securing the drive pin to a paddle. The first end of the feed wire can be welded to the reed by a laser welding operation. The laser melts the reed to form a molten reed material, and the feed wire is pushed through the molten reed material to form a weld between the feed wire and the reed, once the molten reed material solidifies. The wire coil is then cut with a second laser to form the drive pin. The drive pin is then adhered to a paddle with an adhesive.Type: GrantFiled: July 9, 2010Date of Patent: October 8, 2013Assignee: Shure Acquisition Holdings, Inc.Inventors: Kevin M. Bedwell, Lajos Frohlich
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Publication number: 20130255069Abstract: According to one embodiment, a method for manufacturing a pressure sensing device includes preparing a sensor unit and a mounting substrate. The sensor unit includes: a membrane body; and an element unit provided on the membrane body. The element unit includes: a first electrode; a second electrode; and a first magnetic layer provided between the first electrode and the second electrode and having magnetization in a first direction. The mounting substrate includes: a base; a first electrode pad provided on the base; and a second electrode pad provided on the base and provided apart from the first electrode pad. The method further includes joining the first electrode pad to the first electrode while heated, and joining the second electrode pad to the second electrode while heated, with an external magnetic field along the first direction applied to the sensor unit.Type: ApplicationFiled: December 11, 2012Publication date: October 3, 2013Inventors: Yoshihiro HIGASHI, Michiko Hara, Hideaki Fukuzawa, Yoshihiko Fuji, Hiromi Yuasa, Tomohiko Nagata
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Patent number: 8542865Abstract: An electromechanical transducer 180, motor structure 200 and voice coil winding support structure or bobbin 210 are configured to protect and transport heat away from a voice coil 220 which is would solely within the interior of bobbin 210 and configured for reciprocating movement in close proximity to an extended cooling pole piece 204. A compact, economical and efficient adaptation of a pancake style motor includes generous volume for a powerful magnet 208, while providing an extended, linear range of excursion and continuous cooling for the generously overhung voice coil 220.Type: GrantFiled: March 10, 2008Date of Patent: September 24, 2013Inventor: Robert M. O'neill
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Publication number: 20130241919Abstract: This disclosure provides systems, methods and apparatus for electromechanical systems devices that can be switched between a transmissive state and a reflective state. In one aspect, the electromechanical systems devices is a display device including a movable layer disposed over an optical stack having a partially transmissive and a partially reflective layer that has a high refractive index and a low absorption coefficient. The movable layer is configured to be actuated between a first position and a second position such that the display device displays a color when the movable layer is in the first position and displays black when the movable layer is in the second position. Alternately, the display device displays white when the movable layer is in the first position and displays a color when the movable layer is in the second position.Type: ApplicationFiled: August 20, 2012Publication date: September 19, 2013Applicant: QUALCOMM MEMS Technologies, Inc.Inventor: Marc Maurice Mignard
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Publication number: 20130225944Abstract: A sensor assembly includes: an electrically insulating and flexible body (13), in the form of a plate having a first face (13a) and a second face (13b); and a first sensor (15; 315) and a second sensor (17), which are incorporated in the body (13). The first sensor (15) is set between the first face (13a) and the second sensor (17), and the second sensor (17) is set between the first sensor (15) and the second face (13b).Type: ApplicationFiled: February 25, 2013Publication date: August 29, 2013Applicant: STMicroelectronics S.r.l.Inventor: STMicroelectronics S.r.l.
