Abstract: An electronic device includes a plurality of antenna units and a circuit. At least one of the antenna units includes a first electrode, a phase modulation electrode, and a liquid crystal layer located between the first electrode and the phase-shift electrode. The circuit provides a first AC signal directly to the phase modulation electrode, and it provides a second AC signal indirectly to the phase-shift electrode.

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

Abstract: A system and method for a multi-panel multi-function active electronically scanned array (AESA) radar operation receives radar commands from individual aircraft systems and segments a plurality of AESA panels fixed (at variable azimuth/elevation about the aircraft) into a plurality of subarrays to carry out each individual function commanded by the individual aircraft system. Dependent on aircraft status and phase of flight, the and individual AESA are designated for use and the subarrays are sized based on desired radar function at the specific phase of flight and specific threat associated with the phase. The system dynamically shifts the designated AESA, subarray size, beam characteristics, power settings, and function to enable multiple simultaneous function of the suite of AESA panels.

Abstract: A transaction card (smartcard) having a front “continuous” or non-continuous metal layer (ML, CML, DML) with a module opening (MO) for a dual-interface transponder chip module (TCM). Coating polyurethane resin may be used to replace (in lieu of) adhesive film layers and plastic slugs, and to fill module openings, cut-outs and voids in a metal transaction card. The amplifying element (BAC) and magnetic shielding layer may be encapsulated in a polyurethane resin. The resin may further fill and seal the module opening in the front face continuous metal layer and any voids or recesses in subsequent layers. The resin may fill and seal any discontinuity or opening in the rear discontinuous metal layer. The dual interface chip module may be implanted in a milled-out cavity in the polyurethane resin. Removed metal sections may also be encased in polyurethane resin.

Abstract: A slot antenna assembly adapted to a metal case is provided in the disclosure. The slot antenna assembly includes a substrate and a metal wire. The substrate includes a first sheet plate and a second sheet plate. The first sheet plate is conductive and is provided with a slot opposite to an opening of the metal case, a size of the slot being less than or equal to a size of the opening. The second sheet plate is not conductive and is connected to the first sheet plate. The metal wire is located on a surface of the second sheet plate to be connected to a feeding signal. A vertical projection of the metal wire on the first sheet plate crosses the slot, and the metal wire and the slot together excite a low-frequency mode and a high-frequency mode.

Abstract: An antenna offset compensation determination method includes: transmitting, from a first apparatus to a second apparatus, one or more first signals from a first plurality of antenna elements, of a first antenna of the first apparatus, and one or more second signals from a second plurality of antenna elements, of the first antenna; receiving, at the first apparatus from the second apparatus, one or more first indications of a first linear offset of a first signal distinction line relative to a second antenna of the second apparatus, the first signal distinction line corresponding to a first transition between the one or more first signals and the one or more second signals as received by the second antenna; and determining, based on the first linear offset, one or more compensation parameters for compensating for the first linear offset.

Abstract: The present invention is directed to a composite material with a high dielectric constant. In certain embodiments, the composite material of the invention is biocompatible and is used in an implantable medical device, such as an implantable antenna, probe, sensor or electrode. In certain embodiments, the present invention comprises a biocompatible conductive or semi-conductive filler comprising filler particles dispersed within a biocompatible electrically insulating material. The filler particles may comprise an electrically insulating coating.

Abstract: An image display device according to an embodiment of the present disclosure includes a display panel, a touch sensor structure and an antenna electrode layer. The display panel includes a panel substrate, and an electrode structure and an insulation structure stacked on the panel substrate. The touch sensor structure is disposed on the display panel. The antenna electrode layer is disposed on the display panel at the same level as that of the touch sensor structure and at least partially overlaps the electrode structure of the display panel in a thickness direction. The antennal electrode layer is disposed in consideration of an electrode construction of the display panel and the touch sensor structure to provide a thin-layered image display device with high reliability.

