Abstract: An installation system for an associated housing includes a sensor and a tool. The sensor includes: a barrel portion, a sensing end of the barrel portion, a non-sensing end of the barrel portion, an over-mold portion at the non-sensing end, and a wire extending from the non-sensing end. The tool includes a handle and an applicator secured to the handle. The applicator includes a first applicator portion, a second applicator portion, and a channel. When the over-mold portion of the sensor is proximate to a channel opening and the channel opening is blindly inserted into the associated housing opening, a force applied to the handle along an angle relative to the longitudinal axis of the handle frictionally seats the sensor in the associated housing.

Abstract: An information processing device configured to determine a mounting position of a tape feeder to any one of multiple feeder mounting sections formed in a work machine, in which mounting positions of two or more tape feeders configured to supply components of holding target held by two or more holding tools of a work head disposed in the work machine are determined to any one of the multiple feeder mounting sections based on position information indicating supply positions of the two or more tape feeders, so that a difference in an amount of deviation of the supply positions of the two or more tape feeders is within a predetermined range.

Abstract: A press-fit insertion method is provided. The press-fit insertion method includes loading press-fit pins into a connector, heating a printed circuit board (PCB) defining plated through holes (PTHs) into which the press-fit pins are insertable and pressing the connector onto the PCB to insert the press-fit pins into the PTHs with the PCB remaining heated.

Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

Abstract: An apparatus includes a transfer mechanism to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace on a product substrate. The transfer mechanism includes one or more transfer wires. Two or more stabilizers disposed on either side of the one or more transfer wires. A needle actuator is connected to the one or more transfer wires and the two or more stabilizers to move the one or more transfer wires and the two or more stabilizers to a die transfer position.

Abstract: One example of a pre-molded lead frame includes a mold body, a plurality of recesses, and a plurality of first leads. The mold body includes a first main surface and a second main surface opposite to the first main surface. Each recess of the plurality of recesses extends from the first main surface into the mold body. The plurality of first leads are coupled to the mold body and extend from a third surface of the mold body. The third surface extends between the first main surface and the second main surface.

Abstract: A component supply device including a stage on which electronic components are scattered; a contacting section at a height so as to contact the electronic components on the stage; a slide device to relatively slide the stage and the contacting section; a dropping opening to allow the electronic components scattered on the stage caught by the contacting section to drop in accordance with the relative movement of the stage and the contacting section by the slide device; and a wall at a side opposite to a side of the dropping opening at which the electronic components scattered on the stage drop. The contacting section is provided to extend in a direction perpendicular to a sliding direction by the slide device, and at least a portion of the contacting section is inclined with respect to a straight direction along the sliding direction and an upper surface of the stage.

Abstract: A removable device for retaining electrical contacts, having: a rigid element for holding electrical contacts including a plurality of housings that are configured to accept the electrical contacts, the lateral walls of the holding element that are adjacent to the housings having a plurality of openings that each lead into one housing of the plurality of housings of the holding element; and an elastic element for retaining the electrical contacts in the holding element including a plurality of sprung blades that are arranged facing the openings leading into the housings of the rigid holding element so as to retain the electrical contacts in the housings of the holding element. The invention further relates to a soldering method implementing such a device.

Abstract: An electrical terminal for use with an electrical connector which includes a housing for receiving the electrical terminals therein. The electrical terminals have transition portions and substrate mating portions. The transition portions extend from a rear face of the housing. The substrate mating portions extend from the transition portions. The substrate mating portions have substrate engagement ends configured to be inserted into openings of a substrate. Shoulders are provided on the substrate mating portions. The shoulders are in a different plane than a longitudinal axis of the transition portions. Wherein forces associated with mating the electrical terminals to the substrate are transferred through the shoulders to an insertion tool used to move the terminals into the openings.

Abstract: A board work machine that includes a rotary head with multiple positions is provided for lowering nozzle holders and is able to continue operating even though it is determined that the nozzle holder cannot be lowered at one of the multiple positions. In step S1 in a Z shaft updating process, when determining based on Z shaft table that a lifting and lowering operation function is not effective and that an assigned Z shaft is not used for lifting and lowering, CPU lifts up and lowers a Z shaft that differs from the assigned Z shaft in step S11. Mounter can continue mounting work by using the Z shaft that differs from the assigned Z shaft.

