Applying Terminal Patents (Class 29/619)
  • Patent number: 6851180
    Abstract: A manufacturing method for a gas senor having sensor element on and in which an outer electrode terminal and an inner electrode terminal are press-fitted. The manufacturing method features stability of installation of the outer and inner electrode terminals without causing physical damage to the sensor element. Outer and inner terminal installation jigs are used in the method.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: February 8, 2005
    Assignee: Denso Corporation
    Inventors: Yasuo Hattori, Kazuo Matsubara
  • Patent number: 6817088
    Abstract: A power adapter is shown for use on injection molding runner nozzles. The power adapter provides for quick and easy installation (and removal) of thick film resistance heaters on the runner nozzles, without the need for rewiring. The power adapter comprises a series of rings that allow insertion of the terminal end of the heater, which is then rotated into a locked position. One of the rings contains contacts which are at least semi-permanently wired to a power source. To facilitate the power adapter, a novel method terminating the heating element is used. A noble-metal-based bonding agent (such a silver-base ink) is applied to the heating element and/or terminal plate. The terminal plate is then affixed to the heating element and the bonding agent is fired.
    Type: Grant
    Filed: June 16, 2000
    Date of Patent: November 16, 2004
    Assignee: Watlow Electric Msg.C
    Inventor: Hongy Lin
  • Publication number: 20040194294
    Abstract: An electrical resistor is made by providing a sacrificial layer and conductive pads disposed on a first surface of the sacrificial layer. An electrically resistive material is deposited over the pads and on the first surface of the sacrificial layer to form at least one unit including the resistive material and the pads. At least part of the sacrificial layer is then removed so as to expose one or more of the pads.
    Type: Application
    Filed: April 20, 2004
    Publication date: October 7, 2004
    Applicant: Tessera, Inc.
    Inventor: Joseph Fjelstad
  • Patent number: 6799367
    Abstract: A windbreak provided along a side of a tray prevents insulators located close to an entrance of a furnace from being directly cooled by the air coming into the furnace. All of the insulators mounted on the tray can be uniformly cooled when conveyed out of the furnace after finishing a sintering operation. A resistance value of the electric resistor in an insulator located close to the entrance is substantially equalized with a resistance value of the electric resistor in another insulator located far from the entrance.
    Type: Grant
    Filed: December 19, 2001
    Date of Patent: October 5, 2004
    Assignee: Denso Corporation
    Inventor: Koji Hori
  • Publication number: 20040172807
    Abstract: The invention is directed to an electrical component having a base body (1) that comprises a layer stack of mutually overlapping, electrically conductive electrode layers (3) that are separated from one another by electrically conductive ceramic layers (10), whereby the electrically conductive ceramic layers (10) are composed of a ceramic whose specific electrical resistance exhibits a negative temperature coefficient, whereby the electrically conductive ceramic layers (10) are produced of ceramic green films that are sintered in common with the electrode layers (3), and whereby outside electrodes (2) that are electrically conductively connected to the electrode layers (3) are arranged at two opposite outside surfaces of the base body (1). The invention is also directed to a method for the manufacture of the component and to the employment of the component.
    Type: Application
    Filed: March 3, 2003
    Publication date: September 9, 2004
    Inventors: Friedrich Rosc, Ingrid Rosc, Berrit Ines Rosc, Jordis Brit Rosc, Franz Schrank, Gerald Kloiber
  • Publication number: 20040163234
    Abstract: A rigid substrate board (105) having at least one layer with first (106) and second (107) opposing surfaces. At least one bore is formed in the layer and extending from the first surface (106) to the second surface (107). A resistive material is disposed within the bore and fills the bore to form a resistor (140). Further, a first conductor (115) is disposed on the first surface (106) to form an electrical connection with a first end of the resistor (140), and a second conductor (120) is disposed on the second surface to form an electrical connection with a second end of the resistor. A plurality of resistors (140) can be formed in the substrate layer (105) and interconnected to define a resistive network.