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Patent number: 8516681Abstract: In a loud speaker, the diaphragm has a protruded part protruding on a yoke side on the inside and in the vicinity of an inner coupling part as a coupled portion to a voice coil. The loud speaker can be manufactured with the voice coil accurately positioned with respect to a diaphragm, and the voice coil is accurately vibrated vertically inside a magnetic gap. The possibility of the voice coil coming into contact with a plate and a yoke as a magnetic circuit body of the loud speaker can be reduced, thereby to improve production efficiency and a yield at the time of manufacturing the loud speaker.Type: GrantFiled: October 20, 2009Date of Patent: August 27, 2013Assignee: Panasonic CorporationInventors: Mitsukazu Kuze, Takehiko Tanabu, Satoshi Itoh, Masashi Kawabe, Mamiko Tsutsumi
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Patent number: 8518733Abstract: Provided is a method of manufacturing an electromechanical transducer having a reduced variation in a breakdown strength caused by a variation in flatness of an insulating layer. In the method of manufacturing the electromechanical transducer, a first insulating layer is formed on a first substrate, a barrier wall is formed by removing a part of the first insulating layer, and a second insulating layer is formed on a region of the first substrate after the part of the first insulating layer has been removed. Next, a gap is formed by bonding a second substrate on the barrier wall, and a vibration film that is opposed to the second insulating layer via the gap is formed from the second substrate. In the forming of the barrier wall, a height on a gap side in a direction vertical to the first substrate becomes lower than a height of a center portion.Type: GrantFiled: September 11, 2012Date of Patent: August 27, 2013Assignee: Canon Kabushiki KaishaInventors: Ayako Kato, Kazutoshi Torashima
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Publication number: 20130208764Abstract: The present disclosure relates to a composite material for a temperature sensor, and a method of manufacturing the temperature sensor using the same. The composite material according to the disclosure may contain four or more kinds of metal oxides that are combined with highly insulating materials, thereby producing a material with semiconductor-like properties that makes it possible to easily and accurately measure a temperature even at a high temperature in the range of 500° C. and above. Furthermore, unlike a conventional temperature sensors in which an electrode is printed/plated on the device surface, the sensor of the disclosure includes electrode wires with a predetermined diameter that are inserted into the metal oxide of the temperature sensor during a process in which the metal oxide is press-molded to form the temperature sensor so the electrode wires are prevented from becoming disconnected from the device.Type: ApplicationFiled: May 11, 2012Publication date: August 15, 2013Applicants: Industry-Academic Cooperation Foundation, Chosun University, HYUNDAI MOTOR COMPANYInventors: Na Yun Ko, Tae Seung Lee, Jin Seong Park
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Patent number: 8505190Abstract: Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensor 100 includes (A) applying a polymer 120 to a base substrate 110, (B) patterning the polymer 120 so as to form an opening part 125 in the polymer 120, (C) completing a cap 130 by forming a cavity 115 on the base substrate 110 exposed fro the opening part 125 through an etching process in a thickness direction, and (D) bonding the cap 130 to a device substrate 140 by using a polymer 120, whereby the polymer 120 is applied to the base substrate 110 in a constant thickness D3, such that the cap 130 may be easily bonded to the device substrate 140 by using the polymer 120.Type: GrantFiled: July 11, 2011Date of Patent: August 13, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hyun Kee Lee, Tae Joon Park, Sang Kee Yoon, Hyung Jae Park, Yeong Gyu Lee, Heung Woo Park
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Patent number: 8499434Abstract: A method of creating an improved sensitivity capacitive fingerprint sensor involves forming vias from a first side of a sensor chip having an array of capacitive sensors, making the vias electrically conductive, and attaching a cover plate over the first side of the sensor chip spaced from the sensor chip by a distance of less than 25 ?m. An improved sensitivity capacitive fingerprint sensor has a capacitive sensor array including multiple sensor cells and electrically conductive, through-chip vias extending from connection points for sensor cell circuitry to a back side of the capacitive sensor array, a chip including active detection circuitry and electrical connection points, the electrical connection points being respectively connected to corresponding ones of the sensor cell circuitry connection points, and a cover plate, disposed above the sensor cells at a spacing of less than 25 ?m.Type: GrantFiled: November 11, 2009Date of Patent: August 6, 2013Assignee: Cufer Asset Ltd. L.L.C.Inventors: Abhay Misra, John Trezza