Abstract: A radio-frequency device comprises an encapsulation material and a radio-frequency chip embedded into the encapsulation material, wherein the radio-frequency chip has a first main surface and a second main surface. The radio-frequency device furthermore comprises an electrical redistribution layer arranged over the first main surface of the radio-frequency chip and the encapsulation material, and a radio-frequency antenna formed in the redistribution layer and configured to emit signals in a direction pointing from the second main surface to the first main surface and/or to receive signals in a direction pointing from the first main surface to the second main surface. The radio-frequency device furthermore comprises a microwave component having an electrically conductive wall structure, the microwave component being arranged below the radio-frequency antenna and embedded into the encapsulation material.

Abstract: A functional vehicle component and related methods include a transmitter coil and a molded part. The molded part includes a first thermoformed film, a molded polymeric structural layer arranged under the film, a printed electronic circuit arranged under the film and adjacent the structural layer, an optional second thermoformed film, and graphics on the first film. The electronic circuit includes a receiver coil, conductive traces, and electronic elements. The first film is arranged to cover the polymeric structural layer and the electronic circuit to thereby define an exposed surface of the molded part. The first film and/or the graphics camouflages the circuit. The transmitter coil is connected to an external power source, and is arranged on the molded part such that the receiver coil is inductively coupled to the transmitter coil so as to wirelessly power the electronic elements of the circuit.

Abstract: A biostimulator, such as a leadless cardiac pacemaker, having a header assembly that includes an antenna, is described. The antenna can be integrated into an insulator that separates an electrode of the header assembly from a flange of the header assembly. The antenna includes an antenna loop embedded in a ceramic material of the insulator. The antenna loop is located distal to the flange to reduce the likelihood of signal interference and increase communication range of the antenna. The header assembly is mounted on a housing have an electronics compartment, and an antenna lead extends from the antenna loop to electronic circuitry contained within the electronics compartment. Other embodiments are also described and claimed.

Abstract: A semiconductor package includes a semiconductor die, an encapsulation layer and at least one antenna structure. The encapsulation layer laterally encapsulates the semiconductor die. The at least one antenna structure is embedded in the encapsulation layer aside the semiconductor die. The at least one antenna structure includes a dielectric bulk, and a dielectric constant of the dielectric bulk is higher than a dielectric constant of the encapsulation layer.

Abstract: A closed-loop motion monitoring and control system for structural mode control in a large, flexible space structure. The system uses combined sensor data to detect low-magnitude, low-frequency motion, estimate structure deformation constants, and damp structural vibrations with electromagnetic torque application.

Abstract: An antenna assembly for use with a medical implant includes an antenna that defines at least one turn and an electromagnetic shield.

Abstract: A tire including a rubber sheet which covers an end of the carcass ply which has been folded back and an RFID tag serving as an electronic component provided between the bead filler and the rubber sheet, in which the bead filler is formed in an annular shape, the rubber sheet is formed in an annular shape by one end side and another end side of a long sheet being joined, and the RFID tag serving as the electronic component is disposed between the bead filler and the rubber sheet at a joint part which is a portion of the rubber sheet which is joined.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.

Abstract: The present disclosure provides a manufacturing method of a flat panel liquid crystal antenna, including the following steps: providing a first substrate, wherein the two sides of the first substrate are provided with a first metal film layer and a third metal film layer respectively; simultaneously patterning the metal film layer on the two sides to obtain a patterned first metal film layer and a patterned third metal film layer; providing a second substrate, wherein one side of the second substrate is provided with a second metal film layer; patterning the second metal film layer to obtain a patterned second metal film layer; and oppositely bonding the first substrate and the second substrate to form a liquid crystal cell, and preparing a liquid crystal layer. The present disclosure also provides a flat panel liquid crystal antenna by using the above method.

Abstract: A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.

Abstract: A display device includes a display panel in which an active area and a peripheral area are defined, and an antenna unit including a main pattern, a first sub-pattern, and an antenna line. The main pattern is disposed on the display panel in the active area, transmits and/or receives a signal, and operates at a first frequency. The first sub-pattern is disposed on the display panel in the active area, is spaced apart from the main pattern in a first direction, is capacitively coupled to the main pattern, and operates at a second frequency different from the first frequency.