Abstract: A component supply device including: a stage configured such that components can be scattered on the stage; a slide device configured to slide the stage; a contacting section configured to contact the component scattered on the stage in accordance with sliding of the stage by the slide device; and a control device configured to control operation of the slide device, wherein the control device includes a determining section configured to determine whether the stage has been slid to a set position when the stage is slid towards the contacting section, and an operation control section configured to control operation of the slide device so as to, in a case in which it is determined by the determining section that the stage has not been slid to the set position, after sliding the stage in a direction away from the contacting section, once again slide the stage towards the contacting section.

Abstract: A display device includes: a display panel including a plurality of pixels; a first flexible printed circuit board attached to the display panel and electrically connected thereto; a first printed circuit board attached to the first flexible printed circuit board and electrically connected thereto; a data driver which applies a data voltage to the plurality of pixels, receives a voltage flowing to the plurality of pixels and generates mobility sensing information based on the voltage flowing to the plurality of pixels; and a timing controller which detects a first misalignment between the first printed circuit board and the first flexible printed circuit board, and a second misalignment between the display panel and the first flexible printed circuit board, based on the mobility sensing information.

Abstract: A component feeding device includes a component exposing unit and a tape traveling guide unit. The component exposing unit lifts a cover tape of a component storage tape, and pushes a lifted part of the cover tape outward while folding the lifted part downward. The tape traveling guide unit guides the component storage tape to help it in traveling. The tape traveling guide unit includes a guide body and opening width defining members fitted to the guide body. The guide body has an opening serving as an opening for taking out a component, and a cover tape path demarcating portion that demarcates a path through a lifted part of the cover tape passes. Each of the opening width defining members defines the opening width of the opening, and applies a downward pressure to a first specific area of an upper surface of the carrier tape.

Abstract: A component mounting device configured to mount a component, which has a feature portion on an upper surface, on a board. The component mounting device picks up the component, images a lower surface of the picked-up component, temporarily loads the picked-up component on a target temporary loading position to a temporary loading stand which is corrected based on a pickup deviation amount of the component to be recognized based on a lower surface image of the imaged component. Subsequently, the component mounting device images an upper surface of the temporarily loaded component, picks up again the component which is temporarily loaded on the temporary loading stand, and images a lower surface of the re-picked up component. Then, the component mounting device mounts the re-picked up component on a target mounting position of the board corrected based on a positional deviation amount of the feature portion.

Abstract: An automatic exchanging device for moving in an arrangement direction of multiple component mounting machines alongside the front face of a component mounting line to set feeders to and/or remove feeders from a feeder setting base of each component mounting machine, and a control device for controlling the movement of the automatic exchanging device. The control device monitors the operational states of the multiple component mounting machines and, when an error requiring the work of the operator occurs in any one of the component mounting machines, sets a predetermined range including the component mounting machine to a movement prohibited area of the automatic exchanging device to move the automatic exchanging device out of the movement prohibited area until it is determined that the work is completed.

Abstract: Provided is a method for determining the maximum number of constant tables at table locations in one or more pick-and-place lines for the placement of components on modules using pick-and-place machines, the fittings on the constant tables being used in all the fitting families of a pick-and-place line, one fitting family including a set of modules which can be produced on a pick-and-place line with a common component fitting, wherein the maximum number of constant tables is determined by calculation using mixed-integer liner optimization on the basis of input data describing the pick-and-place infrastructure, wherein the pick-and place infrastructure can include in particular the pick-and-place lines having the pick-and-place machines, each with pick-and-place head, at least one transport system for the modules, the said constant tables, and further tables which can be variably fitted.

Abstract: Disclosed is a solar cell panel module including a solar cell panel; a wiring enclosure electrically connected to the solar cell panel and mounted on or at a back surface of the solar cell panel; and an adhesive member disposed between the wiring enclosure and the solar cell panel to attach the wiring enclosure and the solar cell panel. An air gap opened to an outside and having a thickness corresponding to a thickness of the adhesive member is provided between the solar cell panel and the wiring enclosure by the adhesive member.