    Type: Application
    Filed: February 24, 2003
    Publication date: August 26, 2004
    Inventors: Terry Provo, C. Michael Newton
  • Patent number: 6779251
    Abstract: An assembly method for a vehicle anti-theft key having an embedded resistor pellet is provided. The resistor pellet includes a flange at one end which abuts one side of the key blade when the opposed end of the pellet is inserted into a through opening formed in the shank portion of the key blade. With the resistor pellet loosely positioned within the through opening, a second flange is attached to the end of the pellet that was inserted through the through opening, thereby capturing the pellet within the through opening by the two opposed flanges. In one embodiment, the second flange is formed in place by employing a polymeric molding process, such as a thermoforming injection molding process. A handle for the key is efficiently formed substantially simultaneously with the second flange using the same polymeric molding process.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: August 24, 2004
    Assignee: Hurd Corporation
    Inventors: David C. Banks, Charles C. Edwards
  • Patent number: 6769160
    Abstract: A process for manufacturing an electronic part having a ceramic body and an outer electrode form on the surface of the body, the outer electrode including a plurality of layers and having a Sn plating layer as the outermost layer. The Sn plating layer having an average crystal grain size of about 1 &mgr;m or less is formed on a Ni or Ni alloy by electroplating in a plating bath having a pH of about 3 to 10.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: August 3, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shoichi Higuchi, Tatsuo Kunishi, Yukio Hamaji
  • Patent number: 6766574
    Abstract: A temperature sensor including a thermosensitive element and a ceramic body having a hollow section which surrounds the thermosensitive element airtightly. The thermosensitive element is formed on a heat-sensing surface side of the ceramic body having the hollow section. The hollow section is formed at a position which is shifted to the heat-sensing surface side with respect to the center of the temperature sensor. The ceramic body includes a heat-sensing surface side ceramic layer (1) having the thermosensitive element (4) disposed thereon, a spacer ceramic layer (3) having an aperture, and a substrate ceramic layer (2) serving as a substrate.
    Type: Grant
    Filed: May 23, 2001
    Date of Patent: July 27, 2004
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Yoshihito Mizoguchi, Takeshi Mitsuoka, Satoshi Iio
  • Patent number: 6757963
    Abstract: A surface of a first ceramic component is joined to a surface of a second ceramic component using a silver-based composition. The silver-based composition is a mixture of silver metal and a metal oxide and the metal in the metal oxide is a metal other than silver. The silver-based composition is applied to the surface of the first ceramic component and to the surface of the second ceramic component. The silver-based composition applied to the first ceramic component is contacted to the silver-based composition applied to the second ceramic component. The surfaces of the first and second ceramic components are heated to melt the applied silver-based compositions. The surfaces of the first and second ceramic components are cooled to form a bond between the first and second ceramic components.
    Type: Grant
    Filed: January 23, 2002
    Date of Patent: July 6, 2004
    Assignee: McGraw-Edison Company
    Inventors: Alan M. Meier, David R. Miller, Kevin R. Dickson, Roger S. Perkins, Michael M. Ramarge
  • Patent number: 6751848
    Abstract: A method of adjusting a resistance value of a film resistor. The method includes defining, as a single resistive element, a portion of a resistive film formed over a first linear conductive film formed at a position at which a first resistance value is detected when an electric contact is slid thereto, and a second linear conductive film formed at a position at which a second resistance value is detected when the electric contact is slid thereto. The method also includes trimming a portion of the resistive element at opposite sides of the first linear conductive film in a longitudinal direction substantially perpendicular to the width direction to form first and second trimmed portions; and trimming a portion of the resistive element from an end of the second trimmed portion in the width direction toward the second linear conductive film to form a third trimmed portion.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: June 22, 2004
    Assignee: Yazaki Corporation
    Inventors: Syunsuke Nagakura, Manabu Ooishi, Hisafumi Maruo
  • Patent number: 6751862
    Abstract: An electronic device containing an electronic element such as a thermistor element is produced first by providing the element with electrodes formed on its two main surfaces facing outward away from each other, at least two terminals and a casing. Each terminal has a contact part for contacting one of the electrodes and an extended part extending from the contact part. The contact part of at least one of the terminals is elastic and bendable. The terminals and the electronic element are inserted into the casing either sequentially or simultaneously as an assembly in any of the ways such that the electrodes on the electronic element are not rubbed directly against the contact parts of the terminals. This may be done by disposing flexible guide plates over the contact parts such that the electrodes will glide over these guide plates as the electronic element is inserted after the terminals are installed inside the casing.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: June 22, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Junichi Hamatani, Satoshi Tsuruhara
  • Patent number: 6748646
    Abstract: A heated element assembly and method of manufacturing heated element assemblies is provided. The heated element assembly including a first and second molded sections shaped to mate with each other is provided. A resistance heating element is secured between the first and second molded sections by an interference fit. The resistance heating element includes a piercable supporting substrate and a resistance wire sewn thereon. The resistance wire is disposed in a predetermined circuit path which is substantially encompassed by the first and second molded sections. The resistance heating element is easily fixed in a position between the first and second molded sections and is capable of providing heat on vertical, horizontal and contoured surfaces.
