Abstract: A wireless modem for communication in a network of wireless modems via a communication channel includes a transceiver assembly, transceiver electronics and a power supply. The transceiver electronics include transmitter electronics, receiver electronics and at least one processing unit. The transmitter electronics cause the transceiver assembly to send wireless signals into the communication channel. The receiver electronics decode signals received by the transceiver assembly.

Abstract: In accordance with one example embodiment of the present invention an apparatus is disclosed. The apparatus includes a cover, a ground plane, a first inductor, and a second inductor. The cover includes a first end and an opposite second end. The cover is configured to operate as a first loop radiator portion. The ground plane is proximate the cover. The ground plane is configured to operate as a second loop radiator portion. The first inductor is proximate the first end of the cover. The second inductor is between the second end of the cover and the ground plane. The cover, the ground plane, the first inductor, and the second inductor are configured to provide a loop radiator.

Abstract: An integrated antenna and electromagnetic (EM) noise shield apparatus for use with a radio frequency communicating device and EM noise generating electronic equipment housed within a generally cylindrical outer glass enclosure or bezel of wireless utility meter. A flexible printed circuit (PC) board has an upper region and a lower ground plane region. A radiating element is defined on the PC board in the upper region. A metal ground plane component has a first portion having the shape of a circle segment and a second orthogonal portion. The ground plane component is mechanically fixed and electrically connected to the ground plane region of the PC board, with the orthogonal second portion being proximate to and shielding the radiating element. The ground plane component and the ground plane portion of the PC board define an electromagnetic shield for electromagnetic emissions between EM noise generating electronic equipment housed within said outer bezel and the radiating element.

Abstract: The present invention is directed to a selectively accessible enhanced radio-frequency identification (RFID) device, that is enhanced performance and security by selectively responsive to predetermined electromagnetic interrogation thereof, that comprises an enhanced component for enabling a user to adjust readable distances and selectively enable or disable interrogatory access to the enhanced RFID device, to protect from unauthorized interrogation thereof. The inventive enhanced RFID device comprises an antenna, a microchip and at least one enhanced component. The enhanced component may use “Electromagnetic Induction” to the antenna to increase performance and “Electromagnetic Shield”, to cover the antenna. In one embodiment thereof, the enhanced RFID device may be advantageously utilizing retention component to keep closed it in an Always-OFF mode, such that the enhanced RFID device is only accessible to electromagnetic interrogation thereof, when the enhanced RFID device is open to an Always-ON mode.

Abstract: A coaxial connector to be attached to a coaxial change-over switch includes an insulated connector housing; an outer connector conductor provided outside the insulated connector housing and capable of connecting to an outer conductor of a coaxial cable; and a contact provided in the insulated connector housing to be movable for connecting to a center conductor of the coaxial cable. The contact has a first portion including a distal end portion and a second portion connected to the first portion via a bent section. The contact is mounted on a mounting section of the insulated connector housing, and is supported in a cantilever state at the second portion. The distal end portion is elastically displaced in a direction opposite to an attaching direction of the coaxial change-over switch when the distal end portion contacts with the coaxial change-over switch.

Abstract: A method of forming and connecting an antenna to a feedthrough member of a housing. The method comprising a step of: positioning the feedthrough member and an antenna template relative to each other. A step of connecting the first portion of at least one electrically conducting wire to the feedthrough member. An additional step of winding the wire at least once around the antenna template, and a further step of connecting a second portion of each wire to said feedthrough member.

Abstract: A planar antenna, such as included as a portion of a wireless communication assembly, can include a dielectric portion, a first conductive portion, extending along a surface of the dielectric portion, and a second conductive portion, parallel to the first conductive portion, extending along the surface of the dielectric portion, the second conductive portion laterally offset from the first portion to provide a specified lateral separation between the first and second conductive portions. The first and second conductive portions can be configured to provide respective resonant operating frequencies ranges offset from each other, and the first and second conductive portions can be configured to follow a commonly-shared path, including at least one bend, along the surface of the dielectric portion.