Abstract: Component mounting line includes multiple component mounting machines arranged along a conveyance direction of a board, feeder storage container that stores multiple feeders that are attachable and detachable to component mounting machine, and exchanging robot capable of exchanging feeder between feeder storage container and each of the component mounting machines, in which feeder storage container is installed in the same arrangement as the multiple component mounting machines, and exchanging robot moves along the conveyance direction of the board and exchanges feeder. Accordingly, regardless of which of the component mounting machines feeder is used in, replenishment and collection may be performed in feeder storage container, so that an operator can easily replenish and collect feeder.

Abstract: The component mounting method is a method for mounting a component using a component mounter including a mounting head, a component camera as an imaging device configured to image a component, a first component holding section provided on the mounting head and capable of holding a first component, and a second component holding section capable of holding a second component at a position lower than the first component, the component mounting method having steps wherein the first component holding section picks up the first component, the imaging device images the first component, the second component holding section picks up the second component while the first component holding section holds the first component, and the second component is imaged while the first component holding section holds the first component and the second component holding section holds the second component.

Abstract: Provided is a semiconductor device comprising a semiconductor substrate that includes a transistor region; an emitter electrode that is provided on the semiconductor substrate; a first dummy trench portion that is provided on the transistor region of the semiconductor substrate and includes a dummy conducting portion that is electrically connected to the emitter electrode; and a first contact portion that is a partial region of the transistor region, provided between an end portion of a long portion of the first dummy trench portion and an end portion of the semiconductor substrate, and electrically connects the emitter electrode and a semiconductor region with a first conductivity type provided in the transistor region.

Abstract: Mechanical vibrations are generated on a frame of an aerial vehicle as a response to operation of the aerial vehicle, such as rotation of motors and/or propellers. Likewise, environmental conditions, such as wind, humidity, etc., may also cause vibrations on the frame of aerial vehicles. These vibrations may be destructive to the aerial vehicle, impact stability of the aerial vehicle, and/or result in audible sounds. Disclosed are systems and methods for measuring and/or predicting the vibrations on the frame of the aerial vehicle, generating anti-vibrations, and outputting those anti-vibrations such that the anti-vibrations modify vibrations on the frame of the aerial vehicle.

Abstract: In mounter, work using multiple suction nozzles is executed by executing an exchange of suction nozzles between nozzle station and mounting head. In addition, placement positions of suction nozzles at nozzle station are set so that the distance between accommodation section at the nozzle station and part camera is shorter for the suction nozzle to be exchanged more times at the nozzle station. Then, for exchange of suction nozzles during mounting work, the suction nozzle attached to the mounting head is returned to a placement section corresponding to a set placement position. As a result, placement positions at the nozzle station are rearranged into the set placement positions, so that the distance that the mounting head moves for nozzle exchange can be made shorter, which makes it possible to reduce the time required for nozzle exchange.

Abstract: An assembly system that includes a robot adapted to grip an electronic device to be mounted on a circuit board, a first vision system that identifies a position and a posture of the electronic device gripped by the robot, a fixing device that fixe a plurality of circuit boards thereon, and a second vision system that identifies a position and a posture of the circuit board fixed on the fixing device. The robot mounts the gripped electronic device on a circuit board under the visual guidance of the first vision system and the second vision system. The view field of the second vision system is not capable of completely covering a surface region of all circuit boards fixed on the fixing device. The assembly system further includes a moving mechanism that moves the second vision system in a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction, so that the second vision system completes identification of all circuit boards on the fixing device step by step.

Abstract: An automatic assembly machine fora combined control button, includes a frame, a power distribution control box, a turntable and turntable drive disposed on the frame so as to fit with each other, wherein the base fixtures fitting controller bases are evenly disposed along the circumference of the turntable; the front side of the frame located at the right side of the turntable is disposed with a base feeding mechanism; the rear side of the base feeding mechanism located on the frame is provided with a base transportation device fitting with the base fixtures; and the left side of the base transportation device along the rotating direction of the turntable is provided with a button assembly mechanism cooperating with the base fixtures.

Abstract: A mounting head that is included in a component mounter for mounting a component on a board and sucks the component by a nozzle is provided. The mounting head includes: a nozzle shaft that is disposed to be freely upward and downward movable and has the nozzle installed at a lower end of the nozzle shaft; an imaging element holder that moves upward and downward according to upward and downward movement of the nozzle shaft; and an imaging element that is held by the imaging element holder and images an area including a lower end of the nozzle.