    Type: Grant
    Filed: February 21, 2002
    Date of Patent: June 15, 2004
    Assignee: Watlow Polymer Technologies
    Inventors: Theodore Von Arx, Keith Laken, John W. Schlesselman, Ronald E. Papenfuss
  • Patent number: 6749891
    Abstract: A precipitate film having plating resistance may be formed on the surface of a varistor element during sintering process. Accordingly, the manufacturing process can be shortened, thereby improving the productivity. The manufacturing method comprises (a) a first process of forming the varistor element whose main component is zinc oxide; (b) a second process of sintering the varistor element and precipitating zinc compound having at least one of acid resistance and alkali resistance on the surface of the varistor. Preferably, the manufacturing method further comprises (c) a process of attaching an external electrode to the varistor element, and the external electrode attaching process is executed after finishing the varistor element sintering process.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: June 15, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kaori Shiraishi, Tatsuya Inoue, Riho Sasaki, Keiichi Noi, Hideaki Tokunaga
  • Patent number: 6732422
    Abstract: A method of forming a resistor is described which achieves improved resistor stability and voltage coefficient of resistance. A resistor is formed from a conducting material such as doped silicon or polysilicon. The resistor has a rectangular first, second, third, fourth, and fifth resistor elements. A layer of protective dielectric is formed over the first, second, and third resistor elements leaving the fourth and fifth resistor elements exposed. The conducting material in the exposed fourth and fifth resistor elements is then changed to a silicide to form low resistance contacts between the second and fourth resistor elements and between the second and fourth resistor elements. The second and third resistor elements are wider than the first resistor element and provide a low resistance contacts to the first resistor element. This provides a low voltage coefficient of resistance and thermal process stability for the resistor.
    Type: Grant
    Filed: January 4, 2002
    Date of Patent: May 11, 2004
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Kong-Beng Thei, Chih-Hsien Lin, Shyh-Chyi Wong
  • Patent number: 6725529
    Abstract: According to the method the resistive strip is attached to a single co extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.
    Type: Grant
    Filed: February 18, 2002
    Date of Patent: April 27, 2004
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Joel J. Smejkal, Steve E. Hendricks
  • Patent number: 6727111
    Abstract: A multi-element electronic chip device is manufactured which has a plurality of elements such as film resistors 2 or the like on one insulating substrate 1 by carrying out a step of performing primary division of a ceramic material plate A corresponding to a multiplicity of insulating substrates 1 into ceramic bars A′ each corresponding to a row of plural insulating substrates 1, a step of forming grooves 6 in lengthwise side faces of each ceramic bar A′ before forming side electrodes 5 for both ends of each film resistor 2 or forming grooves 6 after forming side electrodes 5, and a step of performing secondary division of the ceramic bar A′ into individual insulating substrates 1. This structure is a low cost solution for preventing the side electrodes 5 for different film resistors 2 from connecting with each other.
    Type: Grant
    Filed: June 11, 2002
    Date of Patent: April 27, 2004
    Assignee: Rohm Co., Ltd.
    Inventor: Torayuki Tsukada
  • Patent number: 6704997
    Abstract: Organic thermistor devices are produced by a first step of molding an organic thermistor material by covering a plurality of electrically conductive members to form a conductor-containing member, which is elongated in a longitudinal direction, has a pair of mutually oppositely facing side surfaces, having the conductive plates buried parallel to one another inside the organic thermistor material, each mutually adjacent pair of these conductive members being externally exposed on different ones of the side surfaces, a second step of forming a pair of electrodes elongated in the longitudinal direction on the side surfaces of the conductor-containing member, and a third step of thereafter cutting this conductor-containing member transversely at specified positions so as to divide into individual units.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: March 16, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shinichi Osada, Tomozo Yamanouchi, Yuichi Takaoka, Takashi Shikama
  • Publication number: 20030217458
    Abstract: A surface-mount positive temperature coefficient thermistor includes a disk-shaped positive temperature coefficient thermistor element having electrodes provided on opposing main surfaces thereof, an insulating case having an inner space with the thermistor element inserted therein, and a pair of metal terminals arranged to make electrical contact with the respective main surface electrodes of the thermistor element, and to sandwich therebetween the thermistor element. The insulating case includes a pair of main surfaces that are substantially parallel to the main surfaces of the thermistor element, a pair of opening side surfaces each having an opening, and a pair of end surfaces each having a terminal insertion hole provided therein. One end of each of the pair of metal terminals is inserted from the respective terminal insertion holes into the inner space, and the metal terminals press-hold the thermistor element so as to sandwich the thermistor element therebetween.