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Publication number: 20130192056Abstract: An electromechanical transducer of the present invention includes a first electrode, a vibrating membrane formed above the first electrode through a gap, a second electrode formed on the vibrating membrane, and an insulating protective layer formed on a surface of the second electrode side. A region where the protective layer is not formed is present on at least part of a surface of the vibrating membrane.Type: ApplicationFiled: March 11, 2013Publication date: August 1, 2013Applicant: CANON KABUSHIKI KAISHAInventor: CANON KABUSHIKI KAISHA
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Publication number: 20130182745Abstract: A low-profile temperature sensor probe is disclosed as including a probe circuit subassembly having a temperature sensing thermistor, the subassembly being overmolded with a durable insulating material to form the probe body. The probe body forms a connector block portion and a flexible extension portion. The flexible extension portion enables the sensor probe to conform to the surface of the object to be sensed without undue strain on the components. The thermistor element is located in a protective pocket and positioned relative the probe body to ensure direct contact with the object to be sensed. The connector block is configured to accommodate a standard plug-in type electrical connector.Type: ApplicationFiled: January 3, 2013Publication date: July 18, 2013Applicant: Therm-O-Disc, IncorporatedInventor: Therm-O-Disc, Incorporated
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Patent number: 8479376Abstract: A method produces a magnetostrictive torque sensor which detects a steering torque applied to a steering shaft by electrically detecting distortion of magnetostrictive films provided on a surface of the steering shaft. A plating step forms the magnetostrictive film on the surface of the steering shaft, and a heat treatment step heat treats the magnetostrictive film on the steering shaft. During the heat treatment step, hydrogen in the magnetostrictive film is decreased so that a hydrogen desorbing peak around 120° C. disappears when the magnetostrictive film is heated after the heat treatment step.Type: GrantFiled: March 10, 2010Date of Patent: July 9, 2013Assignee: Honda Motor Co., Ltd.Inventors: Yasuo Shimizu, Nagatsugu Mukaibou
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Patent number: 8479576Abstract: The present invention discloses a MEMS (Micro-Electro-Mechanical System, MEMS) device with a deformation protection structure. The MEMS device is located on a substrate, and it includes: a movable part; and a deformation protection structure, which has: a fixed plug, which is fixed on the substrate; multiple metal layers, including a top metal layer; and multiple plugs connecting the multiple metal layers. From top view, the top metal layer overlaps a portion of the movable part, and from cross section view, the bottom surface of the top metal layer is higher than the top surface of the movable part by a predetermined distance.Type: GrantFiled: March 8, 2011Date of Patent: July 9, 2013Assignee: Pixart Imaging IncorporationInventor: Chuan-Wei Wang
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Patent number: 8474134Abstract: A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element having an optical function part and bonding pads therearound is mounted by wire bonding, with an upper face of the element upward. A bank to dam a liquid sealing resin is provided around the optical functional element on the substrate, and the liquid sealing resin is dropped and filled between the optical functional element and the bank such that the bonding pads and partial gold wires for the wire bonding are exposed. A package-component member having a hole corresponding to the optical functional element is abutted to the bank such that the hole is opposed to the function part of the functional element. Thereby, the package-component member is contacted to the liquid sealing resin. The package-component member is fixed to the substrate by curing the liquid sealing resin, and the bank is cut away.Type: GrantFiled: March 19, 2010Date of Patent: July 2, 2013Assignee: Dexerials CorporationInventors: Yoshihiro Yoneda, Takahiro Asada, Kazuaki Suzuki
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Patent number: 8458889Abstract: An actuator manufacturing method includes alternately stacking a plurality of dielectric elastomer layers and a plurality of conductive rubber layers along the direction of thickness to form a sheet, and wrapping the sheet formed about a core to form a rolled sheet. When the sheet formed in the step of alternately stacking is wrapped about the core, the sheet is formed by the dielectric elastomer layers and the conductive rubber layers. Therefore, even if the dielectric elastomer layers in the sheet are made to be thin, the thickness of the entire sheet is prevented from being excessively thin.Type: GrantFiled: August 30, 2011Date of Patent: June 11, 2013Assignee: Toyoda Gosei Co., Ltd.Inventors: Yutaka Tsuchikawa, Takashi Maeno, Naoto Kuriyama, Takanori Nakai, Hiromitsu Takeuchi, Yoji Kimura