Abstract: A method of manufacturing an antenna comprising: providing a millimeter wave (MMW) antenna attached to a signal pad on an integrated circuit mounted on a substrate, and adjusting one or more parameters of the antenna to conform to predetermined desired thresholds, levels or ranges, wherein the adjustment is selected from the group consisting of: locating a conducting or dielectric object at a desired tuner location in proximity to the antenna to tune the central signal frequency, locating a conducting reflector at a desired reflector location in proximity to the antenna to tune the radiation direction or pattern, and selecting a conducting patch or object as a radiator/detector element to modify the bandwidth. Also a millimeter wave (MMW) antenna.

Abstract: The device (10) includes a near-field communication antenna (12) delimiting a useful magnetic field receiving area (S), a microcircuit (14) connected to the antenna (12) and a magnetic shielding layer (16) arranged so as to extend at least partially under the area (S). It also includes a support (18) built into a microcircuit card body (20) including an open cavity (30) in one of its faces (F2) extending at least partially under the antenna area (S) and sized so as to completely accommodate the shielding layer (16). More specifically, the body (20) includes a detachable plate (22) within which are arranged the antenna (12) and the microcircuit (14) and within which the layer (16) extends at least partially.

Abstract: Disclosed are apparatus and methodology subject matters relating to an antenna configured for mounting under the glass in a utility meter. The antenna is configured as a patch antenna where a radiating element is mounted on one side of a plastic substrate while a conductive ground plane element is mounted on the other side of the substrate. The ground plane element faces the meter electronics and thereby provides protection to the electronics from the electromagnetic field of the antenna. Both the radiating element and ground plane element may be provided by hot stamping conductive material directly on to the front and rear surfaces of the substrate. The antenna may be feed by a microstrip feedline mounted on the printed circuit board supporting other meter components.

Abstract: An electrosurgical system for directing energy to tissue includes a generator assembly operable to supply power having a selected phase, amplitude and frequency, and an applicator array assembly. The applicator array assembly includes a shell assembly, a plurality of energy applicators disposed within the shell assembly, and a power divider unit electrically coupled to the generator assembly. The power divider unit is operable to divide power into the applicator array assembly.

Abstract: A method for manufacturing a nonreciprocal circuit device in which a ferrite-magnet device including ferrite having first and second center electrodes arranged to intersect and be electrically insulated from each other and a pair of permanent magnets fixed to both principal surfaces of the ferrite so as to apply a direct current magnetic field to the ferrite is solder-bonded to a surface of a substrate. The ferrite-magnet device is solder-bonded to the surface of the substrate while a magnetic plate is disposed on a back surface of the substrate.

Abstract: An apparatus, such as an antenna assembly, can include a flexible dielectric sheet, a first flexible conductor coupled to the flexible dielectric sheet, a second flexible conductor coupled to the flexible dielectric sheet, a matching section electrically coupled to the first and second conductors, and a hollow dielectric housing having a curved interior surface. The first and second flexible conductors can be sized, shaped, and laterally spaced a specified distance from each other to provide a specified input impedance corresponding to a specified range of operating frequencies for use in wireless information transfer between the antenna assembly and a satellite. The first and second flexible conductors can be located along the curved interior surface of the hollow dielectric housing following an arc-shaped path along the curved interior surface.

Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

Abstract: A method for manufacturing a septum polarizer includes dispensing a layer of adhesive on a first contact surface of a first substrate, attaching the first substrate to a second substrate to form a combined structure, and elevating the combined structure to a first temperature that is above a first cure temperature of the adhesive for a predetermined period of time. The method further includes after attaching the first substrate to the second substrate, applying a continuous metallization coating over each outer surface of the attached first and second substrates, and elevating the combined structure and metallization coating to a second temperature, thereby curing the metallization coating without degrading the layer of adhesive. The metallization coating has a second cure temperature that is lower than the first cure temperature of the adhesive, and the second temperature is above the second cure temperature and below the first cure temperature.