    Type: Application
    Filed: March 25, 2003
    Publication date: November 27, 2003
    Inventors: Takeo Haga, Hiroki Tanaka, Toshiharu Hirota, Hiroshi Kuwahara
  • Patent number: 6622372
    Abstract: A sensor device is assembled by placing a sensor and a potentiometer within a sensor casing. An electrical connection extending from inside to outside the sensing casing has an interior portion inside the sensor casing and an exterior portion outside the sensor casing. The sensor and the potentiometer are coupled to the interior portion and are sealed within the sensor casing. A potentiometer setting apparatus is coupled to the exterior portion and is used to set the potentiometer. Then, the interior portion of the electrical connection is destroyed so that the potentiometer cannot be subsequently reset.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: September 23, 2003
    Assignee: Honeywell International Inc.
    Inventors: Frederick W. Hintz, Stephen J. Postma
  • Patent number: 6609292
    Abstract: A method of making a small chip resistor properly and efficiently is provided. This method makes chip resistors each of which comprises a unit substrate which is rectangular as viewed in plan and has a predetermined thickness, a resistor element provided on an upper surface of the substrate, and electrodes provided at opposite ends of the unit substrate.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: August 26, 2003
    Assignee: Rohm Co., Ltd.
    Inventor: Yoshio Kurita
  • Patent number: 6606783
    Abstract: A chip thermistor has a pair of outer electrodes opposite each other with a specified distance in between on one of the surfaces of a thermistor element and an inner electrode extending inside the thermistor element so as to overlap these outer electrodes in the direction perpendicular to the surface on which the outer electrodes are formed. An electrically insulating layer is preferably formed on the same surface as and between the pair of outer electrodes. Each of the outer electrodes may be formed with two or more layers, the outermost of the layers being of gold. The resistance value of such a chip thermistor can be adjusted by abrading at least a portion of the edges of the thermistor element together with portions of the outer electrodes.
    Type: Grant
    Filed: September 26, 2000
    Date of Patent: August 19, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masahiko Kawase, Norimitsu Kitoh
  • Patent number: 6568068
    Abstract: A method and system for fabricating electrical heating devices employing positive temperature coefficient (PTC) thermistor as heating elements which includes: assembling the heating devices with PTC thermistor heating elements preselected according to electrical resistance, applying pressure across the interface between the PTC heating elements and the radiator plates of the heating devices during their assembly, and exposing the heating devices for extended periods of time to both ambient and operational temperatures. The method of fabrication further includes continuously monitoring the electrical resistance of the heating devices and holding their electrical resistance stable by adjusting the pressure applied across the interface between the PTC heating elements and the radiator plates.
    Type: Grant
    Filed: May 4, 2000
    Date of Patent: May 27, 2003
    Assignee: A.T.C.T. Advanced Thermal Chips Technologies Ltd.
    Inventors: Gad Golan, Yuly Galperin
  • Publication number: 20030079336
    Abstract: An assembly method for a vehicle anti-theft key having an embedded resistor pellet is provided. The resistor pellet includes a flange at one end which abuts one side of the key blade when the opposed end of the pellet is inserted into a through opening formed in the shank portion of the key blade. With the resistor pellet loosely positioned within the through opening, a second flange is attached to the end of the pellet that was inserted through the through opening, thereby capturing the pellet within the through opening by the two opposed flanges. In one embodiment, the second flange is formed in place by employing a polymeric molding process, such as a thermoforming injection molding process. A handle for the key is efficiently formed substantially simultaneously with the second flange using the same polymeric molding process.
    Type: Application
    Filed: October 29, 2001
    Publication date: May 1, 2003
    Inventors: David C. Banks, Charles C. Edwards
  • Patent number: 6510605
    Abstract: A surface mount resistor is formed from an elongated resistive body having first and second terminal ends and a raised center portion formed therebetween. The raised center portion includes slots in its edges which form a serpentine current path through the raised center portion of the resistor. A dielectric surrounds and encapsulates the raised center portion and an electrically conductive material coats the first and second terminal ends. The method for manufacturing involves utilizing an elongated ribbon which is of unitary construction and which is formed to create a carrier strip and a raised center portion for the resistors ultimately to be formed.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: January 28, 2003
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Joel J. Smejkal, Steve E. Hendricks, Larry K. Sockrider
  • Publication number: 20030005576
    Abstract: A multi-element electronic chip device is manufactured which has a plurality of elements such as film resistors 2 or the like on one insulating substrate 1 by carrying out a step of performing primary division of a ceramic material plate A corresponding to a multiplicity of insulating substrates 1 into ceramic bars A′ each corresponding to a row of plural insulating substrates 1, a step of forming grooves 6 in lengthwise side faces of each ceramic bar A′ before forming side electrodes 5 for both ends of each film resistor 2 or forming grooves 6 after forming side electrodes 5, and a step of performing secondary division of the ceramic bar A′ into individual insulating substrates 1. This structure is a low cost solution for preventing the side electrodes 5 for different film resistors 2 from connecting with each other.