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Publication number: 20130135890Abstract: The invention provides an equipment indicator lamp and a method for assembling the same. The equipment indicator lamp includes: a light source fixed and electrically connected to a circuit board; and a display part disposed on a housing of an equipment, so that the light emitted from the light source is projected out of the equipment via the display part. The equipment indicator lamp according to the invention has less elements, thus the material cost and manufacturing steps are reduced, the manufacturing process is easy to control, the lifespan of the light source is prolonged, and the whole appearance of the configuration become concise and artistic.Type: ApplicationFiled: June 7, 2012Publication date: May 30, 2013Applicant: DELTA ELECTRONICS, INC.Inventors: Lunzi Jing, Wuming Ku
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Patent number: 8448327Abstract: A method of manufacturing radiation tomography apparatus according to this invention includes a first spacer joining step of joining a spacer to a radiation detector, and a second spacer joining step of joining both the radiation detectors to each other via the spacer such that clearance between adjacent scintillators corresponds to integral multiples of an arrangement pitch of scintillation counter crystal. Accordingly, the scintillators provided in the radiation tomography apparatus of this invention are arranged more regularly, which achieves enhanced spatial resolution of the radiation tomography apparatus.Type: GrantFiled: May 12, 2008Date of Patent: May 28, 2013Assignee: Shimadzu CorporationInventor: Hiromichi Tonami
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Patent number: 8438718Abstract: A movable device of acceleration sensors and a vibration device of a gyroscope are formed on the same sensor wafer spaced apart from each other by a wall. A cap wafer having gaps corresponding to the movable mechanical components of the acceleration sensors and gyroscope is provided for the wafer and an adsorbent divided into a plurality of divisional portions is disposed in the gap for the gyroscope. After the sensor wafer and the cap wafer have been bonded together at a temperature of inactivation of the adsorbent and in an atmospheric pressure ambience of noble gas and activated gas, the adsorbent divisional portions are activated in sequence to adsorb the activated gas so as to adjust the pressure inside the gyroscope, thus manufacturing a combined sensor wafer.Type: GrantFiled: February 16, 2011Date of Patent: May 14, 2013Assignee: Hitachi Automotive Systems, Ltd.Inventors: Takanori Aono, Kengo Suzuki, Akira Koide, Masahide Hayashi
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Patent number: 8434211Abstract: A method for manufacturing a measuring apparatus for capacitive determining and/or monitoring of at least the fill level of a medium. The measuring apparatus has a probe unit and an electronics unit. During a measurement, the electronics unit supplies the probe unit with an exciter signal and receives from the probe unit a received signal, from which the electronics unit ascertains a capacitance value. The probe unit is coated with an insulation layer, the coated probe unit is connected with the electronics unit and inserted into a container containing a calibration medium, the coated probe unit is covered completely by the calibration medium and an associated received signal is gained, and, with the associated received signal, at least one adjustable component of the electronics unit is set.Type: GrantFiled: August 12, 2009Date of Patent: May 7, 2013Assignee: Endress + Hauser GmbH + Co. KGInventors: Volker Dreyer, Armin Wernet
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Publication number: 20130104660Abstract: An ultrasonic transducer module for an ultrasonic sensor for detection and/or examination of value documents which includes at least one piezoelectric ultrasonic transducer with electrical connecting strands, and a mounting module for holding the ultrasonic transducer for mounting on a connection support. The mounting module has conducting paths which are electrically connected to the connecting strands of the ultrasonic transducer and which have contact areas which are so configured that the ultrasonic transducer module is placeable for mounting onto a surface of the connection support on which there are located contact areas complementary to the conducting path contact areas, with the contact areas and the complementary contact areas being solderable to each other.Type: ApplicationFiled: July 6, 2011Publication date: May 2, 2013Applicant: GIESECKE & DEVRIENT GMBHInventors: Joseph Lohner, Hans-Uwe Moosler, Ernst Rausch, Walter Berngeher