Abstract: A method for producing a rollable web with successive antennas, where an electronic chip is attached to an antenna in a predetermined position. The position of an electronic chip changes with respect to the antenna when compared to at least some of the chips within individual and successive antennas. A rollable web includes successive antennas, where electronic chips are attached to antennas in a predetermined position. In the rollable web, the position of a chip changes with respect to the antenna compared to at least some of the chips within individual and successive antennas.

Abstract: A cover for a portable electronic device is disclosed. The cover can include at least one electrical component. For example, in one embodiment, an electrical component can be embedded in the cover. When the cover is placed on or mated with the portable electronic device, the electrical component embedded in the cover is able to interact with electrical circuitry of the portable electronic device. Advantageously, the cover can not only provide a protective and/or ornamental covering for the portable electronic device but can also augment the electrical capabilities of the portable electronic device.

Abstract: A method of manufacturing a micro antenna is provided. The method includes forming a plurality of holes penetrating a first substrate, filling each of the plurality of holes with a conductive material to form a plurality of vertical conducting parts, forming a plurality of horizontal conducting parts on each of two different surfaces of the first substrate, wherein the each of the horizontal conducting parts is electrically connected to the corresponding vertical conducting parts, bonding the first substrate, on which the vertical conducting parts and the horizontal conducting parts have been formed, to a second substrate, and removing the first substrate to expose a whole structure of a 3D micro antenna which is formed on the second substrate and includes the vertical conducting parts and the horizontal conducting parts connected to each other.

Abstract: A reader/writer comprises a circuit board, a communication control portion mounted on the circuit board and configured to perform communication with IC tags, sealing resin for sealing the communication control portion; and an antenna electrically connected to the communication control portion, in which a resin layer is disposed on the sealing resin, the resin layer having a higher adhesiveness to a conductive film used as the antenna than that of the sealing resin, and the antenna is disposed on the resin layer.

Abstract: A method for manufacture of a contactless smart card device including mounting at least one antenna and at least one smart card module onto a substrate layer, placing paramagnetic material over at least part of the at least one antenna, and laminating the substrate layer and the paramagnetic material to provide a laminate.

Abstract: A multi-angle ultra wide band antenna for electronic devices is disclosed. The said antenna cover all mobile bands worldwide: 700/850/900/1700/1800/1900 and 2100 MHz and with sufficient bandwidth to include the 2400 and 2500 MHz mainly used in wireless networks, having a radiated element supported by a first substrate and expanding into a spatial geometry for transmission and reception of radio signal. An antenna base has a plurality of first solder pads on a second substrate for physical attachment to a printed circuit board and a second solder pad electrically connected to a terminal of said antenna to radio circuitry feed point, with compatible surface mount technology. The first and second substrates are joined by a bending line as a single substrate, where the said first substrate is allowed to be bent relative to the plane of the said second substrate.

Abstract: A device comprising a metallic conical portion, said conical portion substantially hollow having a vertex end and a base end, a first cylindrical portion disposed annularly about the base end of the conical portion, a metallic second cylindrical portion coupled to the vertex of the conical portion, said cylindrical portion having a threaded aperture, and an antenna feed coupled to the threaded aperture. The device may have a patch disposed on an insulator portion connected to the second cylindrical portion, said patch and insulator portion each having an aperture, and a metallic ground portion connected to the insulator portion, said ground portion having an ground aperture, and a threaded screw disposed through the ground aperture, the patch, the insulator aperture and into the threaded aperture. An RF feed may be created by coupling the threaded aperture to a conductive material disposed on the insulator portion.