    Type: Application
    Filed: June 11, 2002
    Publication date: January 9, 2003
    Applicant: ROHM CO., LTD.
    Inventor: Torayuki Tsukada
  • Publication number: 20020092154
    Abstract: A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween. According to the method the resistive strip is attached to a single co extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.
    Type: Application
    Filed: February 18, 2002
    Publication date: July 18, 2002
    Inventors: Joel J. Smejkal, Steve E. Hendricks
  • Patent number: 6401329
    Abstract: A surface mount resistor includes an elongated piece of resistive material having strips of conductive material attached to its opposite ends. The strips of conductive material are separated to create an exposed central portion of the resistive material therebetween. According to the method the resistive strip is attached to a single co extensive strip of conductive material and a central portion of the conductive material is removed to create the exposed central portion of the resistive strip.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: June 11, 2002
    Assignee: Vishay Dale Electronics, Inc.
    Inventors: Joel J. Smejkal, Steve E. Hendricks
  • Patent number: 6276049
    Abstract: A sensor, such as a proximity sensor, having its components sealed within a case, has its sensitivity adjusted with a remotely settable digital potentiometer after assembly of the sensor. The adjustment connection is then destroyed.
    Type: Grant
    Filed: October 6, 1998
    Date of Patent: August 21, 2001
    Assignee: Honeywell International INC
    Inventors: Frederick W. Hintz, Stephen J. Postma
  • Patent number: 6272735
    Abstract: In order to present a temperature sensor which works stable also in a high temperature condition showing only a small deviation in the resistance value of thermistor, the invented temperature sensor comprises a heat resisting cap (5) made of a metal, a thermistor (1) housed inside the heat resisting cap (5) and at least more than one lead wire (4) which is electrically connected with the thermistor (1) and is pulled out of said heat resisting cap (5), said heat resisting cap (5) being formed with an alloy containing Ni—Cr as the main ingredient.
    Type: Grant
    Filed: June 3, 1999
    Date of Patent: August 14, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroki Moriwake, Nobuharu Katsuki, Tsuyoshi Tanaka, Katsunori Matsubara, Takashi Tamai
  • Patent number: 6232867
    Abstract: A method of fabricating a monolithic chip varistor includes the steps of preparing a varistor body including a plurality of varistor layers and at least one pair of internal electrodes; forming a first layer for each of a pair of external electrodes by applying a metal component and a glass component to an exterior portion of the varistor body, followed by heat treatment; forming a second layer for the external electrode on the first layer by applying a glass component, followed by heat treatment; forming a third layer for the external electrode on the second layer by applying a glass component that is different from the glass component used for forming the second layer, followed by heat treatment; forming a fourth layer for the external electrode on the third layer by applying a metal component that is different from the metal component used for forming the first layer, followed by heat treatment under the same heat treatment conditions as those used for the formation of the first layer; and forming a fifth
    Type: Grant
    Filed: August 22, 2000
    Date of Patent: May 15, 2001
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshikazu Yoshida, Toru Tominaga, Tadashi Morimoto
  • Patent number: 6173487
    Abstract: A fan speed controller of an automotive vehicle air conditioning device is usually placed in an air flow duct to be effectively cooled. Thus, compact construction of the speed controller is needed to obtain a larger air flow in the air flow duct. For this purpose, various compact resistor units for the speed controller have been proposed. However, some of them are poor in durability against shocks. In view of this, a compact resistor unit for a speed controller includes a resistor block that has a flat resistor, a flat insulating plate and a flat radiation plate which are respectively positioned against one another. The compact resistor unit further includes a holder block of molded plastic on which the resistor block is mounted. The compact resistor unit also includes a plurality of metal terminals partially embedded in the holder block, where the terminals are connected to particular portions of the flat resistor.
    Type: Grant
    Filed: October 30, 1998
    Date of Patent: January 16, 2001
    Assignees: Calsonic Corporation, Calsonic Products, Inc.