Abstract: A radio frequency (RF) system comprises an RF-array of antenna elements, a regulating arrangement to tune the antenna elements' impedances and a camera system to acquire image information of the RF-array. An analysis module is provided to derive operational settings such as resonant tuning settings, decoupling and impedance matchings of the antenna elements' impedances from the image information. The image information also represents the actual impedances and resonant properties of the RF-array. From the image information appropriate impedance settings can be derived that are the tuning parameters to render the RF-array resonant.

Abstract: An electrical component includes an electrical part and a flat carrier on which the electrical part is disposed. A housing accommodates the carrier with the electrical part such that the part on the carrier is situated opposite a housing section to which the carrier is connected. An annular casing composed of a flexible material completely surrounds the electrical part and bears against the carrier by way of its first end and against the housing section by way of its second end. A potting compound surrounds the electrical part within the casing and at least partially fills the free volume. A method for producing an electrical component is also provided.

Abstract: Discussed is a touch display device having an antenna disposed in a panel, thereby improving product reliability while reducing manufacturing cost. The touch display device includes a display unit including a plurality of pixels disposed in an active area, an encapsulation unit disposed on the display unit, the encapsulation unit being configured to seal the plurality of pixels, a touch sensor unit including a plurality of touch sensors disposed on the encapsulation unit, an antenna pattern disposed at an edge on the touch sensor unit in the state in which a planarization layer is interposed therebetween, the antenna pattern not overlapping a touch electrode and a touch routing line included in the touch sensor unit, and a ground plane disposed in an identical layer to any one metal layer belonging to the display unit, the ground plane overlapping the antenna pattern.

Abstract: Provided are a liquid crystal phase shifter, a manufacturing method thereof, and a liquid crystal antenna. The liquid crystal phase shifter includes a first substrate, a second substrate, microstrips, a ground electrode, and liquid crystals located between the at least one microstrip and the ground electrode. The microstrip line is disposed on a side of the second substrate facing towards the first substrate and includes a first transmission line and a second transmission line that are each a coil and are nested with each other in a direction perpendicular to a plane of the second substrate. The coiling transmission directions of radio frequency signals transmitted on the first and second transmission lines are opposite. The ground electrode overlaps both the first transmission line and the second transmission line in the direction perpendicular to the plane of the second substrate.

Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.

Abstract: An antenna structure utilizing metallic frame of electronic device to simultaneously send and receive radio waves on multiple frequencies includes first and second feeding sources and the metallic frame. A notch in the metallic frame creates first and second radiating portions. The first feeding source feeds the first radiating portion, and a first mode and a second mode can be activated simultaneously to generate radiation signals in a first frequency band and a second frequency band. The second feeding source feeds the second radiating portion and a third mode and a fourth mode can be simultaneously activated to generate radiation signals in a third frequency band and a fourth frequency band. A wireless communication device is also provided. The wireless communication device includes a motherboard and the antenna structure.

Abstract: A method for manufacturing antenna pattern according to an embodiment includes an adhesive arranging step, a metal sheet arranging step, a cutting step, a removing step, and a pressurizing step. In the adhesive arranging step, an adhesive is arranged inside with respect to a perimeter line of the antenna pattern arranged on a continuous body while conveying the continuous body of a base material.

Abstract: Method of producing wire inlaid on a support and inlaid wire obtained. The invention relates to an antenna for radiofrequency transponder, said antenna comprising conducting wire portions which are to a major extent inlaid and conducting wire portions which are to a minor extent non-inlaid on a plane support. The antenna is characterized in that said wire portions which are to a minor extent non-inlaid extend over or cross at least one favoured fold line and/or one fold line predefined according to a standardized folding resistance test. The invention also relates to a portable electronic object comprising said antenna and a corresponding method of production.