Abstract: The present invention relates to an antenna arrangement with a printed circuit board, which has an upper side and a lower side, and an antenna supported by the printed circuit board, in particular ring antenna, which comprises at least one electrically conductive antenna section which is arranged on a narrow side of the printed circuit board adjoining the upper side and/or the lower side. The invention also relates to a process for producing an antenna arrangement which comprises a printed circuit board with an upper side and a lower side and an antenna supported by the printed circuit board, in which process for forming at least one antenna section, an electrically conductive material is attached to a narrow side of the printed circuit board which adjoins the upper side and/or the lower side.

Abstract: There is provided a radio frequency identification (RFID) tag. The RFID tag includes a base formed of an insulating material, a circuit chip adhered to one surface of the base and including a pad for an electrical connection, and an antenna formed by jetting a conductive material onto the one surface of the base and electrically connected to the pad.

Abstract: Directional wide band antenna that may be utilized to enhance cell phone coverage within a building, or for signals intelligence collection (SIGINT). Includes a log-spiral slot antenna with feed-point configured to transfer energy to/from the antenna. Includes an energy absorbent backing and an energy absorbent siding coupled with the log-spiral slot antenna. Includes a cavity behind the log-spiral slot antenna and in front of the energy absorbent backing. Includes a cable connector coupled to a tapered microstrip line coupled to the feed-point wherein the tapered microstrip line is configured to transform the input impedance to the antenna impedance. Housed in a container configured to hold the above listed components. Energy absorbent siding, cavity and energy absorbent backing greatly reduces back lobes. Another embodiment has log-spiral shaped slots at an outer portion of the log-spiral slot antenna overlap with the energy absorbent siding and wherein the feed-point overlaps the cavity.

Abstract: A mobile wireless communications device includes a housing and circuit board carried by the housing and having RF circuitry comprising at least one RF component and plurality of other components mounted on the circuit board. An RF metal shield is secured to the circuit board and surrounds and isolates the at least one RF component and plurality of other components within the RF metal shield. An RF absorber is positioned adjacent an area of the RF component that radiates energy to aid in reducing energy radiated from the RF component into the RF metal shield.

Abstract: A method for manufacturing an integrated circuit device having antenna conductors is provided. The method includes the steps of providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circuit component; forming a plurality of metal bumps above the first antenna conductor; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; removing a portion of the insulating layer to expose a top portion of each metal bump; and forming a second antenna conductor on the insulating layer by screen printing.

Abstract: Disclosed is an apparatus and methodology for providing an RFID device for integration into a tire. A printed circuit board (PCB) is provided with notches in opposed ends of the PCB that are provided with guide portions as a part of the notches that function as threads to guide an end portion of a matching single pitch helical antenna into appropriately placed vias on the PCB. Threading of the helical antenna is assisted by use of an assembly jig having antenna guiding channels and PCB retaining positioning elements.

Abstract: During mounting to an inlay substrate, at least one end portion (including end) of an antenna wire is positioned directly over a terminal of the chip module for subsequent connecting thereto. A sonotrode is disclosed with a cutter above the capillary for nicking the wire. The antenna may comprise two separate stubs, each having an end portion (including end) positioned over a terminal of the chip module. Additional techniques for mounting the antenna wire are disclosed.

Abstract: The present invention relates to a method for application of a chip module to an antenna module, wherein antenna contact surfaces formed on an application side (36) of the chip module are contacted with contact surfaces of an antenna disposed on an antenna side of an antenna substrate in an electrically conductive manner, wherein a plurality of chip modules are arranged in a row arrangement on a sheet carrier and the row arrangement is supplied to a separating device arranged at the application location by means of a supply device, the chip module separated from the row arrangement is subsequently positioned on the antenna substrate by means of an application device and contacting of the antenna contact surfaces of the chip module with the contact surfaces of the antenna is performed. The invention further relates to a device for the application of a chip module to an antenna module.