    Inventors: Hiroyuki Murata, Takashi Ishii, Shuko Yamamoto
  • Patent number: 6148502
    Abstract: An improved surface mount resistor and method for making the same includes a body comprised of an elongated strip of electrically resistive material and a resistor terminal formed at each end of the resistive material. The resistive material is machined with a laser beam to create a current path having a desired resistance. The pattern cut is determined by partitioning the resistive material into a plurality of squares forming a current path through the resistive material with the correct resistivity. The resistive material is cut primarily with axial cuts so that the beam strength of the resistive material is maintained.
    Type: Grant
    Filed: October 2, 1997
    Date of Patent: November 21, 2000
    Assignee: Vishay Sprague, Inc.
    Inventors: George V. Gerber, Joel J. Smejkal
  • Patent number: 6125529
    Abstract: The present invention relates to making sensors by cutting pieces from a boule or ingot of a metal oxide single crystal. The sensors produced are also described.
    Type: Grant
    Filed: June 17, 1997
    Date of Patent: October 3, 2000
    Assignee: Thermometrics, Inc.
    Inventors: Carol Zwick Rosen, Donald G. Wickham, John Carter, Jr., David Sorg
  • Patent number: 6073340
    Abstract: Several heater patterns are printed on a ceramic green sheet for substrates, and the ceramic green sheet is laminated with a ceramic green sheet for cover plates, thereby forming a lamination body. Then, the lamination body is cut so that it is divided into several intermediate bodies, each of which holds a corresponding one of the heater patterns therein and has a side surface on which a terminal portion of the heater pattern is exposed. Then, the intermediate body is baked. As a result, a ceramic heater composed of a heater substrate holding the heater pattern and a cover plate disposed on the heater substrate to cover the heater pattern can be provided without any micro-cracks therein.
    Type: Grant
    Filed: May 29, 1998
    Date of Patent: June 13, 2000
    Assignee: Denso Corporation
    Inventors: Makoto Shirai, Akira Fujii, Masayuki Kobayashi
  • Patent number: 5887338
    Abstract: A temperature sensor, which is used particularly in the intake tube of internal combustion engines in conjunction with an air flow rate meter, includes a sensor element that is constructed as a temperature-dependent NTC resistor in the form of a pill, a cube or the like. A large number of identical temperature sensors are produced by applying a plurality of parallel conductor tracks, which include partial conductor tracks, to a glass plate or wafer, by providing the conductor tracks with outer solderable contact surfaces and inner solderable contact surfaces, by applying and electrically conductively connecting each sensor element to a first partial conductor track, by conductively connecting the sensor element to a second partial conductor track, by coating the sensor element with a resist layer, and by cutting apart the wafer with parallel cuts extending between the individual sensor elements.
    Type: Grant
    Filed: October 28, 1997
    Date of Patent: March 30, 1999
    Assignee: Siemens Aktiengesellschaft
    Inventor: Andreas Wildgen
  • Patent number: 5862585
    Abstract: An electrofusion coupler, for connecting plastics pipes end to end, is formed using a mandrel 10 having at spaced apart locations therealong first and second terminal holder 14. Each terminal holder 14 receives a malleable metal terminal pin 30, and has a diametral slot 26 for receiving an electrical resistance wire 20 which is extended across one terminal holder 14, wound in a plurality of turns around the mandrel 10 and is extended across the other terminal holder 14. Malleable terminal pins 30 are driven into the terminal holder, along the axis of the pin, so that the inner end of the pin is crimped onto the wire to grip it firmly. The mandrel 10, is then placed in an injection mould, an electrofusion sleeve injection moulded around the wound mandrel 10, terminal pins 30 and holders 14, the terminal pin holders 14 are withdrawn radially into the mandrel 10 and the electrofusion coupler stripped axially from the mandrel.
    Type: Grant
    Filed: December 26, 1996
    Date of Patent: January 26, 1999
    Assignee: Glynwed Pipe Systems Limited
    Inventor: Gary Raymond Tessier
  • Patent number: 5697143
    Abstract: In the manufacture of an electrofusion coupler, a winding of an electrical resistance heating wire is wound directly around a mandrel which comprises two parts providing respective ends of the mandrel. The mandrel supports electrically conducting terminal elements by means of supporting locations on the mandrel parts which form an integral part of the mandrel. The resistance wire wound around the mandrel is connected to the electrically conducting terminal elements. Subsequently a body of thermoplastics is molded around the mandrel to form the electrofusion coupler, and thereafter the mandrel parts are extracted axially from the electrofusion coupler from opposite ends, leaving the winding and terminal elements in place in the electrofusion coupler. In a variant, a thermoplastic preform is manufactured having electrically conducting terminal plates secured thereto, the preform having an electrical resistance heating wire wound therearound and secured to said terminal plates.