Abstract: In one embodiment, a radio-frequency identification (RFID) tag includes a substrate having a top surface including first and second ends, a bottom surface, first and second end surfaces, and opposed lateral surfaces, a passive RFID integrated circuit (IC) chip mounted to the top surface of the substrate, a monopole antenna that includes a planar radiating arm that extends out from the RFID IC chip along the top surface of the substrate to the first end of the top surface of the substrate and a matching loop having two grounded matching stubs that surround the chip and a portion of the radiating arm, each matching stub comprising a longitudinal segment that extends along a longitudinal direction of the substrate and a transverse segment that extends along a transverse direction of the substrate along the top surface of the substrate to the radiating arm at a point located between the RFID IC chip and the first end of the top surface, and a ground plane formed on the bottom surface, the second end surface, and

Abstract: Methods and systems for a thin bonded interposer package are disclosed and may, for example, include bonding a semiconductor die to a first surface of a substrate, forming contacts on the first surface of the substrate, encapsulating the semiconductor die, formed contacts, and first surface of the substrate using a mold material while leaving a top surface of the semiconductor die not encapsulated by mold material, forming vias through the mold material to expose the formed contacts. A bond line may be dispensed on the mold material and the semiconductor die for bonding the substrate to an interposer. A thickness of the bond line may be defined by standoffs formed on the top surface of the semiconductor die.

Abstract: A machine includes a first machine substrate and a second machine substrate and a monitoring system for the machine. The monitoring system includes a sensor subsystem including a sensor substrate integral with the first machine substrate and at least one sensor electromagnetic structure coupled to at least a portion of the sensor substrate. The at least one sensor electromagnetic structure includes at least one sensor conducting sub-component. The at least one sensor electromagnetic structure is configured to regulate electromagnetic fields incident thereto in response to at least one measurement characteristic of a machine measurand. The sensor subsystem is configured to obtain at least one measurement characteristic of the machine measurand proximate a machine sensing position.

Abstract: In one embodiment, a radio-frequency identification (RFID) tag including a substrate having a top surface, bottom surface, opposed end surfaces, and opposed lateral surfaces, a passive RFID integrated circuit (IC) chip mounted to the top surface of the substrate, a monopole antenna that includes a planar radiating arm that extends out from the RFID IC chip along the top surface of the substrate and a matching loop having two grounded matching stubs that surround the chip and a portion of the radiating arm, and a ground plane formed on the bottom surface, an end surface, and the top surface of the substrate, the ground plane being electrically coupled to the matching stubs and the radiating arm.

Abstract: An antenna, including at least one set of conductive arms radiative at a resonant frequency, the at least one set of conductive arms including a first conductive arm having a first terminus and a second conductive arm having a second terminus, the first and second termini being closely spaced so as to form a capacitive gap therebetween, the capacitive gap having a width, a feed connection located on the first conductive arm, a first electrical length being defined along the first conductive arm between the feed connection and the first terminus, a ground connection located on the second conductive arm, a second electrical length being defined along the second conductive arm between the ground connection and the second terminus, the resonant frequency depending at least on the width of the capacitive gap and on the first and second electrical lengths, a total electrical length along the set of conductive arms between the first and second termini being less than or equal to half of a wavelength corresponding to

Abstract: An injection-molded case and a manufacturing method thereof having antenna patterns are formed in the injection-molded case by only one insert injection molding process, without a second insert injection molding process as required in the conventional manufacture. The injection-molded case preferably includes: one or more antenna patterns fabricated by a press process; and an injection-molded case part having the antenna patterns provided therewithin, which is fabricated by fixing the antenna patterns on an injection mold and carrying out only one insert injection molding process.

Abstract: The invention relates to an external connector for the production of an electronic card comprising an insulating support that defines an outside face and an inside face opposite one another and a plurality of external metal contact pads. This external connector additionally comprises a plurality of metal projections located on the side of the inside face of the insulating support and respectively connected electrically to at least one subassembly of the plurality of external metal contact pads and/or to contact pads linked to an electronic unit, which is arranged on the inside face of the insulating support, wherein these metal projections are intended to be inserted into individual cavities of the body of the electronic card, and metal contact pads linked to an electronic unit inside the card body and/or an antenna incorporated in this card body are located at the base of these cavities.