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Patent number: 8429808Abstract: A method for fabricating electrostatic transducers and arrays electrically separates the substrate segments of the transducer elements from each other using a technique involving two cutting steps, in which the first step forms a patterned opening in the substrate to make a partial separation of substrate segments, and the second step completes the separation after the substrate segments have been secured to prevent instability of the substrate segments upon completion of the second step. The securing of the substrate segments may be accomplished by filling a nonconductive material in the partial separation or securing the transducer array on a support substrate. When the substrate is conductive, the separated substrate segments serve as separate bottom electrodes that can be individually addressed. The method is especially useful for fabricating ID transducer arrays.Type: GrantFiled: December 3, 2008Date of Patent: April 30, 2013Assignee: Kolo Technologies, Inc.Inventor: Yongli Huang
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Patent number: 8429809Abstract: A method for manufacturing a mirror device is presented. The method includes forming a mirror from a first substrate and forming a hinge/support structure from a second substrate. The hinge/support structure is formed with a recessed region and a torsional hinge region. The mirror is attached to the hinge/support structure at the recessed region. Further, a driver system is employed to cause the mirror to pivot about the torsional hinge region.Type: GrantFiled: January 10, 2012Date of Patent: April 30, 2013Assignee: Texas Instruments IncorporatedInventor: John W. Orcutt
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Publication number: 20130098664Abstract: A resolution-adjustable touch panel and a manufacturing method thereof. The resolution-adjustable touch panel includes a substrate, a plurality of first, second, third and fourth sensor strings, and a flexible printed circuit. The flexible printed circuit board includes a plurality of first, second, third and fourth pins. The first and third pins are respectively and electrically connected to the first and third sensor strings, and the second and fourth pins are respectively and electrically connected to the second and fourth sensor strings by dummy pins. From this, a different-resolution touch panel can be made from the substrate with the same sensor string. Thus, the cost for masks can be reduced.Type: ApplicationFiled: August 22, 2012Publication date: April 25, 2013Applicant: HANNSTAR DISPLAY CORP.Inventors: Yi-Chung Juan, Hsuan-Chen Liu, Sung-Chun Lin, Wen-Chi Lin
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Publication number: 20130062223Abstract: A gas sensor having first and second electrodes, an ion conducting solid electrolyte membrane positioned therebetween, first and second electrically conductive gas diffusion layers, first and second electrode contact members for electrically coupling said first and second electrodes to an external circuit, a water reservoir, a gas entry passageway and a water permeation barrier for controlling the transport of water vapor to the ion conducting solid electrolyte membrane. The water permeation barrier is a thin walled member which allows water vapor to diffuse therethrough and evaporate from an exit surface, the thickness of the water permeation barrier controlling the internal relative humidity of the sensor. A method for adjusting the present sensor in-situ due to changes in the current humidity conditions of the sensor so as to keep the gas sensitivity loss within a predetermined range is also disclosed.Type: ApplicationFiled: September 7, 2012Publication date: March 14, 2013Inventor: Michael David Rabbett
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Publication number: 20130061456Abstract: The invention relates to a method of replacing a defective sensor (100) of a surveillance system for monitoring in particular the pressure of the wheels of a vehicle (V) of the type of that comprising: wireless sensors (100) disposed in each wheel and a receiver; a unique identifier number being assigned to each sensor (100) thus making it possible for the receiver to identify the signal. This method is noteworthy in that it consists in: removing the defective sensor (100); identifying and logging the unique identifier number of the defective sensor (100); identifying and logging the communication protocol used on the vehicle; assigning said unique identifier number to a new virgin sensor (200, 200?) with neither assigned communication protocol nor assigned identifier number and simultaneously; programming the new sensor (200, 200?) so that it utilizes said communication protocol. The invention also relates to the device D and the sensor 200 making it possible to implement same.Type: ApplicationFiled: November 19, 2010Publication date: March 14, 2013Applicant: LDL TechnologyInventors: Philippe Lefaure, Thierry Moreau
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Patent number: 8381386Abstract: A method of manufacturing a boundary acoustic wave device includes the steps of forming an electrode on a first medium layer, forming a second medium layer so as to cover the electrode on the first medium layer, and forming a sound absorbing layer on an external surface of the second medium layer. The sound absorbing layer has an acoustic velocity of transverse waves that is lower than an acoustic velocity of transverse waves of the second medium layer.Type: GrantFiled: December 23, 2008Date of Patent: February 26, 2013Assignee: Murata Manufacturing Co., Ltd.Inventor: Hajime Kando