Abstract: A component mounter includes a mounting head configured to revolve multiple nozzle holders to which multiple pickup nozzles can detachably be attached individually in a circumferential direction and to allow the multiple pickup nozzles to rotate on their own axes while being interlocked with each other and two Z-axis drive devices provided at two locations on a revolving orbit of the multiple pickup nozzles to raise and lower the pickup nozzles situated at the two locations. Then, when a component supplied from a component supply device can be picked up at any of multiple different nozzle angles of the pickup nozzle, the component mounter moves the pickup nozzle to a revolving angle at which the pickup nozzle can be raised and lowered and then lowers the pickup nozzle to pick up the component at a nozzle angle of the multiple nozzle angles which involves a smaller moving amount.

Abstract: A positioning device including a support tab, two pairs of sliding blocks slidably mounted in the support table, a positioning plate extending vertically from on a top of each sliding block, a base on which the support table is supported, a cylinder installed in a chamber of the base, a ball received in the cylinder, a piston rod slidably mounted in the cylinder that pushes the ball to move upward in a vertical direction, so that the ball drives the two pairs of sliding blocks to move away from each other in the first horizontal direction and the second horizontal direction, respectively, until the positioning plates of the two pairs of sliding blocks abut against four inner walls of the opening of the circuit board, respectively, to allow the electronic device to be received in a positioning slot defined by the positioning plates, and a release mechanism.

Abstract: A dedicated correction value related to the mounting position of an upper surface recognition component with a characteristic section on an upper surface thereof is memorized in correction value folder 43a of an HDD, and when performing mounting work of mounting the upper surface recognition component on a board, a position deviation amount of the characteristic section is acquired based on an image of the upper surface of the upper surface recognition component captured by a mark camera, and the component is mounted at the mounting position based on the acquired position deviation amount and the dedicated correction value. Accordingly, it is possible to mount the specific component at a corrected mounting position such that the position of the characteristic section is appropriate, thereby improving mounting accuracy for the upper surface recognition component.

Abstract: A mounter capable of curtailing interference between a mounting head that has a component holding section, and an exchange-use component holding section and a storage section that holds the exchange-use component holding section. A controller of the mounter reads head identification information for identifying the mounting head from the mounting head. Also, different quantities of protruding sections are formed on nozzle tray in accordance with the height in the Z-axis direction. Also, pressure switches that are pressed by protruding sections so as to turn on and off are provided on loading plate on which nozzle tray is loaded. By this, the controller is able to determine whether interference will occur between the mounting head and nozzle tray based on the detection signal of the pressure switches before the mounting head is moved.

Abstract: A method for joining two components is disclosed. In an embodiment of the method, a joining element is inserted into the two components, and during the joining process, at least one parameter quantifying the joining process is determined. The joining element is inserted by a robot and the at least one parameter quantifying the joining process is determined by the robot. A device for joining two components is also disclosed.

Abstract: An automatic splicing device provided with a communication device configured to communicate with a component mounter or a host computer that is connected to the component mounter such that communication is possible, a connection control device configured to control connecting of the a first tape and a second tape, and a display device configured to display information related to connecting of the first tape and the second tape.

Abstract: In component mounting device, if a rotary head held by a head holder greatly deviates from a specified reference, a CPU executes a process for a holding error. The process for the holding error includes a process of holding a rotary head again by the head holder or the like, for example. If the rotary head greatly deviates from a specified reference and the component mounting process is executed as is, there is a fear that poor precision will occur during component mounting. Therefore, the CPU does not execute the component mounting process but executes the process for the holding error.

Abstract: A method and a system for providing operator information in an Surface Mount Technology (SMT) system comprising an SMT information database, a SMT pick and place machine and an identity tag scanner, the method comprising: receiving a bin in said SMT pick and place machine, wherein said bin is adapted to comprise vertically oriented bin load units, wherein said bin load unit has an pallet identity tag attached to the bin load units upwards facing surface; starting SMT production on said SMT pick and place machine; scanning individual identity tags attached to bin load units comprising component tape reels to obtain bin load units IDs.