Abstract: There is disclosed an antenna device relating to a single or dual band antenna system for use in mobile telecommunications devices, laptop and tablet computers, USB adapters and electrically small radio platforms comprising a pair of antennas attached to a conductive ground plane, the antennas being separated by free space in which at least one notch is formed in the conductive ground plane between the pair of antennas characterized in that the notch further includes an inductive component and a capacitive component providing good antenna isolation so as to enable MIMO operation or diversity operation.

Abstract: A “thin” and cost-effective three-dimensional antenna assembly and methods of use and manufacturing thereof. In one exemplary embodiment, the solution of the present disclosure is particularly adapted for small form-factor portable radio devices, and comprises an antenna (or array of antennas) deposited on a thin preformed flexible or deformable structure using a conductive fluid. The antenna (array) includes one or more antennas each having a radiator and a plurality of contacts. Use of the thin preformed structure allows, among other things, thinner form factors for the host wireless device, and obviates use of a separate molded carrier or other more costly or involved processes (such as laser direct structuring).

Abstract: An antenna device includes: a radio device for radio wave transmission; a primary radiator that has a function to radiates radio waves generated by the radio device; a parabolic reflector that reflects the radio waves radiated from the primary radiator; a shroud that shields against unnecessary radiation radio waves among the radio waves radiated from the primary radiator and reflected by the parabolic reflector; and an antenna mounting mechanism that fits the parabolic reflector to an antenna attachment pole. The shroud is arranged so as to cover at least a right and left of the parabolic reflector, the radio device and the primary radiator are arranged inside the shroud, and the antenna mounting mechanism fits the parabolic reflector to the antenna attachment pole so that the antenna attachment pole is located at a lateral center position of the parabolic reflector.

Abstract: Disclosed herein are systems and methods for an implantable device comprising a ferromagnetic mass at least partially disposed near a coil, said coil formed of electrically conducting material and having electrical leads, a resonator circuit coupled to the leads and operable to resonate on application of energy from said leads. Some embodiments include an antenna coupled to said resonator circuit, wherein when either the ferromagnetic mass or the coil moves, power is supplied to the resonator circuit. In certain embodiments the device further includes a modulator coupled to said resonator circuit and operable to modulate the output of the resonator circuit where either the ferromagnetic mass or the coil is disposed in an animal such as a human. some embodiments allow for disposing multiple devices in an animal for characterizing different animal motions.

Abstract: Forming antenna structures having several conductor turns (wire, foil, conductive material) on a an antenna substrate (carrier layer or film or web), removing the antenna structures individually from the antenna substrate using pick & place gantry or by means of die punching, laser cutting or laminating, and transferring the antenna structure with it's end portions (termination ends) in a fixed position for mounting onto or into selected transponder sites on an inlay substrate, and connecting the aligned termination ends of the antenna structure to an RFID (radio frequency identification) chip or chip module disposed on or in the inlay substrate. A contact transfer process is capable of transferring several antenna structures simultaneously to several transponder sites.

Abstract: Provided are a new connection structure connecting a high frequency circuit and a waveguide which allows a substrate opening size to be made common without causing deterioration of a transmission line conversion characteristic, and a manufacturing method of the connection structure. The connection structure includes a module substrate (1) on which the high frequency circuit (11) is mounted and a transmission line conversion means (9, 7) is provided between the high frequency circuit and the waveguide (3), a waveguide conductor (8) in which the waveguide is formed, and a mother substrate (2) which is provided on the waveguide conductor and includes an opening having a size larger than an opening size (d) of the waveguide, and the module substrate is fixed to the mother substrate so as to cover the opening of the mother substrate and a choke is formed utilizing a space among the module substrate, the mother substrate, and the waveguide conductor.

Abstract: A method and device for manufacturing a smart card inlay includes attaching a first and a second end of a single wire antenna to a single first substrate, fixing the wire antenna, aside from the first and second ends thereof, to a second substrate. The method further includes thereafter relocating the first substrate relative to the second substrate such that the first and second ends of the wire antenna are at locations on the second substrate suitable for connection to a chip module, thereafter connecting the first end and the second end to the chip module, and thereafter removing the first substrate.