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Patent number: 8365390Abstract: A method for affixing adhesive films to a main board is provided. The main board includes a main body and a shield. The shield includes a first shield and a second shield. The second shield defines openings. When the second shield is attached to the main body, components of the main body are confined within the openings, respectively. The method includes: first absorbing a single adhesive film to an electrostatic absorbing film. Then, stamping the electrostatic absorbing film and the single adhesive film to form adhesive films that have substantially the same shape and arrangement as the openings. Next, aligning the electrostatic absorbing film with the first shield and affixing the adhesive films to the first shield. Then, removing the electrostatic absorbing film from the first shield. And, assembling the first shield to the second shield.Type: GrantFiled: July 26, 2010Date of Patent: February 5, 2013Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Hua-Lin Lv, Kok-Kan Chan, Ting-Jian Zou, Yu Zou, Kai-Gui Wang
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Publication number: 20130028291Abstract: According to one embodiment, a temperature measurement system including: a plurality of thermocouples; a transmission signal conversion unit configured to convert, to a transmission signal, the thermo-electromotive force generated by each of the plurality of the thermocouple and configured to output the transmission signal; a plurality of transmission units configured to transmit the transmission signal outputted from the transmission signal conversion unit; a first connection unit configured to connect between each of the plurality of the transmission units; a second connection unit configured to connect at least one of the plurality of transmission units to a processing unit configured to process the transmission signal; and a housing unit configured to house at least the first connection unit.Type: ApplicationFiled: July 6, 2012Publication date: January 31, 2013Applicants: Toshiba Plant Systems & Services Corporation, Kabushiki Kaisha ToshibaInventors: Masayuki TOBO, Mamoru Fukui, Kazuhisa Watanabe, Hisanari Yoshida, Shigeru Yamaji, Makoto Suto
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Patent number: 8359728Abstract: A method for manufacturing a corrosion sensor includes applying a first layer of non-conductive material to a substrate, writing a conductive material at discrete locations on the non-conductive material, and writing the conductive material at discrete locations on the previously written conductive material. The method further includes applying a second layer of non-conductive material over the conductive material and machining at least a portion of the second layer of non-conductive material to expose at least a portion of the conductive material.Type: GrantFiled: January 6, 2011Date of Patent: January 29, 2013Assignee: General Electric CompanyInventors: Rebecca Evelyn Hefner, Paul Stephen DiMascio
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Publication number: 20130019462Abstract: Disclosed is a method of manufacturing a flat panel detector such that the surface on the sale of a fluorescent body layer of a scintillator panel which has the fluorescent body layer comprising a column crystal on the supporting body, is coupled to the planar light receiving element surface of a light-receiving element, comprising: a step of manufacturing the scintillator panel which has a larger area than that of the planar light receiving element surface; a step of trimming the edges of the scintillator panel, obtained by the step of manufacturing the scintillator panel, to correspond to the area of the planar light receiving element surface; and a step of coupling the edge-trimmed scintillator panel to the planar light receiving element surface, thus providing a flat panel detector which has an excellent productivity and that can be made small in size without non-image area.Type: ApplicationFiled: February 25, 2011Publication date: January 24, 2013Applicant: KONICA MINOLTA MEDICAL & GRAPHIC, INC.Inventors: Takehiko Shoji, Keiko Itaya, Masashi Kondo, Makoto Iijima
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Publication number: 20130017727Abstract: A sensor or detector device includes a box in the form of a tubular hollow body, through whose opening a connecting cable passes and that is sealed by a connected plug. The device also includes a card or an analogous substrate, carrying the electronic components of the sensor or detector and mounted in the box, by being coated by an insulating filler material filling approximately the entire remaining inside volume of the latter. The Device (1) is characterized in that it includes a mechanical element for the positioning with wedging of the card (6) in the box, preferably along a median plane or with longitudinal symmetry (PM) of the latter, with at least a portion of the element being integrated in the plug (5).Type: ApplicationFiled: July 16, 2012Publication date: January 17, 2013Applicant: SENSTRONIC (SOCIETE PAR ACTIONS SIMPLIFIEE )Inventors: Joël Franc, Remy Kirchdoerffer