Abstract: A wireless IC tag which has an electrically insulative substrate, an antenna circuit provided on the surface of the substrate and an IC chip connected to the antenna circuit, wherein the antenna circuit is formed of solder and the IC chip is connected to the antenna circuit via the solder, and A wireless IC tag comprising an electrically insulative substrate, an antenna circuit provided on the surface of the substrate, an IC chip connected to the antenna circuit, and a jumper wire connected to the antenna circuit, wherein the antenna circuit is formed of a solder, the jumper wire is insulatively coated with a resin composition that evaporates, decomposes, or melts at a temperature not higher than a soldering temperature, and the jumper wire is located on the same side of the substrate where the antenna circuit is provided

Abstract: Described are antenna assemblies and methods for forming antenna assemblies. An antenna assembly includes a dual polarized far-field antenna and a near-field loop antenna. The near-field loop antenna is electromagnetically coupled to the dual polarized far-field antenna. The near-field loop antenna includes two contacts for electrically connecting to a chip.

Abstract: Fibers may be intertwined to form structures for electronic devices and other parts. Fibers may be intertwined using computer-controlled braiding, weaving, and knitting equipment. Binder materials may be selectively incorporated into the intertwined fibers. By controlling the properties of the intertwined fibers and the patterns of incorporated binder, structures can be formed that include antenna windows, sound-transparent and sound-blocking structures, structures that have integral rigid and flexible portions, and tubes with seamless forked portions. Fiber-based structures such as these may be used to form cables and other parts of headphones or other electronic device accessories, housings for electronic devices such as housings for portable computers, and other structures.

Abstract: A method of installation of a notebook computer antenna, the method is mainly to design to use a mode of manufacturing tags to make groups of or integrate antenna sections required by the notebook computer to make a tag antenna; then the tag antenna is stuck and fixed on an inner layer of the housing of the notebook computer. This method can reduce cost of manufacturing and thickness and weight of notebook computers.

Abstract: Golf balls and methods and systems for manufacturing golf balls. In one exemplary embodiment, a portion of a golf ball comprises a core material having a void, a semiconductor component disposed at least partially in the void, and a filler material in the void and surrounding the semiconductor component, the filler material being placed in the void in a liquid state and occupying a first volume in the liquid state and the filler material transforming into a solid state which occupies substantially the first volume. Methods for manufacturing golf balls and fixtures and apparatuses for manufacturing golf balls are also described.

Abstract: Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

Abstract: The invention provides an article and process for producing electronic devices. More particularly the invention relates to an article and process for fabricating patterns of electrically conductive materials on non-electrically conductive substrates by laser ablation. Such an article and process find use in the production of RDIF devices, antennae, electrical circuits, microwave susceptors, contacts, leads, conductors, interactive displays, electrostatic shielding devices and the like. The process involves first providing an electrically conductive metal layer on an electrically non-conductive substrate. Then an electronic circuit is electrically connected to the electrically conductive metal layer.

Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

Abstract: An antenna pattern frame according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion may be provided on one side of the radiator frame and the connection terminal portion may be provided on the other side thereof, while the antenna pattern portion is embedded in the electronic device case; and a contact surface extension provided on the radiator to prevent the radiator from being loosened from the radiator frame during injection molding of the radiator frame, and increasing a contact area with respect to the radiator frame.

Abstract: Method and apparatus for mounting and locating untethered embedded antenna elements in the dielectric cover of electric utility meters configured for but not limited to wireless remote one way or two way radio communications for automated metering applications such as remote meter reading, remote connect/disconnect, home area networking, meter equipment firmware downloads, load management or locations based services. A multiplicity of untethered integral antenna elements and topologies may be located within a replacement dielectric cover for a direct-connect cable free or cable connection to a radio or microwave modem. Also described is a method and apparatus for retro-fitting the antenna elements on the inner face of an existing utility meter dielectric cover.

Abstract: In a method of manufacturing an antenna (11) formed on a substrate (1) an antenna structure (2) is formed on the substrate (1). The antenna structure (2) comprises an area (3) which initially is electrically short-circuited and is designed to be turned into an antenna contact (4a,4b) to be contacted with contacts (12,13) of an integrated circuit (IC). The antenna contact (4a,4b) is formed by mechanically separating the electrically short-circuited 5 area (3) particularly utilizing cutting or stamping means (5).