Abstract: Disclosed is a photomixer for generating and detecting a terahertz continuous wave, including: an optical conductor to which beating light is incident; and a plurality of antenna feeding electrodes formed on both side surfaces of the optical conductor, and configured to receive a current of a terahertz frequency.

Abstract: Embodiments are directed to a structure comprising: a first substrate section having a first thickness, a second substrate section having a second thickness different from the first thickness, a plurality of vias configured to couple a first ground plane associated with the first substrate section and a second ground plane associated with the second substrate section, and a microstrip comprising: a first section associated with the first substrate section and having a first width, a second section associated with the second substrate section and having a second width different from the first width, and a taper between the first width and the second width.

Abstract: An implantable medical device (IMD) antenna and methods of fabricating the same are provided. An IMD can include a ceramic structure having at least one wall defining a hollow cavity. The ceramic structure can include a first end and a second end distal from the first end, the first and second ends being open to provide access to the hollow cavity. The IMD also includes an antenna cofire-integrated into the at least one wall of the ceramic structure and a housing adjoined to the ceramic structure.

Abstract: An implantable medical device (IMD) antenna and methods of fabricating the same are provided. An IMD can include a ceramic structure having at least one wall defining a hollow cavity. The ceramic structure can include a first end and a second end distal from the first end, the first end being open to provide access to the hollow cavity and the second end being closed. The IMD also includes an antenna cofire-integrated into the at least one wall of the ceramic structure and a housing adjoined to the ceramic structure.

Abstract: A smart card with two read-write modes includes antenna layer, and an antenna and a chip module circuits on the antenna layer, wherein the antenna and the chip module circuit are electrically connected via an elastic conductive device. The invention also provides a manufacturing method of the aforesaid smart card with two read-write modes, which includes steps of: embedding an antenna on a back side or a front side of an antenna layer; after completing embedding on the antenna layer, add bedding sheets, printed sheets and protection films respectively above and underneath the antenna layer, then laminating to obtain a card base carrier; cutting card from the treated whole-sheet card base carrier to obtain a card base, and milling slots on the obtained card base, then finally encapsulating.

Abstract: A method of coupling a first port of a single antenna to a first coupling circuit and a second port of the single antenna to a second coupling circuit. The method includes coupling a wireless charging unit to the first coupling unit and coupling an NFC transceiver block to the second coupling circuit. The method further includes isolating the single antenna from the wireless charging unit during a time interval when the NFC transceiver block is operational and isolating the single antenna from the NFC transceiver block during a time interval when the wireless charging unit is operational.

Abstract: An antenna structure is disclosed that includes a first antenna extending from a substrate, a second antenna formed on the substrate, and first and second parasitic elements formed on the substrate. The first antenna provides an omni-directional radiation pattern in the azimuth plane for vertically polarized signals, and the second antenna provides an omni-directional radiation pattern in the azimuth plane for horizontally polarized signals. The parasitic elements absorb and re-radiate electromagnetic waves radiated from the second antenna.

Abstract: A “thin” and cost-effective three-dimensional antenna assembly and methods of use and manufacturing thereof. In one exemplary embodiment, the solution of the present disclosure is particularly adapted for small form-factor portable radio devices, and comprises an antenna (or array of antennas) deposited on a thin preformed flexible or deformable structure using a conductive fluid. The antenna (array) includes one or more antennas each having a radiator and a plurality of contacts. Use of the thin preformed structure allows, among other things, thinner form factors for the host wireless device, and obviates use of a separate molded carrier or other more costly or involved processes (such as laser direct structuring).

Abstract: The proximity readers for opening a door are typically located on a lock, a metal prison wall, on a metal fire door, on a metal door frame. Traditionally, a proximity reader had to be made thick so that the pickup coil/antenna was not close to the metallic mounting surface otherwise the reader's read range would be drastically reduced. The present invention eliminates the problem of these metal surfaces reducing the read range of the proximity reader when mounted on these types of metallic surfaces. The present invention allows the pickup coil/antenna to be mounted close to the metallic mounting surface, be low profile without reducing the read range.