    Type: Grant
    Filed: April 26, 1995
    Date of Patent: December 16, 1997
    Assignee: Glynwed Plastics Ltd.
    Inventor: Malcolm R. Barfield
  • Patent number: 5678300
    Abstract: In order to arrange an electric heating element in a housing of a thermostatic working element and to guide connecting lines to the outside in a sealing manner, a base made of plastic is injection molded into an opening of the bottom through which the connecting lines are guided to the outside.
    Type: Grant
    Filed: January 17, 1996
    Date of Patent: October 21, 1997
    Assignee: Behr-Thomson Dehnstoffregler GmbH & Co.
    Inventors: Roland Saur, Roland Pflieger
  • Patent number: 5674588
    Abstract: A welding sleeve includes a sleeve body having a recess for receiving a plug contact. The recess has sidewalls and a bottom wall. The bottom wall is provided with a projection which defines with the side walls of the recess a pair of slots. The plug contact includes an insertion part adapted to be received within the recess. The insertion part includes leg portions to be received in the slots of the recess and a slit between the legs adjacent the top surface of the projection. The slit receives a portion of the heating element which rests on the top surface of the projection. The width (b) of the slit is less than the diameter (d) of the heating element so as to insure good electrical contact.
    Type: Grant
    Filed: June 12, 1995
    Date of Patent: October 7, 1997
    Assignee: Georg Fischer Rohrleitungssysteme AG
    Inventors: Erasmo Porfido, Dirk Alexander Petry
  • Patent number: 5664320
    Abstract: A subminiature circuit protector includes a substrate carrying a metal fuse element hermetically sealed in a glass sleeve cartridge. The fuse element may comprise a film deposited on the substrate, or, alternatively a metal strip or wire. Leads extend from opposing ends of the sleeve for connection in a circuit, and a gas is sealed in the sleeve to provide a suitable environment to improve operating lifetime and interrupting capability. A method for making a circuit protector includes placing a substrate carrying a fuse element in a glass sleeve and placing leads in contact with the fuse element. The assembly is heated in the presence of a gas below atmospheric pressure to a temperature sufficient to soften the glass. The pressure is then increased to cause the ends of the glass sleeve to form a hermetic seal about the leads.
    Type: Grant
    Filed: March 23, 1995
    Date of Patent: September 9, 1997
    Assignee: Cooper Industries
    Inventor: Leon Gurevich
  • Patent number: 5644835
    Abstract: A method of making an elongated electrical heating element having a resistance wire with a helical portion extending between two lead pins surrounded by compacted insulating powder in an outer casing. The lead pins are attached to a tightly coiled resistance wire by screwing threaded portions at the inner ends of the lead pins into coiled portions at the outer ends of the resistance wire. The lead pins are pulled further apart to stretch the coiled resistance wire to form the helical portion of the resistance wire and then attached to a resistance meter. One of the lead pins is then rotated relative to the other lead pin to adjust the effective electrical resistance of the heating element to an accurate and uniform valve. The resistance wire and lead pins are mounted in an outer casing which further stretches the helical portion to a predetermined length. The outer casing is then filled with insulating powder in a conventional vibrating filling machine.
    Type: Grant
    Filed: September 9, 1996
    Date of Patent: July 8, 1997
    Assignee: Mold-Masters Limited
    Inventor: Egan Villringer
  • Patent number: 5632079
    Abstract: A process for making an integrated terminating resistor on a two-conductor data bus includes making a series of individual resistor elements and assembling the resistor elements in a stack of parallel, spaced array of elements. The elements are soldered together between end portions of the two conductors of the data bus at both ends thereof by inserting the conductors into two diametrically opposed, axially aligned notches in all of the resistor elements and heating solder in the notches to reflow the solder to bond the conductor in the notches. A parallel electrical and mechanicalconnection is thereby established, connecting the elements together electrically and mechanically in a closely spaced array. The array is sealed in a shock absorbing and abrasion resistant enclosure.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: May 27, 1997
    Assignee: The Boeing Company
    Inventor: David G. Morant
  • Patent number: 5581872
    Abstract: An apparatus for winding a heating wire on a core for forming the inner periphery of an electric melt-bonding joint which comprises a core in a generally cylindrical shape which is capable of rotating around its axial center, the core being relatively moved in the axial direction with respect to a heating wire, an engaging piece mounted on the core, which has a holding portion for holding a heating wire, and a fixing means to fix a terminal pin to the leading end of the heating wire, wherein the engaging piece has a holding portion for holding the terminal pin, whereby the heating wire is wound on an outer peripheral portion of the core by rotating the core.