Abstract: An antenna assembly is provided suitable for use with a remote communications module such as, for example, a keyless entry module, a tire pressure monitoring module, etc. The antenna assembly generally includes a support, a folded metallic antenna element mounted on the support, an amplifier coupled to the folded antenna element, and a transmission line coupled to the amplifier.

Abstract: The manufacturing apparatus of a semiconductor device includes a jig having a plurality of holders arranged in a row, a controller for controlling the pitch of the plurality of holders arranged in a row, a support means provided with a plurality of semiconductor integrated circuits, and a support means provided with a substrate having a plurality of elements. By mounting the semiconductor integrated circuits on the respective elements by using the jig having the plurality of holders arranged in a row, semiconductor devices are manufactured.

Abstract: A method of manufacturing an array antenna including a designing step which comprises: determining a one-dimensional reference radiation pattern and an associated reference aperture; computing the cumulative phasorial summation of the field distribution of said reference aperture in a reference direction and representing it as a reference curve in the complex plane; determining a polygonal curve optimally approximating said reference curve, subject to predetermined constraints; and determining, from said polygonal curve, an antenna array pattern, each side of said polygonal curve being associated to a particular antenna element of the array.

Abstract: A method for manufacturing an integrated circuit device having antenna conductors is provided. The method includes the steps of providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circuit component; forming a plurality of metal bumps above the first antenna conductor; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; removing a portion of the insulating layer to expose a top portion of each metal bump; and forming a second antenna conductor on the insulating layer by screen printing.

Abstract: An antenna tube configured to accommodate a grounding clip and an antenna, the antenna tube having a cylindrical tube having an upper end and an inner end opposite the upper end; a circumferentially extending groove in the cylindrical tube located between the upper end and the inner end; and a tapered lip at the inner end of the cylindrical tube, wherein the grounding clip fits between the circumferentially extending groove and the tapered lip, and at least a portion of the antenna slidably fits into the upper end of the cylindrical tube.

Abstract: The planar or printed chip antenna is configured to enhance the gain relative to its area. The antenna includes a dielectric substrate having first and second opposing sides and a plurality of electrically conductive traces thereon configured to define a half-loop antenna element extending along an arcuate path on a first side of the dielectric substrate and having spaced apart first and second ends. First and second base strips are electrically connected together and aligned on the respective first and second opposing sides of the dielectric substrate adjacent the spaced apart first and second ends of the half-loop antenna element. A feed strip is on the second side of the dielectric substrate and aligned with the first end of the half-loop antenna element and electrically connected thereto. At least one capacitive element is associated with the half-loop antenna element.

Abstract: Novel assemblies for use in conjunction with RF shielded enclosures and the like include one or more RF power and signal filters connectibly inserted, attached to, or otherwise made a part of optimized cavities or receptacles formed within an optimized frame of the assembly. The use of optimized cavities or receptacles greatly reduces the number of exterior fasteners needed to connect filters to the assembly or the assembly to an enclosure which, in turn, reduces leakage. The optimized cavities or receptacles may be arranged in a compact manner in order to make optimum use of the available space on an optimized frame of the assembly.

Abstract: The invention relates to a method for producing a device comprising a radio frequency transponder antenna, said method comprising a step of producing the antenna with two terminal sections (15, 17) on a support by means of a wiring technique. The method is characterised in that it comprises a step of producing an end point (9) on an antenna wire at the end of at least one of said terminal sections (5, 15, 17). The invention further relates to the device thus produced.

Abstract: An integrated electronic device, and its method of manufacture, are provided. The integrated electronic device can include an electronic assembly, such as an active RFID assembly, that is electrically coupled to a thin printed flexible electrochemical cell. In one example, the electronic assembly and the electrochemical battery are provided on a single substrate. In one example method of manufacture, the entire cell to be made on a printing press to integrate the battery directly with the electronic assembly.