Abstract: In a case where check unnecessary components (chip components a to c) that do not require checking of the mounted states of the other components before being mounted and check necessary components (die components X and Y) that require checking of the mounted states of the other components before being mounted are mounted on a board, the check unnecessary components are mounted first and the mounted state of each component is inspected. When mounting of the check unnecessary components is completed, the check necessary components are mounted after it is checked that the mounted states of the check unnecessary components are normal based on the inspection results.

Abstract: Embodiments are directed to an electrical contact for use in an LGA connector having a split beam cantilever. The contact includes a base adapted for retention in an LGA connector. The contact also includes two cantilever beams extending from the base. The cantilever beams are each connected to the base at a first end of each respective cantilever beam. The contact includes a neck defining a region where a second end of each the two cantilever beams are connected. A contact tip extends from the neck.

Abstract: A module installation assembly for installing a module into a socket of a land grid array includes a tool having a mounting bracket for connecting the tool to an adjacent fixture, an alignment member connected to the mounting bracket, and cavity defined at least partially by the alignment member. The cavity is substantially aligned with a socket of the land grid array such that the module is configured to pass through the cavity when being connected to the socket.

Abstract: An apparatus and method for press-fitting a connector to a circuit board is provided. The apparatus has a universal press block fixedly connected to a machine press head. A bottom plate of the universal press block has multiple locating holes. A locating block is fixedly connected to the bottom plate. A press block is fixedly connected to the locating block at a predetermined position suitable for press-fitting the connector. The press block has a press block head, a press block body and a sensor provided between the head and the body. The press block head is movable to contact the connector to apply a pressing force to the connector. The sensor detects the pressing force and generates a signal indicative of the pressing force. The press block body receives the signal from the sensor and controls the movement of the press block head based on the signal.

Abstract: A connector support assembly is configured to securely retain an electrical connector during a manufacturing process. The connector support assembly may include a base, a first securing member, and a second securing member. The first and/or second securing members is movable, and is configured to be moved between an open position in which a mating connector of the electrical connector is positioned between the first and second securing members, and a clamped position in which the mating connector is securely clamped between the first and second securing members.

Abstract: Embodiments are directed to an electrical contact for use in an LGA connector having a split beam cantilever. The contact includes a base adapted for retention in an LGA connector. The contact also includes two cantilever beams extending from the base. The cantilever beams are each connected to the base at a first end of each respective cantilever beam. The contact includes a neck defining a region where a second end of each the two cantilever beams are connected. A contact tip extends from the neck.

Abstract: A member preparation method includes a request rank determining step of determining a request member rank of a member fitted to production of a mounting board based on board information and component information including a mounting position of a component mounted on the mounting board. Furthermore, the member preparation method includes a fitting member extracting step of extracting a fitting member fitted to the request member rank in a plurality of members based on a production plan of the mounting board and retained member information in which a member rank is associated with each of the plurality of the members. Furthermore, the member preparation method includes a use member selecting step of selecting a use member in the fitting member, and a member preparation instructing step of generating an instruction to prepare the use member.

Abstract: An electronic component mounting apparatus includes: a mounting head including a holder for extracting an electronic component and mounting the electronic component onto a substrate, the mounting head being movable in a horizontal direction; an imaging camera disposed on the mounting head for imaging a component extraction position, when the holder is at the component extraction position; a recognition unit for recognizing, based on an image captured by the imaging camera, a positional deviation between the component extraction position and a position of a housing portion where a component is stored in a component feeding unit or a position of the component in the housing portion; and a controller for correcting the component extraction position to a position shifted by a positional deviation recognized by the recognition unit before the component feeding unit extracts a subsequent component, and causing the mounting head to move to the corrected position.

Abstract: A robot includes an arm, and a force detector provided in the arm and detecting a force, wherein at least one of a first object and a second object is moved in a direction in which the first object and the second object are closer to each other by the arm, and, if contact of the first object with a position different from an insertion portion of the second object is determined based on output of the force detector, the first object and the second object are separated.

Abstract: This invention relates to an apparatus for conducting immunoassay test. The apparatus includes a groove unit having a groove along a vertical direction configured to hold a rod-shaped portion of a probe along the vertical direction, and a push pin configured to move along a horizontal direction, the push pin being capable of residing at a first position and a second position. A tip of the push pin is capable of pressing the rod-shaped portion of the probe against the groove when the push pin resides at the first position. The distance between the tip of the push pin and the groove is larger than a diameter of the rod-shaped portion of the probe when the push pin resides at the second position.