    Type: Grant
    Filed: November 1, 1994
    Date of Patent: December 10, 1996
    Assignee: Mitsubishi Plastics, Inc.
    Inventors: Yasushi Miyadai, Mitsuru Ono
  • Patent number: 5334968
    Abstract: A network-type resistor array in which a plurality of resistors are successively arranged, in which electrode portions of the resistors are respectively separated by angular electrode-separating notches, so as to prevent the short-circuit between the adjacent electrode portions due to the flowing along of molten solder for electrode connection.
    Type: Grant
    Filed: February 5, 1993
    Date of Patent: August 2, 1994
    Assignee: Rohm Co., Ltd.
    Inventor: Masayuki Negoro
  • Patent number: 5235737
    Abstract: A method of making an injection molding nozzle having an electrical heating element wound in a channel. The heating element has two terminal wires which extend radially outward parallel to each other from either a common end portion or two separate end portions of the heating element. After the heating element is wound in the spiral channel in the nozzle body, forward and rear collar portions are mounted around the nozzle body to form a radial slot or opening between them through which the end portion or portions of the heating element project. A stud portion is mounted to extend radially outward from the slot with a single bore or two parallel bores through which the end portion or portions extend. These components are then brazed together in a vacuum furnace to form a strong integral structure with the end portion or portions of the heating element secured in place. In one embodiment, a spacer portion having two parallel bores is mounted with ceramic paste to the stud portion.
    Type: Grant
    Filed: December 28, 1992
    Date of Patent: August 17, 1993
    Inventor: Jobst U. Gellert
  • Patent number: 5228186
    Abstract: An electro-fusion pipe coupler includes an outer shell and an electric resistance heating coil secured therein by an intervening layer of injection moulded thermoplastic material. The coupler is made by winding the wire onto a core which consists of two separable parts inserting the core into the tubular shell, attaching contacts to the wire ends and inserting them into holes provided in the shell, and injecting molten material into the space defined between the core and the shell to form the layer. For injecting the material the core parts define therebetween radial runners connected to a central sprue inlet and opening at respective outlets spaced around the core.
    Type: Grant
    Filed: July 30, 1992
    Date of Patent: July 20, 1993
    Assignee: Fusion Plastics Ltd.
    Inventors: David Brettell, Russell J. Kirk, Robin B. Carter, David M. A. Kenworthy
  • Patent number: 5152049
    Abstract: An extended resistance temperature sensor formed of a plurality of lengths of pre-insulated resistance temperature detector (RTD) wire. The RTD wire is either unheated, self heated or is heated by means of strands of heater wire integrated with or placed closely adjacent to the RTD wire. The RTD wire itself, or together with the heater wire, is bonded together in one embodiment. Alternatively, the RTD wire, or with the heater wire, may be encased in insulated shrink tubing, thin wall metal tubing or both. Connectors are provided to supply electrical current for heating purposes or to connect the RTD wire to detection circuitry, or both. Protective sheaths are provided over the connectors.
    Type: Grant
    Filed: April 19, 1990
    Date of Patent: October 6, 1992
    Assignee: Fluid Components, Inc.
    Inventor: Malcolm M. McQueen
  • Patent number: 5148594
    Abstract: A method of manufacturing a metallurgically monolithic integral heated probe for injection molding. An electrical terminal and three portions of the probe body are made and assembled together with an electrical heating element extending in an aligned bore. The forward portion is made of abrasion resistant high speed steel, while the rest of the probe body is made of hot work tool steel. A removable and reusable filler tube is screwed into a threaded seat in the rear cap portion and a quantity of silver is loaded into it. After a nickel alloy brazing material is applied to the joins, the assembly is heated in a reduced oxygen atmosphere in a vacuum furnace according to a predetermined cycle. The nickel alloy seals all the joins and the silver braze fills all the spaces between the components to provide a metallurgically monolithic integral probe.
    Type: Grant
    Filed: February 18, 1992
    Date of Patent: September 22, 1992
    Inventor: Jobst U. Gellert
  • Patent number: 5142449
    Abstract: An elastomeric element, having alternating layers of resistive and insulating material, is used to form isolation resistors. A surface of the elastomeric element is contacted with a conductor carrying electrical signals. Another surface is applied to the terminals of a semiconductor component thereby coupling the signals to the semiconductor component through the resistors formed by the elastomeric element.
    Type: Grant
    Filed: October 1, 1990
    Date of Patent: August 25, 1992
    Assignee: Motorola, Inc.
    Inventors: Hugh W. Littlebury, Charles R. Collis