Abstract: A component-handling device for removing components from a structured component supply and for storing the removed components at a reception device, where the reception device is newly adjusted after being initially put into operation after the replacement of device components or after maintenance work, in order to comply with the precision requirements when handling the components. The component-handling device has a self-adjustment device which permits it to adjust the device efficiently in terms of time and with high precision without manual intervention by an operator. The self-adjustment device is composed of a multiplicity of optical sensors and a controller. Adaptation of the measurement results acquired by means of the optical sensors using position sensors and property sensors installed originally for component inspection during fabrication gives rise to a high degree of process reliability and at the same time permits device components to be inspected for damage.

Abstract: A method of allocating electronic components to be mounted to each of a plurality of nozzle holders provided on a mounting head is provided, in which the electronic component which does not have a usage record or the electronic component which is a test target is allocated to a nozzle holder which does not have operation restrictions. An electronic component mounting system is provided with a mounting head which is provided with a plurality of nozzle holders, each of which holds a suction nozzle, and a control device which allocates electronic components to be mounted to each of the plurality of nozzle holders. The control device includes an electronic component allocation section which allocates an electronic component which does not have a usage record or an electronic component which is a test target to a nozzle holder which does not have operation restrictions.

Abstract: An apparatus for installing LED light bar is provided. The apparatus includes a platform at which a component with a LED light bar to be installed is placed; a rotatable arm and a first driving device disposed on a side of the platform. The rotatable arm is provided with a locating member, and one end of the arm is fixed relative to the platform; the first driving device drives the arm to rotate about the fixed end from a first position to a second position. When the arm is located at the first position, the LED light bar to be installed may be placed at the arm, and the locating member may fix the LED light bar on a predetermined position of the arm; when the arm rotates to the second position, the LED light bar adheres to the surface of the component for installing the LED light bar thereon.

Abstract: A placement machine for equipping a substrate with unhoused chips is described. The placement machine has a chassis on which is mounted a feed device, providing a wafer which has a multiplicity of chips. A lifting device is mounted on the chassis, and a substrate-receiving device for receiving the substrate is mounted on the lifting device is movable relative to the chassis by the lifting device. The substrate-receiving device has a one-piece support element, which constitutes at least an upper part of the substrate-receiving device, wherein the substrate to be equipped can be laid on the one-piece support element; and a transport device for transporting the substrate on an upper side of the one-piece support element along a transport direction. The transport device is spatially integrated in the one-piece support element on the upper side of the one-piece support element.

Abstract: A network connector assembly comprises a header housing having two pins forming a pin pair. A first pin end portion can be connected to a counter connector. A second pin end portion can be connected to a PCB. A first electrically conductive shielding member is arranged laterally to the pin pair. A second electrically conductive shielding member is arranged intermediate the pin pair. The second pin end portions form a press fit connector configured to connect to the PCB. The second pin end portions comprise a press protrusion configured to cooperate with a press tool while being pressed in a PCB-opening of the PCB. The second electrically conductive shielding member defines a tool opening arranged at a position that allows movement of a press tool through the tool opening along a tool axis to access the press protrusion.

Abstract: There is provided a component mounting line management device that can determine whether an installation device detachably attached to a component mounting machine is used, when communication between a configuration management device and the component mounting machine is impossible. In the component mounting line management device (1) according to the present invention, each component mounting machine or each installation device includes an installation device information memory device (11). The installation device information memory device (11) stores installation device identification information of the installation device attached at an installation position, and location information on the installation position in correlation with each other. Each component mounting machine includes a communication-abnormal-time installation device determination section (12).

Abstract: A board working device includes: a board conveyance device; multiple heads; and a control device which performs control such that a printed circuit board is positioned in multiple locations in order from an upstream side relative to the progress direction of the printed circuit board, and work performed using a first head of the multiple heads, and further, once the work is completed by the first head at the most downstream side position out of the multiple locations relative to the progress direction of the printed circuit board, performs control such that work is started using a second head of the multiple heads, with the work of the second head being performed with the printed circuit board being positioned in order from a downstream side position out of the multiple locations relative to the progress direction of the printed circuit board.